NO LEAD Cellphone ICs 238

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	No. of Channels	Technology	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Maximum Gain Tolerance	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
ALM-2506-BLKG	Broadcom	RF AND BASEBAND CIRCUIT		NO LEAD	6	HTSON	SQUARE	PLASTIC/EPOXY	YES	1				2.85 V		SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE			.65 mm					DUAL		S-PDSO-N6		1.2 mm	2 mm	Not Qualified				2 mm
ALM-2506-TR1G	Broadcom	RF AND BASEBAND CIRCUIT		NO LEAD	6	HTSON	SQUARE	PLASTIC/EPOXY	YES	1				2.85 V		SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE			.65 mm					DUAL		S-PDSO-N6		1.2 mm	2 mm	Not Qualified				2 mm
ALM-2506-TR2G	Broadcom	RF AND BASEBAND CIRCUIT		NO LEAD	6	HTSON	SQUARE	PLASTIC/EPOXY	YES	1				2.85 V		SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE			.65 mm					DUAL		S-PDSO-N6		1.2 mm	2 mm	Not Qualified				2 mm
TRF371109IRGZR	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				5 V	5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		NICKEL PALLADIUM GOLD SILVER	QUAD		S-PQCC-N48	2	1 mm	7 mm	Not Qualified	e4	30	260	7 mm
SX8653IWLTRT	Semtech	BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	14	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1				1.8 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel			DUAL		R-PDSO-N14		.8 mm	3 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	4 mm
AD6649BCPZ	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	64	HVQCCN	SQUARE	UNSPECIFIED	YES	1			.3 mA	1.8 V	1.8	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC64,.35SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		MATTE TIN	QUAD		S-XQCC-N64	3	1 mm	9 mm	Not Qualified	e3	30	260	9 mm
ADRF6602ACPZ-R7	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	1		BICMOS		5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		MATTE TIN	QUAD		S-XQCC-N40	3	1 mm	6 mm	Not Qualified	e3			6 mm
AD6643BCPZ-250	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	64	HVQCCN	SQUARE	UNSPECIFIED	YES	2		CMOS	.275 mA	1.8 V	1.8	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC64,.35SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		MATTE TIN	QUAD		S-XQCC-N64	3	1 mm	9 mm	Not Qualified	e3	30	260	9 mm
CC110LRTKR	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3 V	1.8/3.6	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC20,.16SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N20	3	.9 mm	4 mm	Not Qualified	e4	30	260	4 mm
CC110LRTKT	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N20	3	.9 mm	4 mm		e4	30	260	4 mm
CC113LRTKR	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N20	3	.9 mm	4 mm		e4	30	260	4 mm
CC113LRTKT	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N20	3	.9 mm	4 mm		e4	30	260	4 mm
CC115LRTKR	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3.6 V	1.8/3.6	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC20,.16SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N20	3	.9 mm	4 mm	Not Qualified	e4	30	260	4 mm
CC115LRTKT	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3.6 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N20	3	.9 mm	4 mm		e4	30	260	4 mm
ACFM-7103-BLK	Broadcom	RF FRONT END CIRCUIT		NO LEAD	7		RECTANGULAR	UNSPECIFIED	NO							MICROELECTRONIC ASSEMBLY								DUAL		R-XDMA-N7
ACFM-7103-TR1	Broadcom	RF FRONT END CIRCUIT		NO LEAD	7		RECTANGULAR	UNSPECIFIED	NO							MICROELECTRONIC ASSEMBLY								DUAL		R-XDMA-N7
SE5007BT-R	Skyworks Solutions	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	1				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel			QUAD		S-XQCC-N16		.6 mm	3 mm			NOT SPECIFIED	NOT SPECIFIED	3 mm
TRF3705IRGER	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N24	2	1 mm	4 mm	Not Qualified	e4	30	260	4 mm
TRF3705IRGET	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N24	2	1 mm	4 mm	Not Qualified	e4	30	260	4 mm
ADL5363ACPZ-R7	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	1		BICMOS		5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.65 mm	85 Cel	-40 Cel		MATTE TIN	QUAD		S-XQCC-N20	3	.9 mm	5 mm		e3			5 mm
AD6672BCPZRL7-250	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1			.145 mA	1.8 V	1.8	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		MATTE TIN	QUAD		S-XQCC-N32	3	.8 mm	5 mm	Not Qualified	e3	30	260	5 mm
BGA7210	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel			QUAD		S-PQCC-N32	1	.85 mm	5 mm					5 mm
SKY65174-21	Skyworks Solutions	RF FRONT END CIRCUIT	OTHER	NO LEAD	10		SQUARE	UNSPECIFIED	NO	1				3.3 V		MICROELECTRONIC ASSEMBLY			.5 mm	85 Cel	-35 Cel			DUAL		S-XDMA-N10		.95 mm	4 mm			NOT SPECIFIED	NOT SPECIFIED	4 mm
AD6673BCPZ-250	Analog Devices	BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1		CMOS	.282 mA	1.8 V	1.8	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		MATTE TIN	QUAD		S-XQCC-N48	3	.8 mm	7 mm	Not Qualified	e3	30	260	7 mm
AD6673BCPZRL7-250	Analog Devices	BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1		CMOS	.282 mA	1.8 V	1.8	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		MATTE TIN	QUAD		S-XQCC-N48	3	.8 mm	7 mm	Not Qualified	e3	30	260	7 mm
ADRF6701ACPZ-R7	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	40	QCCN	SQUARE	PLASTIC/EPOXY	YES			BICMOS		5 V	5	CHIP CARRIER	LCC40,.24SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel			QUAD		S-PQCC-N40				Not Qualified		NOT SPECIFIED	NOT SPECIFIED
SKY65313-21	Skyworks Solutions	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	28		SQUARE	UNSPECIFIED	YES	1				3.3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel			QUAD		S-XQMA-N28	3	1 mm	6 mm					6 mm
LMH6523SQE/NOPB	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	54	HVQCCN	RECTANGULAR	UNSPECIFIED	YES	1	4		485 mA	5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	25.74 dB	MATTE TIN	QUAD		R-XQCC-N54	2	.8 mm	5.5 mm		e3	30	260	10 mm
CC110LRGPT	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3 V	1.8/3.6	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC20,.16SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		NICKEL PALLADIUM GOLD SILVER	QUAD	.6 Mbps	S-PQCC-N20	3	1 mm	4 mm	Not Qualified	e4	30	260	4 mm
CC113LRGPT	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3 V	1.8/3.6	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC20,.16SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)	QUAD	.6 Mbps	S-PQCC-N20	3	1 mm	4 mm	Not Qualified	e4	NOT SPECIFIED	260	4 mm
CC2510F16RHHR	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	36	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1		CMOS		3 V	2.5/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC36,.25SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)	QUAD		S-PQCC-N36	3	1 mm	6 mm	Not Qualified	e4	NOT SPECIFIED	260	6 mm
CC2510F16RHHT	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	36	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1		CMOS		3 V	2.5/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC36,.25SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)	QUAD		S-PQCC-N36	3	1 mm	6 mm	Not Qualified	e4	NOT SPECIFIED	260	6 mm
CC2510F32RHHT	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	36	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1		CMOS		3 V	2.5/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC36,.25SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)	QUAD		S-PQCC-N36	3	1 mm	6 mm	Not Qualified	e4	NOT SPECIFIED	260	6 mm
CC2510F8RHHR	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	36	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1		CMOS		3 V	2.5/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC36,.25SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)	QUAD		S-PQCC-N36	3	1 mm	6 mm	Not Qualified	e4	NOT SPECIFIED	260	6 mm
CC2510F8RHHT	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	36	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1		CMOS		3 V	2.5/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC36,.25SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)	QUAD		S-PQCC-N36	3	1 mm	6 mm	Not Qualified	e4	NOT SPECIFIED	260	6 mm
CC2511F16RSPG3	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	36	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1		CMOS		3 V	3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC36,.25SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N36	3	.9 mm	6 mm	Not Qualified	e4	30	260	6 mm
CC2511F16RSPRG3	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	36	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1		CMOS		3 V	3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC36,.25SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N36	3	.9 mm	6 mm	Not Qualified	e4	30	260	6 mm
NRF24L01-REEL7	Nordic Semiconductor Asa	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	1				3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		MATTE TIN	QUAD		S-XQCC-N20	2	.95 mm	4 mm		e3		260	4 mm
NRF24L01-REEL	Nordic Semiconductor Asa	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	1				3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		MATTE TIN	QUAD		S-XQCC-N20	2	.95 mm	4 mm		e3		260	4 mm
NRF24L01	Nordic Semiconductor Asa	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	1				3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		MATTE TIN	QUAD		S-XQCC-N20	2	.95 mm	4 mm		e3		260	4 mm
TRF37T05IRGER	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N24	2	1 mm	4 mm		e4	30	260	4 mm
TRF37T05IRGET	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N24	2	1 mm	4 mm		e4	30	260	4 mm
ADRF6620ACPZ-R7	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1		BICMOS		5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel			QUAD		S-XQCC-N48		.8 mm	7 mm			NOT SPECIFIED	NOT SPECIFIED	7 mm
SKY73208-11	Skyworks Solutions	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	36		SQUARE	UNSPECIFIED	YES	1		BICMOS		3.3 V		MICROELECTRONIC ASSEMBLY			.5 mm	85 Cel	-40 Cel			QUAD		S-XQMA-N36	3	1.45 mm	6 mm				260	6 mm
SKY13437-11	Skyworks Solutions	RF AND BASEBAND CIRCUIT	OTHER	NO LEAD	22		RECTANGULAR	UNSPECIFIED	YES	1				2.85 V		MICROELECTRONIC ASSEMBLY			.4 mm	90 Cel	-35 Cel			QUAD		R-XQMA-N22	3	.9 mm	2.5 mm				260	3.2 mm
MAX2010ETI	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	28	HVQCCN	SQUARE	UNSPECIFIED	YES	1		BICMOS		5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		TIN LEAD	QUAD		S-XQCC-N28	1	.8 mm	5 mm		e0			5 mm
BGA713N7E6327XTSA1	Infineon Technologies	RF AND BASEBAND CIRCUIT	OTHER	NO LEAD	6	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1				2.8 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-30 Cel		TIN	DUAL		R-PDSO-N6	1	.4 mm	1.3 mm		e3			2 mm
ADF7021-NBCPZ	Analog Devices	BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1		CMOS		3 V	2.5/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		MATTE TIN	QUAD		S-XQCC-N48	3	1 mm	7 mm	Not Qualified	e3	30	260	7 mm

Cellphone ICs

Cellphone ICs (Integrated Circuits) are the electronic components that provide the processing power and functionality for modern cellphones. They are responsible for a wide range of functions, including signal processing, data storage, and communication protocols.

Some common types of cellphone ICs include:

1. Baseband processors: These ICs are responsible for handling the core functions of a cellphone, such as making calls and sending messages. They also manage the cellphone's power consumption and system resources.

2. Radio frequency (RF) transceivers: These ICs are responsible for transmitting and receiving RF signals over cellular networks. They also provide the ability to switch between different network bands and frequencies.

3. Power management ICs: These ICs manage the power supply and battery life of a cellphone. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

4. Memory ICs: These ICs provide storage for the cellphone's operating system, applications, and user data. They include flash memory, RAM, and other types of non-volatile memory.

5. Sensor ICs: These ICs provide sensing capabilities, such as accelerometers, gyroscopes, and proximity sensors. They enable the cellphone to detect motion, orientation, and other environmental conditions.