Analog Devices Other Function Telecom Interface ICs 208

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Screening Level	Nominal Negative Supply Voltage	Nominal Supply Voltage	Package Style (Meter)	Package Equivalence Code	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
HMC244AG16	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	16	LQFP	SQUARE	PLASTIC/EPOXY	YES	1				3 V	FLATPACK, LOW PROFILE		.76 mm	85 Cel	-40 Cel	GOLD OVER NICKEL	QUAD	S-PQFP-G16	1	1.65 mm	5.84 mm	e4	30	250	5.84 mm
AD6679BBPZ-500	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BALL	196	HBGA	SQUARE	PLASTIC/EPOXY	YES	1				1.25 V	GRID ARRAY, HEAT SINK/SLUG		.8 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B196	3	1.49 mm	12 mm	e1	30	260	12 mm
AD6679BBPZRL7-500	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BALL	196	HBGA	SQUARE	PLASTIC/EPOXY	YES	1				1.25 V	GRID ARRAY, HEAT SINK/SLUG		.8 mm	85 Cel	-40 Cel		BOTTOM	S-PBGA-B196	3	1.49 mm	12 mm		30	260	12 mm
ADF5901WCCPZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1		AEC-Q100		3.3 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	.5 mm	105 Cel	-40 Cel	MATTE TIN	QUAD	S-XQCC-N32	3	.8 mm	5 mm	e3	30	260	5 mm
AD9671KBCZ	Analog Devices	TELECOM CIRCUIT	OTHER	BALL	144	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1				1.4 V	GRID ARRAY, LOW PROFILE, FINE PITCH		.8 mm	85 Cel	0 Cel		BOTTOM	S-PBGA-B144	3	1.4 mm	10 mm		30	260	10 mm
AD9670BBCZ	Analog Devices	TELECOM CIRCUIT	OTHER	BALL	144	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1				1.4 V	GRID ARRAY, LOW PROFILE, FINE PITCH		.8 mm	85 Cel	0 Cel		BOTTOM	S-PBGA-B144	3	1.4 mm	10 mm		30	260	10 mm
HMC8200LP5ME	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1				3.3 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	S-XQCC-N32	3	1 mm	5 mm	e4		260	5 mm
ADF5904ACPZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1				3.3 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm	105 Cel	-40 Cel	MATTE TIN	QUAD	S-XQCC-N32	3	.8 mm	5 mm	e3	30	260	5 mm
ADF5904WCCPZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1		AEC-Q100		3.3 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm	105 Cel	-40 Cel	MATTE TIN	QUAD	S-XQCC-N32	3	.8 mm	5 mm	e3	30	260	5 mm
HMC773ALC3BTR	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	12	HVQCCN	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	1					CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm	85 Cel	-40 Cel	GOLD OVER NICKEL	QUAD	S-CQCC-N12	3	.92 mm	3 mm	e4			3 mm
HMC773ALC3B	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	12	HVQCCN	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	1					CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm	85 Cel	-40 Cel	TUNGSTEN NICKEL GOLD	QUAD	S-CQCC-N12	3	.92 mm	3 mm			260	3 mm
HMC8100LP6JE	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	1				3.3 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20	.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	S-XQCC-N40	3	.95 mm	6 mm	e4	30	260	6 mm
HMC8200LP5METR	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1				3.3 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	S-XQCC-N32	3	1 mm	5 mm	e4		260	5 mm
ADF7030-1BSTZN-RL	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1				3 V	FLATPACK, LOW PROFILE, FINE PITCH		.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-PQFP-G48	3	1.6 mm	7 mm	e3	30	260	7 mm
ADF7030-1BSTZN	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1				3 V	FLATPACK, LOW PROFILE, FINE PITCH		.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-PQFP-G48	3	1.6 mm	7 mm	e3	30	260	7 mm
HMC625BLP5E	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				5 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-PQCC-N32	3	1 mm	5 mm	e3	30	260	5 mm
HMC6300BG46	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BALL	65	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				2.7 V	GRID ARRAY, VERY THIN PROFILE, FINE PITCH		.5 mm	85 Cel	-40 Cel		BOTTOM	R-PBGA-B65	1	.815 mm	4 mm		30	260	6 mm
HMC6301BG46	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BALL	75	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1				1.35 V	GRID ARRAY, VERY THIN PROFILE, FINE PITCH		.5 mm	85 Cel	-40 Cel		BOTTOM	R-PBGA-B75	1	.815 mm	4 mm		30	260	6 mm
HMC7891	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	UNSPECIFIED	4		RECTANGULAR	UNSPECIFIED	NO	1				8 V	FLANGE MOUNT			85 Cel	-40 Cel		UNSPECIFIED	R-XXFM-X4	1
HMC625BLP5ETR	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				5 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-PQCC-N32	3	1 mm	5 mm	e3	30	260	5 mm
AD6684BCPZ-500	Analog Devices	TELECOM CIRCUIT		NO LEAD	72	HVQCCN	SQUARE	UNSPECIFIED	YES	1				.975 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm			MATTE TIN	QUAD	S-XQCC-N72	3	1 mm	10 mm	e3	30	260	10 mm
AD6684BCPZRL7-500	Analog Devices	TELECOM CIRCUIT		NO LEAD	72	HVQCCN	SQUARE	UNSPECIFIED	YES	1				.975 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm			MATTE TIN	QUAD	S-XQCC-N72	3	1 mm	10 mm	e3	30	260	10 mm
AD9363ABCZ-REEL	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BALL	144	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1				1.3 V	GRID ARRAY, LOW PROFILE, FINE PITCH		.8 mm	85 Cel	-40 Cel		BOTTOM	S-PBGA-B144	3	1.7 mm	10 mm		30	260	10 mm
AD9363ABCZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BALL	144	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1				1.3 V	GRID ARRAY, LOW PROFILE, FINE PITCH		.8 mm	85 Cel	-40 Cel		BOTTOM	S-PBGA-B144	3	1.7 mm	10 mm		30	260	10 mm
HMC8108LC5TR-R5	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HQCCN	SQUARE	UNSPECIFIED	YES	1					CHIP CARRIER, HEAT SINK/SLUG		.5 mm	85 Cel	-40 Cel		QUAD	S-XQCC-N32	3	1.12 mm	4.9 mm		30	260	4.9 mm
HMC8108LC5TR	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HQCCN	SQUARE	UNSPECIFIED	YES	1					CHIP CARRIER, HEAT SINK/SLUG		.5 mm	85 Cel	-40 Cel		QUAD	S-XQCC-N32	3	1.12 mm	4.9 mm		30	260	4.9 mm
HMC8108LC5	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HQCCN	SQUARE	UNSPECIFIED	YES	1					CHIP CARRIER, HEAT SINK/SLUG		.5 mm	85 Cel	-40 Cel		QUAD	S-XQCC-N32	3	1.12 mm	4.9 mm		30	260	4.9 mm
ADRF6821ACPZ-RL7	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BICMOS			3.3 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm	105 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	S-XQCC-N56	3	.8 mm	8 mm	e4	30	260	8 mm
ADRF6821ACPZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	YES	1	BICMOS			3.3 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm	105 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	S-XQCC-N56	3	.8 mm	8 mm	e4	30	260	8 mm
AD9172BBPZRL	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BALL	144	FBGA	SQUARE	PLASTIC/EPOXY	YES	1				1 V	GRID ARRAY, FINE PITCH		.8 mm	85 Cel	-40 Cel		BOTTOM	S-PBGA-B144		1.71 mm	10 mm		NOT SPECIFIED	NOT SPECIFIED	10 mm
AD9172BBPZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BALL	144	FBGA	SQUARE	PLASTIC/EPOXY	YES	1				1 V	GRID ARRAY, FINE PITCH		.8 mm	85 Cel	-40 Cel		BOTTOM	S-PBGA-B144		1.71 mm	10 mm		NOT SPECIFIED	NOT SPECIFIED	10 mm
ADRF5044BCCZN	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BUTT	24	HLGA	SQUARE	UNSPECIFIED	YES	1			-3.3 V	3.3 V	GRID ARRAY, HEAT SINK/SLUG		.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	BOTTOM	S-XBGA-B24	3	.96 mm	4 mm	e4	30	260	4 mm
FIDO5100BBCZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BALL	144	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			1.2 V	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA144,12X12,32	.8 mm	85 Cel	-40 Cel		BOTTOM	S-PBGA-B144		1.24 mm	10 mm		NOT SPECIFIED	NOT SPECIFIED	10 mm
FIDO5200BBCZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BALL	144	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			1.2 V	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA144,12X12,32	.8 mm	85 Cel	-40 Cel		BOTTOM	S-PBGA-B144		1.24 mm	10 mm		NOT SPECIFIED	NOT SPECIFIED	10 mm
ADRF5045BCCZN-R7	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BUTT	24	HLGA	SQUARE	UNSPECIFIED	YES	1			-3.3 V	3.3 V	GRID ARRAY, HEAT SINK/SLUG		.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	BOTTOM	S-XBGA-B24	3	.96 mm	4 mm	e4	30	260	4 mm
ADRF5045BCCZN	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BUTT	24	HLGA	SQUARE	UNSPECIFIED	YES	1			-3.3 V	3.3 V	GRID ARRAY, HEAT SINK/SLUG		.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	BOTTOM	S-XBGA-B24	3	.96 mm	4 mm	e4	30	260	4 mm
ADL5335ACPZN-R7	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	1				5 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.65 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	S-XQCC-N16	3	.8 mm	4 mm	e4	30	260	4 mm
ADL5335ACPZN	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	1				5 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.65 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	S-XQCC-N16	3	.8 mm	4 mm	e4	30	260	4 mm
ADRF5044BCCZN-R7	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BUTT	24	HLGA	SQUARE	UNSPECIFIED	YES	1			-3.3 V	3.3 V	GRID ARRAY, HEAT SINK/SLUG		.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	BOTTOM	S-XBGA-B24	3	.96 mm	4 mm	e4	30	260	4 mm
HMC773ALC3BTR-R5	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	12	HVQCCN	SQUARE	UNSPECIFIED	YES	1					CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm	85 Cel	-40 Cel		QUAD	S-XQCC-N12		.9 mm	2.9 mm		NOT SPECIFIED	NOT SPECIFIED	2.9 mm
HMC641ALP4ETR	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	1			-3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm	85 Cel	-40 Cel		QUAD	S-XQCC-N24		.95 mm	4 mm		NOT SPECIFIED	NOT SPECIFIED	4 mm
HMC745LC3TR-R5	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	CERAMIC, METAL-SEALED COFIRED	YES	1				3.3 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm	85 Cel	-40 Cel		QUAD	S-CQCC-N16	3	.9 mm	2.9 mm				2.9 mm
ADAR1000ACCZN-R7	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BUTT	88	HLGA	SQUARE	PLASTIC/EPOXY	YES	1			-5 V	3.3 V	GRID ARRAY, HEAT SINK/SLUG		.5 mm	85 Cel	-40 Cel		BOTTOM	S-PBGA-B88	3	.8 mm	7 mm			260	7 mm
ADAR1000ACCZN	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BUTT	88	HLGA	SQUARE	PLASTIC/EPOXY	YES	1			-5 V	3.3 V	GRID ARRAY, HEAT SINK/SLUG		.5 mm	85 Cel	-40 Cel		BOTTOM	S-PBGA-B88		.8 mm	7 mm		NOT SPECIFIED	NOT SPECIFIED	7 mm
ADRV9009BBCZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1				1.3 V	GRID ARRAY, LOW PROFILE, FINE PITCH		.8 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B196	3	1.27 mm	12 mm	e1		260	12 mm
ADRV9008BBCZ-1	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1				1.3 V	GRID ARRAY, LOW PROFILE, FINE PITCH		.8 mm	85 Cel	-40 Cel		BOTTOM	S-PBGA-B196	3	1.27 mm	12 mm			260	12 mm
ADRV9008BBCZ-2	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1				1.3 V	GRID ARRAY, LOW PROFILE, FINE PITCH		.8 mm	85 Cel	-40 Cel		BOTTOM	S-PBGA-B196	3	1.27 mm	12 mm			260	12 mm
ADF5902WCCPZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1		AEC-Q100		3.3 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm	105 Cel	-40 Cel		QUAD	S-XQCC-N32	3	.8 mm	5 mm			260	5 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.