OTHER Other Function Telecom Interface ICs 155

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Part RoHS Manufacturer Telecom IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Applications Surface Mount No. of Functions Output Code No. of Channels Technology Screening Level Nominal Negative Supply Voltage No. of Transceivers Maximum Supply Current Nominal Supply Voltage Hybrid Input Code Power Supplies (V) ISDN Access Rate Package Style (Meter) Package Equivalence Code Sub-Category Carrier Type-3 Terminal Pitch Maximum Operating Temperature Resolution (um) Battery Supply (V) Minimum Output High Voltage Maximum Output Low Voltage Standard Minimum Operating Temperature Maximum Gain Tolerance Terminal Finish Maximum Output Voltage Terminal Position Data Rate JESD-30 Code Reference Point Output (V) Moisture Sensitivity Level (MSL) Maximum Seated Height Linear Coding Carrier Type-2 Carrier Type-1 Width Qualification Maximum Output Low Current Companding Law Input Type Additional Features Battery Feed Maximum Analog Input JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Filter

BGS15AN16E6327XTSA1

Infineon Technologies

TELECOM CIRCUIT

OTHER

NO LEAD

16

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

3.5 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-30 Cel

TIN

QUAD

S-PQCC-N16

1

.77 mm

2.3 mm

e3

2.3 mm

BGS12AL74E6327XTSA1

Infineon Technologies

TELECOM CIRCUIT

OTHER

BUTT

6

BCC

RECTANGULAR

UNSPECIFIED

YES

1

2.8 V

CHIP CARRIER

.55 mm

85 Cel

-30 Cel

GOLD

BOTTOM

R-XBCC-B6

1

.5 mm

1.5 mm

e4

2.3 mm

BGS12AL76E6327XTMA1

Infineon Technologies

TELECOM CIRCUIT

OTHER

BUTT

6

BCC

RECTANGULAR

UNSPECIFIED

YES

1

2.8 V

CHIP CARRIER

.48 mm

85 Cel

-30 Cel

GOLD

BOTTOM

R-XBCC-B6

1

.4 mm

1.4 mm

e4

1.26 mm

RI-STU-MRD1-30

Texas Instruments

TELECOM CIRCUIT

OTHER

THROUGH-HOLE

30

RECTANGULAR

UNSPECIFIED

NO

1

5 V

MICROELECTRONIC ASSEMBLY

50 Cel

-20 Cel

DUAL

R-XDMA-T30

BA4116FV-E2

ROHM

TELECOM CIRCUIT

OTHER

GULL WING

16

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

.65 mm

85 Cel

-30 Cel

TIN/TIN COPPER

DUAL

R-PDSO-G16

1.2 mm

4.4 mm

Not Qualified

e3/e2

10

260

5 mm

L3845B

STMicroelectronics

TELECOM CIRCUIT

OTHER

THROUGH-HOLE

8

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

1

20 V

20

IN-LINE

DIP8,.3

Analog Transmission Interfaces

2.54 mm

70 Cel

-40 Cel

MATTE TIN

DUAL

R-PDIP-T8

5.08 mm

7.62 mm

Not Qualified

e3

L3845D1013TR

STMicroelectronics

TELECOM CIRCUIT

OTHER

GULL WING

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

SMALL OUTLINE

1.27 mm

70 Cel

-40 Cel

TIN LEAD

DUAL

R-PDSO-G8

1.75 mm

3.9 mm

Not Qualified

e0

4.9 mm

LM3290TME/NOPB

Texas Instruments

TELECOM CIRCUIT

OTHER

BALL

30

VFBGA

RECTANGULAR

UNSPECIFIED

YES

1

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

85 Cel

-30 Cel

TIN SILVER COPPER

BOTTOM

R-XBGA-B30

1

.675 mm

e1

30

260

LM3290TMX/NOPB

Texas Instruments

TELECOM CIRCUIT

OTHER

BALL

30

VFBGA

RECTANGULAR

UNSPECIFIED

YES

1

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

85 Cel

-30 Cel

TIN SILVER COPPER

BOTTOM

R-XBGA-B30

1

.675 mm

e1

30

260

LM3291TME/NOPB

Texas Instruments

TELECOM CIRCUIT

OTHER

BALL

12

VFBGA

RECTANGULAR

UNSPECIFIED

YES

1

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

85 Cel

-30 Cel

TIN SILVER COPPER

BOTTOM

R-XBGA-B12

1

.675 mm

e1

30

260

LM3291TMX/NOPB

Texas Instruments

TELECOM CIRCUIT

OTHER

BALL

12

VFBGA

RECTANGULAR

UNSPECIFIED

YES

1

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

85 Cel

-30 Cel

TIN SILVER COPPER

BOTTOM

R-XBGA-B12

1

.675 mm

e1

30

260

P5DF081HN/T1AD2060

NXP Semiconductors

TELECOM CIRCUIT

OTHER

NO LEAD

32

HQCCN

SQUARE

PLASTIC/EPOXY

YES

1

3 V

CHIP CARRIER, HEAT SINK/SLUG

85 Cel

-25 Cel

NICKEL PALLADIUM GOLD

QUAD

S-PQCC-N32

e4

AMIS49587C5871RG

Onsemi

TELECOM CIRCUIT

OTHER

J BEND

28

QCCJ

SQUARE

PLASTIC/EPOXY

YES

1

.08 mA

3.3 V

3.3

CHIP CARRIER

LDCC28,.5SQ

Modems

1.27 mm

80 Cel

-40 Cel

Matte Tin (Sn) - annealed

QUAD

S-PQCC-J28

3

4.572 mm

11.506 mm

Not Qualified

e3

30

260

11.506 mm

PCM3060PW

Texas Instruments

TELECOM CIRCUIT

OTHER

GULL WING

28

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

2

CMOS

3.3 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

.65 mm

85 Cel

-25 Cel

NICKEL PALLADIUM GOLD

DUAL

R-PDSO-G28

2

1.2 mm

4.4 mm

Not Qualified

e4

30

260

9.7 mm

STPAC01F2

STMicroelectronics

TELECOM CIRCUIT

OTHER

BALL

8

VFBGA

SQUARE

PLASTIC/EPOXY

YES

1

2.7 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.5 mm

85 Cel

-30 Cel

BOTTOM

S-PBGA-B8

.715 mm

1.57 mm

Not Qualified

1.57 mm

SN65LVPE502RGET

Texas Instruments

TELECOM CIRCUIT

OTHER

NO LEAD

24

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

2

2

CMOS

.12 mA

3.3 V

3.3

CHIP CARRIER

LCC24,.16SQ,20

Other Telecom ICs

.5 mm

85 Cel

0 Cel

NICKEL PALLADIUM GOLD

QUAD

5 Mbps

S-PQCC-N24

2

1 mm

4 mm

Not Qualified

e4

30

260

4 mm

RI-TRP-R4FF-01

Texas Instruments

TELECOM CIRCUIT

OTHER

1

50 Cel

-25 Cel

1

Not Qualified

RI-TRP-W4FF-01

Texas Instruments

TELECOM CIRCUIT

OTHER

1

50 Cel

-25 Cel

1

Not Qualified

HTSFCH4801EV/DH,11

NXP Semiconductors

TELECOM CIRCUIT

OTHER

NO LEAD

DIE

UNSPECIFIED

UNSPECIFIED

YES

1

UNCASED CHIP

85 Cel

-25 Cel

NICKEL PALLADIUM GOLD

UPPER

X-XUUC-N

Not Qualified

e4

HTSMOH3201EV,118

NXP Semiconductors

TELECOM CIRCUIT

OTHER

NO LEAD

DIE

UNSPECIFIED

UNSPECIFIED

YES

1

UNCASED CHIP

85 Cel

-25 Cel

UPPER

X-XUUC-N

Not Qualified

HTSMOH5601EV,118

NXP Semiconductors

TELECOM CIRCUIT

OTHER

NO LEAD

DIE

UNSPECIFIED

UNSPECIFIED

YES

1

UNCASED CHIP

85 Cel

-25 Cel

SILVER

UPPER

X-XUUC-N

Not Qualified

e4

PN5110A0HN1/C2,118

NXP Semiconductors

TELECOM CIRCUIT

OTHER

NO LEAD

32

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-30 Cel

NICKEL PALLADIUM GOLD

QUAD

S-PQCC-N32

1

1 mm

5 mm

Not Qualified

e4

5 mm

PN5110A0HN1/C2,151

NXP Semiconductors

TELECOM CIRCUIT

OTHER

NO LEAD

32

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-30 Cel

NICKEL PALLADIUM GOLD

QUAD

S-PQCC-N32

1

1 mm

5 mm

Not Qualified

e4

5 mm

PN5120A0HN1/C1,151

NXP Semiconductors

TELECOM CIRCUIT

OTHER

NO LEAD

32

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

3 V

1.8/3.3,2.5/3.3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC32,.2SQ,20

Other Telecom ICs

.5 mm

85 Cel

-30 Cel

NICKEL PALLADIUM GOLD

QUAD

S-PQCC-N32

1

1 mm

5 mm

Not Qualified

e4

260

5 mm

RF-HDT-DVBB-N1

Texas Instruments

TELECOM CIRCUIT

OTHER

1

90 Cel

-25 Cel

Not Qualified

RF-HDT-DVBE-N0

Texas Instruments

TELECOM CIRCUIT

OTHER

1

90 Cel

-25 Cel

Not Qualified

RI-TRP-DR2B-30

Texas Instruments

TELECOM CIRCUIT

OTHER

1

85 Cel

-25 Cel

Not Qualified

NOT SPECIFIED

NOT SPECIFIED

RI-TRP-DR2B

Texas Instruments

TELECOM CIRCUIT

OTHER

1

85 Cel

-25 Cel

1

Not Qualified

RI-TRP-R9QL-30

Texas Instruments

TELECOM CIRCUIT

OTHER

1

85 Cel

-25 Cel

Not Qualified

NOT SPECIFIED

NOT SPECIFIED

RI-TRP-W9QL-20

Texas Instruments

TELECOM CIRCUIT

OTHER

1

70 Cel

-25 Cel

1

Not Qualified

RI-TRP-W9QL-30

Texas Instruments

TELECOM CIRCUIT

OTHER

1

70 Cel

-25 Cel

Not Qualified

NOT SPECIFIED

NOT SPECIFIED

RI-TRP-WE2B-30

Texas Instruments

TELECOM CIRCUIT

OTHER

1

70 Cel

-25 Cel

TIN SILVER COPPER

Not Qualified

e1

RI-TRP-WEHP-30

Texas Instruments

TELECOM CIRCUIT

OTHER

1

70 Cel

-25 Cel

TIN SILVER COPPER

Not Qualified

e1

RI-TRP-WR2B-30

Texas Instruments

TELECOM CIRCUIT

OTHER

1

85 Cel

-25 Cel

TIN SILVER COPPER

Not Qualified

e1

PCM3060PWRG4

Texas Instruments

TELECOM CIRCUIT

OTHER

GULL WING

28

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

2

CMOS

3.3 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

.65 mm

85 Cel

-25 Cel

Nickel/Palladium/Gold (Ni/Pd/Au)

DUAL

R-PDSO-G28

2

1.2 mm

4.4 mm

Not Qualified

e4

NOT SPECIFIED

260

9.7 mm

RI-TRP-R9TD-16

Texas Instruments

TELECOM CIRCUIT

OTHER

UNSPECIFIED

UNSPECIFIED

1

85 Cel

-25 Cel

RI-TRP-W9TD-13

Texas Instruments

TELECOM CIRCUIT

OTHER

UNSPECIFIED

UNSPECIFIED

1

70 Cel

-25 Cel

RI-I03-114A-01

Texas Instruments

TELECOM CIRCUIT

OTHER

1

70 Cel

-25 Cel

Not Qualified

NOT SPECIFIED

NOT SPECIFIED

RI-I03-114A-S1

Texas Instruments

TELECOM CIRCUIT

OTHER

1

70 Cel

-25 Cel

Not Qualified

NOT SPECIFIED

NOT SPECIFIED

RI-I11-112A-03

Texas Instruments

TELECOM CIRCUIT

OTHER

1

70 Cel

-25 Cel

Not Qualified

NOT SPECIFIED

NOT SPECIFIED

RI-I11-112B-03

Texas Instruments

TELECOM CIRCUIT

OTHER

1

70 Cel

-25 Cel

Not Qualified

NOT SPECIFIED

NOT SPECIFIED

RI-I16-114A-S1

Texas Instruments

TELECOM CIRCUIT

OTHER

1

70 Cel

-25 Cel

Not Qualified

NOT SPECIFIED

NOT SPECIFIED

RI-I17-114A-S1

Texas Instruments

TELECOM CIRCUIT

OTHER

1

70 Cel

-25 Cel

Not Qualified

NOT SPECIFIED

NOT SPECIFIED

RI-TRP-R4FF-30

Texas Instruments

TELECOM CIRCUIT

OTHER

UNSPECIFIED

UNSPECIFIED

1

50 Cel

-25 Cel

NOT SPECIFIED

NOT SPECIFIED

RI-TRP-W4FF-30

Texas Instruments

TELECOM CIRCUIT

OTHER

UNSPECIFIED

UNSPECIFIED

1

50 Cel

-25 Cel

NOT SPECIFIED

NOT SPECIFIED

HTRM800/AED,122

NXP Semiconductors

TELECOM CIRCUIT

OTHER

PLASTIC/EPOXY

-15 V

.55 mA

15 V

+-15

MICROELECTRONIC ASSEMBLY

MODULE(UNSPEC)

Other Telecom ICs

70 Cel

-25 Cel

Not Qualified

PN5120A0HN1/C1,157

NXP Semiconductors

TELECOM CIRCUIT

OTHER

NO LEAD

32

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

3 V

1.8/3.3,2.5/3.3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC32,.2SQ,20

Other Telecom ICs

.5 mm

85 Cel

-30 Cel

NICKEL PALLADIUM GOLD

QUAD

S-PQCC-N32

1

1 mm

5 mm

Not Qualified

e4

260

5 mm

MP45DT02TR-M

STMicroelectronics

TELECOM CIRCUIT

OTHER

NO LEAD

6

LGA

RECTANGULAR

UNSPECIFIED

YES

1

1.8 V

GRID ARRAY

85 Cel

-30 Cel

NICKEL PALLADIUM GOLD

BOTTOM

R-XBGA-N6

3

1.35 mm

3.76 mm

e4

260

4.72 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.