NO LEAD Cellphone ICs 238

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Output Code	No. of Channels	Technology	Screening Level	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Resolution (um)	Minimum Operating Temperature	Terminal Finish	Maximum Output Voltage	Terminal Position	JESD-30 Code	Output (V)	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Input Type	Additional Features	Maximum Analog Input	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
ADF4360-8BCPZRL	Analog Devices	BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1			BICMOS			3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20	Other Telecom ICs	.5 mm	85 Cel		-40 Cel	MATTE TIN		QUAD	S-XQCC-N24		3	1 mm	4 mm	Not Qualified				e3	30	260	4 mm
MAX2388EGC-T	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	12	VQCCN	SQUARE	UNSPECIFIED	YES	1						2.7 V		CHIP CARRIER, VERY THIN PROFILE			.5 mm	85 Cel		-40 Cel	TIN LEAD		QUAD	S-XQCC-N12		1	.9 mm	3 mm	Not Qualified				e0			3 mm
MAX5865ETM-T	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1	OFFSET BINARY	2	CMOS			3 V	1.8,3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	Codecs	.5 mm	85 Cel	8	-40 Cel	TIN LEAD	3 V	QUAD	S-XQCC-N48	VOLTAGE		.8 mm	7 mm	Not Qualified	DIFFERENTIAL		1.5 V	e0			7 mm
MAX9989ETP-T	Maxim Integrated	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	20	VQCCN	SQUARE	UNSPECIFIED	YES	1			BICMOS			5 V		CHIP CARRIER, VERY THIN PROFILE			.65 mm	85 Cel		-40 Cel	TIN LEAD		QUAD	S-XQCC-N20		1	.8 mm	5 mm	Not Qualified				e0			5 mm
AD8340ACPZ-WP	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1			BIPOLAR		.15 mA	5 V	5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20	Other Telecom ICs	.5 mm	85 Cel		-40 Cel	MATTE TIN		QUAD	S-XQCC-N24		3	1 mm	4 mm	Not Qualified				e3		260	4 mm
ADF4360-0BCPZ	Analog Devices	BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1			BICMOS			3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20	Other Telecom ICs	.5 mm	85 Cel		-40 Cel	MATTE TIN		QUAD	S-XQCC-N24		3	1 mm	4 mm	Not Qualified				e3	30	260	4 mm
ADF4360-0BCPZRL	Analog Devices	BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1			BICMOS			3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20	Other Telecom ICs	.5 mm	85 Cel		-40 Cel	MATTE TIN		QUAD	S-XQCC-N24		3	1 mm	4 mm	Not Qualified				e3	30	260	4 mm
ADF4360-1BCPZ	Analog Devices	BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1			BICMOS			3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20	Other Telecom ICs	.5 mm	85 Cel		-40 Cel	MATTE TIN		QUAD	S-XQCC-N24		3	1 mm	4 mm	Not Qualified				e3	30	260	4 mm
ADF4360-2BCPZ	Analog Devices	BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1			BICMOS			3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20	Other Telecom ICs	.5 mm	85 Cel		-40 Cel	MATTE TIN		QUAD	S-XQCC-N24		3	1 mm	4 mm	Not Qualified				e3	30	260	4 mm
ADF4360-3BCPZ	Analog Devices	BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1			BICMOS			3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20	Other Telecom ICs	.5 mm	85 Cel		-40 Cel	MATTE TIN		QUAD	S-XQCC-N24		3	1 mm	4 mm	Not Qualified				e3	30	260	4 mm
ADF4360-3BCPZRL	Analog Devices	BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1			BICMOS			3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20	Other Telecom ICs	.5 mm	85 Cel		-40 Cel	MATTE TIN		QUAD	S-XQCC-N24		3	1 mm	4 mm	Not Qualified				e3	30	260	4 mm
ADF4360-3BCPZRL7	Analog Devices	BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1			BICMOS			3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20	Other Telecom ICs	.5 mm	85 Cel		-40 Cel	MATTE TIN		QUAD	S-XQCC-N24		3	1 mm	4 mm	Not Qualified				e3	30	260	4 mm
ADF4360-4BCPZ	Analog Devices	BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1			BICMOS			3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20	Other Telecom ICs	.5 mm	85 Cel		-40 Cel	MATTE TIN		QUAD	S-XQCC-N24		3	1 mm	4 mm	Not Qualified				e3	30	260	4 mm
ADF4360-4BCPZRL	Analog Devices	BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1			BICMOS			3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20	Other Telecom ICs	.5 mm	85 Cel		-40 Cel	MATTE TIN		QUAD	S-XQCC-N24		3	1 mm	4 mm	Not Qualified				e3	30	260	4 mm
ADF4360-5BCPZ	Analog Devices	BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1			BICMOS			3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20	Other Telecom ICs	.5 mm	85 Cel		-40 Cel	MATTE TIN		QUAD	S-XQCC-N24		3	1 mm	4 mm	Not Qualified				e3	30	260	4 mm
ADF4360-6BCPZ	Analog Devices	BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1			BICMOS			3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20	Other Telecom ICs	.5 mm	85 Cel		-40 Cel	MATTE TIN		QUAD	S-XQCC-N24		3	1 mm	4 mm	Not Qualified				e3	30	260	4 mm
ADF4360-6BCPZRL7	Analog Devices	BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1			BICMOS			3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20	Other Telecom ICs	.5 mm	85 Cel		-40 Cel	MATTE TIN		QUAD	S-XQCC-N24		3	1 mm	4 mm	Not Qualified				e3	30	260	4 mm
CC1020RUZR	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1						3 V	3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.27SQ,25	Other Telecom ICs	.65 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD		QUAD	S-PQCC-N32		3	1 mm	7 mm	Not Qualified				e4	30	260	7 mm
CC1020RUZ	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1						3 V	3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.27SQ,25	Other Telecom ICs	.65 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD		QUAD	S-PQCC-N32		3	1 mm	7 mm	Not Qualified				e4	30	260	7 mm
CC1101RTKG3	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1						3 V	1.8/3.6	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC20,.16SQ,20	Other Telecom ICs	.5 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD		QUAD	S-PQCC-N20		3	.95 mm	4 mm	Not Qualified				e4	30	260	4 mm
CC1101RTKRG3	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1						3 V	1.8/3.6	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC20,.16SQ,20	Other Telecom ICs	.5 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD		QUAD	S-PQCC-N20		3	.95 mm	4 mm	Not Qualified				e4	30	260	4 mm
CC2420-RTB1	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1			CMOS			1.8 V	1.8,1.8/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	Other Telecom ICs	.5 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD		QUAD	S-XQCC-N48		3	.9 mm	7 mm	Not Qualified				e4	30	260	7 mm
CC2420-RTR1	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1			CMOS			1.8 V	1.8,1.8/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	Other Telecom ICs	.5 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD		QUAD	S-XQCC-N48		3	.9 mm	7 mm	Not Qualified				e4	30	260	7 mm
ADF7025BCPZ	Analog Devices	BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1						3 V	2.5/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	Other Telecom ICs	.5 mm	85 Cel		-40 Cel	MATTE TIN		QUAD	S-XQCC-N48		3	1 mm	7 mm	Not Qualified				e3		260	7 mm
CC2420Z-RTB1	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1			CMOS			1.8 V	1.8,1.8/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	Other Telecom ICs	.5 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD		QUAD	S-XQCC-N48		3	.9 mm	7 mm	Not Qualified				e4	30	260	7 mm
SKY65048-360LF	Skyworks Solutions	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	8	HVSON	SQUARE	PLASTIC/EPOXY	YES	1						5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel		-40 Cel	MATTE TIN		DUAL	S-PDSO-N8		1	1 mm	2 mm	Not Qualified				e3		260	2 mm
ADF7021-VBCPZ-RL	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1						3 V	2.5/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	Other Telecom ICs	.5 mm	85 Cel		-40 Cel	MATTE TIN		QUAD	S-XQCC-N48		3	1 mm	7 mm	Not Qualified				e3	30	260	7 mm
ADF7021-VBCPZ	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1						3 V	2.5/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	Other Telecom ICs	.5 mm	85 Cel		-40 Cel	MATTE TIN		QUAD	S-XQCC-N48		3	1 mm	7 mm	Not Qualified				e3	30	260	7 mm
SKY73083-21	Skyworks Solutions	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	36	HQCCN	SQUARE	UNSPECIFIED	YES	1			BICMOS			5 V		CHIP CARRIER, HEAT SINK/SLUG			.5 mm	85 Cel		-40 Cel			QUAD	S-XQCC-N36		3	1.15 mm	6 mm	Not Qualified						260	6 mm
TRF3702IRHCG4	Texas Instruments	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1					.17 mA	5 V	5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC16,.16SQ,32	Other Telecom ICs	.8 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD		QUAD	S-PQCC-N16		2	1 mm	4 mm	Not Qualified				e4	30	260	4 mm
ADF7020-1BCPZ	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1						3 V	2.5/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	Other Telecom ICs	.5 mm	85 Cel		-40 Cel	MATTE TIN		QUAD	S-XQCC-N48		3	1 mm	7 mm	Not Qualified				e3	30	260	7 mm
ADRF5545ABCPZN-RL	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	1						5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	105 Cel		-40 Cel	NICKEL PALLADIUM GOLD		QUAD	S-XQCC-N40		3	1 mm	6 mm					e4	30	260	6 mm
LARA-R211-02B	U-blox Ag	RF AND BASEBAND CIRCUIT		NO LEAD	100	LGA	RECTANGULAR	UNSPECIFIED	YES	1				TS 16949	300 mA	3.8 V		GRID ARRAY	LGA100(UNSPEC)			65 Cel		-20 Cel			BOTTOM	R-XLGA-N100		4	2.87 mm	24 mm			-40 to 85 extended operating temp available					26 mm
LISA-U200-03S	U-blox Ag	RF AND BASEBAND CIRCUIT		NO LEAD	76	QMA	RECTANGULAR	UNSPECIFIED	YES	1						3.8 V		MICROELECTRONIC ASSEMBLY			1.1 mm	85 Cel		-40 Cel			QUAD	R-XQMA-N76			2.87 mm	22.4 mm								33.2 mm
ADRF5549BCPZN-R7	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	1						5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	105 Cel		-40 Cel			QUAD	S-XQCC-N40		3	1 mm	6 mm							260	6 mm
ADRF5549BCPZN-RL	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	1						5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	105 Cel		-40 Cel			QUAD	S-XQCC-N40		3	1 mm	6 mm							260	6 mm
ADRF5547BCPZN-RL	Analog Devices	RF FRONT END CIRCUIT	INDUSTRIAL	NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	1						5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20		.5 mm	105 Cel		-40 Cel			QUAD	S-XQCC-N40		3	1 mm	6 mm						30	260	6 mm
TOBY-L210-03S	U-blox Ag	RF AND BASEBAND CIRCUIT		NO LEAD	152	LGA	RECTANGULAR	UNSPECIFIED	YES	1						3.8 V		GRID ARRAY				65 Cel		-20 Cel			BOTTOM	R-XBGA-N152		4	2.87 mm	24.8 mm			-40 to 85 extended operating temp available					35.6 mm
TOBY-L210-65S	U-blox Ag	RF AND BASEBAND CIRCUIT		NO LEAD	152	LGA	RECTANGULAR	UNSPECIFIED	YES	1						3.8 V		GRID ARRAY				65 Cel		-20 Cel			BOTTOM	R-XBGA-N152		4	2.87 mm	24.8 mm			-40 to 85 extended operating temp available					35.6 mm
TOBY-L280-03S	U-blox Ag	RF AND BASEBAND CIRCUIT		NO LEAD	152	LGA	RECTANGULAR	UNSPECIFIED	YES	1						3.8 V		GRID ARRAY				65 Cel		-20 Cel			BOTTOM	R-XBGA-N152		4	2.87 mm	24.8 mm			-40 to 85 extended operating temp available					35.6 mm
ADRF6658BCPZ-RL7	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1						3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	105 Cel		-40 Cel	MATTE TIN		QUAD	S-XQCC-N48		3	.8 mm	7 mm					e3	30	260	7 mm
ADRF6658BCPZ	Analog Devices	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1						3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	105 Cel		-40 Cel	MATTE TIN		QUAD	S-XQCC-N48		3	.8 mm	7 mm					e3	30	260	7 mm
STA8089FGBTR	STMicroelectronics	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	YES	1			CMOS			1.2 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	85 Cel		-40 Cel	MATTE TIN		QUAD	S-XQCC-N56		3	.9 mm	7 mm					e3	30	260	7 mm
STA8089FGB	STMicroelectronics	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	YES	1			CMOS			1.2 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	85 Cel		-40 Cel	MATTE TIN		QUAD	S-XQCC-N56		3	.9 mm	7 mm					e3	30	260	7 mm
STA8089FGTR	STMicroelectronics	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	YES	1			CMOS			1.2 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	85 Cel		-40 Cel	MATTE TIN		QUAD	S-XQCC-N56		3	.9 mm	7 mm					e3	30	260	7 mm
STA8089FG	STMicroelectronics	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	YES	1			CMOS			1.2 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	85 Cel		-40 Cel	MATTE TIN		QUAD	S-XQCC-N56		3	.9 mm	7 mm					e3		260	7 mm
BGA7204,115	NXP Semiconductors	BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1						5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel		-40 Cel			QUAD	S-PQCC-N32		1	.85 mm	5 mm						30	260	5 mm
BGA7210,515	NXP Semiconductors	RF AND BASEBAND CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1						5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel		-40 Cel			QUAD	S-PQCC-N32			.85 mm	5 mm								5 mm

Cellphone ICs

Cellphone ICs (Integrated Circuits) are the electronic components that provide the processing power and functionality for modern cellphones. They are responsible for a wide range of functions, including signal processing, data storage, and communication protocols.

Some common types of cellphone ICs include:

1. Baseband processors: These ICs are responsible for handling the core functions of a cellphone, such as making calls and sending messages. They also manage the cellphone's power consumption and system resources.

2. Radio frequency (RF) transceivers: These ICs are responsible for transmitting and receiving RF signals over cellular networks. They also provide the ability to switch between different network bands and frequencies.

3. Power management ICs: These ICs manage the power supply and battery life of a cellphone. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

4. Memory ICs: These ICs provide storage for the cellphone's operating system, applications, and user data. They include flash memory, RAM, and other types of non-volatile memory.

5. Sensor ICs: These ICs provide sensing capabilities, such as accelerometers, gyroscopes, and proximity sensors. They enable the cellphone to detect motion, orientation, and other environmental conditions.