INDUSTRIAL Other Function Telecom Interface ICs 799

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Part RoHS Manufacturer Telecom IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Applications Surface Mount No. of Functions Output Code No. of Channels Technology Screening Level Nominal Negative Supply Voltage No. of Transceivers Maximum Supply Current Nominal Supply Voltage Hybrid Input Code Power Supplies (V) ISDN Access Rate Package Style (Meter) Package Equivalence Code Sub-Category Carrier Type-3 Terminal Pitch Maximum Operating Temperature Resolution (um) Battery Supply (V) Minimum Output High Voltage Maximum Output Low Voltage Standard Minimum Operating Temperature Maximum Gain Tolerance Terminal Finish Maximum Output Voltage Terminal Position Data Rate JESD-30 Code Reference Point Output (V) Moisture Sensitivity Level (MSL) Maximum Seated Height Linear Coding Carrier Type-2 Carrier Type-1 Width Qualification Maximum Output Low Current Companding Law Input Type Additional Features Battery Feed Maximum Analog Input JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Filter

STA8090EXGA

STMicroelectronics

TELECOM CIRCUIT

INDUSTRIAL

BALL

169

TFBGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

1.1 V

GRID ARRAY, THIN PROFILE, FINE PITCH

.65 mm

85 Cel

-40 Cel

MATTE TIN

BOTTOM

S-PBGA-B169

3

1.2 mm

9 mm

e3

260

9 mm

BGS13PN10E6327XTSA1

Infineon Technologies

TELECOM CIRCUIT

INDUSTRIAL

BUTT

10

BCC

RECTANGULAR

UNSPECIFIED

YES

1

CMOS

2.85 V

CHIP CARRIER

.4 mm

85 Cel

-40 Cel

TIN

BOTTOM

R-XBCC-B10

1

.4 mm

1.1 mm

e3

1.5 mm

BGM1033N7E6327XUSA1

Infineon Technologies

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

6

HVSON

RECTANGULAR

PLASTIC/EPOXY

YES

1

2.7 V

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

.54 mm

85 Cel

-40 Cel

DUAL

R-PDSO-N6

.77 mm

1.7 mm

NOT SPECIFIED

NOT SPECIFIED

2.3 mm

BGM15HA12E6327XTSA1

Infineon Technologies

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

12

VQCCN

RECTANGULAR

PLASTIC/EPOXY

YES

1

2.8 V

CHIP CARRIER, VERY THIN PROFILE

.4 mm

85 Cel

-40 Cel

GOLD NICKEL

BOTTOM

R-PBCC-N12

1

.65 mm

1.1 mm

e4

1.9 mm

BGM15MA12E6327XTSA1

Infineon Technologies

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

12

VQCCN

RECTANGULAR

PLASTIC/EPOXY

YES

1

2.8 V

CHIP CARRIER, VERY THIN PROFILE

.4 mm

85 Cel

-40 Cel

BOTTOM

R-PBCC-N12

1

.65 mm

1.1 mm

1.9 mm

ADRF5045BCCZN-R7

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

BUTT

24

HLGA

SQUARE

UNSPECIFIED

YES

1

-3.3 V

3.3 V

GRID ARRAY, HEAT SINK/SLUG

.5 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

BOTTOM

S-XBGA-B24

3

.96 mm

4 mm

e4

30

260

4 mm

ADRF5045BCCZN

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

BUTT

24

HLGA

SQUARE

UNSPECIFIED

YES

1

-3.3 V

3.3 V

GRID ARRAY, HEAT SINK/SLUG

.5 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

BOTTOM

S-XBGA-B24

3

.96 mm

4 mm

e4

30

260

4 mm

RN4870-I/RM128

Microchip Technology

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

33

XMA

RECTANGULAR

UNSPECIFIED

NO

1

3.3 V

MICROELECTRONIC ASSEMBLY

MODULE,33LEAD(UNSPEC)

1.1 mm

85 Cel

-40 Cel

UNSPECIFIED

.01 Mbps

R-XXMA-N33

2.46 mm

12 mm

22 mm

ADL5335ACPZN-R7

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

16

HVQCCN

SQUARE

UNSPECIFIED

YES

1

5 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.65 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

S-XQCC-N16

3

.8 mm

4 mm

e4

30

260

4 mm

ADL5335ACPZN

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

16

HVQCCN

SQUARE

UNSPECIFIED

YES

1

5 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.65 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

S-XQCC-N16

3

.8 mm

4 mm

e4

30

260

4 mm

ADRF5044BCCZN-R7

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

BUTT

24

HLGA

SQUARE

UNSPECIFIED

YES

1

-3.3 V

3.3 V

GRID ARRAY, HEAT SINK/SLUG

.5 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

BOTTOM

S-XBGA-B24

3

.96 mm

4 mm

e4

30

260

4 mm

LMX8410RGZR

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

48

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD SILVER

QUAD

S-PQCC-N48

3

1 mm

7 mm

e4

30

260

7 mm

LMX8410RGZT

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

48

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD SILVER

QUAD

S-PQCC-N48

3

1 mm

7 mm

e4

30

260

7 mm

AX5031-1-TA05

Onsemi

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

20

HVQCCN

SQUARE

UNSPECIFIED

YES

1

CMOS

3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC20,.16SQ,20

.5 mm

85 Cel

-40 Cel

TIN

QUAD

S-XQCC-N20

1

1 mm

4 mm

e3

260

4 mm

HMC773ALC3BTR-R5

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

12

HVQCCN

SQUARE

UNSPECIFIED

YES

1

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

QUAD

S-XQCC-N12

.9 mm

2.9 mm

NOT SPECIFIED

NOT SPECIFIED

2.9 mm

LEA-6H-0

U-blox Ag

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

28

RECTANGULAR

UNSPECIFIED

NO

1

AEC-Q100

3 V

MICROELECTRONIC ASSEMBLY

1.1 mm

85 Cel

-40 Cel

DUAL

R-XDMA-N28

2.7 mm

17 mm

NOT SPECIFIED

NOT SPECIFIED

22.4 mm

LC72720YVS-MPB-E

Onsemi

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

30

LSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

3.3 V

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

.65 mm

85 Cel

-40 Cel

TIN BISMUTH

DUAL

R-PDSO-G30

4

1.5 mm

5.6 mm

e6

30

260

9.75 mm

LC72720YVS-TLM-E

Onsemi

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

30

LSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

3.3 V

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

.65 mm

85 Cel

-40 Cel

TIN BISMUTH

DUAL

R-PDSO-G30

4

1.5 mm

5.6 mm

e6

30

260

9.75 mm

HMC641ALP4ETR

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

24

HVQCCN

SQUARE

UNSPECIFIED

YES

1

-3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

QUAD

S-XQCC-N24

.95 mm

4 mm

NOT SPECIFIED

NOT SPECIFIED

4 mm

LMS7002M

Lime Microsystems

TELECOM CIRCUIT

INDUSTRIAL

BALL

261

BGA

SQUARE

PLASTIC/EPOXY

YES

1

1.2 V

GRID ARRAY

85 Cel

-40 Cel

BOTTOM

S-PBGA-B261

11.5 mm

11.5 mm

IP4047CX6/LF,135

Nexperia

TELECOM CIRCUIT

INDUSTRIAL

BALL

6

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.5 mm

85 Cel

-40 Cel

BOTTOM

R-PBGA-B6

.7 mm

.99 mm

1.44 mm

RN41XVC-I/RM

Microchip Technology

TELECOM CIRCUIT

INDUSTRIAL

THROUGH-HOLE

20

RECTANGULAR

UNSPECIFIED

NO

1

3.3 V

MICROELECTRONIC ASSEMBLY

85 Cel

-40 Cel

DUAL

R-XDMA-T20

1

2 mm

24.4 mm

29.9 mm

RN41XVU-I/RM

Microchip Technology

TELECOM CIRCUIT

INDUSTRIAL

THROUGH-HOLE

20

RECTANGULAR

UNSPECIFIED

NO

1

3.3 V

MICROELECTRONIC ASSEMBLY

85 Cel

-40 Cel

Nickel/Gold (Ni/Au)

DUAL

R-XDMA-T20

2 mm

24.4 mm

e4

29.9 mm

RN42XVU-I/RM

Microchip Technology

TELECOM CIRCUIT

INDUSTRIAL

THROUGH-HOLE

20

RECTANGULAR

UNSPECIFIED

NO

1

3.3 V

MICROELECTRONIC ASSEMBLY

85 Cel

-40 Cel

Nickel/Gold (Ni/Au)

DUAL

R-XDMA-T20

2 mm

24.4 mm

e4

29.9 mm

HMC745LC3TR-R5

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

16

HVQCCN

SQUARE

CERAMIC, METAL-SEALED COFIRED

YES

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

QUAD

S-CQCC-N16

3

.9 mm

2.9 mm

2.9 mm

AX-SFEU-1-01-TB05

Onsemi

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

40

HVQCCN

RECTANGULAR

PLASTIC/EPOXY

YES

1

3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC40,.2X.27,20

.5 mm

85 Cel

-40 Cel

Nickel/Palladium/Gold (Ni/Pd/Au)

QUAD

R-PQCC-N40

1

1 mm

5 mm

e4

260

7 mm

AX5243-1-TA05

Onsemi

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

20

HVQCCN

SQUARE

UNSPECIFIED

YES

1

CMOS

3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

TIN

QUAD

S-XQCC-N20

1

1 mm

4 mm

e3

260

4 mm

AX5243-1-TW30

Onsemi

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

20

HVQCCN

SQUARE

UNSPECIFIED

YES

1

CMOS

3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-XQCC-N20

1

1 mm

4 mm

e3

30

260

4 mm

BGA5M1BN6E6327XTSA1

Infineon Technologies

TELECOM CIRCUIT

INDUSTRIAL

BUTT

6

BCC

RECTANGULAR

UNSPECIFIED

YES

1

1.8 V

CHIP CARRIER

.4 mm

85 Cel

-40 Cel

BOTTOM

R-XBCC-B6

1

.4 mm

.7 mm

1.1 mm

RM024-P125-C-30

Laird Technologies

TELECOM CIRCUIT

INDUSTRIAL

UNSPECIFIED

XMA

RECTANGULAR

UNSPECIFIED

NO

1

MICROELECTRONIC ASSEMBLY

85 Cel

-40 Cel

UNSPECIFIED

.5 Mbps

R-XXMA-X

ALSO AVAILABLE WITH 280kbps data rate

NOT SPECIFIED

NOT SPECIFIED

RM024-S125-C-30

Laird Technologies

TELECOM CIRCUIT

INDUSTRIAL

UNSPECIFIED

XMA

RECTANGULAR

UNSPECIFIED

NO

1

MICROELECTRONIC ASSEMBLY

85 Cel

-40 Cel

UNSPECIFIED

.5 Mbps

R-XXMA-X

ALSO AVAILABLE WITH 280kbps data rate

NOT SPECIFIED

NOT SPECIFIED

ADAR1000ACCZN-R7

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

BUTT

88

HLGA

SQUARE

PLASTIC/EPOXY

YES

1

-5 V

3.3 V

GRID ARRAY, HEAT SINK/SLUG

.5 mm

85 Cel

-40 Cel

BOTTOM

S-PBGA-B88

3

.8 mm

7 mm

260

7 mm

ADAR1000ACCZN

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

BUTT

88

HLGA

SQUARE

PLASTIC/EPOXY

YES

1

-5 V

3.3 V

GRID ARRAY, HEAT SINK/SLUG

.5 mm

85 Cel

-40 Cel

BOTTOM

S-PBGA-B88

.8 mm

7 mm

NOT SPECIFIED

NOT SPECIFIED

7 mm

LEA-6T-0

U-blox Ag

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

28

SON

RECTANGULAR

PLASTIC/EPOXY

YES

1

AEC-Q100; TS 16949

3 V

SMALL OUTLINE

85 Cel

-40 Cel

DUAL

R-PDSO-N28

ADRV9009BBCZ

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

BALL

196

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1

1.3 V

GRID ARRAY, LOW PROFILE, FINE PITCH

.8 mm

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

S-PBGA-B196

3

1.27 mm

12 mm

e1

260

12 mm

AX5042-1-TA05

Onsemi

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

28

HVQCCN

SQUARE

UNSPECIFIED

YES

1

CMOS

2.5 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

Nickel/Palladium/Gold (Ni/Pd/Au)

QUAD

S-XQCC-N28

1

1 mm

5 mm

e4

260

5 mm

ADRV9008BBCZ-1

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

BALL

196

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1

1.3 V

GRID ARRAY, LOW PROFILE, FINE PITCH

.8 mm

85 Cel

-40 Cel

BOTTOM

S-PBGA-B196

3

1.27 mm

12 mm

260

12 mm

ADRV9008BBCZ-2

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

BALL

196

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1

1.3 V

GRID ARRAY, LOW PROFILE, FINE PITCH

.8 mm

85 Cel

-40 Cel

BOTTOM

S-PBGA-B196

3

1.27 mm

12 mm

260

12 mm

ZED-F9P-00B

U-blox Ag

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

54

LGA

RECTANGULAR

UNSPECIFIED

YES

1

AEC-Q100

3 V

GRID ARRAY

1.1 mm

85 Cel

-40 Cel

BOTTOM

R-XBGA-N54

2.6 mm

17 mm

22 mm

XB3-24Z8PS-J

Digi International

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

37

RECTANGULAR

UNSPECIFIED

YES

1

MICROELECTRONIC ASSEMBLY

85 Cel

-40 Cel

UNSPECIFIED

R-XXMA-N37

NOT SPECIFIED

NOT SPECIFIED

XB3-24Z8RM-J

Digi International

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

34

RECTANGULAR

UNSPECIFIED

YES

1

MICROELECTRONIC ASSEMBLY

85 Cel

-40 Cel

UNSPECIFIED

R-XXMA-N34

13 mm

NOT SPECIFIED

NOT SPECIFIED

19 mm

XB3-24Z8RM

Digi International

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

34

RECTANGULAR

UNSPECIFIED

YES

1

MICROELECTRONIC ASSEMBLY

85 Cel

-40 Cel

UNSPECIFIED

R-XXMA-N34

13 mm

19 mm

XB3-24Z8RS

Digi International

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

37

RECTANGULAR

UNSPECIFIED

YES

1

MICROELECTRONIC ASSEMBLY

85 Cel

-40 Cel

UNSPECIFIED

R-XXMA-N37

XB3-24Z8US-J

Digi International

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

37

RECTANGULAR

UNSPECIFIED

YES

1

MICROELECTRONIC ASSEMBLY

85 Cel

-40 Cel

UNSPECIFIED

R-XXMA-N37

NOT SPECIFIED

NOT SPECIFIED

VSC8490YJU-17

Microchip Technology

TELECOM CIRCUIT

INDUSTRIAL

BALL

196

LBGA

SQUARE

PLASTIC/EPOXY

YES

1

1 V

GRID ARRAY, LOW PROFILE

BGA196,14X14,40

1 mm

110 Cel

-40 Cel

BOTTOM

10000 Mbps

S-PBGA-B196

1.4 mm

15 mm

15 mm

VSC8491YJU-17

Microchip Technology

TELECOM CIRCUIT

INDUSTRIAL

BALL

196

LBGA

SQUARE

PLASTIC/EPOXY

YES

1

1 V

GRID ARRAY, LOW PROFILE

BGA196,14X14,40

1 mm

110 Cel

-40 Cel

BOTTOM

10000 Mbps

S-PBGA-B196

1.4 mm

15 mm

15 mm

ADF5902WCCPZ

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

YES

1

AEC-Q100

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

105 Cel

-40 Cel

QUAD

S-XQCC-N32

3

.8 mm

5 mm

260

5 mm

ZED-F9T-00B

U-blox Ag

TELECOM CIRCUIT

INDUSTRIAL

BUTT

54

LGA

RECTANGULAR

UNSPECIFIED

YES

1

AEC-Q100

3 V

GRID ARRAY

1.1 mm

85 Cel

-40 Cel

BOTTOM

R-XBGA-B54

4

2.6 mm

17 mm

22 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.