| Part | RoHS | Manufacturer | Telecom IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | Applications | Surface Mount | No. of Functions | Output Code | No. of Channels | Technology | Screening Level | Nominal Negative Supply Voltage | No. of Transceivers | Maximum Supply Current | Nominal Supply Voltage | Hybrid | Input Code | Power Supplies (V) | ISDN Access Rate | Package Style (Meter) | Package Equivalence Code | Sub-Category | Carrier Type-3 | Terminal Pitch | Maximum Operating Temperature | Resolution (um) | Battery Supply (V) | Minimum Output High Voltage | Maximum Output Low Voltage | Standard | Minimum Operating Temperature | Maximum Gain Tolerance | Terminal Finish | Maximum Output Voltage | Terminal Position | Data Rate | JESD-30 Code | Reference Point | Output (V) | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Linear Coding | Carrier Type-2 | Carrier Type-1 | Width | Qualification | Maximum Output Low Current | Companding Law | Input Type | Additional Features | Battery Feed | Maximum Analog Input | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length | Filter |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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|
Analog Devices |
TELECOM CIRCUIT |
INDUSTRIAL |
BALL |
144 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
1.2 V |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA144,12X12,32 |
.8 mm |
85 Cel |
-40 Cel |
BOTTOM |
S-PBGA-B144 |
1.24 mm |
10 mm |
NOT SPECIFIED |
NOT SPECIFIED |
10 mm |
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|
|
Analog Devices |
TELECOM CIRCUIT |
INDUSTRIAL |
BALL |
144 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
1.2 V |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA144,12X12,32 |
.8 mm |
85 Cel |
-40 Cel |
BOTTOM |
S-PBGA-B144 |
1.24 mm |
10 mm |
NOT SPECIFIED |
NOT SPECIFIED |
10 mm |
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|
|
Texas Instruments |
TELECOM CIRCUIT |
INDUSTRIAL |
BALL |
54 |
VFBGA |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
3.6 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.4 mm |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
4 Mbps |
R-XBGA-B54 |
1 |
.575 mm |
2.93 mm |
e1 |
30 |
260 |
3.26 mm |
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|
|
Texas Instruments |
TELECOM CIRCUIT |
INDUSTRIAL |
BALL |
54 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
3.6 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.4 mm |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B54 |
1 |
.575 mm |
2.925 mm |
e1 |
30 |
260 |
3.265 mm |
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|
|
Texas Instruments |
TELECOM CIRCUIT |
INDUSTRIAL |
BALL |
54 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
3.6 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.4 mm |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B54 |
1 |
.575 mm |
2.925 mm |
e1 |
30 |
260 |
3.265 mm |
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|
STMicroelectronics |
TELECOM CIRCUIT |
INDUSTRIAL |
BALL |
169 |
TFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
1.1 V |
GRID ARRAY, THIN PROFILE, FINE PITCH |
.65 mm |
85 Cel |
-40 Cel |
BOTTOM |
S-PBGA-B169 |
1.2 mm |
9 mm |
NOT SPECIFIED |
NOT SPECIFIED |
9 mm |
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|
|
STMicroelectronics |
TELECOM CIRCUIT |
INDUSTRIAL |
BALL |
169 |
TFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
1.1 V |
GRID ARRAY, THIN PROFILE, FINE PITCH |
.65 mm |
85 Cel |
-40 Cel |
BOTTOM |
S-PBGA-B169 |
1.2 mm |
9 mm |
NOT SPECIFIED |
NOT SPECIFIED |
9 mm |
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|
|
STMicroelectronics |
TELECOM CIRCUIT |
INDUSTRIAL |
BALL |
169 |
TFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
1.1 V |
GRID ARRAY, THIN PROFILE, FINE PITCH |
.65 mm |
85 Cel |
-40 Cel |
BOTTOM |
S-PBGA-B169 |
1.2 mm |
9 mm |
NOT SPECIFIED |
NOT SPECIFIED |
9 mm |
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|
|
STMicroelectronics |
TELECOM CIRCUIT |
INDUSTRIAL |
BALL |
169 |
TFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
1.1 V |
GRID ARRAY, THIN PROFILE, FINE PITCH |
.65 mm |
85 Cel |
-40 Cel |
MATTE TIN |
BOTTOM |
S-PBGA-B169 |
3 |
1.2 mm |
9 mm |
e3 |
260 |
9 mm |
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|
|
Onsemi |
TELECOM CIRCUIT |
BALL |
36 |
VFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.4 mm |
BOTTOM |
S-PBGA-B36 |
.54 mm |
2.34 mm |
NOT SPECIFIED |
NOT SPECIFIED |
2.34 mm |
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|
Lime Microsystems |
TELECOM CIRCUIT |
INDUSTRIAL |
BALL |
261 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
1.2 V |
GRID ARRAY |
85 Cel |
-40 Cel |
BOTTOM |
S-PBGA-B261 |
11.5 mm |
11.5 mm |
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|
Nexperia |
TELECOM CIRCUIT |
INDUSTRIAL |
BALL |
6 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.5 mm |
85 Cel |
-40 Cel |
BOTTOM |
R-PBGA-B6 |
.7 mm |
.99 mm |
1.44 mm |
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|
|
Analog Devices |
TELECOM CIRCUIT |
INDUSTRIAL |
BALL |
196 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
1.3 V |
GRID ARRAY, LOW PROFILE, FINE PITCH |
.8 mm |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B196 |
3 |
1.27 mm |
12 mm |
e1 |
260 |
12 mm |
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|
|
Analog Devices |
TELECOM CIRCUIT |
INDUSTRIAL |
BALL |
196 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
1.3 V |
GRID ARRAY, LOW PROFILE, FINE PITCH |
.8 mm |
85 Cel |
-40 Cel |
BOTTOM |
S-PBGA-B196 |
3 |
1.27 mm |
12 mm |
260 |
12 mm |
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|
|
Analog Devices |
TELECOM CIRCUIT |
INDUSTRIAL |
BALL |
196 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
1.3 V |
GRID ARRAY, LOW PROFILE, FINE PITCH |
.8 mm |
85 Cel |
-40 Cel |
BOTTOM |
S-PBGA-B196 |
3 |
1.27 mm |
12 mm |
260 |
12 mm |
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|
|
STMicroelectronics |
TELECOM CIRCUIT |
BALL |
12 |
VFBGA |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
3.3 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA12,3X4,14 |
.35 mm |
85 Cel |
-30 Cel |
BOTTOM |
R-XBGA-B12 |
.64 mm |
1.1 mm |
NOT SPECIFIED |
NOT SPECIFIED |
1.45 mm |
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|
Microchip Technology |
TELECOM CIRCUIT |
INDUSTRIAL |
BALL |
196 |
LBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
1 V |
GRID ARRAY, LOW PROFILE |
BGA196,14X14,40 |
1 mm |
110 Cel |
-40 Cel |
BOTTOM |
10000 Mbps |
S-PBGA-B196 |
1.4 mm |
15 mm |
15 mm |
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|
Microchip Technology |
TELECOM CIRCUIT |
INDUSTRIAL |
BALL |
196 |
LBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
1 V |
GRID ARRAY, LOW PROFILE |
BGA196,14X14,40 |
1 mm |
110 Cel |
-40 Cel |
BOTTOM |
10000 Mbps |
S-PBGA-B196 |
1.4 mm |
15 mm |
15 mm |
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|
NXP Semiconductors |
TELECOM CIRCUIT |
OTHER |
BALL |
64 |
TFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
AEC-Q100 |
3 V |
GRID ARRAY, THIN PROFILE, FINE PITCH |
.65 mm |
85 Cel |
-30 Cel |
BOTTOM |
S-PBGA-B64 |
1.15 mm |
5.5 mm |
5.5 mm |
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|
|
Texas Instruments |
TELECOM CIRCUIT |
INDUSTRIAL |
BALL |
400 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
GRID ARRAY, FINE PITCH |
.8 mm |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B400 |
3 |
2.65 mm |
17 mm |
RF frequency(Min)(MHz) is 600; RF frequency(Max)(MHz) is 6000 |
e1 |
30 |
260 |
17 mm |
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|
|
Analog Devices |
TELECOM CIRCUIT |
INDUSTRIAL |
BALL |
289 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
4 |
1 V |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA289,17X17,32 |
.8 mm |
110 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B289 |
3 |
1.46 mm |
14 mm |
ALSO OPERATES IN 1.3V AND 1.8V NOMINAL VOLTAGE |
e1 |
30 |
260 |
14 mm |
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|
|
Analog Devices |
TELECOM CIRCUIT |
INDUSTRIAL |
BALL |
289 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
4 |
1 V |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA289,17X17,32 |
.8 mm |
110 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B289 |
3 |
1.46 mm |
14 mm |
ALSO OPERATES IN 1.3V AND 1.8V NOMINAL VOLTAGE |
e1 |
30 |
260 |
14 mm |
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|
Microchip Technology |
TELECOM CIRCUIT |
BALL |
1894 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
GRID ARRAY |
BOTTOM |
S-PBGA-B1894 |
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|
Microchip Technology |
TELECOM CIRCUIT |
BALL |
1932 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
GRID ARRAY |
BOTTOM |
S-PBGA-B1932 |
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|
Microchip Technology |
TELECOM CIRCUIT |
BALL |
1932 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
GRID ARRAY |
BOTTOM |
S-PBGA-B1932 |
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|
Microchip Technology |
TELECOM CIRCUIT |
BALL |
1932 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
GRID ARRAY |
BOTTOM |
S-PBGA-B1932 |
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|
Microchip Technology |
TELECOM CIRCUIT |
BALL |
1932 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
GRID ARRAY |
BOTTOM |
S-PBGA-B1932 |
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|
Microchip Technology |
TELECOM CIRCUIT |
INDUSTRIAL |
BALL |
196 |
LBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
1 V |
GRID ARRAY, LOW PROFILE |
1 mm |
110 Cel |
-40 Cel |
BOTTOM |
S-PBGA-B196 |
1.4 mm |
15 mm |
15 mm |
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|
|
Microchip Technology |
TELECOM CIRCUIT |
BALL |
672 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
GRID ARRAY |
BOTTOM |
S-PBGA-B672 |
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|
|
Microchip Technology |
TELECOM CIRCUIT |
BALL |
672 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
GRID ARRAY |
BOTTOM |
S-PBGA-B672 |
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|
|
Microchip Technology |
TELECOM CIRCUIT |
BALL |
672 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
GRID ARRAY |
BOTTOM |
S-PBGA-B672 |
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|
|
Microchip Technology |
TELECOM CIRCUIT |
BALL |
672 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
GRID ARRAY |
BOTTOM |
S-PBGA-B672 |
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|
|
Analog Devices |
TELECOM CIRCUIT |
BALL |
324 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
1 V |
GRID ARRAY, HEAT SINK/SLUG |
.8 mm |
120 Cel |
-40 Cel |
BOTTOM |
S-PBGA-B324 |
1.72 mm |
15 mm |
15 mm |
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|
|
Analog Devices |
TELECOM CIRCUIT |
INDUSTRIAL |
BALL |
196 |
TFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
1 V |
GRID ARRAY, THIN PROFILE, FINE PITCH |
BGA196,14X14,32 |
.8 mm |
110 Cel |
-40 Cel |
BOTTOM |
S-PBGA-B196 |
3 |
1.19 mm |
12 mm |
30 |
260 |
12 mm |
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|
|
Analog Devices |
TELECOM CIRCUIT |
INDUSTRIAL |
BALL |
196 |
TFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
1 V |
GRID ARRAY, THIN PROFILE, FINE PITCH |
BGA196,14X14,32 |
.8 mm |
110 Cel |
-40 Cel |
BOTTOM |
S-PBGA-B196 |
3 |
1.19 mm |
12 mm |
30 |
260 |
12 mm |
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|
|
Texas Instruments |
TELECOM CIRCUIT |
INDUSTRIAL |
BALL |
400 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
GRID ARRAY, FINE PITCH |
BGA400,20X20,32 |
.8 mm |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
32500 Mbps |
S-PBGA-B400 |
3 |
2.65 mm |
17 mm |
RF frequency(Min)(MHz) : 600, RF frequency(Max)(MHz) : 5500 |
e1 |
30 |
260 |
17 mm |
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|
|
Garmin Canada |
TELECOM CIRCUIT |
INDUSTRIAL |
BALL |
35 |
XMA |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
MICROELECTRONIC ASSEMBLY |
1.5 mm |
85 Cel |
-40 Cel |
UNSPECIFIED |
.06 Mbps |
R-XXMA-B35 |
2.11 mm |
9.8 mm |
14 mm |
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|
|
Analog Devices |
TELECOM CIRCUIT |
BALL |
196 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
2 |
1 V |
GRID ARRAY |
.8 mm |
85 Cel |
-40 Cel |
BOTTOM |
S-PBGA-B196 |
3 |
1.25 mm |
12 mm |
30 |
260 |
12 mm |
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|
|
Analog Devices |
TELECOM CIRCUIT |
BALL |
196 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
2 |
1 V |
GRID ARRAY |
.8 mm |
85 Cel |
-40 Cel |
BOTTOM |
S-PBGA-B196 |
3 |
1.25 mm |
12 mm |
30 |
260 |
12 mm |
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|
|
Texas Instruments |
TELECOM CIRCUIT |
BALL |
400 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
.925 V |
GRID ARRAY |
BGA400,20X20,32 |
.8 mm |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
29500 Mbps |
S-PBGA-B400 |
3 |
2.65 mm |
17 mm |
ALSO VNOM IS 1.2V & 1.8V; RF Frequency Max is 7400 MHz; RF Frequency Min is 5 MHz |
e1 |
260 |
17 mm |
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|
|
Qualcomm |
TELECOM CIRCUIT |
BALL |
105 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
AEC-Q100 |
1.5 V |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA105,11X11,32 |
.8 mm |
85 Cel |
-40 Cel |
BOTTOM |
12 Mbps |
S-PBGA-B105 |
1.6 mm |
10 mm |
10 mm |
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|
Texas Instruments |
TELECOM CIRCUIT |
BALL |
400 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
.925 V |
GRID ARRAY |
BGA400,20X20,32 |
.8 mm |
85 Cel |
-40 Cel |
TIN LEAD |
BOTTOM |
29500 Mbps |
S-PBGA-B400 |
3 |
2.65 mm |
17 mm |
ALSO VNOM IS 1.2V & 1.8V; RF Frequency Max is 7400 MHz; RF Frequency Min is 5 MHz |
e0 |
220 |
17 mm |
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|
|
Texas Instruments |
TELECOM CIRCUIT |
BALL |
400 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
GRID ARRAY, FINE PITCH |
BGA400,20X20,32 |
.8 mm |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
32500 Mbps |
S-PBGA-B400 |
3 |
2.65 mm |
17 mm |
RF frequency(Min)(MHz) : 600; RF frequency(Max)(MHz) : 5500 |
e1 |
260 |
17 mm |
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|
|
Texas Instruments |
TELECOM CIRCUIT |
BALL |
400 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
GRID ARRAY, FINE PITCH |
BGA400,20X20,32 |
.8 mm |
TIN SILVER COPPER |
BOTTOM |
29500 Mbps |
S-PBGA-B400 |
3 |
2.65 mm |
17 mm |
RF frequency(Min)(MHz) : 0; RF frequency(Max)(MHz) : 12000 |
e1 |
260 |
17 mm |
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|
|
Texas Instruments |
TELECOM CIRCUIT |
BALL |
400 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
GRID ARRAY, FINE PITCH |
BGA400,20X20,32 |
.8 mm |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
32500 Mbps |
S-PBGA-B400 |
3 |
2.65 mm |
17 mm |
RF frequency(Max)(MHz) : 7000 |
e1 |
260 |
17 mm |
||||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
TELECOM CIRCUIT |
BALL |
400 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
.925 V |
GRID ARRAY, FINE PITCH |
BGA400,20X20,32 |
.8 mm |
85 Cel |
-40 Cel |
TIN LEAD |
BOTTOM |
29500 Mbps |
S-PBGA-B400 |
3 |
2.65 mm |
17 mm |
e0 |
220 |
17 mm |
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|
|
Texas Instruments |
TELECOM CIRCUIT |
BALL |
400 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
.925 V |
GRID ARRAY, FINE PITCH |
BGA400,20X20,32 |
.8 mm |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
29500 Mbps |
S-PBGA-B400 |
3 |
2.65 mm |
17 mm |
e1 |
260 |
17 mm |
Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.
Some common types of Other Function Telecom Interface ICs include:
1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.
2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.
3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.
4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.