Silicon Labs Other Function Telecom Interface ICs 72

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Nominal Supply Voltage	Package Style (Meter)	Package Equivalence Code	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Data Rate	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
EFR32BG1B132F256GM32-C0R	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	1		3.3 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm	85 Cel	-40 Cel	Matte Tin (Sn)	QUAD		S-XQCC-N32	2	.9 mm	5 mm		e3	NOT SPECIFIED	260	5 mm
BGM111E256V2	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	BUTT	31		RECTANGULAR	UNSPECIFIED	YES	1		3.3 V	MICROELECTRONIC ASSEMBLY		1.2 mm	85 Cel	-40 Cel		UNSPECIFIED		R-XXMA-B31		2.15 mm	12.9 mm					15 mm
MGM111A256V1	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	31	XMA	RECTANGULAR	UNSPECIFIED	YES	1		3.3 V	MICROELECTRONIC ASSEMBLY		1.2 mm	85 Cel	-40 Cel		UNSPECIFIED	.25 Mbps	R-XXMA-N31		2.1 mm	12.9 mm					15 mm
BGM111A256V21	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	31		RECTANGULAR	UNSPECIFIED	YES			3.3 V	MICROELECTRONIC ASSEMBLY		1.2 mm	85 Cel	-40 Cel		UNSPECIFIED		R-XXMA-N31		2.2 mm	12.9 mm					15 mm
AMW037	Silicon Labs	TELECOM CIRCUIT		NO LEAD	44	QMA	RECTANGULAR	UNSPECIFIED	YES	1		3.3 V	MICROELECTRONIC ASSEMBLY		1.27 mm	85 Cel	-40 Cel		UNSPECIFIED	54 Mbps	R-XQMA-N44		2.72 mm	16.51 mm					24.77 mm
SI4060-B1B-FM	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	UNSPECIFIED	YES	1		3.3 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD		S-XQCC-N20	1	.9 mm	4 mm		e3	40	260	4 mm
EFR32BG12P432F1024GM48-C	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	1		3.3 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.27SQ,20	.5 mm	85 Cel	-40 Cel		QUAD	2 Mbps	S-XQCC-N48		.9 mm	7 mm					7 mm
MGM12P02F1024GA-V4R	Silicon Labs	TELECOM CIRCUIT		UNSPECIFIED		XMA	RECTANGULAR	UNSPECIFIED	NO	1		3.3 V	SPECIAL SHAPE			85 Cel	-40 Cel		UNSPECIFIED	1 Mbps	R-XXMA-X			12.9 mm					17.8 mm
MGM12P02F1024GA-V4	Silicon Labs	TELECOM CIRCUIT		UNSPECIFIED		XMA	RECTANGULAR	UNSPECIFIED	NO	1		3.3 V	SPECIAL SHAPE			85 Cel	-40 Cel		UNSPECIFIED	1 Mbps	R-XXMA-X			12.9 mm					17.8 mm
MGM12P02F1024GE-V4	Silicon Labs	TELECOM CIRCUIT		UNSPECIFIED		XMA	RECTANGULAR	UNSPECIFIED	NO	1		3.3 V	SPECIAL SHAPE			85 Cel	-40 Cel		UNSPECIFIED	1 Mbps	R-XXMA-X			12.9 mm					17.8 mm
MGM12P22F1024GA-V4	Silicon Labs	TELECOM CIRCUIT		UNSPECIFIED		XMA	RECTANGULAR	UNSPECIFIED	NO	1		3.3 V	SPECIAL SHAPE			85 Cel	-40 Cel		UNSPECIFIED	1 Mbps	R-XXMA-X			12.9 mm					17.8 mm
MGM12P32F1024GA-V4R	Silicon Labs	TELECOM CIRCUIT		UNSPECIFIED		XMA	RECTANGULAR	UNSPECIFIED	NO	1		3.3 V	SPECIAL SHAPE			85 Cel	-40 Cel		UNSPECIFIED	1 Mbps	R-XXMA-X			12.9 mm					17.8 mm
MGM12P32F1024GA-V4	Silicon Labs	TELECOM CIRCUIT		UNSPECIFIED		XMA	RECTANGULAR	UNSPECIFIED	NO	1		3.3 V	SPECIAL SHAPE			85 Cel	-40 Cel		UNSPECIFIED	1 Mbps	R-XXMA-X			12.9 mm					17.8 mm
MGM12P32F1024GE-V4R	Silicon Labs	TELECOM CIRCUIT		UNSPECIFIED		XMA	RECTANGULAR	UNSPECIFIED	NO	1		3.3 V	SPECIAL SHAPE			85 Cel	-40 Cel		UNSPECIFIED	1 Mbps	R-XXMA-X			12.9 mm					17.8 mm
MGM12P32F1024GE-V4	Silicon Labs	TELECOM CIRCUIT		UNSPECIFIED		XMA	RECTANGULAR	UNSPECIFIED	NO	1		3.3 V	SPECIAL SHAPE			85 Cel	-40 Cel		UNSPECIFIED	1 Mbps	R-XXMA-X			12.9 mm					17.8 mm
MGM210P022JIA2	Silicon Labs	TELECOM CIRCUIT
WFM200SS22XNA2	Silicon Labs	TELECOM CIRCUIT		NO LEAD	52	LGA	SQUARE	UNSPECIFIED	YES	1		1.8 V	GRID ARRAY	LGA52(UNSPEC)	.5 mm	105 Cel	-40 Cel		BOTTOM	72.2 Mbps	S-XLGA-N52	3	1.4 mm	6.5 mm			40	260	6.5 mm
BGM113A256V21	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	36		RECTANGULAR	UNSPECIFIED	YES	1		3.3 V	MICROELECTRONIC ASSEMBLY		.8 mm	85 Cel	-40 Cel		UNSPECIFIED				2 mm	9.15 mm					15.73 mm
WT12-A-AI3	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	31	XMA	RECTANGULAR	UNSPECIFIED	YES	1	CMOS	3.3 V	MICROELECTRONIC ASSEMBLY		1.5 mm	85 Cel	-40 Cel		UNSPECIFIED	3 Mbps	R-XXMA-N31		2.6 mm	14 mm					25 mm
RS9116N-SB00-QMS-B00	Silicon Labs	TELECOM CIRCUIT																MATTE TIN				3				e3	40	260
BLE113-A-V1	Silicon Labs	TELECOM CIRCUIT	INDUSTRIAL	NO LEAD	36	XMA	RECTANGULAR	UNSPECIFIED	YES	1			MICROELECTRONIC ASSEMBLY		.8 mm	85 Cel	-40 Cel		UNSPECIFIED		R-XXMA-N36	3	2.09 mm	9.15 mm	Operates from 2V to 3.6V supply		40	260	15.725 mm
ZM3102AU-CME1R	Silicon Labs	TELECOM CIRCUIT		NO LEAD	18	XMA	RECTANGULAR	UNSPECIFIED	YES	1			MICROELECTRONIC ASSEMBLY						UNSPECIFIED	.04 Mbps	R-XXMA-N18
ZM3102AE-CME1	Silicon Labs	TELECOM CIRCUIT		NO LEAD	18	XMA	RECTANGULAR	UNSPECIFIED	YES	1			MICROELECTRONIC ASSEMBLY						UNSPECIFIED	.04 Mbps	R-XXMA-N18
WT11U-A-AI4	Silicon Labs	TELECOM CIRCUIT		NO LEAD	28	DMA	RECTANGULAR	UNSPECIFIED	NO	1	CMOS	3.3 V	MICROELECTRONIC ASSEMBLY		1.5 mm	85 Cel	-40 Cel		DUAL	3 Mbps	R-XDMA-N28		2.7 mm	14.5 mm					35.75 mm

Other Function Telecom Interface ICs

Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.

Some common types of Other Function Telecom Interface ICs include:

1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.

2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.

4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.