INDUSTRIAL Network Interfaces 107

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Part RoHS Manufacturer Telecom IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Surface Mount No. of Functions No. of Channels Technology Screening Level Nominal Negative Supply Voltage No. of Transceivers Maximum Supply Current Nominal Supply Voltage Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category Terminal Pitch Maximum Operating Temperature Minimum Operating Temperature Terminal Finish Terminal Position Data Rate JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length

2746977

Phoenix Contact

INDUSTRIAL

GULL WING

44

QFP

SQUARE

PLASTIC/EPOXY

YES

CMOS

1

40 mA

5 V

5

FLATPACK

QFP44,.47SQ,32

Network Interfaces

.8 mm

85 Cel

-40 Cel

QUAD

2 Mbps

S-PQFP-G44

Not Qualified

2746980

Phoenix Contact

INDUSTRIAL

GULL WING

64

QFP

SQUARE

PLASTIC/EPOXY

YES

CMOS

1

40 mA

5 V

5

FLATPACK

TQFP64,.63SQ,32

Network Interfaces

.8 mm

85 Cel

-40 Cel

QUAD

2 Mbps

S-PQFP-G64

Not Qualified

KSZ8051RNLUTR

Micrel

ETHERNET TRANSCEIVER

INDUSTRIAL

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

YES

1

AEC-Q100

1

3.3 V

3.3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC32,.2SQ,20

Network Interfaces

.5 mm

85 Cel

-40 Cel

QUAD

100 Mbps

S-PQCC-N32

.9 mm

5 mm

Not Qualified

5 mm

UPD60510F1-HN4-M1-A

Renesas Electronics

INDUSTRIAL

BALL

324

BGA

SQUARE

PLASTIC/EPOXY

YES

3.3 V

3.3

GRID ARRAY

BGA324,18X18,40

Network Interfaces

1 mm

85 Cel

-40 Cel

TIN BISMUTH

BOTTOM

S-PBGA-B324

Not Qualified

e6

MC-10287F1-HN4-M1-A

Renesas Electronics

INDUSTRIAL

BALL

324

BGA

SQUARE

PLASTIC/EPOXY

YES

3.3 V

3.3

GRID ARRAY

BGA324,18X18,40

Network Interfaces

1 mm

85 Cel

-40 Cel

TIN BISMUTH

BOTTOM

S-PBGA-B324

Not Qualified

e6

MRF89XAM9AT-I/RM

Microchip Technology

ETHERNET TRANSCEIVER

INDUSTRIAL

UNSPECIFIED

12

RECTANGULAR

UNSPECIFIED

NO

1

.03 mA

3.3 V

2.5/3.3

MICROELECTRONIC ASSEMBLY

MODULE,12LEAD,.7

Other Telecom ICs

2.54 mm

85 Cel

-40 Cel

MATTE TIN

DUAL

R-XDMA-X12

17.78 mm

Not Qualified

e3

27.94 mm

TJF1051T/3,112

NXP Semiconductors

SUPPORT CIRCUIT

INDUSTRIAL

GULL WING

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

1

.07 mA

5 V

5

SMALL OUTLINE

SOP8,.25

Network Interfaces

1.27 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD SILVER

DUAL

1 Mbps

R-PDSO-G8

1

1.75 mm

3.9 mm

Not Qualified

e4

30

260

4.9 mm

KSZ8031RNLI-TR

Micrel

ETHERNET TRANSCEIVER

INDUSTRIAL

NO LEAD

24

HVQCCN

SQUARE

UNSPECIFIED

YES

1

1.2 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

S-XQCC-N24

2

.9 mm

4 mm

e4

40

260

4 mm

SN65HVD101RGBR

Texas Instruments

SUPPORT CIRCUIT

INDUSTRIAL

NO LEAD

20

HVQCCN

RECTANGULAR

PLASTIC/EPOXY

YES

1

3 mA

24 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

105 Cel

-40 Cel

Nickel/Palladium/Gold (Ni/Pd/Au)

QUAD

R-PQCC-N20

2

1 mm

3.5 mm

e4

NOT SPECIFIED

260

4 mm

SN65HVD102RGBR

Texas Instruments

SUPPORT CIRCUIT

INDUSTRIAL

NO LEAD

20

HVQCCN

RECTANGULAR

PLASTIC/EPOXY

YES

1

2 mA

24 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

105 Cel

-40 Cel

Nickel/Palladium/Gold (Ni/Pd/Au)

QUAD

R-PQCC-N20

2

1 mm

3.5 mm

e4

NOT SPECIFIED

260

4 mm

TLK10034AAJ

Texas Instruments

SUPPORT CIRCUIT

INDUSTRIAL

BALL

324

BGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

4

1249 mA

1 V

GRID ARRAY

1 mm

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

10000 Mbps

S-PBGA-B324

4

3.29 mm

19 mm

e1

30

260

19 mm

TDA5340XUMA1

Infineon Technologies

MANCHESTER ENCODER/DECODER

INDUSTRIAL

GULL WING

20

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

.026 mA

3.3 V

3.3,5

SMALL OUTLINE

TSSOP28,.25

Other Telecom ICs

.635 mm

110 Cel

-40 Cel

DUAL

R-PDSO-G20

3

Not Qualified

TLK106LRHBR

Texas Instruments

ETHERNET TRANSCEIVER

INDUSTRIAL

NO LEAD

32

QCCN

SQUARE

UNSPECIFIED

YES

1

4

1.55 V

CHIP CARRIER

105 Cel

-40 Cel

Nickel/Palladium/Gold (Ni/Pd/Au)

QUAD

100 Mbps

S-XQCC-N32

2

e4

NOT SPECIFIED

260

TLK106LRHBT

Texas Instruments

ETHERNET TRANSCEIVER

INDUSTRIAL

NO LEAD

32

QCCN

SQUARE

UNSPECIFIED

YES

1

4

1.55 V

CHIP CARRIER

105 Cel

-40 Cel

Nickel/Palladium/Gold (Ni/Pd/Au)

QUAD

100 Mbps

S-XQCC-N32

2

e4

NOT SPECIFIED

260

TLK111PTR

Texas Instruments

ETHERNET TRANSCEIVER

INDUSTRIAL

GULL WING

48

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1

4

3.3 V

FLATPACK, LOW PROFILE, FINE PITCH

.5 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

100 Mbps

S-PQFP-G48

1

1.6 mm

7 mm

e4

30

260

7 mm

L9615D

STMicroelectronics

INTERFACE CIRCUIT

INDUSTRIAL

GULL WING

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

BICMOS

1

5 V

5

SMALL OUTLINE

SOP8,.25

Network Interfaces

1.27 mm

110 Cel

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

R-PDSO-G8

3

1.75 mm

3.9 mm

Not Qualified

e4

4.9 mm

SN65LBC031D

Texas Instruments

INTERFACE CIRCUIT

INDUSTRIAL

GULL WING

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

1

1

.08 mA

5 V

5

SMALL OUTLINE

SOP8,.25

Network Interfaces

1.27 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

1 Mbps

R-PDSO-G8

1

1.75 mm

3.9 mm

Not Qualified

e4

20

220

4.9 mm

RN171-I/RM

Microchip Technology

LAN SWITCHING CIRCUIT

INDUSTRIAL

NO LEAD

49

RECTANGULAR

UNSPECIFIED

YES

1

3.3 V

MICROELECTRONIC ASSEMBLY

85 Cel

-40 Cel

MATTE TIN

QUAD

R-XQMA-N49

3.175 mm

17.78 mm

e3

26.67 mm

HI-3111PSIF

Holt Integrated Circuits

INTERFACE CIRCUIT

INDUSTRIAL

GULL WING

18

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

1

15 mA

5 V

3.3/5,5

SMALL OUTLINE

SOP18,.4

Network Interfaces

1.27 mm

85 Cel

-40 Cel

MATTE TIN

DUAL

1 Mbps

R-PDSO-G18

3

2.35 mm

7.5 mm

Not Qualified

e3

260

11.55 mm

TLK1211RCP

Texas Instruments

ETHERNET TRANSCEIVER

INDUSTRIAL

GULL WING

64

HVFQFP

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

1

.113 mA

2.5 V

2.5

FLATPACK, HEAT SINK/SLUG, VERY THIN PROFILE, FINE PITCH

TQFP64,.47SQ

Network Interfaces

.5 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

1250 Mbps

S-PQFP-G64

3

1 mm

10 mm

Not Qualified

e4

30

260

10 mm

DS33Z11

Maxim Integrated

SUPPORT CIRCUIT

INDUSTRIAL

BALL

169

LBGA

SQUARE

PLASTIC/EPOXY

YES

1

1.8 V

GRID ARRAY, LOW PROFILE

1 mm

85 Cel

-40 Cel

BOTTOM

S-PBGA-B169

3

1.5 mm

14 mm

Not Qualified

14 mm

DS33ZH11

Maxim Integrated

SUPPORT CIRCUIT

INDUSTRIAL

BALL

100

FBGA

SQUARE

PLASTIC/EPOXY

YES

1

1.8 V

GRID ARRAY, FINE PITCH

.8 mm

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

S-PBGA-B100

10 mm

Not Qualified

e1

225

10 mm

TLK1221RHAT

Texas Instruments

ETHERNET TRANSCEIVER

INDUSTRIAL

NO LEAD

40

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

1

.113 mA

2.5 V

2.5

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC40,.24SQ,20

Network Interfaces

.5 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

1300 Mbps

S-PQCC-N40

3

1 mm

6 mm

Not Qualified

e4

30

260

6 mm

MAX13054ESA-T

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

GULL WING

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

BICMOS

1

5 V

3.3,5

SMALL OUTLINE

SOP8,.25

Network Interfaces

1.27 mm

85 Cel

-40 Cel

TIN LEAD

DUAL

1 Mbps

R-PDSO-G8

1

1.75 mm

3.9 mm

Not Qualified

e0

4.9 mm

TLK1221RHARG4

Texas Instruments

ETHERNET TRANSCEIVER

INDUSTRIAL

NO LEAD

40

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

1

.113 mA

2.5 V

2.5

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC40,.24SQ,20

Network Interfaces

.5 mm

85 Cel

-40 Cel

Nickel/Palladium/Gold (Ni/Pd/Au)

QUAD

1300 Mbps

S-PQCC-N40

3

1 mm

6 mm

Not Qualified

e4

NOT SPECIFIED

260

6 mm

TLK1221RHATG4

Texas Instruments

ETHERNET TRANSCEIVER

INDUSTRIAL

NO LEAD

40

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

1

.113 mA

2.5 V

2.5

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC40,.24SQ,20

Network Interfaces

.5 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

1300 Mbps

S-PQCC-N40

3

1 mm

6 mm

Not Qualified

e4

30

260

6 mm

PX1011B-EL1/N,551

NXP Semiconductors

INTERFACE CIRCUIT

INDUSTRIAL

BALL

81

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1

1.2 V

GRID ARRAY, LOW PROFILE, FINE PITCH

.8 mm

85 Cel

-40 Cel

BOTTOM

S-PBGA-B81

3

1.6 mm

9 mm

Not Qualified

9 mm

KS8001LI

Micrel

ETHERNET TRANSCEIVER

INDUSTRIAL

GULL WING

48

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

1

1.8 V

3.3

FLATPACK, LOW PROFILE, FINE PITCH

QFP48,.35SQ,20

Network Interfaces

.5 mm

85 Cel

-40 Cel

Tin/Lead (Sn85Pb15)

QUAD

100 Mbps

S-PQFP-G48

3

1.6 mm

7 mm

Not Qualified

e0

30

240

7 mm

MAX4890EETJ

Maxim Integrated

LAN SWITCHING CIRCUIT

INDUSTRIAL

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

YES

1

BICMOS

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

QUAD

S-XQCC-N32

.8 mm

5 mm

Not Qualified

NOT SPECIFIED

NOT SPECIFIED

5 mm

MAX4890EETJ-T

Maxim Integrated

LAN SWITCHING CIRCUIT

INDUSTRIAL

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

YES

1

BICMOS

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

QUAD

S-XQCC-N32

.8 mm

5 mm

Not Qualified

NOT SPECIFIED

NOT SPECIFIED

5 mm

NB4N7132DTG

Onsemi

SUPPORT CIRCUIT

INDUSTRIAL

GULL WING

28

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

.125 mA

3.3 V

3.3

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP28,.25

Other Telecom ICs

.65 mm

85 Cel

-40 Cel

TIN

DUAL

R-PDSO-G28

3

1.2 mm

4.4 mm

Not Qualified

e3

30

260

9.7 mm

SN65HVD253DR

Texas Instruments

TOKEN RING TRANSCEIVER

INDUSTRIAL

GULL WING

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

1

1

.08 mA

5 V

5

SMALL OUTLINE

SOP8,.25

Network Interfaces

1.27 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

1 Mbps

R-PDSO-G8

1

1.75 mm

3.9 mm

Not Qualified

e4

30

260

4.9 mm

PX1011BI-EL1/G,557

NXP Semiconductors

INTERFACE CIRCUIT

INDUSTRIAL

BALL

81

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1

1.2 V

GRID ARRAY, LOW PROFILE, FINE PITCH

.8 mm

85 Cel

-40 Cel

BOTTOM

S-PBGA-B81

3

1.6 mm

9 mm

Not Qualified

260

9 mm

PX1012AI-EL1/G,557

NXP Semiconductors

INTERFACE CIRCUIT

INDUSTRIAL

BALL

81

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1

1.2 V

GRID ARRAY, LOW PROFILE, FINE PITCH

.8 mm

85 Cel

-40 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

S-PBGA-B81

1.6 mm

9 mm

Not Qualified

e1

9 mm

KSZ8041NLAM

Micrel

ETHERNET TRANSCEIVER

INDUSTRIAL

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

YES

1

CMOS

1

3.3 V

3.3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC32,.2SQ,20

Network Interfaces

.5 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

100 Mbps

S-XQCC-N32

2

.9 mm

5 mm

Not Qualified

e4

40

260

5 mm

TLK2211RCPRG4

Texas Instruments

ETHERNET TRANSCEIVER

INDUSTRIAL

GULL WING

64

HVFQFP

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

1

.23 mA

3.3 V

3.3

FLATPACK, HEAT SINK/SLUG, VERY THIN PROFILE, FINE PITCH

TQFP64,.47SQ

Network Interfaces

.5 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

1300 Mbps

S-PQFP-G64

3

1 mm

10 mm

Not Qualified

e4

30

260

10 mm

TLK2211RCPR

Texas Instruments

ETHERNET TRANSCEIVER

INDUSTRIAL

GULL WING

64

HVFQFP

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

1

.23 mA

3.3 V

3.3

FLATPACK, HEAT SINK/SLUG, VERY THIN PROFILE, FINE PITCH

TQFP64,.47SQ

Network Interfaces

.5 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

1300 Mbps

S-PQFP-G64

3

1 mm

10 mm

Not Qualified

e4

30

260

10 mm

CYP15G0101DXB-BBI

Cypress Semiconductor

INTERFACE CIRCUIT

INDUSTRIAL

BALL

100

LBGA

SQUARE

PLASTIC/EPOXY

YES

1

BICMOS

1

3.3 V

3.3

GRID ARRAY, LOW PROFILE

BGA100,10X10,40

Network Interfaces

1 mm

85 Cel

-40 Cel

TIN LEAD

BOTTOM

1500 Mbps

S-PBGA-B100

3

1.4 mm

11 mm

Not Qualified

e0

11 mm

CYP15G0401DXB-BGI

Cypress Semiconductor

ETHERNET TRANSCEIVER

INDUSTRIAL

BALL

256

HBGA

SQUARE

PLASTIC/EPOXY

YES

1

BICMOS

4

3.3 V

3.3

GRID ARRAY, HEAT SINK/SLUG

BGA256,20X20,50

Network Interfaces

1.27 mm

85 Cel

-40 Cel

TIN LEAD

BOTTOM

1500 Mbps

S-PBGA-B256

3

1.745 mm

27 mm

Not Qualified

e0

27 mm

STULPI01ATBR

STMicroelectronics

SUPPORT CIRCUIT

INDUSTRIAL

BALL

36

TFBGA

SQUARE

PLASTIC/EPOXY

YES

1

1.8 V

GRID ARRAY

.5 mm

85 Cel

-40 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

S-PBGA-B36

3

1.16 mm

3.6 mm

Not Qualified

e1

30

260

3.6 mm

MAX2829ETN

Maxim Integrated

SUPPORT CIRCUIT

INDUSTRIAL

NO LEAD

56

HVQCCN

SQUARE

UNSPECIFIED

YES

1

BICMOS

2.7 V

CHIP CARRIER

.5 mm

85 Cel

-40 Cel

QUAD

S-XQCC-N56

.8 mm

8 mm

Not Qualified

NOT SPECIFIED

NOT SPECIFIED

8 mm

TLK2201BIRCPR

Texas Instruments

ETHERNET TRANSCEIVER

INDUSTRIAL

GULL WING

64

HVFQFP

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

1

.111 mA

2.5 V

2.5

FLATPACK, HEAT SINK/SLUG, VERY THIN PROFILE, FINE PITCH

TQFP64,.47SQ

Network Interfaces

.5 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

1600 Mbps

S-PQFP-G64

3

1 mm

10 mm

Not Qualified

e4

30

260

10 mm

MAX4890ETJ

Maxim Integrated

LAN SWITCHING CIRCUIT

INDUSTRIAL

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

YES

1

BICMOS

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

TIN LEAD

QUAD

S-XQCC-N32

1

.8 mm

5 mm

Not Qualified

e0

245

5 mm

TLK1201AIRCPG4

Texas Instruments

ETHERNET TRANSCEIVER

INDUSTRIAL

GULL WING

64

HVFQFP

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

1

.09 mA

2.5 V

2.5

FLATPACK, HEAT SINK/SLUG, VERY THIN PROFILE, FINE PITCH

TQFP64,.47SQ

Network Interfaces

.5 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

1250 Mbps

S-PQFP-G64

3

1 mm

10 mm

Not Qualified

e4

30

260

10 mm

HI-3110PSIF

Holt Integrated Circuits

INTERFACE CIRCUIT

INDUSTRIAL

GULL WING

18

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

SMALL OUTLINE

1.27 mm

85 Cel

-40 Cel

MATTE TIN

DUAL

R-PDSO-G18

3

2.35 mm

7.5 mm

Not Qualified

e3

260

11.55 mm

MAX13052ESA

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

GULL WING

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

BICMOS

1

5 V

3.3,5

SMALL OUTLINE

SOP8,.25

Network Interfaces

1.27 mm

85 Cel

-40 Cel

TIN LEAD

DUAL

1 Mbps

R-PDSO-G8

1

1.75 mm

3.9 mm

Not Qualified

e0

4.9 mm

MAX13053ESA

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

GULL WING

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

BICMOS

1

5 V

3.3,5

SMALL OUTLINE

SOP8,.25

Network Interfaces

1.27 mm

85 Cel

-40 Cel

Tin/Lead (Sn/Pb)

DUAL

1 Mbps

R-PDSO-G8

1

1.75 mm

3.9 mm

Not Qualified

e0

20

240

4.9 mm

MAX13054ESA

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

GULL WING

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

BICMOS

1

5 V

3.3,5

SMALL OUTLINE

SOP8,.25

Network Interfaces

1.27 mm

85 Cel

-40 Cel

TIN LEAD

DUAL

1 Mbps

R-PDSO-G8

1

1.75 mm

3.9 mm

Not Qualified

e0

4.9 mm

Network Interfaces

A network interface is an electronic component that connects a device to a network, enabling it to communicate with other devices and access shared resources. Network interfaces are essential for modern communication systems, providing a means of transmitting and receiving data over a variety of communication channels and protocols.

Some common types of network interfaces include Ethernet, Wi-Fi, Bluetooth, and cellular network interfaces. Ethernet is a wired network interface that uses twisted-pair cables to transmit data over local area networks (LANs). Wi-Fi is a wireless network interface that uses radio waves to transmit data over wireless local area networks (WLANs). Bluetooth is a short-range wireless network interface that is used for connecting peripheral devices such as keyboards and headphones to computers and mobile devices. Cellular network interfaces are used for mobile communications over cellular networks, providing internet connectivity and voice communication.

Network interfaces use various protocols and standards to ensure reliable and efficient data transmission. These protocols include TCP/IP, which is used for internet communication, and IEEE 802.11, which is used for wireless LANs. Network interfaces also use techniques such as packet framing, error correction, and flow control to ensure that data is transmitted accurately and efficiently.

In addition to providing a means of data transmission, network interfaces also enable devices to access shared resources such as printers and file servers. They also enable devices to communicate with each other, allowing for collaboration and information sharing.