BALL Other Function Telecom Interface ICs 143

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Part RoHS Manufacturer Telecom IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Applications Surface Mount No. of Functions Output Code No. of Channels Technology Screening Level Nominal Negative Supply Voltage No. of Transceivers Maximum Supply Current Nominal Supply Voltage Hybrid Input Code Power Supplies (V) ISDN Access Rate Package Style (Meter) Package Equivalence Code Sub-Category Carrier Type-3 Terminal Pitch Maximum Operating Temperature Resolution (um) Battery Supply (V) Minimum Output High Voltage Maximum Output Low Voltage Standard Minimum Operating Temperature Maximum Gain Tolerance Terminal Finish Maximum Output Voltage Terminal Position Data Rate JESD-30 Code Reference Point Output (V) Moisture Sensitivity Level (MSL) Maximum Seated Height Linear Coding Carrier Type-2 Carrier Type-1 Width Qualification Maximum Output Low Current Companding Law Input Type Additional Features Battery Feed Maximum Analog Input JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Filter

STA8058

STMicroelectronics

INDUSTRIAL

BALL

104

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

BICMOS

2.7,3.3

GRID ARRAY, FINE PITCH

BGA104,8X13,32

Other Telecom ICs

.8 mm

85 Cel

-40 Cel

BOTTOM

R-PBGA-B104

Not Qualified

PN5120A0ET/C2J

NXP Semiconductors

OTHER

BALL

64

FBGA

SQUARE

PLASTIC/EPOXY

YES

100 mA

3/3.3

GRID ARRAY, FINE PITCH

BGA64,8X8,25

Other Telecom ICs

.635 mm

85 Cel

-30 Cel

BOTTOM

S-PBGA-B64

1

Not Qualified

260

PN5120A0ET/C2EL

NXP Semiconductors

OTHER

BALL

64

FBGA

SQUARE

PLASTIC/EPOXY

YES

100 mA

3/3.3

GRID ARRAY, FINE PITCH

BGA64,8X8,25

Other Telecom ICs

.635 mm

85 Cel

-30 Cel

BOTTOM

S-PBGA-B64

1

Not Qualified

260

PN5120A0ET/C2QL

NXP Semiconductors

OTHER

BALL

64

FBGA

SQUARE

PLASTIC/EPOXY

YES

100 mA

3/3.3

GRID ARRAY, FINE PITCH

BGA64,8X8,25

Other Telecom ICs

.635 mm

85 Cel

-30 Cel

BOTTOM

S-PBGA-B64

1

Not Qualified

260

TPS657051YZHT

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

BALL

16

VFBGA

SQUARE

UNSPECIFIED

YES

1

3.6 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.5 mm

85 Cel

-40 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

S-XBGA-B16

1

.625 mm

2.3 mm

Not Qualified

e1

30

260

2.3 mm

TPS657052YZHT

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

BALL

16

VFBGA

SQUARE

UNSPECIFIED

YES

1

3.6 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.5 mm

85 Cel

-40 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

S-XBGA-B16

1

.625 mm

2.3 mm

Not Qualified

e1

NOT SPECIFIED

260

2.3 mm

BQ51011YFFR

Texas Instruments

TELECOM CIRCUIT

OTHER

BALL

28

VFBGA

RECTANGULAR

UNSPECIFIED

YES

1

5 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

125 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

R-XBGA-B28

1

.625 mm

1.56 mm

Not Qualified

e1

30

260

2.76 mm

BQ51013YFFT

Texas Instruments

TELECOM CIRCUIT

OTHER

BALL

28

VFBGA

RECTANGULAR

UNSPECIFIED

YES

1

5 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

125 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

R-XBGA-B28

1

.625 mm

1.56 mm

Not Qualified

e1

30

260

2.76 mm

ADP5585ACBZ-01-R7

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

BALL

16

VFBGA

SQUARE

PLASTIC/EPOXY

YES

1

1.8 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

S-PBGA-B16

1

.545 mm

1.59 mm

e1

30

260

1.59 mm

ADP5589ACBZ-00-R7

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

BALL

25

VFBGA

SQUARE

PLASTIC/EPOXY

YES

1

1.8 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

S-PBGA-B25

1

.56 mm

1.99 mm

e1

30

260

1.99 mm

ADP5589ACBZ-01-R7

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

BALL

25

VFBGA

SQUARE

PLASTIC/EPOXY

YES

1

1.8 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

S-PBGA-B25

1

.56 mm

1.99 mm

e1

30

260

1.99 mm

BQ51013AYFPR

Texas Instruments

TELECOM CIRCUIT

OTHER

BALL

28

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

125 Cel

0 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

.002 Mbps

R-PBGA-B28

1

.5 mm

1.88 mm

e1

30

260

3 mm

BQ51013AYFPT

Texas Instruments

TELECOM CIRCUIT

OTHER

BALL

28

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

5 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

125 Cel

0 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

.002 Mbps

R-PBGA-B28

1

.5 mm

1.88 mm

e1

30

260

3 mm

SN65DSI83ZQER

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

BALL

64

VFBGA

SQUARE

PLASTIC/EPOXY

YES

1

1.8 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.5 mm

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

1 Mbps

S-PBGA-B64

3

1 mm

5 mm

e1

30

260

5 mm

SN65DSI85ZQER

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

BALL

64

VFBGA

SQUARE

PLASTIC/EPOXY

YES

1

1.8 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.5 mm

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

1 Mbps

S-PBGA-B64

3

1 mm

5 mm

e1

30

260

5 mm

BQ51013BYFPT

Texas Instruments

TELECOM CIRCUIT

AUTOMOTIVE

BALL

28

VFBGA

RECTANGULAR

UNSPECIFIED

YES

1

5 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

125 Cel

-40 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

.002 Mbps

R-XBGA-B28

1

.5 mm

1.88 mm

e1

30

260

3 mm

LMV1099TLX/NOPB

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

BALL

25

VFBGA

SQUARE

UNSPECIFIED

YES

1

3.6 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.5 mm

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

S-XBGA-B25

1

.675 mm

2.64 mm

e1

30

260

2.764 mm

ADP5586ACBZ-01-R7

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

BALL

16

VFBGA

SQUARE

PLASTIC/EPOXY

YES

1

1.8 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

S-PBGA-B16

1

.545 mm

1.59 mm

e1

1.59 mm

SX8651ICSTRT

Semtech

TELECOM CIRCUIT

INDUSTRIAL

BALL

12

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

1.8 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.5 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

BOTTOM

R-PBGA-B12

1

.625 mm

1.5 mm

e4

260

2 mm

CC2564NSYFVR

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

BALL

54

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

3.6 V

GRID ARRAY

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B54

1

e1

30

260

CC2564NYFVR

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

BALL

54

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

3.6 V

GRID ARRAY

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B54

1

e1

30

260

CC2564YFVR

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

BALL

54

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

3.6 V

GRID ARRAY

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B54

1

e1

30

260

CC2564YFVT

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

BALL

54

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

3.6 V

GRID ARRAY

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B54

1

e1

30

260

TCA5013ZAHR

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

BALL

48

TFBGA

SQUARE

PLASTIC/EPOXY

YES

1

3.3 V

GRID ARRAY, THIN PROFILE, FINE PITCH

.5 mm

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

S-PBGA-B48

3

1.2 mm

5 mm

e1

30

260

5 mm

SN65DSI86ZQER

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

BALL

64

VFBGA

SQUARE

PLASTIC/EPOXY

YES

1

1.2 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.5 mm

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

5400 Mbps

S-PBGA-B64

3

1 mm

5 mm

e1

30

260

5 mm

TCC-106A-RT

Onsemi

TELECOM CIRCUIT

OTHER

BALL

20

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

3.3 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

85 Cel

-30 Cel

BOTTOM

R-PBGA-B20

.65 mm

2.23 mm

2.58 mm

TLK10022CTR

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

BALL

144

HBGA

SQUARE

PLASTIC/EPOXY

YES

1

1 V

GRID ARRAY, HEAT SINK/SLUG

1 mm

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

10000 Mbps

S-PBGA-B144

4

3.25 mm

13.05 mm

e1

30

260

13.05 mm

LM3290TME/NOPB

Texas Instruments

TELECOM CIRCUIT

OTHER

BALL

30

VFBGA

RECTANGULAR

UNSPECIFIED

YES

1

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

85 Cel

-30 Cel

TIN SILVER COPPER

BOTTOM

R-XBGA-B30

1

.675 mm

e1

30

260

LM3290TMX/NOPB

Texas Instruments

TELECOM CIRCUIT

OTHER

BALL

30

VFBGA

RECTANGULAR

UNSPECIFIED

YES

1

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

85 Cel

-30 Cel

TIN SILVER COPPER

BOTTOM

R-XBGA-B30

1

.675 mm

e1

30

260

LM3291TME/NOPB

Texas Instruments

TELECOM CIRCUIT

OTHER

BALL

12

VFBGA

RECTANGULAR

UNSPECIFIED

YES

1

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

85 Cel

-30 Cel

TIN SILVER COPPER

BOTTOM

R-XBGA-B12

1

.675 mm

e1

30

260

LM3291TMX/NOPB

Texas Instruments

TELECOM CIRCUIT

OTHER

BALL

12

VFBGA

RECTANGULAR

UNSPECIFIED

YES

1

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

85 Cel

-30 Cel

TIN SILVER COPPER

BOTTOM

R-XBGA-B12

1

.675 mm

e1

30

260

BQ51010BYFPT

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

BALL

28

VFBGA

RECTANGULAR

UNSPECIFIED

YES

1

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

R-XBGA-B28

1

.5 mm

1.88 mm

e1

30

260

3 mm

BQ51021YFPT

Texas Instruments

TELECOM CIRCUIT

AUTOMOTIVE

BALL

42

VFBGA

RECTANGULAR

UNSPECIFIED

YES

1

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

125 Cel

-40 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

R-XBGA-B42

1

.5 mm

2.844 mm

e1

30

260

3.556 mm

GC5328IZER

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

BALL

484

HBGA

SQUARE

PLASTIC/EPOXY

YES

1

1.2 V

GRID ARRAY

1 mm

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

S-PBGA-B484

4

2.48 mm

23 mm

Not Qualified

e1

30

260

23 mm

TLK3138ZDU

Texas Instruments

TELECOM CIRCUIT

COMMERCIAL

BALL

484

BGA

SQUARE

PLASTIC/EPOXY

YES

2

CMOS

2

1.2 V

1.2,1.5,2.5

GRID ARRAY

BGA484,22X22,40

Network Interfaces

1 mm

70 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

3125 Mbps

S-PBGA-B484

4

2.42 mm

23 mm

Not Qualified

e1

30

260

23 mm

STPAC01F2

STMicroelectronics

TELECOM CIRCUIT

OTHER

BALL

8

VFBGA

SQUARE

PLASTIC/EPOXY

YES

1

2.7 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.5 mm

85 Cel

-30 Cel

BOTTOM

S-PBGA-B8

.715 mm

1.57 mm

Not Qualified

1.57 mm

TPS65720YFFT

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

BALL

25

VFBGA

SQUARE

UNSPECIFIED

YES

1

3.6 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

85 Cel

-40 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

S-XBGA-B25

1

.625 mm

2.3 mm

Not Qualified

e1

NOT SPECIFIED

260

2.3 mm

DS31256B

Maxim Integrated

TELECOM CIRCUIT

COMMERCIAL

BALL

256

BGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

3.3 V

GRID ARRAY

1.27 mm

70 Cel

0 Cel

TIN LEAD

BOTTOM

S-PBGA-B256

2.54 mm

27 mm

Not Qualified

e0

27 mm

TLK3138GDU

Texas Instruments

TELECOM CIRCUIT

COMMERCIAL

BALL

484

BGA

SQUARE

PLASTIC/EPOXY

YES

2

CMOS

2

1.2 V

1.2,1.5,2.5

GRID ARRAY

BGA484,22X22,40

Network Interfaces

1 mm

70 Cel

0 Cel

TIN LEAD

BOTTOM

3125 Mbps

S-PBGA-B484

4

Not Qualified

e0

20

220

AD9993BBCZ

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

BALL

196

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1

1.8 V

GRID ARRAY, LOW PROFILE, FINE PITCH

.8 mm

85 Cel

-40 Cel

BOTTOM

S-PBGA-B196

3

1.4 mm

12 mm

30

260

12 mm

AD9364BBCZREEL

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

BALL

144

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1

1.8 V

GRID ARRAY, LOW PROFILE, FINE PITCH

.8 mm

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

S-PBGA-B144

3

1.7 mm

10 mm

e1

30

260

10 mm

AD9364BBCZ

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

BALL

144

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1

1.8 V

GRID ARRAY, LOW PROFILE, FINE PITCH

.8 mm

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

S-PBGA-B144

3

1.7 mm

10 mm

e1

30

260

10 mm

STHVDAC-253MF3

STMicroelectronics

TELECOM CIRCUIT

OTHER

BALL

16

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

3.3 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

85 Cel

-30 Cel

BOTTOM

R-PBGA-B16

.655 mm

1.6 mm

NOT SPECIFIED

NOT SPECIFIED

1.7 mm

TLK2711AJRZQE

Texas Instruments

TELECOM CIRCUIT

COMMERCIAL

BALL

80

VFBGA

SQUARE

PLASTIC/EPOXY

YES

1

2.5 V

2.5

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA80,9X9,20

Other Telecom ICs

.5 mm

70 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

S-PBGA-B80

3

1 mm

5 mm

Not Qualified

e1

30

260

5 mm

TLK3134ZEL

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

BALL

289

BGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

1.2 V

1.2,1.5,2.5

GRID ARRAY

BGA289,17X17,40

Other Telecom ICs

1 mm

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

3750 Mbps

S-PBGA-B289

4

2.48 mm

19 mm

Not Qualified

e1

30

260

19 mm

STLC60845

STMicroelectronics

TELECOM CIRCUIT

BALL

292

BGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

1.8 V

GRID ARRAY

BOTTOM

S-PBGA-B292

Not Qualified

DS1852B-000

Maxim Integrated

TELECOM CIRCUIT

INDUSTRIAL

BALL

25

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1

3 V

GRID ARRAY, LOW PROFILE, FINE PITCH

.8 mm

100 Cel

-40 Cel

TIN LEAD

BOTTOM

S-PBGA-B25

3

1.5 mm

5 mm

Not Qualified

e0

5 mm

BQ51025YFPT

Texas Instruments

TELECOM CIRCUIT

AUTOMOTIVE

BALL

42

VFBGA

RECTANGULAR

UNSPECIFIED

YES

1

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

125 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

R-XBGA-B42

1

.5 mm

2.844 mm

e1

30

260

3.556 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.