COMMERCIAL Other Function Telecom Interface ICs 79

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Output Code	No. of Channels	Technology	Screening Level	Maximum Supply Current	Nominal Supply Voltage	Input Code	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Resolution (um)	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Input Type	Additional Features	Maximum Analog Input	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
CYRF6936-40LTXC	Cypress Semiconductor	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	1						3 V		2.5/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20	Other Telecom ICs	.5 mm	70 Cel		0 Cel	NICKEL PALLADIUM GOLD	QUAD		S-XQCC-N40	3	1 mm	6 mm	Not Qualified				e4	20	260	6 mm
RI-RFM-003B-00	Texas Instruments	TELECOM CIRCUIT	COMMERCIAL	UNSPECIFIED			RECTANGULAR	UNSPECIFIED	NO	1									MICROELECTRONIC ASSEMBLY				50 Cel		0 Cel		UNSPECIFIED		R-XXMA-X				Not Qualified
TL851CDRG4	Texas Instruments	TELECOM CIRCUIT	COMMERCIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			BIPOLAR		.26 mA	5 V		5	SMALL OUTLINE	SOP16,.25	Other Telecom ICs	1.27 mm	40 Cel		0 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL		R-PDSO-G16	1	1.75 mm	3.9 mm	Not Qualified				e4	NOT SPECIFIED	260	9.9 mm
TL851CNE4	Texas Instruments	TELECOM CIRCUIT	COMMERCIAL	THROUGH-HOLE	16	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1			BIPOLAR			5 V			IN-LINE	DIP16,.3	Other Telecom ICs	2.54 mm	40 Cel		0 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDIP-T16	1	5.08 mm	7.62 mm	Not Qualified				e4			19.305 mm
TL852CNE4	Texas Instruments	TELECOM CIRCUIT	COMMERCIAL	THROUGH-HOLE	16	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1			BIPOLAR			5 V			IN-LINE	DIP16,.3	Other Telecom ICs	2.54 mm	40 Cel		0 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDIP-T16	1	5.08 mm	7.62 mm	Not Qualified				e4			19.305 mm
TLC320AD545PTG4	Texas Instruments	TELECOM CIRCUIT	COMMERCIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	TWOS COMPLEMENT	1				3.3 V	TWOS COMPLEMENT	3.3/5	FLATPACK, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	Codecs	.5 mm	70 Cel	16	0 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQFP-G48	1	1.6 mm	7 mm	Not Qualified	DIFFERENTIAL		3 V	e4	30	260	7 mm
UCC3750DWTRG4	Texas Instruments	TELECOM CIRCUIT	COMMERCIAL	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			BICMOS			5 V			SMALL OUTLINE			1.27 mm	70 Cel		0 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G28	2	2.65 mm	7.5 mm	Not Qualified				e4	30	260	17.9 mm
RN4678APL-V/RM113	Microchip Technology	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	33	XMA	RECTANGULAR	UNSPECIFIED	YES	1						1.9 V			MICROELECTRONIC ASSEMBLY	MODULE,33LEAD(UNSPEC)		1.1 mm	70 Cel		-20 Cel		UNSPECIFIED		R-XXMA-N33		2.46 mm	12 mm								22 mm
BM78SPPS5MC2-0004AA	Microchip Technology	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	33	XMA	RECTANGULAR	UNSPECIFIED	YES	1						1.9 V			MICROELECTRONIC ASSEMBLY	MODULE,33LEAD(UNSPEC)		1.1 mm	70 Cel		-20 Cel	GOLD OVER NICKEL	UNSPECIFIED		R-XXMA-N33		2.46 mm	12 mm					e4	40	255	22 mm
RN4678APL-V/RM120	Microchip Technology	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	33	XMA	RECTANGULAR	UNSPECIFIED	YES	1						1.9 V			MICROELECTRONIC ASSEMBLY	MODULE,33LEAD(UNSPEC)		1.1 mm	70 Cel		-20 Cel		UNSPECIFIED		R-XXMA-N33		2.46 mm	12 mm								22 mm
STA020DJTR	STMicroelectronics	TELECOM CIRCUIT	COMMERCIAL	GULL WING	24	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			CMOS			3.3 V			SMALL OUTLINE			1.27 mm	70 Cel		0 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G24	3	2.65 mm	7.5 mm					e4		260	15.4 mm
BM77SPPS3MC2-0007AA	Microchip Technology	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	30	XMA	RECTANGULAR	UNSPECIFIED	YES	1						3.3 V			MICROELECTRONIC ASSEMBLY	MODULE,30LEAD(UNSPEC)		1.1 mm	70 Cel		-20 Cel		UNSPECIFIED	.1125 Mbps	R-XXMA-N30		1.86 mm	12 mm						NOT SPECIFIED	NOT SPECIFIED	15 mm
BM78SPP05MC2-0002AA	Microchip Technology	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	30	XMA	RECTANGULAR	UNSPECIFIED	YES	1						1.9 V			MICROELECTRONIC ASSEMBLY	MODULE,30LEAD(UNSPEC)		1.1 mm	70 Cel		-20 Cel	GOLD OVER NICKEL	UNSPECIFIED		R-XXMA-N30		1.86 mm	12 mm					e4	40	255	15 mm
BM78SPPS5MC2-0002AA	Microchip Technology	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	33	XMA	RECTANGULAR	UNSPECIFIED	YES	1						1.9 V			MICROELECTRONIC ASSEMBLY	MODULE,33LEAD(UNSPEC)		1.1 mm	70 Cel		-20 Cel	GOLD OVER NICKEL	UNSPECIFIED		R-XXMA-N33		2.46 mm	12 mm					e4	40	255	22 mm
RN4870-V/RM118	Microchip Technology	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	33	XMA	RECTANGULAR	UNSPECIFIED	NO	1						3.3 V			MICROELECTRONIC ASSEMBLY	MODULE,33LEAD(UNSPEC)		1.1 mm	70 Cel		-20 Cel		UNSPECIFIED	.01 Mbps	R-XXMA-N33		2.46 mm	12 mm								22 mm
RN4678-V/RM100	Microchip Technology	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	33	XMA	RECTANGULAR	UNSPECIFIED	YES	1						3.3 V			MICROELECTRONIC ASSEMBLY			1.1 mm	70 Cel		-20 Cel		UNSPECIFIED		R-XXMA-N33		2.46 mm	12 mm								22 mm
RN4678APL-V/RM100	Microchip Technology	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	33	XMA	RECTANGULAR	UNSPECIFIED	YES	1						1.9 V			MICROELECTRONIC ASSEMBLY	MODULE,33LEAD(UNSPEC)		1.1 mm	70 Cel		-20 Cel		UNSPECIFIED		R-XXMA-N33		2.46 mm	12 mm								22 mm
BM70BLES1FC2-0002AA	Microchip Technology	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	33	XMA	RECTANGULAR	UNSPECIFIED	YES	1						3 V			MICROELECTRONIC ASSEMBLY	MODULE,33LEAD(UNSPEC)		1.1 mm	70 Cel		-20 Cel	Nickel/Gold (Ni/Au)	UNSPECIFIED	.0086 Mbps	R-XXMA-N33		2.46 mm	12 mm					e4			22 mm
BM71BLE01FC2-0002AA	Microchip Technology	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	17	QMA	RECTANGULAR	UNSPECIFIED	YES	1						3 V			MICROELECTRONIC ASSEMBLY	MODULE,17LEAD(UNSPEC)		1.2 mm	70 Cel		-20 Cel	Nickel/Gold (Ni/Au)	QUAD	.0086 Mbps	R-XQMA-N17		1.66 mm	6 mm					e4			8 mm
BM71BLES1FC2-0002AA	Microchip Technology	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	16	XMA	RECTANGULAR	UNSPECIFIED	YES	1						3 V			MICROELECTRONIC ASSEMBLY	MODULE,16LEAD(UNSPEC)		1.2 mm	70 Cel		-20 Cel	Nickel/Gold (Ni/Au)	UNSPECIFIED	.0086 Mbps	R-XXMA-N16		2.16 mm	9 mm					e4			11.5 mm
BCM20733A3KML1G	Cypress Semiconductor	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	YES	1			CMOS			1.2 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	70 Cel		0 Cel		QUAD		S-XQCC-N56		1 mm	7 mm								7 mm
BCM43570KFFBG	Cypress Semiconductor	TELECOM CIRCUIT	COMMERCIAL	BALL	242	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1						3.3 V			GRID ARRAY, THIN PROFILE, FINE PITCH	BGA242,23X23,16		.4 mm	60 Cel		0 Cel		BOTTOM	867 Mbps	S-PBGA-B242		1.05 mm	10 mm			Also has 1.2 V core supply					10 mm
RN4871-V/RM118	Microchip Technology	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	16	XMA	RECTANGULAR	UNSPECIFIED	YES	1				TS 16949		3 V			MICROELECTRONIC ASSEMBLY	MODULE,16LEAD(UNSPEC)		1.2 mm	70 Cel		-20 Cel		UNSPECIFIED	.01 Mbps	R-XXMA-N16		2.16 mm	9 mm								11.5 mm
PI3EQX1001XUAEX	Diodes Incorporated	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	18	HVQCCN	SQUARE	UNSPECIFIED	YES	1						3.3 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.4 mm	70 Cel		0 Cel		QUAD		S-XQCC-N18		.4 mm	2 mm						NOT SPECIFIED	NOT SPECIFIED	2 mm
RN4677-V/RM100	Microchip Technology	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	33	XMA	RECTANGULAR	UNSPECIFIED	YES	1				TS 16949		3.3 V			MICROELECTRONIC ASSEMBLY	MODULE,33LEAD(UNSPEC)		1.1 mm	70 Cel		-20 Cel	GOLD OVER NICKEL	UNSPECIFIED	.4 Mbps	R-XXMA-N33		2.46 mm	12 mm					e4			22 mm
RN4677-V/RM112	Microchip Technology	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	33	XMA	RECTANGULAR	UNSPECIFIED	YES	1				TS 16949		3.3 V			MICROELECTRONIC ASSEMBLY	MODULE,33LEAD(UNSPEC)		1.1 mm	70 Cel		-20 Cel	GOLD OVER NICKEL	UNSPECIFIED	.4 Mbps	R-XXMA-N33		2.46 mm	12 mm					e4			22 mm
RN4678-V/RM111	Microchip Technology	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	33	XMA	RECTANGULAR	UNSPECIFIED	YES	1				TS 16949		1.9 V			MICROELECTRONIC ASSEMBLY	MODULE,33LEAD(UNSPEC)		1.1 mm	70 Cel		-20 Cel		UNSPECIFIED		R-XXMA-N33		2.46 mm	12 mm								22 mm
BM23SPKA1NB9-0001AA	Microchip Technology	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	43	XMA	RECTANGULAR	UNSPECIFIED	YES	1						3.7 V			MICROELECTRONIC ASSEMBLY	MODULE,43LEAD(UNSPEC)		1.2 mm	70 Cel		-20 Cel		UNSPECIFIED		R-XXMA-N43		1.9 mm	15 mm								29 mm
BM23SPKA1NB9-0B02AA	Microchip Technology	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	43	XMA	RECTANGULAR	UNSPECIFIED	YES	1						3.7 V			MICROELECTRONIC ASSEMBLY	MODULE,43LEAD(UNSPEC)		1.2 mm	70 Cel		-20 Cel		UNSPECIFIED		R-XXMA-N43		1.9 mm	15 mm								29 mm
BM23SPKS1NB9-0001AA	Microchip Technology	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	43	XMA	RECTANGULAR	UNSPECIFIED	YES	1						3.7 V			MICROELECTRONIC ASSEMBLY	MODULE,43LEAD(UNSPEC)		1.2 mm	70 Cel		-20 Cel		UNSPECIFIED		R-XXMA-N43		1.9 mm	15 mm								29 mm
BM23SPKS1NB9-0B02AA	Microchip Technology	TELECOM CIRCUIT	COMMERCIAL	NO LEAD	43	XMA	RECTANGULAR	UNSPECIFIED	YES	1						3.7 V			MICROELECTRONIC ASSEMBLY	MODULE,43LEAD(UNSPEC)		1.2 mm	70 Cel		-20 Cel		UNSPECIFIED		R-XXMA-N43		1.9 mm	15 mm								29 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.