GULL WING Other Function Telecom Interface ICs 255

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Output Code	No. of Channels	Technology	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Resolution (um)	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Output (V)	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Input Type	Maximum Analog Input	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
BH1417FV-E2	ROHM		INDUSTRIAL	GULL WING	24	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES					28 mA	5 V	5	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP24,.3	Other Telecom ICs	.635 mm	85 Cel		-40 Cel		DUAL	R-PDSO-G24					Not Qualified
ST7590T	STMicroelectronics		INDUSTRIAL	GULL WING	100	QFP	SQUARE	PLASTIC/EPOXY	YES				CMOS	30 mA	18 V	18	FLATPACK	TQFP100,.63SQ	Other Telecom ICs	.5 mm	85 Cel		-40 Cel	TIN SILVER COPPER	QUAD	S-PQFP-G100		3			Not Qualified			e1	30	260
CRX14-MQP/1GE	STMicroelectronics	TELECOM CIRCUIT	OTHER	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES				CMOS	20 mA	5 V	5	SMALL OUTLINE	SOP16,.25	Other Telecom ICs	1.27 mm	85 Cel		-20 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G16		3			Not Qualified			e4	30	260
PRH601HL/C1,557	NXP Semiconductors		OTHER	GULL WING	100	QFP	SQUARE	PLASTIC/EPOXY	YES							3.3,5	FLATPACK	QFP100,.63SQ,20	Other Telecom ICs	.5 mm	70 Cel		-25 Cel		QUAD	S-PQFP-G100		3			Not Qualified					260
LA72910V-MPB-H	Onsemi		OTHER	GULL WING	16	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES						5 V	5	SMALL OUTLINE, SHRINK PITCH	SSOP16,.25	Other Telecom ICs	.635 mm	70 Cel		-30 Cel	TIN BISMUTH	DUAL	R-PDSO-G16		3			Not Qualified			e6	30	260
LA72910V-TLM-H	Onsemi		OTHER	GULL WING	16	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES						5 V	5	SMALL OUTLINE, SHRINK PITCH	SSOP16,.25	Other Telecom ICs	.635 mm	70 Cel		-30 Cel	TIN BISMUTH	DUAL	R-PDSO-G16		3			Not Qualified			e6	30	260
LA72914V-MPB-H	Onsemi		COMMERCIAL	GULL WING	16	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES				BIPOLAR	.04 mA	5 V	5	SMALL OUTLINE, SHRINK PITCH	SSOP16,.25	Other Telecom ICs	.635 mm	70 Cel		-20 Cel	TIN BISMUTH	DUAL	R-PDSO-G16		3			Not Qualified			e6	30	260
LA72912V-MPB-H	Onsemi		OTHER	GULL WING	24	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES				BIPOLAR	.032 mA	5 V	5	SMALL OUTLINE, SHRINK PITCH	SSOP24,.3	Other Telecom ICs	.635 mm	70 Cel		-30 Cel	TIN BISMUTH	DUAL	R-PDSO-G24		3			Not Qualified			e6	30	260
XR2211ACD-F	Exar	TELECOM CIRCUIT	COMMERCIAL	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			BIPOLAR	.009 mA	12 V	12	SMALL OUTLINE	SOP14,.25	Other Telecom ICs	1.27 mm	70 Cel		0 Cel	MATTE TIN	DUAL	R-PDSO-G14		2	1.75 mm	3.9 mm	Not Qualified			e3			8.65 mm
XR2211ACDTR-F	Exar	TELECOM CIRCUIT	COMMERCIAL	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			BIPOLAR		12 V		SMALL OUTLINE			1.27 mm	70 Cel		0 Cel	MATTE TIN	DUAL	R-PDSO-G14		2	1.75 mm	3.9 mm	Not Qualified			e3			8.65 mm
SI4012-C1001GT	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1			CMOS	.0198 mA	3.3 V	2/3.3	SMALL OUTLINE	TSSOP10,.19,20	Other Telecom ICs	.5 mm	85 Cel		-40 Cel		DUAL	S-PDSO-G10			1.1 mm	3 mm	Not Qualified				NOT SPECIFIED	NOT SPECIFIED	3 mm
SI4010-C2-GT	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1			CMOS		3.3 V		SMALL OUTLINE			.5 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD	DUAL	S-PDSO-G10		2	1.1 mm	3 mm	Not Qualified			e4	40	260	3 mm
NCV7425DW0G	Onsemi	TELECOM CIRCUIT	AUTOMOTIVE	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					12 V		SMALL OUTLINE			1.27 mm	125 Cel		-40 Cel	TIN	DUAL	R-PDSO-G16			2.65 mm	7.5 mm				e3			10.3 mm
NCV7425DW0R2G	Onsemi	TELECOM CIRCUIT	AUTOMOTIVE	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					12 V		SMALL OUTLINE			1.27 mm	125 Cel		-40 Cel	TIN	DUAL	R-PDSO-G16		2	2.65 mm	7.5 mm				e3		260	10.3 mm
NCV7425DW5G	Onsemi	TELECOM CIRCUIT	AUTOMOTIVE	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					12 V		SMALL OUTLINE			1.27 mm	125 Cel		-40 Cel	TIN	DUAL	R-PDSO-G16			2.65 mm	7.5 mm				e3			10.3 mm
NCV7425DW5R2G	Onsemi	TELECOM CIRCUIT	AUTOMOTIVE	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					12 V		SMALL OUTLINE			1.27 mm	125 Cel		-40 Cel	MATTE TIN	DUAL	R-PDSO-G16		2	2.65 mm	7.5 mm				e3	30	260	10.3 mm
ADV7619KSVZ-P	Analog Devices	TELECOM CIRCUIT	COMMERCIAL	GULL WING	128	HTFQFP	SQUARE	PLASTIC/EPOXY	YES	1			CMOS		1.8 V		FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH			.4 mm	70 Cel		0 Cel	Matte Tin (Sn) - annealed	QUAD	S-PQFP-G128		3	1.2 mm	14 mm				e3		260	14 mm
TMS3705BDRG4	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1				.02 mA	5 V	5	SMALL OUTLINE	SOP16,.25	Other Telecom ICs	1.27 mm	105 Cel		-40 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G16		3	1.75 mm	3.91 mm	Not Qualified			e4	30	260	9.9 mm
ST7570TR	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	48	HVFQFP	SQUARE	PLASTIC/EPOXY	YES	1			CMOS	.03 mA	13 V	13	FLATPACK, HEAT SINK/SLUG, VERY THIN PROFILE, FINE PITCH	LCC48,.27SQ,20	Other Telecom ICs	.5 mm	85 Cel		-40 Cel	MATTE TIN	QUAD	S-PQFP-G48		3	1 mm	7 mm	Not Qualified			e3	40	260	7 mm
ST7570	STMicroelectronics	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	48	HVFQFP	SQUARE	PLASTIC/EPOXY	YES	1			CMOS	.03 mA	13 V	13	FLATPACK, HEAT SINK/SLUG, VERY THIN PROFILE, FINE PITCH	LCC48,.27SQ,20	Other Telecom ICs	.5 mm	85 Cel		-40 Cel	Matte Tin (Sn) - annealed	QUAD	S-PQFP-G48		3	1 mm	7 mm	Not Qualified			e3	40	260	7 mm
MFRC53001T/0FE,112	NXP Semiconductors	TELECOM CIRCUIT	OTHER	GULL WING	32	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					5 V		SMALL OUTLINE			1.27 mm	85 Cel		-25 Cel		DUAL	R-PDSO-G32		1	2.65 mm	7.5 mm						250	20.5 mm
AFE4300PN	Texas Instruments	TELECOM CIRCUIT	COMMERCIAL	GULL WING	80	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	BINARY/TWOS COMP	2		.00097 mA	3.3 V	3	FLATPACK, LOW PROFILE, FINE PITCH	QFP80,.55SQ,20	Codecs	.5 mm	70 Cel	16	0 Cel	NICKEL PALLADIUM GOLD	QUAD	S-PQFP-G80	VOLTAGE	3	1.6 mm	12 mm	Not Qualified	DIFFERENTIAL	3.4 V	e4	30	260	12 mm
RF430CL330HTB	Texas Instruments	TELECOM CIRCUIT	COMMERCIAL	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			CMOS		3.3 V		SMALL OUTLINE				70 Cel		0 Cel		DUAL	R-PDSO-G14
TDA5210XUMA1	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					5 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	105 Cel		-40 Cel	TIN	DUAL	R-PDSO-G28		3	1.2 mm	4.4 mm	Not Qualified			e3			9.7 mm
TDA5102XUMA1	Infineon Technologies	TELECOM CIRCUIT	OTHER	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel		-25 Cel		DUAL	R-PDSO-G16		3	1.2 mm	4.4 mm	Not Qualified						5 mm
TDA5100XUMA1	Infineon Technologies	TELECOM CIRCUIT	OTHER	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel		-25 Cel		DUAL	R-PDSO-G16		3	1.2 mm	4.4 mm	Not Qualified						5 mm
TDA5101XUMA1	Infineon Technologies	TELECOM CIRCUIT	OTHER	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel		-25 Cel		DUAL	R-PDSO-G16		3	1.2 mm	4.4 mm	Not Qualified						5 mm
TDA5103AHTMA1	Infineon Technologies	TELECOM CIRCUIT	OTHER	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1			BIPOLAR	.0095 mA	3 V	3	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP10,.19,20	Other Telecom ICs	.5 mm	85 Cel		-25 Cel	TIN	DUAL	S-PDSO-G10		1	1.1 mm	3 mm	Not Qualified			e3			3 mm
TDK5111XUMA1	Infineon Technologies	TELECOM CIRCUIT	AUTOMOTIVE	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			BIPOLAR	.0195 mA	3 V	2.1/4	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP16,.25	Other Telecom ICs	.65 mm	125 Cel		-40 Cel		DUAL	R-PDSO-G16		3	1.2 mm	4.4 mm	Not Qualified						5 mm
TDA5250XUMA1	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	38	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.5 mm	85 Cel		-40 Cel		DUAL	R-PDSO-G38		3	1.2 mm	4.4 mm	Not Qualified						9.7 mm
TDK5110XUMA1	Infineon Technologies	TELECOM CIRCUIT	AUTOMOTIVE	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	125 Cel		-40 Cel		DUAL	R-PDSO-G16		3	1.2 mm	4.4 mm	Not Qualified						5 mm
TDK5101XUMA1	Infineon Technologies	TELECOM CIRCUIT	AUTOMOTIVE	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	125 Cel		-40 Cel		DUAL	R-PDSO-G16		3	1.2 mm	4.4 mm	Not Qualified						5 mm
TDK5110FHTMA1	Infineon Technologies	TELECOM CIRCUIT	AUTOMOTIVE	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1			BIPOLAR	.021 mA	3 V	2.1/4	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP10,.19,20	Other Telecom ICs	.5 mm	125 Cel		-40 Cel	MATTE TIN	DUAL	S-PDSO-G10		1	1.1 mm	3 mm	Not Qualified			e3			3 mm
TDK5116FHTMA1	Infineon Technologies	TELECOM CIRCUIT	AUTOMOTIVE	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1					3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.5 mm	125 Cel		-40 Cel	MATTE TIN	DUAL	S-PDSO-G10		1	1.1 mm	3 mm	Not Qualified			e3			3 mm
TDA5212XUMA1	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					5 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel		-40 Cel		DUAL	R-PDSO-G28		3	1.2 mm	4.4 mm	Not Qualified						9.7 mm
TDA7100HTMA1	Infineon Technologies	TELECOM CIRCUIT	OTHER	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1					3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.5 mm	70 Cel		-20 Cel	MATTE TIN	DUAL	S-PDSO-G10		1	1.1 mm	3 mm	Not Qualified			e3			3 mm
TDK5111FHTMA1	Infineon Technologies	TELECOM CIRCUIT	AUTOMOTIVE	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1					3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.5 mm	125 Cel		-40 Cel	MATTE TIN	DUAL	S-PDSO-G10		1	1.1 mm	3 mm	Not Qualified			e3			3 mm
TDK5100FHTMA1	Infineon Technologies	TELECOM CIRCUIT	AUTOMOTIVE	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1					3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.5 mm	125 Cel		-40 Cel	MATTE TIN	DUAL	S-PDSO-G10		1	1.1 mm	3 mm	Not Qualified			e3			3 mm
TDK5101FHTMA1	Infineon Technologies	TELECOM CIRCUIT	AUTOMOTIVE	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1					3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.5 mm	125 Cel		-40 Cel	MATTE TIN	DUAL	S-PDSO-G10		1	1.1 mm	3 mm	Not Qualified			e3			3 mm
TDA5220XUMA1	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					5 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	105 Cel		-40 Cel		DUAL	R-PDSO-G28		3	1.2 mm	4.4 mm	Not Qualified						9.7 mm
TDA5150HTMA1	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1					3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.5 mm	85 Cel		-40 Cel	TIN	DUAL	S-PDSO-G10		1	1.05 mm	3 mm	Not Qualified			e3			3 mm
TDA7116FHTMA1	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	1					3 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.5 mm	85 Cel		-40 Cel	MATTE TIN	DUAL	S-PDSO-G10		1	1.1 mm	3 mm	Not Qualified			e3			3 mm
TDA5200XUMA1	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					5 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel		-40 Cel	TIN	DUAL	R-PDSO-G28		3	1.2 mm	4.4 mm	Not Qualified			e3			9.7 mm
TDA5201XUMA1	Infineon Technologies	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	28	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					5 V		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel		-40 Cel	TIN	DUAL	R-PDSO-G28		3	1.2 mm	4.4 mm	Not Qualified			e3			9.7 mm
TDK5100XUMA1	Infineon Technologies	TELECOM CIRCUIT	AUTOMOTIVE	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			BIPOLAR	.0095 mA	3 V	2.1/4	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP16,.25	Other Telecom ICs	.65 mm	125 Cel		-40 Cel		DUAL	R-PDSO-G16		3	1.2 mm	4.4 mm	Not Qualified						5 mm
MLX90109CDC-AAA-000-RE	Melexis N V	TELECOM CIRCUIT	COMMERCIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					5 V		SMALL OUTLINE			1.27 mm	70 Cel		0 Cel	MATTE TIN	DUAL	R-PDSO-G8		1	1.72 mm	3.9 mm				e3		260	4.9 mm
MLX90109EDC-AAA-000-TU	Melexis N V	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					5 V		SMALL OUTLINE			1.27 mm	85 Cel		-40 Cel	MATTE TIN	DUAL	R-PDSO-G8		1	1.72 mm	3.9 mm				e3		260	4.9 mm
SA606DK/03,118	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1					3 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel		-40 Cel		DUAL	R-PDSO-G20			1.5 mm	4.4 mm							6.5 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.