INDUSTRIAL Network Interfaces 107

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	No. of Channels	Technology	Screening Level	No. of Transceivers	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
TLK2201BIRCPRG4	Texas Instruments	ETHERNET TRANSCEIVER	INDUSTRIAL	GULL WING	64	HVFQFP	SQUARE	PLASTIC/EPOXY	YES	1		CMOS		1	.111 mA	2.5 V	2.5	FLATPACK, HEAT SINK/SLUG, VERY THIN PROFILE, FINE PITCH	TQFP64,.47SQ	Network Interfaces	.5 mm	85 Cel	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	QUAD	1600 Mbps	S-PQFP-G64	3	1 mm	10 mm	Not Qualified	e4	NOT SPECIFIED	260	10 mm
B10011S-MFPG1Y	Atmel	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				1		5 V	5,7/32	SMALL OUTLINE	SOP16,.25	Network Interfaces	1.27 mm	105 Cel	-40 Cel	MATTE TIN	DUAL	.25 Mbps	R-PDSO-G16	1	1.75 mm	3.8 mm	Not Qualified	e3		260	9.9 mm
CYP15G0403DXB-BGXI	Cypress Semiconductor	ETHERNET TRANSCEIVER	INDUSTRIAL	BALL	256	HBGA	SQUARE	PLASTIC/EPOXY	YES	1		BICMOS		4	1.32 mA	3.3 V	3.3	GRID ARRAY, HEAT SINK/SLUG	BGA256,20X20,50	Network Interfaces	1.27 mm	85 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	1500 Mbps	S-PBGA-B256	3	1.745 mm	27 mm	Not Qualified	e1	20	260	27 mm
SN65HVD231DG4	Texas Instruments	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	1	BICMOS		1	.017 mA	3.3 V	3.3	SMALL OUTLINE	SOP8,.25	Network Interfaces	1.27 mm	85 Cel	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	1 Mbps	R-PDSO-G8	1	1.75 mm	3.9 mm	Not Qualified	e4	NOT SPECIFIED	260	4.9 mm
50051R	Echelon	MANCHESTER ENCODER/DECODER	INDUSTRIAL	PIN/PEG	9		RECTANGULAR	PLASTIC/EPOXY	NO	1						5 V	5	MICROELECTRONIC ASSEMBLY	MODULE(UNSPEC)	Network Interfaces		85 Cel	-40 Cel	MATTE TIN OVER NICKEL	UNSPECIFIED		R-PXMA-P9				Not Qualified	e3
HI-1575PQI	Holt Integrated Circuits	MIL-STD-1553 DATA BUS TRANSCEIVER	INDUSTRIAL	GULL WING	32	TQFP	SQUARE	PLASTIC/EPOXY	YES	1		CMOS		2	500 mA	3.3 V		FLATPACK, THIN PROFILE	TQFP32,.35SQ,32		.8 mm	85 Cel	-40 Cel	Tin/Lead (Sn/Pb)	QUAD		S-PQFP-G32	3	1.2 mm	7 mm	Not Qualified	e0	30	240	7 mm
E-STE100P	STMicroelectronics	ETHERNET TRANSCEIVER	INDUSTRIAL	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1		CMOS		1		3.3 V	3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	Network Interfaces	.5 mm	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	QUAD	100 Mbps	S-PQFP-G64	3	1.6 mm	10 mm	Not Qualified	e3	30	260	10 mm
AX-SFJK-API-1-01-TB05	Onsemi	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	40	HVQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	1				1		3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC28,.2X.27,20		.5 mm	85 Cel	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	QUAD	.0006 Mbps	R-PQCC-N40	1	1 mm	5 mm		e4		260	7 mm
AX-SFJK-API-1-01-TX30	Onsemi	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	40	HVQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	1				1		3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC28,.2X.27,20		.5 mm	85 Cel	-40 Cel	NICKEL GOLD PALLADIUM	QUAD	.0006 Mbps	R-PQCC-N40	1	1 mm	5 mm			30	260	7 mm
KSZ8051MNLU-VAO	Microchip Technology	ETHERNET TRANSCEIVER	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1			AEC-Q100; TS 16949	1		3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20		.5 mm	85 Cel	-40 Cel		QUAD	100 Mbps	S-XQCC-N32		1 mm	5 mm					5 mm
KSZ8051RNLU-TR-VAO	Microchip Technology	ETHERNET TRANSCEIVER	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1			AEC-Q100; TS 16949	1		3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20		.5 mm	85 Cel	-40 Cel		QUAD	100 Mbps	S-XQCC-N32		1 mm	5 mm					5 mm
KSZ8721SLI-TR	Microchip Technology	ETHERNET TRANSCEIVER	INDUSTRIAL	GULL WING	48	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS	TS 16949	1		2.5 V		SMALL OUTLINE, SHRINK PITCH	TSSOP48,.40		.635 mm	85 Cel	-40 Cel	MATTE TIN	DUAL	100 Mbps	R-PDSO-G48		2.794 mm	7.493 mm		e3			15.875 mm
VSC8486YJB-11	Microchip Technology	ETHERNET TRANSCEIVER	INDUSTRIAL	BALL	144	LBGA	SQUARE	PLASTIC/EPOXY	YES	1				1		1.2 V		GRID ARRAY, LOW PROFILE	BGA144,12X12,40		1 mm	85 Cel	-40 Cel		BOTTOM	.00001 Mbps	S-PBGA-B144		1.4 mm	13 mm					13 mm
VSC8662XIC-03	Microchip Technology	ETHERNET TRANSCEIVER	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1				2		1.2 V		GRID ARRAY	BGA256,16X16,40		1 mm	100 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1000 Mbps	S-PBGA-B256		2 mm	17 mm		e1			17 mm
BCM53101PIMLG	Broadcom	ETHERNET TRANSCEIVER	INDUSTRIAL	NO LEAD	132	HVQCCN	SQUARE	UNSPECIFIED	YES	1		CMOS				1.2 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD		S-XQCC-N132	3	.9 mm	10 mm					10 mm
BCM53134PIFBG	Broadcom	ETHERNET TRANSCEIVER	INDUSTRIAL	BALL	212	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1		CMOS				1 V		GRID ARRAY, THIN PROFILE, FINE PITCH			.65 mm	85 Cel	-45 Cel		BOTTOM		S-PBGA-B212	3	1.017 mm	11 mm					11 mm
BCM5325FIQMG	Broadcom	ETHERNET TRANSCEIVER	INDUSTRIAL	GULL WING	128	FQFP	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS		6	290 mA	1.8 V		FLATPACK, FINE PITCH	QFP128,.68X.91,20		.5 mm	85 Cel	-40 Cel		QUAD	100 Mbps	R-PQFP-G128	3	3.4 mm	14 mm					20 mm
BCM53242MIPBG	Broadcom	ETHERNET TRANSCEIVER	INDUSTRIAL	BALL	400	BGA	SQUARE	PLASTIC/EPOXY	YES	1		CMOS		24	1450 mA	1.2 V		GRID ARRAY	BGA400,20X20,50		1.27 mm	85 Cel	-40 Cel		QUAD	1000 Mbps	S-PBGA-B400		2.33 mm	27 mm					27 mm
KSZ9131MNXI-TR	Microchip Technology	ETHERNET TRANSCEIVER	INDUSTRIAL	NO LEAD	64	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				1		1.2 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC64,.32SQ,16		.4 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	1000 Mbps	S-PQCC-N64		.9 mm	8 mm		e3	30	260	8 mm
KSZ9131MNXI	Microchip Technology	ETHERNET TRANSCEIVER	INDUSTRIAL	NO LEAD	64	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				1		1.2 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC64,.32SQ,16		.4 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	1000 Mbps	S-PQCC-N64		.9 mm	8 mm		e3	30	260	8 mm
BCM54140B0IFBG	Broadcom	ETHERNET TRANSCEIVER	INDUSTRIAL	BALL	256	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS		4				GRID ARRAY				85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		R-PBGA-B256					e1		255
LAN8820I-ABZJ-TR	Microchip Technology	ETHERNET TRANSCEIVER	INDUSTRIAL	NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	YES	1			TS 16949	1		1.2 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC56,.31SQ,20		.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	1000 Mbps	S-XQCC-N56		1 mm	8 mm		e3			8 mm
TLK10031CTR	Texas Instruments	SUPPORT CIRCUIT	INDUSTRIAL	BALL	144	BGA	SQUARE	PLASTIC/EPOXY	YES	1		CMOS		1	700 mA	1 V		GRID ARRAY	BGA144,12X12,40		1 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	10312.5 Mbps	S-PBGA-B144	4	3.25 mm	13 mm	Not Qualified	e1	30	260	13 mm
DP83848LFQSQE	Texas Instruments	ETHERNET TRANSCEIVER	INDUSTRIAL	NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	1		CMOS	AEC-Q100	4		3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	105 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	100000 Mbps	S-XQCC-N40	3	1 mm	6 mm		e4	30	260	6 mm
DP83848LFQSQ	Texas Instruments	ETHERNET TRANSCEIVER	INDUSTRIAL	NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	1		CMOS	AEC-Q100			3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	105 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	100000 Mbps	S-XQCC-N40	3	1 mm	6 mm		e4	30	260	6 mm
MC34CM3120EPR2	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1						5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD		S-XQCC-N48		1 mm	5 mm					5 mm
AD9371BBCZ-REEL	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	BALL	196	HBGA	SQUARE	PLASTIC/EPOXY	YES	1						1.3 V		GRID ARRAY, HEAT SINK/SLUG			.8 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B196	3	1.27 mm	12 mm		e1	30	260	12 mm
AD9371BBCZ	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	BALL	196	HBGA	SQUARE	PLASTIC/EPOXY	YES	1						1.3 V		GRID ARRAY, HEAT SINK/SLUG			.8 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B196	3	1.27 mm	12 mm		e1	30	260	12 mm
RN171-I/RM481	Microchip Technology	LAN SWITCHING CIRCUIT	INDUSTRIAL	NO LEAD	49		RECTANGULAR	UNSPECIFIED	YES	1			TS 16949			3.3 V		MICROELECTRONIC ASSEMBLY				85 Cel	-40 Cel		QUAD		R-XQMA-N49		3.175 mm	17.78 mm					26.67 mm
RN2483-I/RM101	Microchip Technology	ETHERNET TRANSCEIVER	INDUSTRIAL	NO LEAD	47		RECTANGULAR		YES	1						3.3 V		MICROELECTRONIC ASSEMBLY			1.27 mm	85 Cel	-40 Cel				R-XXMA-N47		3.34 mm	17.78 mm					26.67 mm
ATA6565-GCQW1	Microchip Technology	CAN TRANSCEIVER	INDUSTRIAL	NO LEAD	14	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	2			AEC-Q100	2	85 mA	5 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC14,.12,25		.65 mm	85 Cel	-40 Cel		DUAL	5 Mbps	R-PDSO-N14		1 mm	3 mm			NOT SPECIFIED	NOT SPECIFIED	4.5 mm
CC3120RNMARGKR	Texas Instruments	WIRELESS LAN CIRCUIT	INDUSTRIAL	NO LEAD	64	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				1		3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N64	3	1 mm	9 mm		e4	30	260	9 mm
CC3120RNMARGKT	Texas Instruments	WIRELESS LAN CIRCUIT	INDUSTRIAL	NO LEAD	64	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				1		3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N64	3	1 mm	9 mm		e4	30	260	9 mm
AD9375BBCZ-REEL	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1						1.3 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	85 Cel	-40 Cel		BOTTOM		S-PBGA-B196	3	1.27 mm	12 mm			30	260	12 mm
AD9375BBCZ	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1						1.3 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	85 Cel	-40 Cel		BOTTOM		S-PBGA-B196	3	1.27 mm	12 mm			30	260	12 mm
KSZ9031RNXUA-TR	Microchip Technology	ETHERNET TRANSCEIVER	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1			AEC-Q100; TS 16949			1.2 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		QUAD		S-XQCC-N48		.9 mm	7 mm					7 mm
KSZ9031RNXUB-TRVAO	Microchip Technology	ETHERNET TRANSCEIVER	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1			AEC-Q100	1		1.2 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20		.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	1000 Mbps	S-XQCC-N48		1 mm	7 mm		e3			7 mm
KSZ9031RNXUB-VAO	Microchip Technology	ETHERNET TRANSCEIVER	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1			AEC-Q100	1		1.2 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20		.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	1000 Mbps	S-XQCC-N48		1 mm	7 mm		e3			7 mm
KSZ9031RNXVA-TR	Microchip Technology	ETHERNET TRANSCEIVER	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1			AEC-Q100; TS 16949			1.2 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	105 Cel	-40 Cel		QUAD		S-XQCC-N48		.9 mm	7 mm					7 mm
KSZ9031RNXVB-TRVAO	Microchip Technology	ETHERNET TRANSCEIVER	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1			AEC-Q100	1		1.2 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20		.5 mm	105 Cel	-40 Cel	MATTE TIN	QUAD	1000 Mbps	S-XQCC-N48	3	1 mm	7 mm		e3	30	260	7 mm
KSZ9031RNXVB-VAO	Microchip Technology	ETHERNET TRANSCEIVER	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1			AEC-Q100	1		1.2 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20		.5 mm	105 Cel	-40 Cel	MATTE TIN	QUAD	1000 Mbps	S-XQCC-N48	3	1 mm	7 mm		e3		260	7 mm
KSZ8041MLLI	Microchip Technology	ETHERNET TRANSCEIVER	INDUSTRIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1		CMOS	TS 16949	1	58.3 mA	3.3 V		FLATPACK, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20		.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	100 Mbps	S-XQFP-G48		1.6 mm	7 mm		e3			7 mm
AX-SFJK-1-01-TB05	Onsemi	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	40	HVQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	1				1		3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC28,.2X.27,20		.5 mm	85 Cel	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	QUAD	.0006 Mbps	R-PQCC-N40	1	1 mm	5 mm		e4		260	7 mm
RN2483A-I/RM103	Microchip Technology	ETHERNET TRANSCEIVER	INDUSTRIAL	NO LEAD	47		RECTANGULAR	UNSPECIFIED	YES	1			TS 16949			3.3 V		MICROELECTRONIC ASSEMBLY			1.27 mm	85 Cel	-40 Cel		UNSPECIFIED		R-XXMA-N47		3.34 mm	17.78 mm					26.67 mm
VSC8254YMR-01	Microchip Technology	ETHERNET TRANSCEIVER	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1				2		1 V		GRID ARRAY	BGA256,16X16,40		1 mm	110 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	10000 Mbps	S-PBGA-B256		2.7 mm	17 mm		e1			17 mm
VSC8489YJU-02	Microchip Technology	ETHERNET TRANSCEIVER	INDUSTRIAL	BALL	196	LBGA	SQUARE	PLASTIC/EPOXY	YES	1				2	150 mA	1.2 V		GRID ARRAY, LOW PROFILE	BGA196,14X14,40		1 mm	110 Cel	-40 Cel		BOTTOM		S-PBGA-B196		1.4 mm	15 mm					15 mm
BCM53112MB0ILFBG	Broadcom	SUPPORT CIRCUIT	INDUSTRIAL	UNSPECIFIED			SQUARE	UNSPECIFIED		1												85 Cel	-40 Cel
BGS8458Z	NXP Semiconductors	WIRELESS LAN CIRCUIT	INDUSTRIAL	NO LEAD	6	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1		CMOS				3.6 V		SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	85 Cel	-40 Cel		DUAL		R-PDSO-N6	1	.33 mm	1.2 mm				260	1.4 mm

Network Interfaces

A network interface is an electronic component that connects a device to a network, enabling it to communicate with other devices and access shared resources. Network interfaces are essential for modern communication systems, providing a means of transmitting and receiving data over a variety of communication channels and protocols.

Some common types of network interfaces include Ethernet, Wi-Fi, Bluetooth, and cellular network interfaces. Ethernet is a wired network interface that uses twisted-pair cables to transmit data over local area networks (LANs). Wi-Fi is a wireless network interface that uses radio waves to transmit data over wireless local area networks (WLANs). Bluetooth is a short-range wireless network interface that is used for connecting peripheral devices such as keyboards and headphones to computers and mobile devices. Cellular network interfaces are used for mobile communications over cellular networks, providing internet connectivity and voice communication.

Network interfaces use various protocols and standards to ensure reliable and efficient data transmission. These protocols include TCP/IP, which is used for internet communication, and IEEE 802.11, which is used for wireless LANs. Network interfaces also use techniques such as packet framing, error correction, and flow control to ensure that data is transmitted accurately and efficiently.

In addition to providing a means of data transmission, network interfaces also enable devices to access shared resources such as printers and file servers. They also enable devices to communicate with each other, allowing for collaboration and information sharing.