COMMERCIAL Other Function Telecom Interface ICs 79

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Output Code	No. of Channels	Technology	Nominal Negative Supply Voltage	No. of Transceivers	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Resolution (um)	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Output (V)	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Input Type	Maximum Analog Input	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
LA72914V-MPB-H	Onsemi		COMMERCIAL	GULL WING	16	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES				BIPOLAR			.04 mA	5 V	5	SMALL OUTLINE, SHRINK PITCH	SSOP16,.25	Other Telecom ICs	.635 mm	70 Cel		-20 Cel	TIN BISMUTH	DUAL		R-PDSO-G16		3			Not Qualified			e6	30	260
XR2211ACD-F	Exar	TELECOM CIRCUIT	COMMERCIAL	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			BIPOLAR			.009 mA	12 V	12	SMALL OUTLINE	SOP14,.25	Other Telecom ICs	1.27 mm	70 Cel		0 Cel	MATTE TIN	DUAL		R-PDSO-G14		2	1.75 mm	3.9 mm	Not Qualified			e3			8.65 mm
XR2211ACDTR-F	Exar	TELECOM CIRCUIT	COMMERCIAL	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			BIPOLAR				12 V		SMALL OUTLINE			1.27 mm	70 Cel		0 Cel	MATTE TIN	DUAL		R-PDSO-G14		2	1.75 mm	3.9 mm	Not Qualified			e3			8.65 mm
XR2211ACP-F	Exar	TELECOM CIRCUIT	COMMERCIAL	THROUGH-HOLE	14	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1			BIPOLAR			.009 mA	12 V	12	IN-LINE	DIP14,.3	Other Telecom ICs	2.54 mm	70 Cel		0 Cel	MATTE TIN	DUAL		R-PDIP-T14			5.33 mm	7.62 mm	Not Qualified			e3			19.305 mm
ADV7619KSVZ-P	Analog Devices	TELECOM CIRCUIT	COMMERCIAL	GULL WING	128	HTFQFP	SQUARE	PLASTIC/EPOXY	YES	1			CMOS				1.8 V		FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH			.4 mm	70 Cel		0 Cel	Matte Tin (Sn) - annealed	QUAD		S-PQFP-G128		3	1.2 mm	14 mm				e3		260	14 mm
AFE4300PN	Texas Instruments	TELECOM CIRCUIT	COMMERCIAL	GULL WING	80	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	BINARY/TWOS COMP	2				.00097 mA	3.3 V	3	FLATPACK, LOW PROFILE, FINE PITCH	QFP80,.55SQ,20	Codecs	.5 mm	70 Cel	16	0 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQFP-G80	VOLTAGE	3	1.6 mm	12 mm	Not Qualified	DIFFERENTIAL	3.4 V	e4	30	260	12 mm
LM96551SQ/NOPB	Texas Instruments	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	80	HVQCCN	SQUARE	UNSPECIFIED	YES	1									CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	70 Cel		0 Cel		QUAD		S-XQCC-N80		3	.8 mm	12 mm					30	260	12 mm
LM96551SQE/NOPB	Texas Instruments	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	80	HVQCCN	SQUARE	UNSPECIFIED	YES	1									CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	70 Cel		0 Cel	MATTE TIN	QUAD		S-XQCC-N80		3	.8 mm	12 mm				e3	30	260	12 mm
LM96551SQX/NOPB	Texas Instruments	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	80	HVQCCN	SQUARE	UNSPECIFIED	YES	1									CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	70 Cel		0 Cel		QUAD		S-XQCC-N80		3	.8 mm	12 mm					30	260	12 mm
LM96550SQX/NOPB	Texas Instruments	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	80	HVQCCN	SQUARE	UNSPECIFIED	YES	1			CMOS	-10 V			10 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	70 Cel		0 Cel	MATTE TIN	QUAD		S-XQCC-N80		3	.8 mm	12 mm				e3	30	260	12 mm
RF430CL330HTB	Texas Instruments	TELECOM CIRCUIT	COMMERCIAL	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			CMOS				3.3 V		SMALL OUTLINE				70 Cel		0 Cel		DUAL		R-PDSO-G14
MLX90109CDC-AAA-000-RE	Melexis N V	TELECOM CIRCUIT	COMMERCIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1							5 V		SMALL OUTLINE			1.27 mm	70 Cel		0 Cel	MATTE TIN	DUAL		R-PDSO-G8		1	1.72 mm	3.9 mm				e3		260	4.9 mm
WL1801MODGBMOCR	Texas Instruments	TELECOM CIRCUIT	COMMERCIAL	BUTT	100	LGA	RECTANGULAR	PLASTIC/EPOXY	YES	1							3.7 V	2.9/4.8	GRID ARRAY	LGA100(UNSPEC)	Other Telecom ICs	.7 mm	70 Cel		-20 Cel	NICKEL PALLADIUM GOLD	BOTTOM	100 Mbps	R-PBGA-B100		3	2 mm	13.3 mm	Not Qualified			e4	30	260	13.4 mm
WL1805MODGBMOCR	Texas Instruments	TELECOM CIRCUIT	COMMERCIAL	BUTT	100	LGA	RECTANGULAR	PLASTIC/EPOXY	YES	1							3.7 V	2.9/4.8	GRID ARRAY	LGA100(UNSPEC)	Other Telecom ICs	.7 mm	70 Cel		-20 Cel	NICKEL PALLADIUM GOLD	BOTTOM	100 Mbps	R-PBGA-B100		3	2 mm	13.3 mm	Not Qualified			e4	30	260	13.4 mm
WL1805MODGBMOCT	Texas Instruments	TELECOM CIRCUIT	COMMERCIAL	BUTT	100	LGA	RECTANGULAR	PLASTIC/EPOXY	YES	1							3.7 V	2.9/4.8	GRID ARRAY	LGA100(UNSPEC)	Other Telecom ICs	.7 mm	70 Cel		-20 Cel	NICKEL PALLADIUM GOLD	BOTTOM	100 Mbps	R-PBGA-B100		3	2 mm	13.3 mm	Not Qualified			e4	30	260	13.4 mm
WL1831MODGBMOCT	Texas Instruments	TELECOM CIRCUIT	COMMERCIAL	BUTT	100	LGA	RECTANGULAR	PLASTIC/EPOXY	YES	1							3.7 V	2.9/4.8	GRID ARRAY	LGA100(UNSPEC)	Other Telecom ICs	.7 mm	70 Cel		-20 Cel	NICKEL PALLADIUM GOLD	BOTTOM	100 Mbps	R-PBGA-B100		3	2 mm	13.3 mm	Not Qualified			e4	30	260	13.4 mm
MAX5935CAX	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	36	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			BICMOS						SMALL OUTLINE, SHRINK PITCH			.8 mm	70 Cel		0 Cel		DUAL		R-PDSO-G36			2.65 mm	7.5 mm					NOT SPECIFIED	NOT SPECIFIED	15.375 mm
MAX2105CWI	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			BIPOLAR				5 V		SMALL OUTLINE			1.27 mm	70 Cel		0 Cel	TIN LEAD	DUAL		R-PDSO-G28		1	2.65 mm	7.5 mm	Not Qualified			e0		245	17.9 mm
MAX3267CSA	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			BIPOLAR			.05 mA	3.3 V	3/5	SMALL OUTLINE	SOP8,.25	Other Telecom ICs	1.27 mm	70 Cel		0 Cel	TIN LEAD	DUAL		R-PDSO-G8		1	1.75 mm	3.9 mm	Not Qualified			e0			4.9 mm
SN75FC1000PJD	Texas Instruments	TELECOM CIRCUIT	COMMERCIAL	GULL WING	64	HTFQFP	SQUARE	PLASTIC/EPOXY	YES	1			BICMOS			.25 mA	3.3 V	3.3	FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH	TQFP64,.47SQ	Other Telecom ICs	.5 mm	70 Cel		0 Cel		QUAD		S-PQFP-G64			1.2 mm	10 mm	Not Qualified				NOT SPECIFIED	NOT SPECIFIED	10 mm
CY7B923-SC	Cypress Semiconductor	TELECOM CIRCUIT	COMMERCIAL	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			BICMOS			85 mA	5 V	5	SMALL OUTLINE	SOP28,.4	Other Telecom ICs	1.27 mm	70 Cel		0 Cel	Tin/Lead (Sn/Pb)	DUAL		R-PDSO-G28		1	2.67 mm	7.5 mm	Not Qualified			e0	30	225	17.905 mm
CY7B923-JC	Cypress Semiconductor	TELECOM CIRCUIT	COMMERCIAL	J BEND	28	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1			BICMOS			85 mA	5 V	5	CHIP CARRIER	LDCC28,.5SQ	Other Telecom ICs	1.27 mm	70 Cel		0 Cel	TIN LEAD	QUAD		S-PQCC-J28		3	4.57 mm	11.53 mm	Not Qualified			e0			11.53 mm
MAX3120CSA	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1							3.3 V		SMALL OUTLINE			1.27 mm	70 Cel		0 Cel	TIN LEAD	DUAL		R-PDSO-G8		1	1.75 mm	3.9 mm	Not Qualified			e0			4.9 mm
MAX3120CUA	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1							3.3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	70 Cel		0 Cel	TIN LEAD	DUAL		S-PDSO-G8		1	1.1 mm	3 mm	Not Qualified			e0			3 mm
MAX3750CEE	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	16	HSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			BIPOLAR			.084 mA	3.3 V	3.3	SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH	SSOP16,.25	Other Telecom ICs	.635 mm	70 Cel		0 Cel	TIN LEAD	DUAL		R-PDSO-G16		1	1.75 mm	3.9 mm	Not Qualified			e0			4.9 mm
MAX3751CEE	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	16	HSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			BIPOLAR			.078 mA	3.3 V	3.3	SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH	SSOP16,.25	Other Telecom ICs	.635 mm	70 Cel		0 Cel	TIN LEAD	DUAL		R-PDSO-G16		1	1.75 mm	3.9 mm	Not Qualified			e0			4.89 mm
AD9816JSRL	Analog Devices	TELECOM CIRCUIT	COMMERCIAL	GULL WING	44	QFP	SQUARE	PLASTIC/EPOXY	YES	1			CMOS				5 V		FLATPACK			.8 mm	70 Cel		0 Cel	TIN LEAD	QUAD		S-PQFP-G44			2.45 mm	10 mm	Not Qualified			e0			10 mm
MAX3265CUB	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	10	HTSSOP	SQUARE	PLASTIC/EPOXY	YES	1			BIPOLAR			.076 mA	3.3 V	3.3/5	SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH	TSSOP10,.19,20	ATM/SONET/SDH ICs	.5 mm	70 Cel		0 Cel	TIN LEAD	DUAL		S-PDSO-G10		1	1.1 mm	3 mm	Not Qualified			e0	20	240	3 mm
MAX3265CUE	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	16	HTSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			BIPOLAR			.076 mA	3.3 V	3.3/5	SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH	TSSOP16,.25	ATM/SONET/SDH ICs	.65 mm	70 Cel		0 Cel	TIN LEAD	DUAL		R-PDSO-G16		1	1.1 mm	4.4 mm	Not Qualified			e0			5 mm
MAX3268CUB	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	10	HTSSOP	SQUARE	PLASTIC/EPOXY	YES	1			BIPOLAR			.062 mA	3.3 V	3.3/5	SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH	TSSOP10,.19,20	ATM/SONET/SDH ICs	.5 mm	70 Cel		0 Cel	TIN LEAD	DUAL		S-PDSO-G10		1	1.1 mm	3 mm	Not Qualified			e0	20	240	3 mm
MAX3269CUB	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	10	HTSSOP	SQUARE	PLASTIC/EPOXY	YES	1			BIPOLAR			.078 mA	3.3 V	3.3/5	SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH	TSSOP10,.19,20	ATM/SONET/SDH ICs	.5 mm	70 Cel		0 Cel	Tin/Lead (Sn85Pb15)	DUAL		S-PDSO-G10		1	1.1 mm	3 mm	Not Qualified			e0	20	240	3 mm
MAX3750CEE-T	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	16	HSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			BIPOLAR			.084 mA	3.3 V	3.3	SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH	SSOP16,.25	Other Telecom ICs	.635 mm	70 Cel		0 Cel	TIN LEAD	DUAL		R-PDSO-G16		1	1.75 mm	3.9 mm	Not Qualified			e0			4.9 mm
CYRF7936-40LFXC	Cypress Semiconductor	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	1							2.4 V	2.5/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20	Other Telecom ICs	.5 mm	70 Cel		0 Cel	MATTE TIN	QUAD		S-XQCC-N40		3	1 mm	6 mm	Not Qualified			e3	20	260	6 mm
HFBR-5320Z	Broadcom	TELECOM CIRCUIT	COMMERCIAL	UNSPECIFIED			RECTANGULAR	UNSPECIFIED	NO	1							5 V		FIBER OPTIC				70 Cel		0 Cel	MATTE TIN	UNSPECIFIED		R-XXFO-X					Not Qualified			e3		260
TLK3138ZDU	Texas Instruments	TELECOM CIRCUIT	COMMERCIAL	BALL	484	BGA	SQUARE	PLASTIC/EPOXY	YES	2			CMOS		2		1.2 V	1.2,1.5,2.5	GRID ARRAY	BGA484,22X22,40	Network Interfaces	1 mm	70 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	3125 Mbps	S-PBGA-B484		4	2.42 mm	23 mm	Not Qualified			e1	30	260	23 mm
CY7B9234-270JXCT	Cypress Semiconductor	TELECOM CIRCUIT	COMMERCIAL	J BEND	28	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1			BICMOS				5 V		CHIP CARRIER			1.27 mm	70 Cel		0 Cel	MATTE TIN	QUAD		S-PQCC-J28		3	4.572 mm	11.5316 mm	Not Qualified			e3	20	260	11.5316 mm
CY7B9334-270JXC	Cypress Semiconductor	TELECOM CIRCUIT	COMMERCIAL	J BEND	28	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1			BICMOS				5 V		CHIP CARRIER			1.27 mm	70 Cel		0 Cel		QUAD		S-PQCC-J28			4.572 mm	11.5316 mm	Not Qualified				NOT SPECIFIED	NOT SPECIFIED	11.5316 mm
DS31256B	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1			CMOS				3.3 V		GRID ARRAY			1.27 mm	70 Cel		0 Cel	TIN LEAD	BOTTOM		S-PBGA-B256			2.54 mm	27 mm	Not Qualified			e0			27 mm
TLK3138GDU	Texas Instruments	TELECOM CIRCUIT	COMMERCIAL	BALL	484	BGA	SQUARE	PLASTIC/EPOXY	YES	2			CMOS		2		1.2 V	1.2,1.5,2.5	GRID ARRAY	BGA484,22X22,40	Network Interfaces	1 mm	70 Cel		0 Cel	TIN LEAD	BOTTOM	3125 Mbps	S-PBGA-B484		4			Not Qualified			e0	20	220
DS2291/87-22291-000	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	30		RECTANGULAR	UNSPECIFIED	NO	1							5 V		MICROELECTRONIC ASSEMBLY				70 Cel		0 Cel	TIN LEAD	SINGLE		R-XSMA-N30					Not Qualified			e0
MRF24WB0MA/RM	Microchip Technology	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	36	DIE	RECTANGULAR	UNSPECIFIED	YES	1							3.3 V	3.3	UNCASED CHIP	MODULE,36LEAD,.8	Other Telecom ICs		70 Cel		0 Cel	MATTE TIN	UPPER		R-XUUC-N36					Not Qualified			e3
MRF24WB0MB/RM	Microchip Technology	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	36	DIE	RECTANGULAR	UNSPECIFIED	YES	1							3.3 V		UNCASED CHIP				70 Cel		0 Cel	MATTE TIN	UPPER		R-XUUC-N36					Not Qualified			e3
TLK2711AJRZQE	Texas Instruments	TELECOM CIRCUIT	COMMERCIAL	BALL	80	VFBGA	SQUARE	PLASTIC/EPOXY	YES	1							2.5 V	2.5	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA80,9X9,20	Other Telecom ICs	.5 mm	70 Cel		0 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B80		3	1 mm	5 mm	Not Qualified			e1	30	260	5 mm
AD1803JRU	Analog Devices	TELECOM CIRCUIT	COMMERCIAL	GULL WING	24	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			CMOS				3.3 V	3.3/5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP24,.25	Modems	.65 mm	70 Cel		0 Cel	TIN LEAD	DUAL		R-PDSO-G24			1.1 mm	4.4 mm	Not Qualified			e0			7.8 mm
DS2174Q	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	J BEND	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1						.06 mA	3.3 V	3.3	CHIP CARRIER	LDCC44,.7SQ	Other Telecom ICs	1.27 mm	70 Cel		0 Cel	TIN LEAD	QUAD		S-PQCC-J44		3	4.57 mm	16.585 mm	Not Qualified			e0			16.585 mm
MAX3268CUB-T	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	10	HTSSOP	SQUARE	PLASTIC/EPOXY	YES	1			BIPOLAR			.062 mA	3.3 V	3.3/5	SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH	TSSOP10,.19,20	ATM/SONET/SDH ICs	.5 mm	70 Cel		0 Cel	TIN LEAD	DUAL		S-PDSO-G10		1	1.1 mm	3 mm	Not Qualified			e0	20	240	3 mm
MAX3768CUB	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	10	HTSSOP	SQUARE	PLASTIC/EPOXY	YES	1			BIPOLAR			.062 mA	3.3 V	3.3/5	SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH	TSSOP10,.19,20	ATM/SONET/SDH ICs	.5 mm	70 Cel		0 Cel	TIN LEAD	DUAL		S-PDSO-G10		1	1.1 mm	3 mm	Not Qualified			e0	20	240	3 mm
MAX3768CUB-T	Maxim Integrated	TELECOM CIRCUIT	COMMERCIAL	GULL WING	10	HTSSOP	SQUARE	PLASTIC/EPOXY	YES	1			BIPOLAR			.062 mA	3.3 V	3.3/5	SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH	TSSOP10,.19,20	ATM/SONET/SDH ICs	.5 mm	70 Cel		0 Cel	TIN LEAD	DUAL		S-PDSO-G10		1	1.1 mm	3 mm	Not Qualified			e0	20	240	3 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.