INDUSTRIAL Other Function Telecom Interface ICs 799

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Screening Level	Nominal Supply Voltage	Package Style (Meter)	Package Equivalence Code	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Additional Features	Maximum Analog Input	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
453-00005C	Laird Technologies	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	39		RECTANGULAR	UNSPECIFIED	YES	1			3 V	MICROELECTRONIC ASSEMBLY		.75 mm	85 Cel	-40 Cel		UNSPECIFIED		R-XXMA-N39	4	2.33 mm	10 mm				30	260	14 mm
XB24CZ7PIS-004	Digi International	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD			RECTANGULAR	UNSPECIFIED	YES	1			3.3 V	MICROELECTRONIC ASSEMBLY			85 Cel	-40 Cel		UNSPECIFIED		R-XXMA-N							NOT SPECIFIED	NOT SPECIFIED
ADS58J64IRRHR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	72	HQCCN	RECTANGULAR	UNSPECIFIED	YES	1			1.15 V	CHIP CARRIER, HEAT SINK/SLUG			85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		R-XQCC-N72	3				2 V	e4	30	260
MWCT1013VLHSTR	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V	FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	.5 mm	105 Cel	-40 Cel		QUAD		S-PQFP-G64		1.6 mm	10 mm						10 mm
MWCT1013VLHST	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V	FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	.5 mm	105 Cel	-40 Cel		QUAD		S-PQFP-G64		1.6 mm	10 mm						10 mm
TEF6657HN/V101,518	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	QCCN	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100	3.3 V	CHIP CARRIER			85 Cel	-40 Cel		QUAD		S-PQCC-N32
AFE7700IABJ	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	BALL	400	FBGA	SQUARE	PLASTIC/EPOXY	YES	1				GRID ARRAY, FINE PITCH		.8 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B400	3	2.65 mm	17 mm	RF frequency(Min)(MHz) is 600; RF frequency(Max)(MHz) is 6000		e1	30	260	17 mm
ADRV9026BBCZ-REEL	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	4			1 V	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	.8 mm	110 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B289	3	1.46 mm	14 mm	ALSO OPERATES IN 1.3V AND 1.8V NOMINAL VOLTAGE		e1	30	260	14 mm
ADRV9026BBCZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	4			1 V	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	.8 mm	110 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B289	3	1.46 mm	14 mm	ALSO OPERATES IN 1.3V AND 1.8V NOMINAL VOLTAGE		e1	30	260	14 mm
ATSAMW25H18-MR210PB1952	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	51		RECTANGULAR	UNSPECIFIED	YES	1			3.3 V	MICROELECTRONIC ASSEMBLY		1.2 mm	85 Cel	-40 Cel		UNSPECIFIED		R-XXMA-N51		2.138 mm	14.908 mm						33.864 mm
ATSAMW25H18-MR210PB1954	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	51		RECTANGULAR	UNSPECIFIED	YES	1			3.3 V	MICROELECTRONIC ASSEMBLY		1.2 mm	85 Cel	-40 Cel		UNSPECIFIED		R-XXMA-N51		2.138 mm	14.908 mm						33.864 mm
ATSAMW25H18-MR210PB1961	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	51		RECTANGULAR	UNSPECIFIED	YES	1			3.3 V	MICROELECTRONIC ASSEMBLY		1.2 mm	85 Cel	-40 Cel		UNSPECIFIED		R-XXMA-N51		2.138 mm	14.908 mm						33.864 mm
BM70BLE01FC2-0B04AA	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	30	XMA	RECTANGULAR	UNSPECIFIED	YES	1		TS 16949	3 V	MICROELECTRONIC ASSEMBLY	MODULE,30LEAD(UNSPEC)	1.1 mm	85 Cel	-40 Cel		UNSPECIFIED	.0086 Mbps	R-XXMA-N30		.66 mm	12 mm						15 mm
MRF24J40ME-I/RM	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	12		RECTANGULAR	UNSPECIFIED	NO	1		TS 16949	3.3 V	MICROELECTRONIC ASSEMBLY		2.54 mm	85 Cel	-40 Cel		DUAL		R-XDMA-N12		3.48 mm	22.86 mm						33.02 mm
MRF24J40MET-I/RM	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	12		RECTANGULAR	UNSPECIFIED	NO	1		TS 16949	3.3 V	MICROELECTRONIC ASSEMBLY		2.54 mm	85 Cel	-40 Cel		DUAL		R-XDMA-N12		3.48 mm	22.86 mm						33.02 mm
MRF24WN0MA-I/RM100	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	37		RECTANGULAR	UNSPECIFIED	YES	1		TS 16949	3.3 V	MICROELECTRONIC ASSEMBLY			85 Cel	-40 Cel		UNSPECIFIED		R-XXMA-N37		2.286 mm	17.78 mm						26.67 mm
RN42-I/RM630	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	XMA	RECTANGULAR	UNSPECIFIED	YES	1		TS 16949	3.3 V	MICROELECTRONIC ASSEMBLY	MODULE,32LEAD(UNSPEC)	1 mm	85 Cel	-40 Cel	GOLD OVER NICKEL	UNSPECIFIED	3 Mbps	R-XXMA-N32		2.4 mm	13.4 mm			e4			25.8 mm
RN42APL-I/RM550	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	XMA	RECTANGULAR	UNSPECIFIED	YES	1		TS 16949	3.3 V	MICROELECTRONIC ASSEMBLY	MODULE,32LEAD(UNSPEC)	1 mm	85 Cel	-40 Cel	GOLD OVER NICKEL	UNSPECIFIED	3 Mbps	R-XXMA-N32		2.4 mm	13.4 mm			e4			25.8 mm
RN41-I/RM630	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32		RECTANGULAR	UNSPECIFIED	YES	1		TS 16949	3.3 V	MICROELECTRONIC ASSEMBLY			85 Cel	-40 Cel	GOLD OVER NICKEL	UNSPECIFIED		R-XXMA-N32		2.1 mm	13.2 mm			e4			25.8 mm
RN41SM-I/RM	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32		RECTANGULAR	UNSPECIFIED	YES	1		TS 16949	3.3 V	MICROELECTRONIC ASSEMBLY			85 Cel	-40 Cel	GOLD OVER NICKEL	UNSPECIFIED		R-XXMA-N32		2.1 mm	13.2 mm			e4			25.8 mm
RN42-I/RM477	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	XMA	RECTANGULAR	UNSPECIFIED	YES	1		TS 16949	3.3 V	MICROELECTRONIC ASSEMBLY	MODULE,32LEAD(UNSPEC)	1 mm	85 Cel	-40 Cel	GOLD OVER NICKEL	UNSPECIFIED	3 Mbps	R-XXMA-N32		2.4 mm	13.4 mm			e4			25.8 mm
RN42HCI-I/RM	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	35	XMA	RECTANGULAR	UNSPECIFIED	YES	1			3.3 V	MICROELECTRONIC ASSEMBLY	MODULE,35LEAD(UNSPEC)	1.2 mm	85 Cel	-40 Cel		UNSPECIFIED	3 Mbps	R-XXMA-N35		2.4 mm	13.4 mm				NOT SPECIFIED	NOT SPECIFIED	25.6 mm
RN42HID-I/RM	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	XMA	RECTANGULAR	UNSPECIFIED	YES	1		TS 16949	3.3 V	MICROELECTRONIC ASSEMBLY	MODULE,32LEAD(UNSPEC)	1 mm	85 Cel	-40 Cel	GOLD OVER NICKEL	UNSPECIFIED	3 Mbps	R-XXMA-N32		2.4 mm	13.4 mm			e4			25.8 mm
RN42N-I/RM477	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32		RECTANGULAR	UNSPECIFIED	YES	1		TS 16949	3.3 V	MICROELECTRONIC ASSEMBLY			85 Cel	-40 Cel	GOLD OVER NICKEL	UNSPECIFIED		R-XXMA-N32		2.4 mm	13.4 mm			e4			20.5 mm
RN42SM-I/RM	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32		RECTANGULAR	UNSPECIFIED	YES	1		TS 16949	3.3 V	MICROELECTRONIC ASSEMBLY			85 Cel	-40 Cel	GOLD OVER NICKEL	UNSPECIFIED		R-XXMA-N32		2.4 mm	13.4 mm			e4			25.8 mm
RN42U-I/RM	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32		RECTANGULAR	UNSPECIFIED	YES	1		TS 16949	3.3 V	MICROELECTRONIC ASSEMBLY			85 Cel	-40 Cel		UNSPECIFIED		R-XXMA-N32		2.4 mm	13.4 mm				NOT SPECIFIED	NOT SPECIFIED	25.8 mm
MRF24WG0MART-I/RM	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	36		RECTANGULAR	UNSPECIFIED	NO	1		TS 16949	3.3 V	MICROELECTRONIC ASSEMBLY			85 Cel	-40 Cel		DUAL		R-XDMA-N36		2.7 mm	21 mm						31 mm
A2235-H	Lantronix	TELECOM CIRCUIT	INDUSTRIAL	UNSPECIFIED			RECTANGULAR	UNSPECIFIED	NO	1			3.3 V	MICROELECTRONIC ASSEMBLY			85 Cel	-40 Cel		UNSPECIFIED		R-XXMA-X
BG96MA-128-SGN	Quectel Wireless Solutions	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	102		RECTANGULAR	UNSPECIFIED	YES	1			3.8 V	MICROELECTRONIC ASSEMBLY			85 Cel	-40 Cel		UNSPECIFIED		R-XXMA-N102		2.3 mm	22.5 mm						26.5 mm
AX50311-1-WD1	Onsemi	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD		DIE	UNSPECIFIED	UNSPECIFIED	YES	1	CMOS		3 V	UNCASED CHIP	DIE OR CHIP		85 Cel	-40 Cel		UPPER	2 Mbps	X-XUUC-N				DATA RATE 350 KBPS FOR FSK,MODULATION			NOT SPECIFIED	NOT SPECIFIED
AX5042-1-TW30	Onsemi	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	28	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS		2.5 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC28,.2SQ,20	.5 mm	85 Cel	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	QUAD	.25 Mbps	S-XQCC-N28		1 mm	5 mm			e4			5 mm
ATSAMW25H18-MR210PB	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	51		RECTANGULAR	UNSPECIFIED	YES	1			3.3 V	MICROELECTRONIC ASSEMBLY		1.2 mm	85 Cel	-40 Cel		UNSPECIFIED		R-XXMA-N51		2.138 mm	14.908 mm						33.864 mm
MRF24WG0MA-I/RM10C	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	36		RECTANGULAR	UNSPECIFIED	NO	1		TS 16949	3.3 V	MICROELECTRONIC ASSEMBLY		1.27 mm	85 Cel	-40 Cel		DUAL		R-XDMA-N36		2.7 mm	21 mm						31 mm
MRF24WG0MB-I/RM10C	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	36		RECTANGULAR	UNSPECIFIED	NO	1		TS 16949	3.3 V	MICROELECTRONIC ASSEMBLY		1.27 mm	85 Cel	-40 Cel		DUAL		R-XDMA-N36		2.7 mm	21 mm						31 mm
MRF24WG0MBR-I/RM10C	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	36		RECTANGULAR	UNSPECIFIED	NO	1		TS 16949	3.3 V	MICROELECTRONIC ASSEMBLY			85 Cel	-40 Cel		DUAL		R-XDMA-N36		2.7 mm	21 mm						31 mm
MRF24WG0MAT-I/RM10C	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL		36		RECTANGULAR	UNSPECIFIED		1		TS 16949	3.3 V				85 Cel	-40 Cel						2.7 mm	21 mm						31 mm
ATSAMW25H18-MR210PB1944	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	51		RECTANGULAR	UNSPECIFIED	YES	1			3.3 V	MICROELECTRONIC ASSEMBLY		1.2 mm	85 Cel	-40 Cel		UNSPECIFIED		R-XXMA-N51		2.138 mm	14.908 mm						33.864 mm
ATSAMW25H18-MR510PB	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	51		RECTANGULAR	UNSPECIFIED	YES	1			3.3 V	MICROELECTRONIC ASSEMBLY		1.2 mm	85 Cel	-40 Cel		UNSPECIFIED		R-XXMA-N51		2.138 mm	14.908 mm						33.864 mm
VSC8491YJU-13	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	BALL	196	LBGA	SQUARE	PLASTIC/EPOXY	YES	1			1 V	GRID ARRAY, LOW PROFILE		1 mm	110 Cel	-40 Cel		BOTTOM		S-PBGA-B196		1.4 mm	15 mm						15 mm
ADTR1107ACCZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	TFLGA	SQUARE	UNSPECIFIED	YES	1			5 V	GRID ARRAY, THIN PROFILE, FINE PITCH	LCC24,.2SQ,25	.65 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	BOTTOM		S-XBGA-N24	3	1.13 mm	5 mm			e4		260	5 mm
ADL5910ACPZN-R7	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	1			3.3 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm	105 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-XQCC-N16	3	.8 mm	3 mm			e4	30	260	3 mm
ADF5901ACPZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1			3.3 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	.5 mm	105 Cel	-40 Cel		QUAD		S-XQCC-N32	3	.8 mm	5 mm				30	260	5 mm
HMC8100LP6JETR	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	1			3.3 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20	.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD		S-XQCC-N40	3	.95 mm	6 mm			e4	30	260	6 mm
RN4871-I/RM128	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	XMA	RECTANGULAR	UNSPECIFIED	NO	1		TS 16949	3.3 V	MICROELECTRONIC ASSEMBLY	MODULE,16LEAD(UNSPEC)	1.2 mm	85 Cel	-40 Cel		UNSPECIFIED	.01 Mbps	R-XXMA-N16		2.16 mm	9 mm						11.5 mm
AX-SFAZ-1-01-TB05	Onsemi	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	40	HVQCCN	RECTANGULAR	PLASTIC/EPOXY	YES	1			3.3 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.2X.27,20	.5 mm	85 Cel	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	QUAD	.0006 Mbps	R-PQCC-N40		1 mm	5 mm			e4			7 mm
ATA5577M3330C-DDB	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	UNSPECIFIED	2	DIE	RECTANGULAR	UNSPECIFIED		1				UNCASED CHIP	DIE OR CHIP	.524 mm	85 Cel	-40 Cel		UPPER		R-XUUC-N2		.162 mm	1 mm						1.35 mm
STA8089GR	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS		1.1 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC56,.27SQ,16	.4 mm	85 Cel	-40 Cel		QUAD		S-XQCC-N56		.9 mm	7 mm						7 mm
BGM113A256V21	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	36		RECTANGULAR	UNSPECIFIED	YES	1			3.3 V	MICROELECTRONIC ASSEMBLY		.8 mm	85 Cel	-40 Cel		UNSPECIFIED				2 mm	9.15 mm						15.73 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.