INDUSTRIAL Other Function Telecom Interface ICs 799

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	No. of Transceivers	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Maximum Gain Tolerance	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Linear Coding	Width	Qualification	Input Type	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Filter
AD73311LARSZ-REEL	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		.0125 mA	3 V	3	SMALL OUTLINE, SHRINK PITCH	SSOP20,.3	Modems	.65 mm	105 Cel	-40 Cel		MATTE TIN	DUAL		R-PDSO-G20	1	2 mm		5.3 mm	Not Qualified			e3	40	260	7.2 mm
AD73311LARUZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		.0125 mA	3 V	3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP20,.25	Modems	.65 mm	105 Cel	-40 Cel		MATTE TIN	DUAL		R-PDSO-G20	1	1.1 mm		4.4 mm	Not Qualified			e3		260	6.5 mm
AD9861BCPZ-50	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	64	HVQCCN	SQUARE	UNSPECIFIED	YES	1				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		MATTE TIN	QUAD		S-XQCC-N64	3	1 mm		9 mm	Not Qualified			e3		260	9 mm
AD9861BCPZ-80	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	64	HVQCCN	SQUARE	UNSPECIFIED	YES	1				3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC64,.35SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		MATTE TIN	QUAD		S-XQCC-N64	3	1 mm		9 mm	Not Qualified			e3		260	9 mm
AD9861BCPZRL-80	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	64	HVQCCN	SQUARE	UNSPECIFIED	YES	1				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		MATTE TIN	QUAD		S-XQCC-N64	3	1 mm		9 mm	Not Qualified			e3		260	9 mm
AD9878BSTZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			3.3 V	3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	Modems	.5 mm	85 Cel	-40 Cel		MATTE TIN	QUAD		S-PQFP-G100	3	1.6 mm		14 mm	Not Qualified			e3		260	14 mm
ADM1041ARQZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	24	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			5 V		SMALL OUTLINE, SHRINK PITCH			.635 mm	85 Cel	-40 Cel		Matte Tin (Sn) - annealed	DUAL		R-PDSO-G24	1	1.7526 mm		3.9116 mm	Not Qualified			e3	30	260	8.6614 mm
ADN2891ACPZ-RL7	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	1			.049 mA	3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC16,.12SQ,20	ATM/SONET/SDH ICs	.5 mm	95 Cel	-40 Cel		MATTE TIN	QUAD		S-XQCC-N16	3	.9 mm		3 mm	Not Qualified			e3	30	260	3 mm
ADN2891ACPZ-RL	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	1			.049 mA	3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC16,.12SQ,20	ATM/SONET/SDH ICs	.5 mm	95 Cel	-40 Cel		MATTE TIN	QUAD		S-XQCC-N16	3	.9 mm		3 mm	Not Qualified			e3	30	260	3 mm
TLK2701IRCPRG4	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	64	HVFQFP	SQUARE	PLASTIC/EPOXY	YES	1				2.5 V	2.5	FLATPACK, HEAT SINK/SLUG, VERY THIN PROFILE, FINE PITCH	TQFP64,.47SQ	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		NICKEL PALLADIUM GOLD	QUAD		S-PQFP-G64	3	1 mm		10 mm	Not Qualified			e4	30	260	10 mm
ADN2892ACPZ-RL	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	1			.054 mA	3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC16,.12SQ,20	ATM/SONET/SDH ICs	.5 mm	95 Cel	-40 Cel		MATTE TIN	QUAD		S-XQCC-N16	3	.9 mm		3 mm	Not Qualified			e3		260	3 mm
AD9863BCPZ-50	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	64	HVQCCN	SQUARE	UNSPECIFIED	YES	1				3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC64,.35SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		MATTE TIN	QUAD		S-XQCC-N64	3	1 mm		9 mm	Not Qualified			e3		260	9 mm
AD73311LARSZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		.0125 mA	3 V	3	SMALL OUTLINE, SHRINK PITCH	SSOP20,.3	Modems	.65 mm	105 Cel	-40 Cel		MATTE TIN	DUAL		R-PDSO-G20	1	2 mm		5.3 mm	Not Qualified			e3		260	7.2 mm
AD73311LARUZ-RL	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		.0125 mA	3 V	3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP20,.25	Modems	.65 mm	105 Cel	-40 Cel		MATTE TIN	DUAL		R-PDSO-G20	1	1.1 mm		4.4 mm	Not Qualified			e3		260	6.5 mm
AD73311LARUZ-RL7	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		.0125 mA	3 V	3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP20,.25	Modems	.65 mm	105 Cel	-40 Cel		MATTE TIN	DUAL		R-PDSO-G20	1	1.1 mm		4.4 mm	Not Qualified			e3		260	6.5 mm
AD73360ARZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			3 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel		MATTE TIN	DUAL		R-PDSO-G28	3	2.65 mm		7.5 mm	Not Qualified			e3	30	260	17.9 mm
AD73360ARZ-REEL	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			3 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel		MATTE TIN	DUAL		R-PDSO-G28	3	2.65 mm		7.5 mm	Not Qualified			e3	30	260	17.9 mm
AD73360LARZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3.3 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel		MATTE TIN	DUAL		R-PDSO-G28	3	2.65 mm		7.5 mm	Not Qualified			e3	30	260	17.9 mm
U2741B-NFBG3Y	Atmel	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	16	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			.0125 mA	3 V	2.2/5.5	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	SSOP16,.25	Other Telecom ICs	.635 mm	85 Cel	-40 Cel		MATTE TIN	DUAL		R-PDSO-G16	1	1.7 mm			Not Qualified			e3		260	4.9 mm
GC4016-PBZ	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	BALL	160	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			2.5 V		GRID ARRAY			1 mm	85 Cel	-40 Cel		TIN SILVER COPPER	BOTTOM		S-PBGA-B160	3	1.75 mm		15 mm	Not Qualified			e1	30	260	15 mm
CC2500RTKG3	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			3 V	1.8/3.6	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC20,.16SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N20	3	.9 mm		4 mm	Not Qualified			e4	30	260	4 mm
CC2500RTKRG3	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			3 V	1.8/3.6	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC20,.16SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N20	3	.9 mm		4 mm	Not Qualified			e4	30	260	4 mm
TLK2521IPAP	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	64	TFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			2.5 V	2.5	FLATPACK, THIN PROFILE, FINE PITCH	TQFP64,.47SQ	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		NICKEL PALLADIUM GOLD	QUAD		S-PQFP-G64	3	1.2 mm		10 mm	Not Qualified			e4	30	260	10 mm
AD608ARZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel		MATTE TIN	DUAL		R-PDSO-G16	1	1.75 mm		3.9 mm	Not Qualified			e3	30	260	9.9 mm
AD73311ARZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			3 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel		MATTE TIN	DUAL		R-PDSO-G20	1	2.65 mm		7.5 mm	Not Qualified			e3	30	260	12.8 mm
AD974ARSZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	28	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS			5 V		SMALL OUTLINE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel		MATTE TIN	DUAL		R-PDSO-G28	3	2 mm		5.3 mm	Not Qualified			e3	30	260	10.2 mm
AD974ARZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS			5 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel		MATTE TIN	DUAL		R-PDSO-G28	3	2.65 mm		7.5 mm	Not Qualified			e3	30	260	17.9 mm
AD974BRSZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	28	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS			5 V		SMALL OUTLINE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel		MATTE TIN	DUAL		R-PDSO-G28	3	2 mm		5.3 mm	Not Qualified			e3		260	10.2 mm
AD9856ASTZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			3 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel		MATTE TIN	QUAD		S-PQFP-G48	3	1.6 mm		7 mm	Not Qualified			e3	30	260	7 mm
AD6623ASZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	128	FQFP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			2.5 V		FLATPACK, FINE PITCH			.5 mm	85 Cel	-40 Cel		MATTE TIN	QUAD		R-PQFP-G128	3	3.4 mm		14 mm	Not Qualified			e3		260	20 mm
AD73311LARSZ-REEL7	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		.0125 mA	3 V	3	SMALL OUTLINE, SHRINK PITCH	SSOP20,.3	Modems	.65 mm	105 Cel	-40 Cel		MATTE TIN	DUAL		R-PDSO-G20	1	2 mm		5.3 mm	Not Qualified			e3		260	7.2 mm
AD73322LARZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		.031 mA	3 V	3	SMALL OUTLINE	SOP28,.4	Codecs	1.27 mm	85 Cel	-40 Cel	.75 dB	MATTE TIN	DUAL		R-PDSO-G28	3	2.65 mm	16-BIT	7.5 mm	Not Qualified			e3	30	260	17.9 mm	YES
AD974BRZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS			5 V		SMALL OUTLINE			1.27 mm	85 Cel	-40 Cel		MATTE TIN	DUAL		R-PDSO-G28	3	2.65 mm		7.5 mm	Not Qualified			e3	30	260	17.9 mm
AD974BNZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	THROUGH-HOLE	28	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	BICMOS			5 V		IN-LINE			2.54 mm	85 Cel	-40 Cel		MATTE TIN	DUAL		R-PDIP-T28		5.33 mm		7.62 mm	Not Qualified			e3			36.687 mm
TLK2711IRCPG4	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	64	HVFQFP	SQUARE	PLASTIC/EPOXY	YES	1				2.5 V	2.5	FLATPACK, HEAT SINK/SLUG, VERY THIN PROFILE, FINE PITCH	TQFP64,.47SQ	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		NICKEL PALLADIUM GOLD	QUAD		S-PQFP-G64	3	1 mm		10 mm	Not Qualified			e4	30	260	10 mm
ONET2591TAY	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	11	DIE	RECTANGULAR	UNSPECIFIED	YES	1			20 mA	3.3 V	3.3	UNCASED CHIP	DIE OR CHIP	Other Telecom ICs		85 Cel	-40 Cel			UPPER	2500 Mbps	R-XUUC-N11					Not Qualified		Data rate is 2.5 Gbps		NOT SPECIFIED	NOT SPECIFIED
ONET4291TAY	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	10	DIE	RECTANGULAR	UNSPECIFIED	YES	1			25 mA	3.3 V	3.3	UNCASED CHIP	DIE OR CHIP	Other Telecom ICs		85 Cel	-40 Cel			UPPER	4250 Mbps	R-XUUC-N10					Not Qualified		Data rate is 4.25 Gbps		NOT SPECIFIED	NOT SPECIFIED
TLK2501IRCPRG4	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	64	HVFQFP	SQUARE	PLASTIC/EPOXY	YES	1		1		2.5 V	2.5	FLATPACK, HEAT SINK/SLUG, VERY THIN PROFILE, FINE PITCH	TQFP64,.47SQ	Network Interfaces	.5 mm	85 Cel	-40 Cel		NICKEL PALLADIUM GOLD	QUAD	2500 Mbps	S-PQFP-G64	3	1 mm		10 mm	Not Qualified			e4	30	260	10 mm
TSC2200IPWRG4	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				2.7 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel		Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL		R-PDSO-G28	1	1.2 mm		4.4 mm	Not Qualified	SINGLE-ENDED		e4	NOT SPECIFIED	260	9.7 mm
UCC2751DG4	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS		.003 mA	12 V	12	SMALL OUTLINE	SOP16,.25	Telephone Circuits	1.27 mm	85 Cel	-40 Cel			DUAL		R-PDSO-G16		1.75 mm		3.9 mm	Not Qualified				NOT SPECIFIED	NOT SPECIFIED	9.9 mm
ADF7012BRUZ-RL7	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	24	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			3 V	2.5/3.3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP24,.25	Other Telecom ICs	.65 mm	85 Cel	-40 Cel		MATTE TIN	DUAL		R-PDSO-G24	1	1.2 mm		4.4 mm	Not Qualified			e3	30	260	7.8 mm
ADF7012BRUZ-RL	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	24	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			3 V	2.5/3.3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP24,.25	Other Telecom ICs	.65 mm	85 Cel	-40 Cel		MATTE TIN	DUAL		R-PDSO-G24	1	1.2 mm		4.4 mm	Not Qualified			e3	30	260	7.8 mm
ADN2830ACPZ32	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1				5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-40 Cel		MATTE TIN	QUAD		S-XQCC-N32	3	1 mm		5 mm	Not Qualified			e3			5 mm
ATA5428-PLQW	Atmel	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1				3 V	3/5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel		MATTE TIN	QUAD		S-XQCC-N48		1 mm		7 mm	Not Qualified			e3			7 mm
CC2431ZRTC	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	48	QCCN	SQUARE	UNSPECIFIED	YES	1						CHIP CARRIER				85 Cel	-40 Cel		NICKEL PALLADIUM GOLD	QUAD		S-XQCC-N48	3			7 mm	Not Qualified			e4	30	260	7 mm
CC2550RSTG3	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS		.0228 mA	3 V	1.8/3.6	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC16,.16SQ,25	Other Telecom ICs	.65 mm	85 Cel	-40 Cel		NICKEL PALLADIUM GOLD	QUAD		S-XQCC-N16	3	.95 mm		4 mm	Not Qualified			e4	30	260	4 mm
ATA3741P2-TGSY	Atmel	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			.0086 mA	5 V	5	SMALL OUTLINE	SOP20,.4	Other Telecom ICs	1.27 mm	105 Cel	-40 Cel		MATTE TIN	DUAL		R-PDSO-G20	1			7.4 mm	Not Qualified			e3		260	12.825 mm
TLK4211EARGTR	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			.038 mA	3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC16,.12SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel			QUAD		S-PQCC-N16		1 mm		3 mm	Not Qualified				NOT SPECIFIED	NOT SPECIFIED	3 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.