GULL WING Cellphone ICs 66

Reset All

Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	No. of Channels	Technology	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Resolution (um)	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Output (V)	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Input Type	Maximum Analog Input	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
CC1050-RTB1	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	24	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS		3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G24		3	1.2 mm	4.4 mm				e4	30	260	7.8 mm
CC1050-RTR1	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	24	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS		3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G24		3	1.2 mm	4.4 mm				e4	30	260	7.8 mm
MAX2690EUB	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	10	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.5 mm	85 Cel		-40 Cel	TIN LEAD	DUAL	R-PDSO-G10		1	1.092 mm	2.9465 mm	Not Qualified			e0			3 mm
AD7002AS	Analog Devices	BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	44	QFP	SQUARE	PLASTIC/EPOXY	YES	1	1	CMOS	.03 mA	5 V	5	FLATPACK	QFP44,.57SQ,32	Codecs	.8 mm	85 Cel	10	-40 Cel	TIN LEAD	QUAD	S-PQFP-G44	VOLTAGE		2.45 mm	10 mm	Not Qualified	SINGLE-ENDED		e0			10 mm
CC1000PWG3	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS		3 V	2.5/3.3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP28,.25	Other Telecom ICs	.65 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G28		3	1.2 mm	4.4 mm	Not Qualified			e4	30	260	9.7 mm
CC1000PWRG3	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS		3 V	2.5/3.3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP28,.25	Other Telecom ICs	.65 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G28		3	1.2 mm	4.4 mm	Not Qualified			e4	30	260	9.7 mm
MAX2440EAI	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	28	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			.036 mA	3.3 V	3.3	SMALL OUTLINE, SHRINK PITCH	SSOP28,.3	Other Telecom ICs	.65 mm	85 Cel		-40 Cel	TIN LEAD	DUAL	R-PDSO-G28		1	1.99 mm	5.29 mm	Not Qualified			e0			10.2 mm
MAX2421EAI	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	28	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3.3 V	3.3	SMALL OUTLINE, SHRINK PITCH	SSOP28,.3	Other Telecom ICs	.65 mm	85 Cel		-40 Cel	TIN LEAD	DUAL	R-PDSO-G28		1	1.99 mm	5.29 mm	Not Qualified			e0			10.2 mm
MAX2422EAI	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	28	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3.3 V	3.3	SMALL OUTLINE, SHRINK PITCH	SSOP28,.3	Other Telecom ICs	.65 mm	85 Cel		-40 Cel	TIN LEAD	DUAL	R-PDSO-G28		1	1.99 mm	5.29 mm	Not Qualified			e0			10.2 mm
TRF3040	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1				3.75 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel		-40 Cel		QUAD	S-PQFP-G48			1.6 mm	7 mm	Not Qualified						7 mm
MAX2312EEI	Maxim Integrated	BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	28	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			.0415 mA	2.75 V	3/5	SMALL OUTLINE, SHRINK PITCH	SSOP28,.25	Other Telecom ICs	.635 mm	85 Cel		-40 Cel	TIN LEAD	DUAL	R-PDSO-G28		1	1.73 mm	3.9 mm	Not Qualified			e0			9.89 mm
AD607ARS-REEL	Analog Devices	BASEBAND CIRCUIT	OTHER	GULL WING	20	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3 V		SMALL OUTLINE, SHRINK PITCH			.65 mm	85 Cel		-25 Cel	TIN LEAD	DUAL	R-PDSO-G20		1	2 mm	5.3 mm	Not Qualified			e0		240	7.2 mm
TCM4400EPN	Texas Instruments	BASEBAND CIRCUIT	OTHER	GULL WING	80	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1		BICMOS	.03 mA	3 V	3	FLATPACK	QFP80,.55SQ,20	Other Telecom ICs	.5 mm	85 Cel		-25 Cel		QUAD	S-PQFP-G80			1.6 mm	12 mm	Not Qualified				NOT SPECIFIED	NOT SPECIFIED	12 mm
TCM8030PN	Texas Instruments	BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	80	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1		CMOS		3 V	3/5	FLATPACK, LOW PROFILE, FINE PITCH	QFP80,.55SQ,20	Other Telecom ICs	.5 mm	85 Cel		-40 Cel		QUAD	S-PQFP-G80			1.6 mm	12 mm	Not Qualified				NOT SPECIFIED	NOT SPECIFIED	12 mm
TRF4900PW	Texas Instruments	RF AND BASEBAND CIRCUIT	COMMERCIAL	GULL WING	24	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS	.075 mA	3 V	3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP24,.25	Other Telecom ICs	.65 mm	70 Cel		0 Cel		DUAL	R-PDSO-G24			1.2 mm	4.4 mm	Not Qualified				NOT SPECIFIED	NOT SPECIFIED	7.8 mm
TRF4400PWG4	Texas Instruments	RF AND BASEBAND CIRCUIT	OTHER	GULL WING	24	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS	.075 mA	3 V	3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP24,.25	Other Telecom ICs	.65 mm	60 Cel		-20 Cel		DUAL	R-PDSO-G24			1.2 mm	4.4 mm	Not Qualified				NOT SPECIFIED	NOT SPECIFIED	7.8 mm
TRF4900PWG4	Texas Instruments	RF AND BASEBAND CIRCUIT	COMMERCIAL	GULL WING	24	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS		3 V	2.5/3.3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP24,.25	Other Telecom ICs	.65 mm	70 Cel		0 Cel		DUAL	R-PDSO-G24			1.2 mm	4.4 mm	Not Qualified				NOT SPECIFIED	NOT SPECIFIED	7.8 mm
SI4136-F-BT	Silicon Labs	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	24	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS	.031 mA	3 V	3/3.3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP24,.25	Other Telecom ICs	.65 mm	85 Cel		-40 Cel		DUAL	R-PDSO-G24			1.2 mm	4.4 mm	Not Qualified				NOT SPECIFIED	NOT SPECIFIED	7.8 mm
SI4136-F-GTR	Silicon Labs	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	24	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel		-40 Cel	MATTE TIN	DUAL	R-PDSO-G24		3	1.2 mm	4.4 mm	Not Qualified			e3		260	7.8 mm
SI4136-F-GT	Silicon Labs	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	24	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS	.031 mA	3 V	3/3.3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP24,.25	Other Telecom ICs	.65 mm	85 Cel		-40 Cel	MATTE TIN	DUAL	R-PDSO-G24		3	1.2 mm	4.4 mm	Not Qualified			e3		260	7.8 mm
CC1000PW	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS	.001 mA	3 V	2.5/3.3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP28,.25	Other Telecom ICs	.65 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G28		3	1.2 mm	4.4 mm	Not Qualified			e4	30	260	9.7 mm
TRF4400PWRG4	Texas Instruments	RF AND BASEBAND CIRCUIT	OTHER	GULL WING	24	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS	.075 mA	3 V	3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP24,.25	Other Telecom ICs	.65 mm	60 Cel		-20 Cel		DUAL	R-PDSO-G24			1.2 mm	4.4 mm	Not Qualified				NOT SPECIFIED	NOT SPECIFIED	7.8 mm
CC1000-RTB1	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS	.001 mA	3 V	2.5/3.3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP28,.25	Other Telecom ICs	.65 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G28		3	1.2 mm	4.4 mm	Not Qualified			e4	30	260	9.7 mm
CC1000-RTR1	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS	.001 mA	3 V	2.5/3.3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP28,.25	Other Telecom ICs	.65 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G28		3	1.2 mm	4.4 mm	Not Qualified			e4	30	260	9.7 mm
SA601DK,112	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel		-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	R-PDSO-G20		1	1.5 mm	4.4 mm	Not Qualified			e4	30	260	6.5 mm
SA601DK,118	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G20		1	1.5 mm	4.4 mm	Not Qualified			e4			6.5 mm
SA620DK,112	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel		-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	R-PDSO-G20		1	1.5 mm	4.4 mm	Not Qualified			e4	30	260	6.5 mm
SA620DK,118	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel		-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	R-PDSO-G20		1	1.5 mm	4.4 mm	Not Qualified			e4	30	260	6.5 mm
ADS58C20IPFPR	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	80	HTFQFP	SQUARE	PLASTIC/EPOXY	YES	1						FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH	QFP80,.55SQ,20		.5 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD	QUAD	S-PQFP-G80		3	1.2 mm	12 mm			3.45 V	e4	30	260	12 mm
ADS58C20IPFP	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	80	HTFQFP	SQUARE	PLASTIC/EPOXY	YES	1						FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH	QFP80,.55SQ,20		.5 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD	QUAD	S-PQFP-G80		3	1.2 mm	12 mm			3.45 V	e4	30	260	12 mm
ADS58C23IPFPR	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	80	HTFQFP	SQUARE	PLASTIC/EPOXY	YES	1						FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH	QFP80,.55SQ,20		.5 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD	QUAD	S-PQFP-G80		3	1.2 mm	12 mm			3.45 V	e4	30	260	12 mm
TRF4900PWR	Texas Instruments	RF AND BASEBAND CIRCUIT	COMMERCIAL	GULL WING	24	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS	.075 mA	3 V	3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP24,.25	Other Telecom ICs	.65 mm	60 Cel		-20 Cel		DUAL	R-PDSO-G24			1.2 mm	4.4 mm	Not Qualified				NOT SPECIFIED	NOT SPECIFIED	7.8 mm
MAX2606EUT-T	Maxim Integrated	BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	6	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				2.75 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.95 mm	85 Cel		-40 Cel	TIN LEAD	DUAL	R-PDSO-G6		1	1.45 mm	1.625 mm	Not Qualified			e0			2.9 mm
MAX2607EUT-T	Maxim Integrated	BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	6	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				2.75 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.95 mm	85 Cel		-40 Cel	TIN LEAD	DUAL	R-PDSO-G6		1	1.45 mm	1.625 mm	Not Qualified			e0			2.9 mm
MAX2608EUT-T	Maxim Integrated	BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	6	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				2.75 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.95 mm	85 Cel		-40 Cel	TIN LEAD	DUAL	R-PDSO-G6		1	1.45 mm	1.625 mm	Not Qualified			e0			2.9 mm
MAX2609EUT-T	Maxim Integrated	BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	6	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				2.75 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.95 mm	85 Cel		-40 Cel	TIN LEAD	DUAL	R-PDSO-G6		1	1.45 mm	1.625 mm	Not Qualified			e0			2.9 mm
TRF6901PTR	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1			.04 mA	2.7 V	2/3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	Other Telecom ICs	.5 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD	QUAD	S-PQFP-G48		1	1.6 mm	7 mm	Not Qualified			e4	30	260	7 mm
MAX2620EUA	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1		BIPOLAR		3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel		-40 Cel	TIN LEAD	DUAL	S-PDSO-G8		1	1.1 mm	3 mm	Not Qualified			e0	20	240	3 mm
MAX4003EUA	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1		CMOS		3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel		-40 Cel	TIN LEAD	DUAL	S-PDSO-G8		1	1.1 mm	3 mm	Not Qualified			e0			3 mm
TRF5901PT	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1		CMOS	.053 mA	3 V	3	FLATPACK, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	Other Telecom ICs	.5 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD	QUAD	S-PQFP-G48		1	1.6 mm	7 mm	Not Qualified			e4	30	260	7 mm
DSL01-010SC5	STMicroelectronics	BASEBAND CIRCUIT		GULL WING	5		RECTANGULAR	PLASTIC/EPOXY	YES							SMALL OUTLINE							NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G5		1			Not Qualified			e4	30	260
DSL01-024SC5	STMicroelectronics	BASEBAND CIRCUIT		GULL WING	5		RECTANGULAR	PLASTIC/EPOXY	YES							SMALL OUTLINE							NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G5		1			Not Qualified			e4	30	260
TRF6903PTR	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1		CMOS		2.7 V	2.5/3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	Other Telecom ICs	.5 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD	QUAD	S-PQFP-G48		1	1.6 mm	7 mm	Not Qualified			e4	30	260	7 mm
TRF4903PW	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	24	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			.042 mA	2.7 V	2.7	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP24,.25	Other Telecom ICs	.65 mm	85 Cel		-40 Cel		DUAL	R-PDSO-G24			1.2 mm	4.4 mm	Not Qualified				NOT SPECIFIED	NOT SPECIFIED	7.8 mm
MAX2620EUA-T	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1		BIPOLAR		3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel		-40 Cel	TIN LEAD	DUAL	S-PDSO-G8		1	1.1 mm	3 mm	Not Qualified			e0			3 mm
MAX2685EEE-T	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	16	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3 V		SMALL OUTLINE, SHRINK PITCH			.635 mm	85 Cel		-40 Cel	TIN LEAD	DUAL	R-PDSO-G16		1	1.73 mm	3.9 mm	Not Qualified			e0			4.89 mm
MAX2690EUB-T	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	10	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.5 mm	85 Cel		-40 Cel	TIN LEAD	DUAL	R-PDSO-G10		1	1.092 mm	2.9465 mm	Not Qualified			e0			3 mm
MAX4003EUA-T	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1		CMOS		3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel		-40 Cel	TIN LEAD	DUAL	S-PDSO-G8		1	1.1 mm	3 mm	Not Qualified			e0			3 mm

Cellphone ICs

Cellphone ICs (Integrated Circuits) are the electronic components that provide the processing power and functionality for modern cellphones. They are responsible for a wide range of functions, including signal processing, data storage, and communication protocols.

Some common types of cellphone ICs include:

1. Baseband processors: These ICs are responsible for handling the core functions of a cellphone, such as making calls and sending messages. They also manage the cellphone's power consumption and system resources.

2. Radio frequency (RF) transceivers: These ICs are responsible for transmitting and receiving RF signals over cellular networks. They also provide the ability to switch between different network bands and frequencies.

3. Power management ICs: These ICs manage the power supply and battery life of a cellphone. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

4. Memory ICs: These ICs provide storage for the cellphone's operating system, applications, and user data. They include flash memory, RAM, and other types of non-volatile memory.

5. Sensor ICs: These ICs provide sensing capabilities, such as accelerometers, gyroscopes, and proximity sensors. They enable the cellphone to detect motion, orientation, and other environmental conditions.