GULL WING Other Function Telecom Interface ICs 255

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Screening Level	Nominal Supply Voltage	Package Style (Meter)	Package Equivalence Code	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
HMC244AG16	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	16	LQFP	SQUARE	PLASTIC/EPOXY	YES	1			3 V	FLATPACK, LOW PROFILE		.76 mm	85 Cel	-40 Cel	GOLD OVER NICKEL	QUAD		S-PQFP-G16	1	1.65 mm	5.84 mm		e4	30	250	5.84 mm
RF430CL330HTPWRQ1	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	14	SOP	RECTANGULAR	UNSPECIFIED	YES	1		AEC-Q100	3.3 V	SMALL OUTLINE			105 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL		R-XDSO-G14	2				e4	30	260
TB6865AFG	Toshiba	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS		3.3 V	FLATPACK, LOW PROFILE, FINE PITCH		.5 mm	85 Cel	-40 Cel		QUAD		S-PQFP-G100		1.7 mm	14 mm			NOT SPECIFIED	NOT SPECIFIED	14 mm
ADF7030-1BSTZN-RL	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1			3 V	FLATPACK, LOW PROFILE, FINE PITCH		.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-PQFP-G48	3	1.6 mm	7 mm		e3	30	260	7 mm
ADF7030-1BSTZN	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1			3 V	FLATPACK, LOW PROFILE, FINE PITCH		.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-PQFP-G48	3	1.6 mm	7 mm		e3	30	260	7 mm
TLE8457ASJXUMA1	Infineon Technologies	TELECOM CIRCUIT		GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS	AEC-Q100	8 V	SMALL OUTLINE		1.27 mm			TIN	DUAL		R-PDSO-G8	3	1.75 mm	4 mm		e3			5 mm
SN65DSI85TPAPRQ1	Texas Instruments	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	64	HTFQFP	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100	1.8 V	FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH		.5 mm	105 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	1 Mbps	S-PQFP-G64	3	1.2 mm	10 mm		e4	30	260	10 mm
TLE8457BSJXUMA1	Infineon Technologies	TELECOM CIRCUIT		GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS	AEC-Q100	8 V	SMALL OUTLINE		1.27 mm			TIN	DUAL		R-PDSO-G8	3	1.75 mm	4 mm		e3			5 mm
LC72720YVS-MPB-E	Onsemi	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	30	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3.3 V	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH		.65 mm	85 Cel	-40 Cel	TIN BISMUTH	DUAL		R-PDSO-G30	4	1.5 mm	5.6 mm		e6	30	260	9.75 mm
LC72720YVS-TLM-E	Onsemi	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	30	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3.3 V	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH		.65 mm	85 Cel	-40 Cel	TIN BISMUTH	DUAL		R-PDSO-G30	4	1.5 mm	5.6 mm		e6	30	260	9.75 mm
MWCT1013VLHSTR	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V	FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	.5 mm	105 Cel	-40 Cel		QUAD		S-PQFP-G64		1.6 mm	10 mm					10 mm
MWCT1013VLHST	NXP Semiconductors	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V	FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	.5 mm	105 Cel	-40 Cel		QUAD		S-PQFP-G64		1.6 mm	10 mm					10 mm
MWCT1001AVLHR	NXP Semiconductors	TELECOM CIRCUIT		GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100	3.3 V	FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	.5 mm	105 Cel	-40 Cel	TIN	QUAD		S-PQFP-G64	3	1.6 mm	10 mm		e3	40	260	10 mm
MICRF009YM	Microchip Technology	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			5 V	SMALL OUTLINE	SOP16,.25	1.27 mm	85 Cel	-40 Cel	MATTE TIN	DUAL	.002 Mbps	R-PDSO-G16	1	1.895 mm	3.9 mm	Operates from 4.75V to 5.5V	e3	30	260	9.9 mm
CC400DBR	Texas Instruments	TELECOM CIRCUIT		GULL WING	28	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3 V	SMALL OUTLINE, SHRINK PITCH	SSOP28,.3	.65 mm	85 Cel	-30 Cel		DUAL	.0096 Mbps	R-PDSO-G28		2 mm	5.3 mm					10.2 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.