GULL WING Cellphone ICs 66

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
AD8348ARUZ	Analog Devices	BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR		5 V	5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP28,.25	Other Telecom ICs	.65 mm	85 Cel	-40 Cel	MATTE TIN	DUAL	R-PDSO-G28	1	1.2 mm	4.4 mm	Not Qualified	e3	30	260	9.7 mm
TRF4903PWR	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	24	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		.043 mA	2.7 V	2.7	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP24,.25	Other Telecom ICs	.65 mm	85 Cel	-40 Cel		DUAL	R-PDSO-G24		1.2 mm	4.4 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	7.8 mm
TRF4900PWRG4	Texas Instruments	RF AND BASEBAND CIRCUIT	COMMERCIAL	GULL WING	24	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	.075 mA	3 V	3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP24,.25	Other Telecom ICs	.65 mm	60 Cel	-20 Cel		DUAL	R-PDSO-G24		1.2 mm	4.4 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	7.8 mm
AD607ARSZ	Analog Devices	BASEBAND CIRCUIT	OTHER	GULL WING	20	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3 V		SMALL OUTLINE, SHRINK PITCH			.65 mm	85 Cel	-25 Cel	MATTE TIN	DUAL	R-PDSO-G20	1	2 mm	5.3 mm	Not Qualified	e3		260	7.2 mm
TRF4903PWG4	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	24	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		.042 mA	2.7 V	2.7	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP24,.25	Other Telecom ICs	.65 mm	85 Cel	-40 Cel		DUAL	R-PDSO-G24		1.2 mm	4.4 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	7.8 mm
TRF4903PWRG4	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	24	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		.043 mA	2.7 V	2.7	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP24,.25	Other Telecom ICs	.65 mm	85 Cel	-40 Cel		DUAL	R-PDSO-G24		1.2 mm	4.4 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	7.8 mm
ADF7901BRUZ-RL	Analog Devices	RF AND BASEBAND CIRCUIT	COMMERCIAL	GULL WING	24	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3 V	3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP24,.25	Other Telecom ICs	.65 mm	50 Cel	0 Cel	MATTE TIN	DUAL	R-PDSO-G24	1	1.2 mm	4.4 mm	Not Qualified	e3	30	260	7.8 mm
AD607ARSZ-REEL	Analog Devices	BASEBAND CIRCUIT	OTHER	GULL WING	20	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3 V		SMALL OUTLINE, SHRINK PITCH			.65 mm	85 Cel	-25 Cel	MATTE TIN	DUAL	R-PDSO-G20	1	2 mm	5.3 mm	Not Qualified	e3		260	7.2 mm
TRF6903PTRG4	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		2.7 V	2.5/3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	S-PQFP-G48	1	1.6 mm	7 mm	Not Qualified	e4	30	260	7 mm
CC1050PWG3	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	24	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		3 V	2.5/3.3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP24,.25	Other Telecom ICs	.65 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G24	3	1.2 mm	4.4 mm	Not Qualified	e4	30	260	7.8 mm
CC1050PWRG3	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	24	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		3 V	2.5/3.3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP24,.25	Other Telecom ICs	.65 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G24	3	1.2 mm	4.4 mm	Not Qualified	e4	30	260	7.8 mm
CC1050PW	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	24	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		3 V	2.5/3.3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP24,.25	Other Telecom ICs	.65 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G24	3	1.2 mm	4.4 mm	Not Qualified	e4	30	260	7.8 mm
TRF6900APTG4	Texas Instruments	RF AND BASEBAND CIRCUIT	COMMERCIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	.05 mA	3 V	3	FLATPACK, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	Other Telecom ICs	.5 mm	60 Cel	-20 Cel	NICKEL PALLADIUM GOLD	QUAD	S-PQFP-G48	1	1.6 mm	7 mm	Not Qualified	e4	30	260	7 mm
MAX4003EUA/GH9-T	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1			3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel		DUAL	S-PDSO-G8	1	1.1 mm	3 mm					3 mm
BLM6G10-30G,118	NXP Semiconductors	BASEBAND CIRCUIT		GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			28 V		SMALL OUTLINE			1.37 mm			TIN	DUAL	R-PDSO-G16	3	3.6 mm	11 mm		e3	30	245	15.9 mm
BLM6G10-30G,135	NXP Semiconductors	BASEBAND CIRCUIT		GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			28 V		SMALL OUTLINE			1.37 mm			Tin (Sn)	DUAL	R-PDSO-G16		3.6 mm	11 mm		e3			15.9 mm
A2I25H060GNR1	NXP Semiconductors	RF AND BASEBAND CIRCUIT		GULL WING	17	HSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	LDMOS		28 V		SMALL OUTLINE, HEAT SINK/SLUG						TIN	DUAL	R-PDSO-G17	3	2.67 mm	9.02 mm		e3	40	260	17.53 mm
A2I25H060NR1	NXP Semiconductors	RF AND BASEBAND CIRCUIT		GULL WING	17	HSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	LDMOS		28 V		SMALL OUTLINE, HEAT SINK/SLUG						TIN	DUAL	R-PDSO-G17	3	2.67 mm	9.02 mm		e3	40	260	17.53 mm

Cellphone ICs

Cellphone ICs (Integrated Circuits) are the electronic components that provide the processing power and functionality for modern cellphones. They are responsible for a wide range of functions, including signal processing, data storage, and communication protocols.

Some common types of cellphone ICs include:

1. Baseband processors: These ICs are responsible for handling the core functions of a cellphone, such as making calls and sending messages. They also manage the cellphone's power consumption and system resources.

2. Radio frequency (RF) transceivers: These ICs are responsible for transmitting and receiving RF signals over cellular networks. They also provide the ability to switch between different network bands and frequencies.

3. Power management ICs: These ICs manage the power supply and battery life of a cellphone. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

4. Memory ICs: These ICs provide storage for the cellphone's operating system, applications, and user data. They include flash memory, RAM, and other types of non-volatile memory.

5. Sensor ICs: These ICs provide sensing capabilities, such as accelerometers, gyroscopes, and proximity sensors. They enable the cellphone to detect motion, orientation, and other environmental conditions.