Silicon Labs Other Function Telecom Interface ICs 72

Reset All
Part RoHS Manufacturer Telecom IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Applications Surface Mount No. of Functions Output Code No. of Channels Technology Screening Level Nominal Negative Supply Voltage No. of Transceivers Maximum Supply Current Nominal Supply Voltage Hybrid Input Code Power Supplies (V) ISDN Access Rate Package Style (Meter) Package Equivalence Code Sub-Category Carrier Type-3 Terminal Pitch Maximum Operating Temperature Resolution (um) Battery Supply (V) Minimum Output High Voltage Maximum Output Low Voltage Standard Minimum Operating Temperature Maximum Gain Tolerance Terminal Finish Maximum Output Voltage Terminal Position Data Rate JESD-30 Code Reference Point Output (V) Moisture Sensitivity Level (MSL) Maximum Seated Height Linear Coding Carrier Type-2 Carrier Type-1 Width Qualification Maximum Output Low Current Companding Law Input Type Additional Features Battery Feed Maximum Analog Input JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Filter

SI4012-C1001GT

Silicon Labs

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

10

TSSOP

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

.0198 mA

3.3 V

2/3.3

SMALL OUTLINE

TSSOP10,.19,20

Other Telecom ICs

.5 mm

85 Cel

-40 Cel

DUAL

S-PDSO-G10

1.1 mm

3 mm

Not Qualified

NOT SPECIFIED

NOT SPECIFIED

3 mm

SI4431-B1-FMR

Silicon Labs

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

20

HVQCCN

SQUARE

UNSPECIFIED

YES

1

3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

QUAD

S-XQCC-N20

.9 mm

4 mm

Not Qualified

NOT SPECIFIED

NOT SPECIFIED

4 mm

SI4010-C2-GT

Silicon Labs

TELECOM CIRCUIT

INDUSTRIAL

GULL WING

10

TSSOP

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

3.3 V

SMALL OUTLINE

.5 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

S-PDSO-G10

2

1.1 mm

3 mm

Not Qualified

e4

40

260

3 mm

SI4313-B1-FMR

Silicon Labs

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

20

HVQCCN

SQUARE

UNSPECIFIED

YES

1

3.3 V

CHIP CARRIER

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-XQCC-N20

1

.9 mm

4 mm

Not Qualified

e3

40

260

4 mm

SI4313-B1-FM

Silicon Labs

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

20

HVQCCN

SQUARE

UNSPECIFIED

YES

1

3.3 V

CHIP CARRIER

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-XQCC-N20

1

.9 mm

4 mm

Not Qualified

e3

40

260

4 mm

SI4311-B21-GM

Silicon Labs

TELECOM CIRCUIT

INDUSTRIAL

HVQCCN

1

CMOS

3.3 V

.5 mm

85 Cel

-40 Cel

.9 mm

3 mm

3 mm

SI4330-B1-FMR

Silicon Labs

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

20

HVQCCN

SQUARE

UNSPECIFIED

YES

1

3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-XQCC-N20

1

.9 mm

4 mm

Not Qualified

e3

40

260

4 mm

SI4735-B20-GMR

Silicon Labs

TELECOM CIRCUIT

OTHER

NO LEAD

20

HVQCCN

SQUARE

UNSPECIFIED

YES

1

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-20 Cel

QUAD

S-XQCC-N20

.6 mm

3 mm

Not Qualified

NOT SPECIFIED

NOT SPECIFIED

3 mm

EFR32BG13P532F512GM32-D

Silicon Labs

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

32

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC32,.2SQ,20

.5 mm

85 Cel

-40 Cel

QUAD

S-XQCC-N32

3

.9 mm

5 mm

40

260

5 mm

EFR32BG13P632F512GM32-D

Silicon Labs

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

32

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC32,.2SQ,20

.5 mm

85 Cel

-40 Cel

QUAD

S-XQCC-N32

3

.9 mm

5 mm

40

260

5 mm

MGM210P032JIA2

Silicon Labs

TELECOM CIRCUIT

WF111-E-V1-ETSI

Silicon Labs

TELECOM CIRCUIT

WT41-E-AI4

Silicon Labs

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

57

RECTANGULAR

UNSPECIFIED

YES

1

3.3 V

MICROELECTRONIC ASSEMBLY

1.5 mm

85 Cel

-40 Cel

QUAD

R-XQMA-N57

3.35 mm

14.5 mm

NOT SPECIFIED

NOT SPECIFIED

35.55 mm

WF111-E-V1

Silicon Labs

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

33

QMA

RECTANGULAR

UNSPECIFIED

YES

1

1.5 V

MICROELECTRONIC ASSEMBLY

1.27 mm

85 Cel

-40 Cel

QUAD

72.2 Mbps

R-XQMA-N33

3

2.3 mm

12 mm

40

260

19 mm

SI21822-B60-GM/R

Silicon Labs

TELECOM CIRCUIT

COMMERCIAL EXTENDED

NO LEAD

68

HQCCN

SQUARE

UNSPECIFIED

YES

1

1.2 V

CHIP CARRIER, HEAT SINK/SLUG

75 Cel

-10 Cel

QUAD

S-XQCC-N68

WT41-A-AI4

Silicon Labs

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

59

RECTANGULAR

UNSPECIFIED

YES

1

3.3 V

MICROELECTRONIC ASSEMBLY

1.5 mm

85 Cel

-40 Cel

QUAD

R-XQMA-N59

5.65 mm

14.5 mm

NOT SPECIFIED

NOT SPECIFIED

35.55 mm

WGM110A1MV2R

Silicon Labs

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

40

RECTANGULAR

UNSPECIFIED

YES

1

3.3 V

MICROELECTRONIC ASSEMBLY

1.25 mm

85 Cel

-40 Cel

UNSPECIFIED

R-XXMA-N40

2.1 mm

14.4 mm

21 mm

WGM110A1MV2

Silicon Labs

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

40

RECTANGULAR

UNSPECIFIED

YES

1

3.3 V

MICROELECTRONIC ASSEMBLY

1.25 mm

85 Cel

-40 Cel

UNSPECIFIED

R-XXMA-N40

2.1 mm

14.4 mm

21 mm

BGM113A256V1

Silicon Labs

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

36

RECTANGULAR

UNSPECIFIED

YES

1

3.3 V

MICROELECTRONIC ASSEMBLY

.8 mm

85 Cel

-40 Cel

UNSPECIFIED

R-XXMA-N36

2.09 mm

9.15 mm

15.73 mm

WT11I-A-AI4

Silicon Labs

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

28

RECTANGULAR

UNSPECIFIED

NO

1

3.3 V

MICROELECTRONIC ASSEMBLY

1.5 mm

85 Cel

-40 Cel

DUAL

R-XDMA-N28

2.86 mm

14.5 mm

35.75 mm

WT11I-E-AI5

Silicon Labs

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

28

RECTANGULAR

UNSPECIFIED

NO

1

3.3 V

MICROELECTRONIC ASSEMBLY

1.5 mm

85 Cel

-40 Cel

DUAL

R-XDMA-N28

2.86 mm

14.5 mm

35.75 mm

WT41-A-AI5

Silicon Labs

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

59

RECTANGULAR

UNSPECIFIED

YES

1

3.3 V

MICROELECTRONIC ASSEMBLY

1.5 mm

85 Cel

-40 Cel

UNSPECIFIED

R-XXMA-N59

5.65 mm

14 mm

35.3 mm

BLE112-A-V1

Silicon Labs

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

31

RECTANGULAR

UNSPECIFIED

YES

1

MICROELECTRONIC ASSEMBLY

1.25 mm

85 Cel

-40 Cel

UNSPECIFIED

R-XXMA-N31

2.3 mm

12.05 mm

18.1 mm

BLE112-E-V1

Silicon Labs

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

31

RECTANGULAR

UNSPECIFIED

YES

1

MICROELECTRONIC ASSEMBLY

1.25 mm

85 Cel

-40 Cel

UNSPECIFIED

R-XXMA-N31

2.3 mm

12.05 mm

18.1 mm

BLE113-A-M256K

Silicon Labs

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

36

XMA

RECTANGULAR

UNSPECIFIED

YES

1

3 V

MICROELECTRONIC ASSEMBLY

.8 mm

85 Cel

-40 Cel

UNSPECIFIED

2 Mbps

R-XXMA-N36

2 mm

9.15 mm

15.73 mm

BLE121LR-A-M256K

Silicon Labs

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

36

RECTANGULAR

UNSPECIFIED

YES

1

3 V

MICROELECTRONIC ASSEMBLY

.9 mm

85 Cel

-40 Cel

UNSPECIFIED

R-XXMA-N36

1.8 mm

13 mm

14.7 mm

BT111-A-HCI

Silicon Labs

TELECOM CIRCUIT

OTHER

NO LEAD

21

RECTANGULAR

UNSPECIFIED

YES

1

MICROELECTRONIC ASSEMBLY

1.1 mm

85 Cel

-30 Cel

UNSPECIFIED

R-XXMA-N21

2.31 mm

9.3 mm

13.05 mm

BT121-A-V1

Silicon Labs

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

33

RECTANGULAR

UNSPECIFIED

YES

1

3.3 V

MICROELECTRONIC ASSEMBLY

1 mm

85 Cel

-40 Cel

UNSPECIFIED

R-XXMA-N33

2.1 mm

11 mm

13.9 mm

BT121-A-V2

Silicon Labs

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

33

RECTANGULAR

UNSPECIFIED

YES

1

3.3 V

MICROELECTRONIC ASSEMBLY

1 mm

85 Cel

-40 Cel

UNSPECIFIED

R-XXMA-N33

2.1 mm

11 mm

13.9 mm

WT12-A-AI4

Silicon Labs

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

31

RECTANGULAR

UNSPECIFIED

YES

1

3.3 V

MICROELECTRONIC ASSEMBLY

1.5 mm

85 Cel

-40 Cel

UNSPECIFIED

R-XXMA-N31

2.6 mm

14 mm

NOT SPECIFIED

NOT SPECIFIED

25.6 mm

WT12-A-AI5

Silicon Labs

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

31

XMA

RECTANGULAR

UNSPECIFIED

YES

1

3.3 V

MICROELECTRONIC ASSEMBLY

85 Cel

-40 Cel

UNSPECIFIED

2.1781 Mbps

R-XXMA-N31

2.6 mm

14 mm

NOT SPECIFIED

NOT SPECIFIED

25.6 mm

WT12-A-HCI21

Silicon Labs

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

31

RECTANGULAR

UNSPECIFIED

YES

1

3.3 V

MICROELECTRONIC ASSEMBLY

1.5 mm

85 Cel

-40 Cel

UNSPECIFIED

R-XXMA-N31

2.6 mm

14 mm

NOT SPECIFIED

NOT SPECIFIED

25.6 mm

EFR32BG1B232F256GM48-C0

Silicon Labs

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

48

HVQCCN

SQUARE

UNSPECIFIED

YES

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

QUAD

S-XQCC-N48

.9 mm

7 mm

7 mm

EFR32BG1V132F256GM32-C0

Silicon Labs

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

32

HVQCCN

SQUARE

UNSPECIFIED

YES

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-XQCC-N32

2

.9 mm

5 mm

e3

40

260

5 mm

WT32I-A-AI6-APTX

Silicon Labs

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

50

RECTANGULAR

UNSPECIFIED

YES

1

MICROELECTRONIC ASSEMBLY

1 mm

85 Cel

-40 Cel

UNSPECIFIED

R-XXMA-N50

3

2.55 mm

15.9 mm

40

260

23.9 mm

WT32I-A-AI6IAP

Silicon Labs

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

50

RECTANGULAR

UNSPECIFIED

YES

1

MICROELECTRONIC ASSEMBLY

1 mm

85 Cel

-40 Cel

UNSPECIFIED

R-XXMA-N50

2.55 mm

15.9 mm

NOT SPECIFIED

NOT SPECIFIED

23.9 mm

WT32I-A-AI6

Silicon Labs

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

50

RECTANGULAR

UNSPECIFIED

YES

1

MICROELECTRONIC ASSEMBLY

1 mm

85 Cel

-40 Cel

UNSPECIFIED

R-XXMA-N50

2.55 mm

15.9 mm

NOT SPECIFIED

NOT SPECIFIED

23.9 mm

WT32I-E-AI6-APTX

Silicon Labs

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

50

RECTANGULAR

UNSPECIFIED

YES

1

MICROELECTRONIC ASSEMBLY

1 mm

85 Cel

-40 Cel

UNSPECIFIED

R-XXMA-N50

2.55 mm

15.9 mm

23.9 mm

WT32I-E-AI6IAP

Silicon Labs

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

50

RECTANGULAR

UNSPECIFIED

YES

1

MICROELECTRONIC ASSEMBLY

1 mm

85 Cel

-40 Cel

UNSPECIFIED

R-XXMA-N50

2.55 mm

15.9 mm

23.9 mm

WT32I-E-AI6

Silicon Labs

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

50

RECTANGULAR

UNSPECIFIED

YES

1

MICROELECTRONIC ASSEMBLY

1 mm

85 Cel

-40 Cel

UNSPECIFIED

R-XXMA-N50

2.55 mm

15.9 mm

23.9 mm

BGM121A256V1R

Silicon Labs

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

56

SQUARE

UNSPECIFIED

YES

1

3.3 V

MICROELECTRONIC ASSEMBLY

85 Cel

-40 Cel

UNSPECIFIED

S-XXMA-N56

1.4 mm

6.5 mm

6.5 mm

BGM121A256V1

Silicon Labs

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

56

SQUARE

UNSPECIFIED

YES

1

3.3 V

MICROELECTRONIC ASSEMBLY

85 Cel

-40 Cel

UNSPECIFIED

S-XXMA-N56

1.4 mm

6.5 mm

6.5 mm

BGM123N256V2

Silicon Labs

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

56

SQUARE

UNSPECIFIED

YES

1

3.3 V

MICROELECTRONIC ASSEMBLY

85 Cel

-40 Cel

UNSPECIFIED

S-XXMA-N56

3

1.4 mm

6.5 mm

40

260

6.5 mm

ETRX2-PA

Silicon Labs

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

38

RECTANGULAR

UNSPECIFIED

YES

1

3 V

MICROELECTRONIC ASSEMBLY

2.54 mm

85 Cel

-40 Cel

UNSPECIFIED

R-XXMA-N38

20.5 mm

37.5 mm

ETRX2

Silicon Labs

TELECOM CIRCUIT

INDUSTRIAL

NO LEAD

38

RECTANGULAR

UNSPECIFIED

YES

1

3 V

MICROELECTRONIC ASSEMBLY

2.54 mm

85 Cel

-40 Cel

UNSPECIFIED

R-XXMA-N38

20.5 mm

37.5 mm

EFR32BG1B232F256GJ43-C0

Silicon Labs

TELECOM CIRCUIT

INDUSTRIAL

BALL

43

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

3.3 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

85 Cel

-40 Cel

BOTTOM

R-PBGA-B43

.54 mm

3.143 mm

3.295 mm

EFR32BG1P332F256GJ43-C0

Silicon Labs

TELECOM CIRCUIT

INDUSTRIAL

BALL

43

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

3.3 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B43

1

.54 mm

3.143 mm

e1

40

260

3.295 mm

EFR32BG1V132F256GJ43-C0

Silicon Labs

TELECOM CIRCUIT

INDUSTRIAL

BALL

43

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

3.3 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

85 Cel

-40 Cel

BOTTOM

R-PBGA-B43

.54 mm

3.143 mm

3.295 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.