INDUSTRIAL Other Function Telecom Interface ICs 799

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Part RoHS Manufacturer Telecom IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Applications Surface Mount No. of Functions Output Code No. of Channels Technology Screening Level Nominal Negative Supply Voltage No. of Transceivers Maximum Supply Current Nominal Supply Voltage Hybrid Input Code Power Supplies (V) ISDN Access Rate Package Style (Meter) Package Equivalence Code Sub-Category Carrier Type-3 Terminal Pitch Maximum Operating Temperature Resolution (um) Battery Supply (V) Minimum Output High Voltage Maximum Output Low Voltage Standard Minimum Operating Temperature Maximum Gain Tolerance Terminal Finish Maximum Output Voltage Terminal Position Data Rate JESD-30 Code Reference Point Output (V) Moisture Sensitivity Level (MSL) Maximum Seated Height Linear Coding Carrier Type-2 Carrier Type-1 Width Qualification Maximum Output Low Current Companding Law Input Type Additional Features Battery Feed Maximum Analog Input JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Filter

SN65LVCP40RGZTG4

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

48

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

.254 mA

3.3 V

3.3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC48,.27SQ,20

Other Telecom ICs

.5 mm

85 Cel

-40 Cel

Nickel/Palladium/Gold (Ni/Pd/Au)

QUAD

4000 Mbps

S-PQCC-N48

3

1 mm

7 mm

Not Qualified

e4

NOT SPECIFIED

260

7 mm

ONET4291TAYS

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

10

DIE

RECTANGULAR

UNSPECIFIED

YES

1

.025 mA

3.3 V

3.3

UNCASED CHIP

DIE OR CHIP

Other Telecom ICs

85 Cel

-40 Cel

UPPER

R-XUUC-N10

Not Qualified

NOT SPECIFIED

NOT SPECIFIED

RN41-I/RM

Microchip Technology

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

32

RECTANGULAR

UNSPECIFIED

YES

1

3.3 V

MICROELECTRONIC ASSEMBLY

85 Cel

-40 Cel

MATTE TIN

UNSPECIFIED

R-XXMA-N32

2.2 mm

13.2 mm

e3

25.8 mm

RN41N-I/RM477

Microchip Technology

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

35

RECTANGULAR

UNSPECIFIED

YES

1

3.3 V

MICROELECTRONIC ASSEMBLY

85 Cel

-40 Cel

MATTE TIN

QUAD

R-XQMA-N35

2.2 mm

13.2 mm

e3

20.1 mm

RN41N-I/RM615

Microchip Technology

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

35

RECTANGULAR

UNSPECIFIED

YES

1

3.3 V

MICROELECTRONIC ASSEMBLY

85 Cel

-40 Cel

MATTE TIN

QUAD

R-XQMA-N35

2.2 mm

13.2 mm

e3

20.1 mm

CC1201RHBT

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

32

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

3 V

3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC32,.2SQ,20

Other Telecom ICs

.5 mm

85 Cel

-40 Cel

Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

QUAD

1.25 Mbps

S-PQCC-N32

3

1 mm

5 mm

Not Qualified

e4

NOT SPECIFIED

260

5 mm

TRF3722IRGZT

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

48

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

S-PQCC-N48

2

1 mm

7 mm

e4

30

260

7 mm

ONET8501TYS

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

19

DIE

RECTANGULAR

UNSPECIFIED

YES

1

44 mA

3.3 V

UNCASED CHIP

100 Cel

-40 Cel

UPPER

11300 Mbps

R-XUUC-N19

Not Qualified

Data rate is 11.3 Gbps

NOT SPECIFIED

NOT SPECIFIED

ONET8501TY

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

19

DIE

RECTANGULAR

UNSPECIFIED

YES

1

44 mA

3.3 V

UNCASED CHIP

100 Cel

-40 Cel

UPPER

11300 Mbps

R-XUUC-N19

Not Qualified

Data rate is 11.3 Gbps

NOT SPECIFIED

NOT SPECIFIED

AMIS-49250-XTD

Onsemi

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

44

HVQCCN

SQUARE

UNSPECIFIED

YES

1

1

.0008 mA

3 V

3,5

CHIP CARRIER

LCC44,.28SQ,20

Network Interfaces

.5 mm

85 Cel

-40 Cel

TIN

QUAD

.03125 Mbps

S-XQCC-N44

3

.9 mm

7 mm

Not Qualified

e3

30

260

7 mm

AMIS-49250-XTP

Onsemi

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

44

HVQCCN

SQUARE

UNSPECIFIED

YES

1

1

.0008 mA

3 V

3,5

CHIP CARRIER

LCC44,.28SQ,20

Network Interfaces

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

.03125 Mbps

S-XQCC-N44

3

.9 mm

7 mm

Not Qualified

e3

30

260

7 mm

XRT85L61IG-F

Exar

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

28

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

3.3 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

.65 mm

85 Cel

-40 Cel

MATTE TIN

DUAL

R-PDSO-G28

1

1.2 mm

4.4 mm

Not Qualified

e3

9.7 mm

AD9993BBCZ

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

BALL

196

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1

1.8 V

GRID ARRAY, LOW PROFILE, FINE PITCH

.8 mm

85 Cel

-40 Cel

BOTTOM

S-PBGA-B196

3

1.4 mm

12 mm

30

260

12 mm

UAA3201T/V1,112

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

16

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

3.5/6

SMALL OUTLINE

SOP16,.25

Other Telecom ICs

1.27 mm

85 Cel

-40 Cel

DUAL

R-PDSO-G16

Not Qualified

UAA3220TS/V1,118

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

24

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

SMALL OUTLINE, SHRINK PITCH

.65 mm

85 Cel

-40 Cel

DUAL

R-PDSO-G24

2 mm

5.3 mm

8.2 mm

SA5211D,602

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

14

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

BIPOLAR

.031 mA

5 V

5

SMALL OUTLINE

SOP14,.25

Other Telecom ICs

1.27 mm

85 Cel

-40 Cel

DUAL

R-PDSO-G14

1.75 mm

3.9 mm

Not Qualified

40

260

8.65 mm

SA5212AD,602

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

BIPOLAR

.033 mA

5 V

5

SMALL OUTLINE

SOP8,.25

Other Telecom ICs

1.27 mm

85 Cel

-40 Cel

DUAL

R-PDSO-G8

1.75 mm

3.9 mm

Not Qualified

40

260

4.9 mm

SA602AD,602

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

6 V

SMALL OUTLINE

1.27 mm

85 Cel

-40 Cel

DUAL

R-PDSO-G8

1.75 mm

3.9 mm

Not Qualified

4.9 mm

SA606DK,112

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

20

LSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

3 V

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

.65 mm

85 Cel

-40 Cel

DUAL

R-PDSO-G20

1.5 mm

4.4 mm

Not Qualified

40

260

6.5 mm

SA606DK,118

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

20

LSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

3 V

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

.65 mm

85 Cel

-40 Cel

DUAL

R-PDSO-G20

1.5 mm

4.4 mm

Not Qualified

6.5 mm

SA612AN,112

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

THROUGH-HOLE

8

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

1

6 V

IN-LINE

2.54 mm

85 Cel

-40 Cel

DUAL

R-PDIP-T8

4.2 mm

7.62 mm

Not Qualified

40

250

9.5 mm

SA636DK,112

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

20

LSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

3 V

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

.65 mm

85 Cel

-40 Cel

DUAL

R-PDSO-G20

1.5 mm

4.4 mm

Not Qualified

40

260

6.5 mm

SA636DK,118

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

20

LSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

3 V

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

.65 mm

85 Cel

-40 Cel

DUAL

R-PDSO-G20

1.5 mm

4.4 mm

Not Qualified

6.5 mm

SA639DH,512

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

24

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

BIPOLAR

.01 mA

3 V

3/5

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP24,.25

Other Telecom ICs

.65 mm

85 Cel

-40 Cel

DUAL

R-PDSO-G24

1.1 mm

4.4 mm

Not Qualified

40

260

7.8 mm

SA647DH,112

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

20

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

3 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

.65 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

R-PDSO-G20

1

1.1 mm

4.4 mm

Not Qualified

e4

6.5 mm

SA647DH,118

NXP Semiconductors

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

20

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

3 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

.65 mm

85 Cel

-40 Cel

DUAL

R-PDSO-G20

1.1 mm

4.4 mm

Not Qualified

6.5 mm

AD9364BBCZREEL

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

BALL

144

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1

1.8 V

GRID ARRAY, LOW PROFILE, FINE PITCH

.8 mm

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

S-PBGA-B144

3

1.7 mm

10 mm

e1

30

260

10 mm

AD9364BBCZ

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

BALL

144

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1

1.8 V

GRID ARRAY, LOW PROFILE, FINE PITCH

.8 mm

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

S-PBGA-B144

3

1.7 mm

10 mm

e1

30

260

10 mm

SST12LP17E-QU8E

Microchip Technology

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

8

HVSON

SQUARE

PLASTIC/EPOXY

YES

1

3.3 V

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

.4 mm

85 Cel

-40 Cel

MATTE TIN

DUAL

S-PDSO-N8

3

.6 mm

2 mm

e3

2 mm

MRF24J40MDT-I/RM

Microchip Technology

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

12

RECTANGULAR

UNSPECIFIED

NO

1

3.3 V

MICROELECTRONIC ASSEMBLY

2.54 mm

85 Cel

-40 Cel

MATTE TIN

DUAL

R-XDMA-N12

3.3528 mm

22.86 mm

e3

33.02 mm

STA311B

STMicroelectronics

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

56

HVQCCN

SQUARE

UNSPECIFIED

YES

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

90 Cel

-40 Cel

QUAD

S-XQCC-N56

1 mm

8 mm

NOT SPECIFIED

NOT SPECIFIED

8 mm

ALM-GN001-BLKG

Broadcom

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

6

HVSON

RECTANGULAR

PLASTIC/EPOXY

YES

1

1.8 V

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

.54 mm

85 Cel

-40 Cel

DUAL

R-PDSO-N6

.9 mm

1.7 mm

2.3 mm

ALM-GN001-TR1G

Broadcom

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

6

HVSON

RECTANGULAR

PLASTIC/EPOXY

YES

1

1.8 V

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

.54 mm

85 Cel

-40 Cel

DUAL

R-PDSO-N6

.9 mm

1.7 mm

2.3 mm

SI4330-B1-FMR

Silicon Labs

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

20

HVQCCN

SQUARE

UNSPECIFIED

YES

1

3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-XQCC-N20

1

.9 mm

4 mm

Not Qualified

e3

40

260

4 mm

TLK2711AIRCPR

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

64

HVFQFP

SQUARE

PLASTIC/EPOXY

YES

1

2.5 V

2.5

FLATPACK, HEAT SINK/SLUG, VERY THIN PROFILE, FINE PITCH

TQFP64,.47SQ

Other Telecom ICs

.5 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

S-PQFP-G64

3

1 mm

10 mm

Not Qualified

e4

30

260

10 mm

TLK2711AIRCP

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

64

HVFQFP

SQUARE

PLASTIC/EPOXY

YES

1

2.5 V

2.5

FLATPACK, HEAT SINK/SLUG, VERY THIN PROFILE, FINE PITCH

TQFP64,.47SQ

Other Telecom ICs

.5 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

S-PQFP-G64

3

1 mm

10 mm

Not Qualified

e4

30

260

10 mm

ONET8501PBRGTT

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

16

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

100 Cel

-40 Cel

Nickel/Palladium/Gold (Ni/Pd/Au)

QUAD

11300 Mbps

S-PQCC-N16

2

1 mm

3 mm

Not Qualified

e4

NOT SPECIFIED

260

3 mm

TDA7541W

STMicroelectronics

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

64

QFP

SQUARE

PLASTIC/EPOXY

YES

1

BICMOS

8.5 V

FLATPACK

85 Cel

-40 Cel

QUAD

S-PQFP-G64

Not Qualified

NOT SPECIFIED

NOT SPECIFIED

TDA7541

STMicroelectronics

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

64

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1

BICMOS

8.5 V

FLATPACK, LOW PROFILE, FINE PITCH

.5 mm

85 Cel

-40 Cel

QUAD

S-PQFP-G64

1.6 mm

10 mm

Not Qualified

NOT SPECIFIED

NOT SPECIFIED

10 mm

TDA7255V

Infineon Technologies

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

40

VQCCN

RECTANGULAR

PLASTIC/EPOXY

YES

1

BICMOS

3 V

2.5/5

CHIP CARRIER, VERY THIN PROFILE

LCC40,.22X.26,20

Other Telecom ICs

.5 mm

85 Cel

-40 Cel

QUAD

R-PQCC-N40

.9 mm

5.5 mm

Not Qualified

NOT SPECIFIED

NOT SPECIFIED

6.5 mm

ADF9010BCPZ-RL7

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

48

HVQCCN

SQUARE

UNSPECIFIED

YES

1

BICMOS

.41 mA

3.3 V

3.3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC48,.27SQ,20

Other Telecom ICs

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-XQCC-N48

3

1 mm

7 mm

Not Qualified

e3

260

7 mm

ADF9010BCPZ

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

48

HVQCCN

SQUARE

UNSPECIFIED

YES

1

BICMOS

.41 mA

3.3 V

3.3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC48,.27SQ,20

Other Telecom ICs

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-XQCC-N48

3

1 mm

7 mm

Not Qualified

e3

260

7 mm

TLK3134ZEL

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

BALL

289

BGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

1.2 V

1.2,1.5,2.5

GRID ARRAY

BGA289,17X17,40

Other Telecom ICs

1 mm

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

3750 Mbps

S-PBGA-B289

4

2.48 mm

19 mm

Not Qualified

e1

30

260

19 mm

MCP2150-I/SO

Microchip Technology

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

18

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

TS 16949

3.3 V

SMALL OUTLINE

SOP18,.4

1.27 mm

85 Cel

-40 Cel

Matte Tin (Sn)

DUAL

R-PDSO-G18

2

2.64 mm

7.49 mm

Not Qualified

e3

40

260

17.87 mm

TSC2200IPWR

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

28

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

2.7 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

.65 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

R-PDSO-G28

1

1.2 mm

4.4 mm

Not Qualified

SINGLE-ENDED

e4

30

260

9.7 mm

AD9832BRU-REEL

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

16

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

5 mA

3.3 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

.65 mm

85 Cel

-40 Cel

TIN LEAD

DUAL

R-PDSO-G16

1

1.1 mm

4.4 mm

Not Qualified

e0

240

5 mm

DS1852B-000

Maxim Integrated

TELECOM CIRCUIT

INDUSTRIAL

BALL

25

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1

3 V

GRID ARRAY, LOW PROFILE, FINE PITCH

.8 mm

100 Cel

-40 Cel

TIN LEAD

BOTTOM

S-PBGA-B25

3

1.5 mm

5 mm

Not Qualified

e0

5 mm

DS2174QN

Maxim Integrated

TELECOM CIRCUIT

INDUSTRIAL

J BEND

44

QCCJ

SQUARE

PLASTIC/EPOXY

YES

1

.06 mA

3.3 V

3.3

CHIP CARRIER

LDCC44,.7SQ

Other Telecom ICs

1.27 mm

85 Cel

-40 Cel

TIN LEAD

QUAD

S-PQCC-J44

3

4.57 mm

16.585 mm

Not Qualified

e0

16.585 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.