OTHER Other Function Telecom Interface ICs 155

Reset All

Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Screening Level	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
STHVDAC-253MF3	STMicroelectronics	TELECOM CIRCUIT	OTHER	BALL	16	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				3.3 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-30 Cel		BOTTOM		R-PBGA-B16		.655 mm	1.6 mm			NOT SPECIFIED	NOT SPECIFIED	1.7 mm
XCC2564MODNCMOET	Texas Instruments	TELECOM CIRCUIT	OTHER	BUTT	33	BCC	SQUARE	UNSPECIFIED	YES	1				3.6 V		CHIP CARRIER				70 Cel	-20 Cel		BOTTOM		S-XBCC-B33		1.4 mm	7 mm					7 mm
SN761634RTWR	Texas Instruments	TELECOM CIRCUIT	OTHER	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3 V	3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20	Other Telecom ICs	.5 mm	85 Cel	-20 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N24	2	.8 mm	4 mm	Not Qualified	e4	30	260	4 mm
TDA5101	Infineon Technologies	TELECOM CIRCUIT	OTHER	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR			3 V	3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP16,.25	Other Telecom ICs	.65 mm	85 Cel	-25 Cel		DUAL		R-PDSO-G16	3	1.2 mm	4.4 mm	Not Qualified			260	5 mm
MAX3277U/D	Maxim Integrated	TELECOM CIRCUIT	OTHER	NO LEAD	9	DIE	RECTANGULAR	UNSPECIFIED	YES	1	BIPOLAR		.041 mA	3.3 V	3.3	UNCASED CHIP	DIE OR CHIP	Other Telecom ICs		85 Cel	0 Cel	TIN LEAD	UPPER		R-XUUC-N9				Not Qualified	e0
RI-I16-112A-03	Texas Instruments	TELECOM CIRCUIT	OTHER							1										70 Cel	-25 Cel										NOT SPECIFIED	NOT SPECIFIED
RI-I17-112A-03	Texas Instruments	TELECOM CIRCUIT	OTHER							1										70 Cel	-25 Cel										NOT SPECIFIED	NOT SPECIFIED
AD61009ARSRL	Analog Devices	TELECOM CIRCUIT	OTHER	GULL WING	20	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3 V		SMALL OUTLINE, SHRINK PITCH			.65 mm	85 Cel	-25 Cel	TIN LEAD	DUAL		R-PDSO-G20	1	2 mm	5.3 mm	Not Qualified	e0		240	7.2 mm
MAX3953UGK	Maxim Integrated	TELECOM CIRCUIT	OTHER	NO LEAD	68	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BIPOLAR		.58 mA	3.3 V	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC68,.45SQ,20	ATM/SONET/SDH ICs	.5 mm	85 Cel	0 Cel	TIN LEAD	QUAD		S-XQCC-N68	3	.9 mm	10 mm	Not Qualified	e0			10 mm
HPA01195YFPR	Texas Instruments	TELECOM CIRCUIT	OTHER	BALL	28	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				5 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	125 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM		R-PBGA-B28	1	.5 mm	1.88 mm		e1	30	260	3 mm
RI-TRP-W9VS-30	Texas Instruments	TELECOM CIRCUIT	OTHER							1										70 Cel	-25 Cel										NOT SPECIFIED	NOT SPECIFIED
AD8316ARM-REEL7	Analog Devices	TELECOM CIRCUIT	OTHER	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1			.012 mA	2.7 V	3/5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP10,.19,20	Other Telecom ICs	.5 mm	85 Cel	-30 Cel	TIN LEAD	DUAL		S-PDSO-G10		1.1 mm	3 mm	Not Qualified	e0			3 mm
ADN2820ACHIPS	Analog Devices	TELECOM CIRCUIT	OTHER	NO LEAD	14	DIE	RECTANGULAR	UNSPECIFIED	YES	1	BIPOLAR			3.3 V	3.3	UNCASED CHIP	DIE OR CHIP	Other Telecom ICs		85 Cel	-15 Cel		UPPER		R-XUUC-N14				Not Qualified		NOT SPECIFIED	NOT SPECIFIED
SI4735-B20-GMR	Silicon Labs	TELECOM CIRCUIT	OTHER	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	1						CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-20 Cel		QUAD		S-XQCC-N20		.6 mm	3 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	3 mm
ONET9901TAY	Texas Instruments	TELECOM CIRCUIT	OTHER	NO LEAD	18	DIE	RECTANGULAR	UNSPECIFIED	YES	1			.041 mA	3.3 V	3.3	UNCASED CHIP	DIE OR CHIP	Other Telecom ICs		85 Cel	0 Cel		UPPER		R-XUUC-N18				Not Qualified		NOT SPECIFIED	NOT SPECIFIED
CR14-MQP/1GE	STMicroelectronics	TELECOM CIRCUIT	OTHER	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		.02 mA	5 V	5	SMALL OUTLINE	SOP16,.25	Other Telecom ICs	1.27 mm	85 Cel	-20 Cel		DUAL		R-PDSO-G16		1.75 mm	3.9 mm	Not Qualified				9.9 mm
AD8315ACPZ-REEL7	Analog Devices	TELECOM CIRCUIT	OTHER	NO LEAD	8	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR		.0129 mA	2.7 V	3/5	SMALL OUTLINE	SOLCC8,.08,20	Other Telecom ICs	.5 mm	85 Cel	-30 Cel	MATTE TIN	DUAL		R-XDSO-N8	1	1 mm	2 mm	Not Qualified	e3	30	260	3 mm
AD9860BSTZ	Analog Devices	TELECOM CIRCUIT	OTHER	GULL WING	128	LFQFP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			3.3 V	3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP128,.63X.87,20	Other Telecom ICs	.5 mm	70 Cel	-40 Cel	MATTE TIN	QUAD		R-PQFP-G128	3	1.6 mm	14 mm	Not Qualified	e3	30	260	20 mm
AD9860BSTZRL	Analog Devices	TELECOM CIRCUIT	OTHER	GULL WING	128	LFQFP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			3.3 V	3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP128,.63X.87,20	Other Telecom ICs	.5 mm	70 Cel	-40 Cel	MATTE TIN	QUAD		R-PQFP-G128	3	1.6 mm	14 mm	Not Qualified	e3		260	20 mm
AD9862BSTZ	Analog Devices	TELECOM CIRCUIT	OTHER	GULL WING	128	LFQFP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS			3.3 V	3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP128,.63X.87,20	Other Telecom ICs	.5 mm	70 Cel	-40 Cel	MATTE TIN	QUAD		R-PQFP-G128	3	1.6 mm	14 mm	Not Qualified	e3	30	260	20 mm
AD6652BBCZ	Analog Devices	TELECOM CIRCUIT	OTHER	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			2.5 V		GRID ARRAY			1 mm	70 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B256	3		17 mm	Not Qualified	e1		260	17 mm
AD8315ARMZ	Analog Devices	TELECOM CIRCUIT	OTHER	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1	BIPOLAR		.0129 mA	2.7 V	3/5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP8,.19	Other Telecom ICs	.65 mm	85 Cel	-30 Cel	MATTE TIN	DUAL		S-PDSO-G8	1	1.1 mm	3 mm	Not Qualified	e3	30	260	3 mm
AD8315ARMZ-RL	Analog Devices	TELECOM CIRCUIT	OTHER	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1	BIPOLAR		.0129 mA	2.7 V	3/5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP8,.19	Other Telecom ICs	.65 mm	85 Cel	-30 Cel	MATTE TIN	DUAL		S-PDSO-G8	1	1.1 mm	3 mm	Not Qualified	e3	30	260	3 mm
RN4020BCN-V/RM120	Microchip Technology	TELECOM CIRCUIT	OTHER	NO LEAD	24	XMA	RECTANGULAR	UNSPECIFIED	YES	1		TS 16949		3.3 V		MICROELECTRONIC ASSEMBLY	MODULE,24LEAD(UNSPEC)		1.2 mm	85 Cel	-30 Cel	GOLD OVER NICKEL	UNSPECIFIED	1 Mbps	R-XXMA-N24		2.38 mm	11.5 mm		e4			19.5 mm
PN7150B0HN/C11004E	NXP Semiconductors	TELECOM CIRCUIT	OTHER	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				2.75 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20		.5 mm	85 Cel	-30 Cel		QUAD		S-PQCC-N40		1 mm	6 mm					6 mm
PN7150B0HN/C11004Y	NXP Semiconductors	TELECOM CIRCUIT	OTHER	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				2.75 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20		.5 mm	85 Cel	-30 Cel		QUAD		S-PQCC-N40		1 mm	6 mm					6 mm
BGS13SL9E6327XTSA1	Infineon Technologies	TELECOM CIRCUIT	OTHER	BUTT	9	BCC	SQUARE	UNSPECIFIED	YES	1				3 V		CHIP CARRIER			.4 mm	85 Cel	-30 Cel		BOTTOM		S-XBCC-B9		.32 mm	1.15 mm					1.15 mm
OL2300NHN/F,118	NXP Semiconductors	TELECOM CIRCUIT	OTHER	NO LEAD	16	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			19 mA	2.7 V	2.7	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC16,.12SQ,20	Other Telecom ICs	.5 mm	85 Cel	-25 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N16	1	1 mm	3 mm	Not Qualified	e4	30	260	3 mm
OL2311AHN/C0B,515	NXP Semiconductors	TELECOM CIRCUIT	OTHER	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			21.5 mA	2.7 V	2.7	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	Other Telecom ICs	.5 mm	85 Cel	-25 Cel		QUAD		S-PQCC-N32	2A	.85 mm	5 mm	Not Qualified			260	5 mm
OL2381AHN/C0B,515	NXP Semiconductors	TELECOM CIRCUIT	OTHER	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			.0012 mA	2.7 V	2.7	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	Other Telecom ICs	.5 mm	85 Cel	-25 Cel		QUAD		S-PQCC-N32	2A	.85 mm	5 mm	Not Qualified			260	5 mm
SL3S1001FTT,118	NXP Semiconductors	TELECOM CIRCUIT	OTHER	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1						SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	80 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL		S-PDSO-G8	1	1.1 mm	3 mm		e4	30	260	3 mm
BGS16MN14E6327XTSA1	Infineon Technologies	TELECOM CIRCUIT	OTHER	NO LEAD	14	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			3.5 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-30 Cel	Tin (Sn)	QUAD		S-PQCC-N14	1	.77 mm	2 mm		e3	NOT SPECIFIED	NOT SPECIFIED	2 mm
TRPGR30ENATGB	Texas Instruments	TELECOM CIRCUIT	OTHER	UNSPECIFIED			UNSPECIFIED	UNSPECIFIED		1										70 Cel	-25 Cel							3.85 mm					31.2 mm
RI-TRP-R9BK-20	Texas Instruments	TELECOM CIRCUIT	OTHER				UNSPECIFIED	UNSPECIFIED		1							DIE OR CHIP	Other Telecom ICs		70 Cel	-25 Cel								Not Qualified		NOT SPECIFIED	NOT SPECIFIED
PN5120A0HN1/C2,151	NXP Semiconductors	TELECOM CIRCUIT	OTHER	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3 V	1.8/3.3,2.5/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	Other Telecom ICs	.5 mm	85 Cel	-30 Cel		QUAD		S-PQCC-N32	1	1 mm	5 mm	Not Qualified			260	5 mm
GS2971-IBE3	Semtech	TELECOM CIRCUIT	OTHER	BALL	100	LBGA	SQUARE	PLASTIC/EPOXY	YES	1				1.2 V		GRID ARRAY, LOW PROFILE			1 mm	85 Cel	-20 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B100	1	1.7 mm	11 mm		e1		260	11 mm
PN5180A0ET/C1,151	NXP Semiconductors	TELECOM CIRCUIT	OTHER	BALL	64	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1				1.8 V		GRID ARRAY, THIN PROFILE, FINE PITCH			.65 mm	85 Cel	-30 Cel	TIN SILVER COPPER	BOTTOM		S-PBGA-B64	1	1.15 mm	5.5 mm		e1	30	260	5.5 mm
PN5180A0HN/C1,551	NXP Semiconductors	TELECOM CIRCUIT	OTHER	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				1.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-30 Cel		QUAD		S-PQCC-N40		1 mm	6 mm					6 mm
TCP-4112UB-DT	Onsemi	TELECOM CIRCUIT	OTHER	BALL	4	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1						GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.42 mm	85 Cel	-30 Cel	NICKEL GOLD	BOTTOM		R-PBGA-B4	1	.345 mm	.609 mm		e4		260	.626 mm
STHVDAC-256MTGF3	STMicroelectronics	TELECOM CIRCUIT	OTHER	BALL	20	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				3.3 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.4 mm	85 Cel	-30 Cel		BOTTOM		R-PBGA-B20		.64 mm	1.94 mm			NOT SPECIFIED	NOT SPECIFIED	2.23 mm
TCP-4182UB-DT	Onsemi	TELECOM CIRCUIT	OTHER	BALL	4	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1						GRID ARRAY, VERY THIN PROFILE, FINE PITCH			.42 mm	85 Cel	-30 Cel	NICKEL GOLD	BOTTOM		R-PBGA-B4	1	.345 mm	.609 mm		e4		260	1.009 mm
AD9671KBCZ	Analog Devices	TELECOM CIRCUIT	OTHER	BALL	144	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1				1.4 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	85 Cel	0 Cel		BOTTOM		S-PBGA-B144	3	1.4 mm	10 mm			30	260	10 mm
AD9670BBCZ	Analog Devices	TELECOM CIRCUIT	OTHER	BALL	144	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1				1.4 V		GRID ARRAY, LOW PROFILE, FINE PITCH			.8 mm	85 Cel	0 Cel		BOTTOM		S-PBGA-B144	3	1.4 mm	10 mm			30	260	10 mm
RI-I11-114A-01	Texas Instruments	TELECOM CIRCUIT	OTHER	UNSPECIFIED			SQUARE	UNSPECIFIED	NO	1						SPECIAL SHAPE				70 Cel	-25 Cel		UNSPECIFIED		S-XXSS-X						NOT SPECIFIED	NOT SPECIFIED
RI-STU-251B-01	Texas Instruments	TELECOM CIRCUIT	OTHER	UNSPECIFIED			RECTANGULAR	UNSPECIFIED	NO	1						SPECIAL SHAPE				70 Cel	-20 Cel		UNSPECIFIED		R-XXSS-X
RI-STU-251B-30	Texas Instruments	TELECOM CIRCUIT	OTHER	UNSPECIFIED			RECTANGULAR	UNSPECIFIED	NO	1						SPECIAL SHAPE				70 Cel	-20 Cel		UNSPECIFIED		R-XXSS-X
MFRC52302HN1,151	NXP Semiconductors	TELECOM CIRCUIT	OTHER	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE			.5 mm	85 Cel	-25 Cel	NICKEL PALLADIUM GOLD	QUAD		S-PQCC-N32	1	1 mm	5 mm		e4	30	260	5 mm
BT111-A-HCI	Silicon Labs	TELECOM CIRCUIT	OTHER	NO LEAD	21		RECTANGULAR	UNSPECIFIED	YES	1						MICROELECTRONIC ASSEMBLY			1.1 mm	85 Cel	-30 Cel		UNSPECIFIED		R-XXMA-N21		2.31 mm	9.3 mm					13.05 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.