Analog Devices Other Function Telecom Interface ICs 208

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Nominal Supply Voltage	Package Style (Meter)	Package Equivalence Code	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
ADRV9026BBCZ-REEL	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	4	1 V	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	.8 mm	110 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B289	3	1.46 mm	14 mm	ALSO OPERATES IN 1.3V AND 1.8V NOMINAL VOLTAGE	e1	30	260	14 mm
ADRV9026BBCZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	4	1 V	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	.8 mm	110 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B289	3	1.46 mm	14 mm	ALSO OPERATES IN 1.3V AND 1.8V NOMINAL VOLTAGE	e1	30	260	14 mm
ADCA3990AMLZ	Analog Devices	TELECOM CIRCUIT	OTHER	THROUGH-HOLE	9		RECTANGULAR	UNSPECIFIED	NO	1		FLANGE MOUNT			100 Cel	-30 Cel		SINGLE	R-XSFM-T9						NOT SPECIFIED	NOT SPECIFIED
ADTR1107ACCZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	24	TFLGA	SQUARE	UNSPECIFIED	YES	1	5 V	GRID ARRAY, THIN PROFILE, FINE PITCH	LCC24,.2SQ,25	.65 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	BOTTOM	S-XBGA-N24	3	1.13 mm	5 mm		e4		260	5 mm
ADL5910ACPZN-R7	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	1	3.3 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm	105 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	S-XQCC-N16	3	.8 mm	3 mm		e4	30	260	3 mm
ADF5901ACPZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1	3.3 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	.5 mm	105 Cel	-40 Cel		QUAD	S-XQCC-N32	3	.8 mm	5 mm			30	260	5 mm
HMC8100LP6JETR	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	1	3.3 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20	.5 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	S-XQCC-N40	3	.95 mm	6 mm		e4	30	260	6 mm
ADF5709BEZ	Analog Devices	TELECOM CIRCUIT		NO LEAD	24	QCCN	SQUARE	CERAMIC	YES	1	5 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm	85 Cel	-40 Cel		QUAD	S-CQCC-N24		1.2 mm	3.9 mm					3.9 mm
ADF5709BEZ-R7	Analog Devices	TELECOM CIRCUIT		NO LEAD	24	QCCN	SQUARE	CERAMIC	YES	1	5 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm	85 Cel	-40 Cel		QUAD	S-CQCC-N24		1.2 mm	3.9 mm					3.9 mm
AD9988BBPZRL-4D4AC	Analog Devices	TELECOM CIRCUIT		BALL	324	BGA	SQUARE	PLASTIC/EPOXY	YES	1	1 V	GRID ARRAY, HEAT SINK/SLUG		.8 mm	120 Cel	-40 Cel		BOTTOM	S-PBGA-B324		1.72 mm	15 mm					15 mm
ADRV9002BBCZ-RL	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BALL	196	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1	1 V	GRID ARRAY, THIN PROFILE, FINE PITCH	BGA196,14X14,32	.8 mm	110 Cel	-40 Cel		BOTTOM	S-PBGA-B196	3	1.19 mm	12 mm			30	260	12 mm
ADRV9002BBCZ	Analog Devices	TELECOM CIRCUIT	INDUSTRIAL	BALL	196	TFBGA	SQUARE	PLASTIC/EPOXY	YES	1	1 V	GRID ARRAY, THIN PROFILE, FINE PITCH	BGA196,14X14,32	.8 mm	110 Cel	-40 Cel		BOTTOM	S-PBGA-B196	3	1.19 mm	12 mm			30	260	12 mm
ADRF5519BCPZN	Analog Devices	TELECOM CIRCUIT		NO LEAD	40	QCCN	SQUARE	PLASTIC/EPOXY	YES	1	5 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm	105 Cel	-40 Cel		QUAD	S-PQCC-N40	3	1 mm	6 mm			30	260	6 mm
ADRF5519BCPZN-RL	Analog Devices	TELECOM CIRCUIT		NO LEAD	40	QCCN	SQUARE	PLASTIC/EPOXY	YES	1	5 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm	105 Cel	-40 Cel		QUAD	S-PQCC-N40	3	1 mm	6 mm			30	260	6 mm
ADRV9004BBCZ-RL	Analog Devices	TELECOM CIRCUIT		BALL	196	BGA	SQUARE	PLASTIC/EPOXY	YES	2	1 V	GRID ARRAY		.8 mm	85 Cel	-40 Cel		BOTTOM	S-PBGA-B196	3	1.25 mm	12 mm			30	260	12 mm
ADRV9004BBCZ	Analog Devices	TELECOM CIRCUIT		BALL	196	BGA	SQUARE	PLASTIC/EPOXY	YES	2	1 V	GRID ARRAY		.8 mm	85 Cel	-40 Cel		BOTTOM	S-PBGA-B196	3	1.25 mm	12 mm			30	260	12 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.