BALL Other Function Telecom Interface ICs 143

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Part RoHS Manufacturer Telecom IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Applications Surface Mount No. of Functions Output Code No. of Channels Technology Screening Level Nominal Negative Supply Voltage No. of Transceivers Maximum Supply Current Nominal Supply Voltage Hybrid Input Code Power Supplies (V) ISDN Access Rate Package Style (Meter) Package Equivalence Code Sub-Category Carrier Type-3 Terminal Pitch Maximum Operating Temperature Resolution (um) Battery Supply (V) Minimum Output High Voltage Maximum Output Low Voltage Standard Minimum Operating Temperature Maximum Gain Tolerance Terminal Finish Maximum Output Voltage Terminal Position Data Rate JESD-30 Code Reference Point Output (V) Moisture Sensitivity Level (MSL) Maximum Seated Height Linear Coding Carrier Type-2 Carrier Type-1 Width Qualification Maximum Output Low Current Companding Law Input Type Additional Features Battery Feed Maximum Analog Input JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Filter

FIDO5100BBCZ

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

BALL

144

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

1.2 V

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA144,12X12,32

.8 mm

85 Cel

-40 Cel

BOTTOM

S-PBGA-B144

1.24 mm

10 mm

NOT SPECIFIED

NOT SPECIFIED

10 mm

FIDO5200BBCZ

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

BALL

144

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

1.2 V

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA144,12X12,32

.8 mm

85 Cel

-40 Cel

BOTTOM

S-PBGA-B144

1.24 mm

10 mm

NOT SPECIFIED

NOT SPECIFIED

10 mm

CC2564BYFVR-XI

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

BALL

54

VFBGA

RECTANGULAR

UNSPECIFIED

YES

1

3.6 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

4 Mbps

R-XBGA-B54

1

.575 mm

2.93 mm

e1

30

260

3.26 mm

CC2560BYFVR

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

BALL

54

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

3.6 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B54

1

.575 mm

2.925 mm

e1

30

260

3.265 mm

CC2560BYFVT

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

BALL

54

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

3.6 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B54

1

.575 mm

2.925 mm

e1

30

260

3.265 mm

STA8090EXGAJTR

STMicroelectronics

TELECOM CIRCUIT

INDUSTRIAL

BALL

169

TFBGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

1.1 V

GRID ARRAY, THIN PROFILE, FINE PITCH

.65 mm

85 Cel

-40 Cel

BOTTOM

S-PBGA-B169

1.2 mm

9 mm

NOT SPECIFIED

NOT SPECIFIED

9 mm

STA8090EXGAJ

STMicroelectronics

TELECOM CIRCUIT

INDUSTRIAL

BALL

169

TFBGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

1.1 V

GRID ARRAY, THIN PROFILE, FINE PITCH

.65 mm

85 Cel

-40 Cel

BOTTOM

S-PBGA-B169

1.2 mm

9 mm

NOT SPECIFIED

NOT SPECIFIED

9 mm

STA8090EXGATR

STMicroelectronics

TELECOM CIRCUIT

INDUSTRIAL

BALL

169

TFBGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

1.1 V

GRID ARRAY, THIN PROFILE, FINE PITCH

.65 mm

85 Cel

-40 Cel

BOTTOM

S-PBGA-B169

1.2 mm

9 mm

NOT SPECIFIED

NOT SPECIFIED

9 mm

STA8090EXGA

STMicroelectronics

TELECOM CIRCUIT

INDUSTRIAL

BALL

169

TFBGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

1.1 V

GRID ARRAY, THIN PROFILE, FINE PITCH

.65 mm

85 Cel

-40 Cel

MATTE TIN

BOTTOM

S-PBGA-B169

3

1.2 mm

9 mm

e3

260

9 mm

NL3HS644FCTAG

Onsemi

TELECOM CIRCUIT

BALL

36

VFBGA

SQUARE

PLASTIC/EPOXY

YES

1

3.3 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

BOTTOM

S-PBGA-B36

.54 mm

2.34 mm

NOT SPECIFIED

NOT SPECIFIED

2.34 mm

LMS7002M

Lime Microsystems

TELECOM CIRCUIT

INDUSTRIAL

BALL

261

BGA

SQUARE

PLASTIC/EPOXY

YES

1

1.2 V

GRID ARRAY

85 Cel

-40 Cel

BOTTOM

S-PBGA-B261

11.5 mm

11.5 mm

IP4047CX6/LF,135

Nexperia

TELECOM CIRCUIT

INDUSTRIAL

BALL

6

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.5 mm

85 Cel

-40 Cel

BOTTOM

R-PBGA-B6

.7 mm

.99 mm

1.44 mm

ADRV9009BBCZ

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

BALL

196

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1

1.3 V

GRID ARRAY, LOW PROFILE, FINE PITCH

.8 mm

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

S-PBGA-B196

3

1.27 mm

12 mm

e1

260

12 mm

ADRV9008BBCZ-1

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

BALL

196

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1

1.3 V

GRID ARRAY, LOW PROFILE, FINE PITCH

.8 mm

85 Cel

-40 Cel

BOTTOM

S-PBGA-B196

3

1.27 mm

12 mm

260

12 mm

ADRV9008BBCZ-2

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

BALL

196

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1

1.3 V

GRID ARRAY, LOW PROFILE, FINE PITCH

.8 mm

85 Cel

-40 Cel

BOTTOM

S-PBGA-B196

3

1.27 mm

12 mm

260

12 mm

STHVDAC-253C7

STMicroelectronics

TELECOM CIRCUIT

BALL

12

VFBGA

RECTANGULAR

UNSPECIFIED

YES

1

3.3 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA12,3X4,14

.35 mm

85 Cel

-30 Cel

BOTTOM

R-XBGA-B12

.64 mm

1.1 mm

NOT SPECIFIED

NOT SPECIFIED

1.45 mm

VSC8490YJU-17

Microchip Technology

TELECOM CIRCUIT

INDUSTRIAL

BALL

196

LBGA

SQUARE

PLASTIC/EPOXY

YES

1

1 V

GRID ARRAY, LOW PROFILE

BGA196,14X14,40

1 mm

110 Cel

-40 Cel

BOTTOM

10000 Mbps

S-PBGA-B196

1.4 mm

15 mm

15 mm

VSC8491YJU-17

Microchip Technology

TELECOM CIRCUIT

INDUSTRIAL

BALL

196

LBGA

SQUARE

PLASTIC/EPOXY

YES

1

1 V

GRID ARRAY, LOW PROFILE

BGA196,14X14,40

1 mm

110 Cel

-40 Cel

BOTTOM

10000 Mbps

S-PBGA-B196

1.4 mm

15 mm

15 mm

PN5120A0ET/C2,151

NXP Semiconductors

TELECOM CIRCUIT

OTHER

BALL

64

TFBGA

SQUARE

PLASTIC/EPOXY

YES

1

AEC-Q100

3 V

GRID ARRAY, THIN PROFILE, FINE PITCH

.65 mm

85 Cel

-30 Cel

BOTTOM

S-PBGA-B64

1.15 mm

5.5 mm

5.5 mm

AFE7700IABJ

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

BALL

400

FBGA

SQUARE

PLASTIC/EPOXY

YES

1

GRID ARRAY, FINE PITCH

.8 mm

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

S-PBGA-B400

3

2.65 mm

17 mm

RF frequency(Min)(MHz) is 600; RF frequency(Max)(MHz) is 6000

e1

30

260

17 mm

ADRV9026BBCZ-REEL

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

BALL

289

LFBGA

SQUARE

PLASTIC/EPOXY

YES

4

1 V

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA289,17X17,32

.8 mm

110 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

S-PBGA-B289

3

1.46 mm

14 mm

ALSO OPERATES IN 1.3V AND 1.8V NOMINAL VOLTAGE

e1

30

260

14 mm

ADRV9026BBCZ

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

BALL

289

LFBGA

SQUARE

PLASTIC/EPOXY

YES

4

1 V

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA289,17X17,32

.8 mm

110 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

S-PBGA-B289

3

1.46 mm

14 mm

ALSO OPERATES IN 1.3V AND 1.8V NOMINAL VOLTAGE

e1

30

260

14 mm

PM5440B-FEI

Microchip Technology

TELECOM CIRCUIT

BALL

1894

BGA

SQUARE

PLASTIC/EPOXY

YES

1

GRID ARRAY

BOTTOM

S-PBGA-B1894

PM5980B-FEI

Microchip Technology

TELECOM CIRCUIT

BALL

1932

BGA

SQUARE

PLASTIC/EPOXY

YES

1

GRID ARRAY

BOTTOM

S-PBGA-B1932

PM5981B-FEI

Microchip Technology

TELECOM CIRCUIT

BALL

1932

BGA

SQUARE

PLASTIC/EPOXY

YES

1

GRID ARRAY

BOTTOM

S-PBGA-B1932

PM5990B-FEI

Microchip Technology

TELECOM CIRCUIT

BALL

1932

BGA

SQUARE

PLASTIC/EPOXY

YES

1

GRID ARRAY

BOTTOM

S-PBGA-B1932

PM5991B-FEI

Microchip Technology

TELECOM CIRCUIT

BALL

1932

BGA

SQUARE

PLASTIC/EPOXY

YES

1

GRID ARRAY

BOTTOM

S-PBGA-B1932

VSC8491YJU-13

Microchip Technology

TELECOM CIRCUIT

INDUSTRIAL

BALL

196

LBGA

SQUARE

PLASTIC/EPOXY

YES

1

1 V

GRID ARRAY, LOW PROFILE

1 mm

110 Cel

-40 Cel

BOTTOM

S-PBGA-B196

1.4 mm

15 mm

15 mm

WP3160W6NFEI-320B1

Microchip Technology

TELECOM CIRCUIT

BALL

672

BGA

SQUARE

PLASTIC/EPOXY

YES

1

GRID ARRAY

BOTTOM

S-PBGA-B672

WP3161F5NFEI-320B1

Microchip Technology

TELECOM CIRCUIT

BALL

672

BGA

SQUARE

PLASTIC/EPOXY

YES

1

GRID ARRAY

BOTTOM

S-PBGA-B672

WP3161W6NFEI-320B1

Microchip Technology

TELECOM CIRCUIT

BALL

672

BGA

SQUARE

PLASTIC/EPOXY

YES

1

GRID ARRAY

BOTTOM

S-PBGA-B672

WP3161D4NFEI-400B1

Microchip Technology

TELECOM CIRCUIT

BALL

672

BGA

SQUARE

PLASTIC/EPOXY

YES

1

GRID ARRAY

BOTTOM

S-PBGA-B672

AD9988BBPZRL-4D4AC

Analog Devices

TELECOM CIRCUIT

BALL

324

BGA

SQUARE

PLASTIC/EPOXY

YES

1

1 V

GRID ARRAY, HEAT SINK/SLUG

.8 mm

120 Cel

-40 Cel

BOTTOM

S-PBGA-B324

1.72 mm

15 mm

15 mm

ADRV9002BBCZ-RL

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

BALL

196

TFBGA

SQUARE

PLASTIC/EPOXY

YES

1

1 V

GRID ARRAY, THIN PROFILE, FINE PITCH

BGA196,14X14,32

.8 mm

110 Cel

-40 Cel

BOTTOM

S-PBGA-B196

3

1.19 mm

12 mm

30

260

12 mm

ADRV9002BBCZ

Analog Devices

TELECOM CIRCUIT

INDUSTRIAL

BALL

196

TFBGA

SQUARE

PLASTIC/EPOXY

YES

1

1 V

GRID ARRAY, THIN PROFILE, FINE PITCH

BGA196,14X14,32

.8 mm

110 Cel

-40 Cel

BOTTOM

S-PBGA-B196

3

1.19 mm

12 mm

30

260

12 mm

AFE8092IABJ

Texas Instruments

TELECOM CIRCUIT

INDUSTRIAL

BALL

400

FBGA

SQUARE

PLASTIC/EPOXY

YES

1

GRID ARRAY, FINE PITCH

BGA400,20X20,32

.8 mm

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

32500 Mbps

S-PBGA-B400

3

2.65 mm

17 mm

RF frequency(Min)(MHz) : 600, RF frequency(Max)(MHz) : 5500

e1

30

260

17 mm

D52MD2M8IA-TRAY

Garmin Canada

TELECOM CIRCUIT

INDUSTRIAL

BALL

35

XMA

RECTANGULAR

UNSPECIFIED

YES

1

MICROELECTRONIC ASSEMBLY

1.5 mm

85 Cel

-40 Cel

UNSPECIFIED

.06 Mbps

R-XXMA-B35

2.11 mm

9.8 mm

14 mm

ADRV9004BBCZ-RL

Analog Devices

TELECOM CIRCUIT

BALL

196

BGA

SQUARE

PLASTIC/EPOXY

YES

2

1 V

GRID ARRAY

.8 mm

85 Cel

-40 Cel

BOTTOM

S-PBGA-B196

3

1.25 mm

12 mm

30

260

12 mm

ADRV9004BBCZ

Analog Devices

TELECOM CIRCUIT

BALL

196

BGA

SQUARE

PLASTIC/EPOXY

YES

2

1 V

GRID ARRAY

.8 mm

85 Cel

-40 Cel

BOTTOM

S-PBGA-B196

3

1.25 mm

12 mm

30

260

12 mm

AFE7903IABJ

Texas Instruments

TELECOM CIRCUIT

BALL

400

BGA

SQUARE

PLASTIC/EPOXY

YES

1

.925 V

GRID ARRAY

BGA400,20X20,32

.8 mm

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

29500 Mbps

S-PBGA-B400

3

2.65 mm

17 mm

ALSO VNOM IS 1.2V & 1.8V; RF Frequency Max is 7400 MHz; RF Frequency Min is 5 MHz

e1

260

17 mm

BC57G687C-ANN-E4

Qualcomm

TELECOM CIRCUIT

BALL

105

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1

AEC-Q100

1.5 V

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA105,11X11,32

.8 mm

85 Cel

-40 Cel

BOTTOM

12 Mbps

S-PBGA-B105

1.6 mm

10 mm

10 mm

AFE7903IALK

Texas Instruments

TELECOM CIRCUIT

BALL

400

BGA

SQUARE

PLASTIC/EPOXY

YES

1

.925 V

GRID ARRAY

BGA400,20X20,32

.8 mm

85 Cel

-40 Cel

TIN LEAD

BOTTOM

29500 Mbps

S-PBGA-B400

3

2.65 mm

17 mm

ALSO VNOM IS 1.2V & 1.8V; RF Frequency Max is 7400 MHz; RF Frequency Min is 5 MHz

e0

220

17 mm

AFE8092HIABJ

Texas Instruments

TELECOM CIRCUIT

BALL

400

FBGA

SQUARE

PLASTIC/EPOXY

YES

1

GRID ARRAY, FINE PITCH

BGA400,20X20,32

.8 mm

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

32500 Mbps

S-PBGA-B400

3

2.65 mm

17 mm

RF frequency(Min)(MHz) : 600; RF frequency(Max)(MHz) : 5500

e1

260

17 mm

AFE7952IABJ

Texas Instruments

TELECOM CIRCUIT

BALL

400

FBGA

SQUARE

PLASTIC/EPOXY

YES

1

GRID ARRAY, FINE PITCH

BGA400,20X20,32

.8 mm

TIN SILVER COPPER

BOTTOM

29500 Mbps

S-PBGA-B400

3

2.65 mm

17 mm

RF frequency(Min)(MHz) : 0; RF frequency(Max)(MHz) : 12000

e1

260

17 mm

AFE8000IABJ

Texas Instruments

TELECOM CIRCUIT

BALL

400

FBGA

SQUARE

PLASTIC/EPOXY

YES

1

GRID ARRAY, FINE PITCH

BGA400,20X20,32

.8 mm

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

32500 Mbps

S-PBGA-B400

3

2.65 mm

17 mm

RF frequency(Max)(MHz) : 7000

e1

260

17 mm

AFE7901IALK

Texas Instruments

TELECOM CIRCUIT

BALL

400

FBGA

SQUARE

PLASTIC/EPOXY

YES

1

.925 V

GRID ARRAY, FINE PITCH

BGA400,20X20,32

.8 mm

85 Cel

-40 Cel

TIN LEAD

BOTTOM

29500 Mbps

S-PBGA-B400

3

2.65 mm

17 mm

e0

220

17 mm

AFE7901IABJ

Texas Instruments

TELECOM CIRCUIT

BALL

400

FBGA

SQUARE

PLASTIC/EPOXY

YES

1

.925 V

GRID ARRAY, FINE PITCH

BGA400,20X20,32

.8 mm

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

29500 Mbps

S-PBGA-B400

3

2.65 mm

17 mm

e1

260

17 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.