Ball Analog-to-Digital Converters 169

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Part RoHS Manufacturer Converter Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material No. of Analog In Channels Surface Mount Maximum Supply Voltage Maximum Analog Input Voltage Sample Rate No. of Functions Technology Screening Level Nominal Bandwidth No. of Bits Maximum Supply Current Maximum Linearity Error (EL) Nominal Supply Voltage Output Bit Code Power Supplies (V) Nominal Negative Supply Voltage Package Style (Meter) Package Equivalence Code Sub-Category Minimum Supply Voltage Terminal Pitch Maximum Operating Temperature Minimum Analog Input Voltage Output Format Minimum Operating Temperature Terminal Finish Sample and Hold/Track and Hold Terminal Position Maximum Conversion Time JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Input Bit Code

DDC232CZXGT

Texas Instruments

Analog To Digital Converter, Delta-Sigma

Commercial

Ball

64

LFBGA

Square

Plastic/Epoxy

32

Yes

5.25 V

3.125 kHz

1

20

0.05 %

5 V

Binary, Offset Binary

3,5 V

Grid Array, Low Profile, Fine Pitch

BGA64,8X8,32

Analog to Digital Converters

0.031 in (0.8 mm)

70 °C (158 °F)

Serial

0 °C (32 °F)

Tin/Silver/Copper

Bottom

S-PBGA-B64

3

0.057 in (1.45 mm)

0.315 in (8 mm)

No

e1

260 °C (500 °F)

0.315 in (8 mm)

DDC264CKZAWR

Texas Instruments

Analog To Digital Converter, Delta-Sigma

Commercial

Ball

100

LFBGA

Square

Plastic/Epoxy

64

Yes

1

20

0.00015 %

5 V

Offset Binary

3,5 V

Grid Array, Low Profile, Fine Pitch

BGA100,10X10,32

Analog to Digital Converters

0.031 in (0.8 mm)

70 °C (158 °F)

Serial

0 °C (32 °F)

Tin Silver Copper

Sample

Bottom

S-PBGA-B100

3

0.059 in (1.5 mm)

0.354 in (9 mm)

No

e1

30 s

260 °C (500 °F)

0.354 in (9 mm)

DDC264CKZAW

Texas Instruments

Analog To Digital Converter, Delta-Sigma

Commercial

Ball

100

LFBGA

Square

Plastic/Epoxy

64

Yes

1

20

0.00015 %

5 V

Offset Binary

3,5 V

Grid Array, Low Profile, Fine Pitch

BGA100,10X10,32

Analog to Digital Converters

0.031 in (0.8 mm)

70 °C (158 °F)

Serial

0 °C (32 °F)

Tin Silver Copper

Sample

Bottom

S-PBGA-B100

3

0.059 in (1.5 mm)

0.354 in (9 mm)

No

e1

30 s

260 °C (500 °F)

0.354 in (9 mm)

ADS5120CZHK

Texas Instruments

Analog To Digital Converter, Proprietary Method

Commercial

Ball

257

LFBGA

Square

Plastic/Epoxy

8

Yes

1.4 V

40 MHz

1

CMOS

10

340 mA

0.1465 %

1.8 V

Offset Binary

1.8,3.3 V

Grid Array, Low Profile, Fine Pitch

BGA257,19X19,32

Analog to Digital Converters

0.031 in (0.8 mm)

70 °C (158 °F)

650 mV

Parallel, Word

0 °C (32 °F)

Tin Silver Copper

Track

Bottom

1 µs

S-PBGA-B257

3

0.055 in (1.4 mm)

0.63 in (16 mm)

No

e1

30 s

260 °C (500 °F)

0.63 in (16 mm)

ADS5121IZHK

Texas Instruments

Analog To Digital Converter, Proprietary Method

Industrial

Ball

257

LFBGA

Square

Plastic/Epoxy

8

Yes

1.42 V

40 MHz

1

CMOS

10

255 mA

0.1465 %

1.8 V

Offset Binary

1.8,3.3 V

Grid Array, Low Profile, Fine Pitch

BGA257,19X19,32

Analog to Digital Converters

0.031 in (0.8 mm)

85 °C (185 °F)

760 mV

Parallel, Word

-40 °C (-40 °F)

Tin Silver Copper

Track

Bottom

200 ns

S-PBGA-B257

3

0.055 in (1.4 mm)

0.63 in (16 mm)

No

e1

30 s

260 °C (500 °F)

0.63 in (16 mm)

ADC12DJ3200ZEG

Texas Instruments

Analog To Digital Converter, Proprietary Method

Industrial

Ball

144

FBGA

Square

Plastic/Epoxy

1

Yes

1.04 V

6400 MHz

1

12

1.1 V

Offset Binary, 2's Complement Binary

Grid Array, Fine Pitch

0.031 in (0.8 mm)

85 °C (185 °F)

-500 mV

Serial, Parallel, Word

-40 °C (-40 °F)

Tin/Lead

Bottom

S-PBGA-B144

3

0.076 in (1.94 mm)

0.394 in (10 mm)

Peak-to-peak input voltage range: 0.8 V

e0

20 s

235 °C (455 °F)

0.394 in (10 mm)

ADC12DJ5200RFAAVT

Texas Instruments

Analog To Digital Converter, Proprietary Method

Industrial

Ball

144

FBGA

Square

Plastic/Epoxy

2

Yes

1.04 V

5200 MHz

1

12

1.1 V

Offset Binary, 2's Complement Binary

Grid Array, Fine Pitch

0.031 in (0.8 mm)

85 °C (185 °F)

-1.04 V

Serial

-40 °C (-40 °F)

Tin Silver Copper

Track

Bottom

S-PBGA-B144

3

0.076 in (1.94 mm)

0.394 in (10 mm)

Peak-to-peak input voltage range: 0.825 V

e1

30 s

260 °C (500 °F)

0.394 in (10 mm)

AD9213BBPZ-10G

Analog Devices

Analog To Digital Converter, Proprietary Method

Other

Ball

192

HBGA

Square

Plastic/Epoxy

1

Yes

1.4 V

10250 MHz

1

12

0.1514 %

1 V

Offset Binary, 2's Complement Binary, Gray Code

Grid Array, Heat Sink/Slug

0.031 in (0.8 mm)

115 °C (239 °F)

-1.4 V

Parallel, Word

-20 °C (-4 °F)

Bottom

0.4 ns

S-PBGA-B192

0.067 in (1.71 mm)

0.472 in (12 mm)

0.472 in (12 mm)

MCP37D31-200E/TE

Microchip Technology

Analog To Digital Converter, Flash Method

Automotive

Ball

121

TFBGA

Square

Plastic/Epoxy

8

Yes

4.46 V

200 MHz

1

AEC-Q100

16

300 mA

1.2 V

Offset Binary, 2's Complement Binary

Grid Array, Thin Profile, Fine Pitch

BGA121,11X11,25

0.026 in (0.65 mm)

125 °C (257 °F)

-4.46 V

Serial, Parallel, Word

-40 °C (-40 °F)

Sample

Bottom

25 ns

S-PBGA-B121

0.043 in (1.08 mm)

0.315 in (8 mm)

0.315 in (8 mm)

AD9083BBCZ

Analog Devices

Analog To Digital Converter, Flash Method

Industrial

Ball

100

LFBGA

Square

Plastic/Epoxy

16

Yes

2 V

2000 MHz

1

16

471 mA

1 V

Offset Binary, 2's Complement Binary, Gray Code

Grid Array, Low Profile, Fine Pitch

BGA100,10X10,32

0.031 in (0.8 mm)

115 °C (239 °F)

-2 V

Serial

-40 °C (-40 °F)

Bottom

S-PBGA-B100

3

0.055 in (1.4 mm)

0.354 in (9 mm)

30 s

260 °C (500 °F)

0.354 in (9 mm)

AD9083BBCZ-RL7

Analog Devices

Analog To Digital Converter, Flash Method

Industrial

Ball

100

LFBGA

Square

Plastic/Epoxy

16

Yes

2 V

2000 MHz

1

16

471 mA

1 V

Offset Binary, 2's Complement Binary, Gray Code

Grid Array, Low Profile, Fine Pitch

BGA100,10X10,32

0.031 in (0.8 mm)

115 °C (239 °F)

-2 V

Serial

-40 °C (-40 °F)

Bottom

S-PBGA-B100

3

0.055 in (1.4 mm)

0.354 in (9 mm)

30 s

260 °C (500 °F)

0.354 in (9 mm)

AD4030-24BBCZ

Analog Devices

Analog To Digital Converter, Successive Approximation

Ball

64

FBGA

Square

Plastic/Epoxy

1

Yes

5.07 V

2 MHz

1

24

11.2 mA

0.00009 %

1.8 V

Binary

Grid Array, Fine Pitch

BGA64,8X8,32

0.031 in (0.8 mm)

125 °C (257 °F)

-5.07 V

Serial

-40 °C (-40 °F)

Track

Bottom

300 ns

S-PBGA-B64

0.076 in (1.92 mm)

0.276 in (7 mm)

0.276 in (7 mm)

AD4030-24BBCZ-RL

Analog Devices

Analog To Digital Converter, Successive Approximation

Ball

64

FBGA

Square

Plastic/Epoxy

1

Yes

5.07 V

2 MHz

1

24

11.2 mA

0.00009 %

1.8 V

Binary

Grid Array, Fine Pitch

BGA64,8X8,32

0.031 in (0.8 mm)

125 °C (257 °F)

-5.07 V

Serial

-40 °C (-40 °F)

Track

Bottom

300 ns

S-PBGA-B64

0.076 in (1.92 mm)

0.276 in (7 mm)

0.276 in (7 mm)

AD4695BCBZ-RL7

Analog Devices

Analog To Digital Converter, Successive Approximation

Ball

32

VFBGA

Square

Plastic/Epoxy

16

Yes

5.75 V

500 kHz

1

16

0.003814697 %

5 V

Binary, 2's Complement Binary

Grid Array, Very Thin Profile, Fine Pitch

BGA36,6X6,20

0.02 in (0.5 mm)

125 °C (257 °F)

0 mV

Parallel, Word

-40 °C (-40 °F)

Bottom

415 ns

S-PBGA-B36

0.022 in (0.56 mm)

0.117 in (2.96 mm)

0.117 in (2.96 mm)

ADS52J90ZZE

Texas Instruments

Analog To Digital Converter, Proprietary Method

Industrial

Ball

198

LFBGA

Rectangular

Plastic/Epoxy

16

Yes

2 V

65 MHz

1

14

0.0183 %

1.8 V

2's Complement Binary

Grid Array, Low Profile, Fine Pitch

0.031 in (0.8 mm)

85 °C (185 °F)

-2 V

Serial

-40 °C (-40 °F)

Tin Silver Copper

Bottom

15 ns

R-PBGA-B198

3

0.055 in (1.4 mm)

0.354 in (9 mm)

Peak-to-peak input voltage range: 2 V

e1

30 s

260 °C (500 °F)

0.591 in (15 mm)

AD9684BBPZ-500

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

Ball

196

LFBGA

Square

Plastic/Epoxy

2

Yes

2.06 V

1250 MHz

1

14

0.0305 %

1.25 V

Offset Binary, 2's Complement Binary, Gray Code

Grid Array, Low Profile, Fine Pitch

0.031 in (0.8 mm)

85 °C (185 °F)

-2.06 V

Serial, Parallel, Word

-40 °C (-40 °F)

Sample

Bottom

S-PBGA-B196

3

0.059 in (1.49 mm)

0.472 in (12 mm)

30 s

260 °C (500 °F)

0.472 in (12 mm)

AD9684BBPZRL7-500

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

Ball

196

LFBGA

Square

Plastic/Epoxy

2

Yes

2.06 V

1250 MHz

1

14

0.0305 %

1.25 V

Offset Binary, 2's Complement Binary, Gray Code

Grid Array, Low Profile, Fine Pitch

0.031 in (0.8 mm)

85 °C (185 °F)

-2.06 V

Serial, Parallel, Word

-40 °C (-40 °F)

Sample

Bottom

S-PBGA-B196

3

0.059 in (1.49 mm)

0.472 in (12 mm)

30 s

260 °C (500 °F)

0.472 in (12 mm)

DDC1128ZKLR

Texas Instruments

Analog To Digital Converter, Proprietary Method

Commercial

Ball

192

LFBGA

Square

Plastic/Epoxy

128

Yes

6 kHz

1

20

5 V

Binary

Grid Array, Low Profile, Fine Pitch

0.02 in (0.5 mm)

70 °C (158 °F)

Serial

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B192

3

0.055 in (1.4 mm)

0.354 in (9 mm)

e1

30 s

260 °C (500 °F)

0.354 in (9 mm)

DDC1128ZKLT

Texas Instruments

Analog To Digital Converter, Proprietary Method

Commercial

Ball

192

LFBGA

Square

Plastic/Epoxy

128

Yes

6 kHz

1

20

5 V

Binary

Grid Array, Low Profile, Fine Pitch

0.02 in (0.5 mm)

70 °C (158 °F)

Serial

0 °C (32 °F)

Tin Silver Copper

Bottom

S-PBGA-B192

3

0.055 in (1.4 mm)

0.354 in (9 mm)

e1

30 s

260 °C (500 °F)

0.354 in (9 mm)

DDC2256AZZF

Texas Instruments

Analog To Digital Converter, Delta-Sigma

Commercial

Ball

323

LFBGA

Rectangular

Plastic/Epoxy

256

Yes

2.5 V

17 kHz

1

24

Binary

Grid Array, Low Profile, Fine Pitch

0.031 in (0.8 mm)

70 °C (158 °F)

-2.5 V

Parallel

0 °C (32 °F)

Tin Silver Copper

Bottom

R-PBGA-B323

3

0.065 in (1.66 mm)

0.551 in (14 mm)

e1

30 s

260 °C (500 °F)

0.63 in (16 mm)

DDC316CZXGR

Texas Instruments

Analog To Digital Converter, Proprietary Method

Commercial

Ball

64

LFBGA

Square

Plastic/Epoxy

16

Yes

100 kHz

1

16

0.0244 %

5 V

Binary, Offset Binary

Grid Array, Low Profile, Fine Pitch

0.031 in (0.8 mm)

70 °C (158 °F)

Serial, Parallel, Word

0 °C (32 °F)

Tin/Silver/Copper

Bottom

S-PBGA-B64

3

0.057 in (1.45 mm)

0.315 in (8 mm)

e1

30 s

260 °C (500 °F)

0.315 in (8 mm)

ADC12D2000RFIUT/NOPB

Texas Instruments

Analog To Digital Converter, Proprietary Method

Industrial

Ball

292

HBGA

Square

Plastic/Epoxy

2

Yes

860 mV

4000 MHz

1

12

2 V

Offset Binary, 2's Complement Binary

Grid Array, Heat Sink/Slug

0.05 in (1.27 mm)

85 °C (185 °F)

-860 mV

Serial, Parallel, Word

-40 °C (-40 °F)

Tin Silver

Track

Bottom

S-PBGA-B292

3

0.102 in (2.58 mm)

1.063 in (27 mm)

e2

30 s

250 °C (482 °F)

1.063 in (27 mm)

ADC12D2000RFIUT

Texas Instruments

Analog To Digital Converter, Proprietary Method

Industrial

Ball

292

HBGA

Square

Plastic/Epoxy

2

Yes

860 mV

4000 MHz

1

12

2 V

Offset Binary, 2's Complement Binary

Grid Array, Heat Sink/Slug

0.05 in (1.27 mm)

85 °C (185 °F)

-860 mV

Serial, Parallel, Word

-40 °C (-40 °F)

Track

Bottom

S-PBGA-B292

3

0.102 in (2.58 mm)

1.063 in (27 mm)

20 s

220 °C (428 °F)

1.063 in (27 mm)

AD9208BBPZ-3000

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

Ball

196

HBGA

Square

Plastic/Epoxy

4

Yes

1.7 V

3000 MHz

1

14

0.1282 %

975 mV

Offset Binary, 2's Complement Binary

Grid Array, Heat Sink/Slug

0.031 in (0.8 mm)

85 °C (185 °F)

-1.7 V

Serial

-40 °C (-40 °F)

Sample

Bottom

S-PBGA-B196

3

0.06 in (1.53 mm)

0.472 in (12 mm)

30 s

260 °C (500 °F)

0.472 in (12 mm)

AD9208BBPZRL-3000

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

Ball

196

HBGA

Square

Plastic/Epoxy

4

Yes

1.7 V

3000 MHz

1

14

0.1282 %

975 mV

Offset Binary, 2's Complement Binary

Grid Array, Heat Sink/Slug

0.031 in (0.8 mm)

85 °C (185 °F)

-1.7 V

Serial

-40 °C (-40 °F)

Sample

Bottom

S-PBGA-B196

3

0.06 in (1.53 mm)

0.472 in (12 mm)

30 s

260 °C (500 °F)

0.472 in (12 mm)

ADC12DJ3200AAVT

Texas Instruments

Analog To Digital Converter, Proprietary Method

Industrial

Ball

144

FBGA

Square

Plastic/Epoxy

2

Yes

1.04 V

3200 MHz

1

12

1.1 V

Offset Binary, 2's Complement Binary

Grid Array, Fine Pitch

0.031 in (0.8 mm)

85 °C (185 °F)

-1.04 V

Serial, Parallel, Word

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B144

3

0.076 in (1.94 mm)

0.394 in (10 mm)

Peak-to-peak input voltage range: 0.8 V

e1

30 s

260 °C (500 °F)

0.394 in (10 mm)

ADC12DJ3200AAV

Texas Instruments

Analog To Digital Converter, Proprietary Method

Industrial

Ball

144

FBGA

Square

Plastic/Epoxy

2

Yes

1.04 V

3200 MHz

1

12

1.1 V

Offset Binary, 2's Complement Binary

Grid Array, Fine Pitch

0.031 in (0.8 mm)

85 °C (185 °F)

-1.04 V

Serial, Parallel, Word

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B144

3

0.076 in (1.94 mm)

0.394 in (10 mm)

Peak-to-peak input voltage range: 0.8 V

e1

30 s

260 °C (500 °F)

0.394 in (10 mm)

MAX108CHC-B50105

Maxim Integrated

Analog To Digital Converter, Flash Method

Commercial

Ball

192

LBGA

Square

Plastic/Epoxy

1

Yes

525 mV

1500 MHz

1

Bipolar

8

0.1953 %

5 V

Offset Binary

-5 V

Grid Array, Low Profile

0.05 in (1.27 mm)

70 °C (158 °F)

-525 mV

Parallel, 8 Bits

0 °C (32 °F)

Track

Bottom

S-PBGA-B192

0.066 in (1.67 mm)

0.984 in (25 mm)

0.984 in (25 mm)

AD9689BBPZ-2600

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

Ball

196

HBGA

Square

Plastic/Epoxy

2

Yes

2 V

2600 MHz

1

14

0.0793 %

975 mV

Offset Binary, 2's Complement Binary

Grid Array, Heat Sink/Slug

0.031 in (0.8 mm)

85 °C (185 °F)

-2 V

Serial

-40 °C (-40 °F)

Sample

Bottom

S-PBGA-B196

3

0.062 in (1.57 mm)

0.472 in (12 mm)

30 s

260 °C (500 °F)

0.472 in (12 mm)

AD9689BBPZRL-2600

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

Ball

196

HBGA

Square

Plastic/Epoxy

2

Yes

2 V

2600 MHz

1

14

0.0793 %

975 mV

Offset Binary, 2's Complement Binary

Grid Array, Heat Sink/Slug

0.031 in (0.8 mm)

85 °C (185 °F)

-2 V

Serial

-40 °C (-40 °F)

Sample

Bottom

S-PBGA-B196

3

0.062 in (1.57 mm)

0.472 in (12 mm)

30 s

260 °C (500 °F)

0.472 in (12 mm)

AD9689BBPZ-2000

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

Ball

196

HBGA

Square

Plastic/Epoxy

2

Yes

2 V

2000 MHz

1

14

0.0494 %

975 mV

Offset Binary, 2's Complement Binary

Grid Array, Heat Sink/Slug

0.031 in (0.8 mm)

85 °C (185 °F)

-2 V

Serial

-40 °C (-40 °F)

Sample

Bottom

S-PBGA-B196

0.062 in (1.57 mm)

0.472 in (12 mm)

0.472 in (12 mm)

ADC12DJ2700AAVT

Texas Instruments

Analog To Digital Converter, Proprietary Method

Industrial

Ball

144

FBGA

Square

Plastic/Epoxy

2

Yes

1.04 V

2700 MHz

1

12

950 mA

1.1 V

Offset Binary, 2's Complement Binary

Grid Array, Fine Pitch

BGA144,12X12,32

0.031 in (0.8 mm)

85 °C (185 °F)

-1.04 V

Serial, Parallel, Word

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B144

3

0.076 in (1.94 mm)

0.394 in (10 mm)

Peak-to-peak input voltage range: 0.8 V

e1

30 s

260 °C (500 °F)

0.394 in (10 mm)

ADC12DJ2700AAV

Texas Instruments

Analog To Digital Converter, Proprietary Method

Industrial

Ball

144

FBGA

Square

Plastic/Epoxy

2

Yes

1.04 V

2700 MHz

1

12

950 mA

1.1 V

Offset Binary, 2's Complement Binary

Grid Array, Fine Pitch

BGA144,12X12,32

0.031 in (0.8 mm)

85 °C (185 °F)

-1.04 V

Serial, Parallel, Word

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B144

3

0.076 in (1.94 mm)

0.394 in (10 mm)

Peak-to-peak input voltage range: 0.8 V

e1

30 s

260 °C (500 °F)

0.394 in (10 mm)

ADC08DJ3200AAVT

Texas Instruments

Analog To Digital Converter, Proprietary Method

Industrial

Ball

144

FBGA

Square

Plastic/Epoxy

2

Yes

800 mV

3200 MHz

1

8

1.1 V

Offset Binary, 2's Complement Binary

Grid Array, Fine Pitch

0.031 in (0.8 mm)

85 °C (185 °F)

-800 mV

Serial, Parallel, 8 Bits

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B144

3

0.076 in (1.94 mm)

0.394 in (10 mm)

Peak-to-peak input voltage range: 0.8 V

e1

30 s

260 °C (500 °F)

0.394 in (10 mm)

ADC08DJ3200AAV

Texas Instruments

Analog To Digital Converter, Proprietary Method

Industrial

Ball

144

FBGA

Square

Plastic/Epoxy

2

Yes

800 mV

3200 MHz

1

8

1.1 V

Offset Binary, 2's Complement Binary

Grid Array, Fine Pitch

0.031 in (0.8 mm)

85 °C (185 °F)

-800 mV

Serial, Parallel, 8 Bits

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B144

3

0.076 in (1.94 mm)

0.394 in (10 mm)

Peak-to-peak input voltage range: 0.8 V

e1

30 s

260 °C (500 °F)

0.394 in (10 mm)

ADC12DL3200ACF

Texas Instruments

Analog To Digital Converter, Proprietary Method

Industrial

Ball

256

BGA

Square

Plastic/Epoxy

2

Yes

1.04 V

3200 MHz

1

12

1.3 A

1.1 V

Offset Binary, 2's Complement Binary

Grid Array

BGA256,16X16,39

0.039 in (1 mm)

85 °C (185 °F)

-1.04 V

Serial, Parallel, Word

-40 °C (-40 °F)

Tin/Silver/Copper

Bottom

S-PBGA-B256

3

0.13 in (3.31 mm)

0.669 in (17 mm)

Peak-to-peak input voltage range: 0.8 V

e1

30 s

260 °C (500 °F)

0.669 in (17 mm)

ADC12DJ5200RFAAV

Texas Instruments

Analog To Digital Converter, Proprietary Method

Industrial

Ball

144

FBGA

Square

Plastic/Epoxy

2

Yes

1.04 V

5200 MHz

1

12

1.1 V

Offset Binary, 2's Complement Binary

Grid Array, Fine Pitch

0.031 in (0.8 mm)

85 °C (185 °F)

-1.04 V

Serial

-40 °C (-40 °F)

Tin Silver Copper

Track

Bottom

S-PBGA-B144

3

0.076 in (1.94 mm)

0.394 in (10 mm)

Peak-to-peak input voltage range: 0.825 V

e1

30 s

260 °C (500 °F)

0.394 in (10 mm)

AD9213BBPZ-6G

Analog Devices

Analog To Digital Converter, Proprietary Method

Other

Ball

192

HBGA

Square

Plastic/Epoxy

1

Yes

1.4 V

10250 MHz

1

12

0.1807 %

1 V

Offset Binary, 2's Complement Binary, Gray Code

Grid Array, Heat Sink/Slug

0.031 in (0.8 mm)

115 °C (239 °F)

-1.4 V

Parallel, Word

-20 °C (-4 °F)

Bottom

0.4 ns

S-PBGA-B192

0.067 in (1.71 mm)

0.472 in (12 mm)

0.472 in (12 mm)

ADC12DJ2700ZEGT

Texas Instruments

Analog To Digital Converter, Proprietary Method

Industrial

Ball

144

FBGA

Square

Plastic/Epoxy

2

Yes

800 mV

2700 MHz

1

12

950 mA

1.1 V

Offset Binary, 2's Complement Binary

Grid Array, Fine Pitch

BGA144,12X12,32

0.031 in (0.8 mm)

85 °C (185 °F)

-800 mV

Serial, Parallel, Word

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B144

3

0.076 in (1.94 mm)

0.394 in (10 mm)

Peak-to-peak input voltage range: 0.8 V

e0

20 s

235 °C (455 °F)

0.394 in (10 mm)

ADC12DJ2700ZEG

Texas Instruments

Analog To Digital Converter, Proprietary Method

Industrial

Ball

144

FBGA

Square

Plastic/Epoxy

2

Yes

800 mV

2700 MHz

1

12

950 mA

1.1 V

Offset Binary, 2's Complement Binary

Grid Array, Fine Pitch

BGA144,12X12,32

0.031 in (0.8 mm)

85 °C (185 °F)

-800 mV

Serial, Parallel, Word

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B144

3

0.076 in (1.94 mm)

0.394 in (10 mm)

Peak-to-peak input voltage range: 0.8 V

e0

20 s

235 °C (455 °F)

0.394 in (10 mm)

ADC12DJ3200ZEGT

Texas Instruments

Analog To Digital Converter, Proprietary Method

Industrial

Ball

144

FBGA

Square

Plastic/Epoxy

1

Yes

1.04 V

6400 MHz

1

12

1.1 V

2's Complement Binary

Grid Array, Fine Pitch

0.031 in (0.8 mm)

85 °C (185 °F)

-1.04 V

Serial

-40 °C (-40 °F)

Tin/Lead

Bottom

S-PBGA-B144

3

0.076 in (1.94 mm)

0.394 in (10 mm)

Peak-to-peak input voltage range: 0.8 V

e0

20 s

235 °C (455 °F)

0.394 in (10 mm)

ADS7066IYBHR

Texas Instruments

Analog To Digital Converter, Successive Approximation

Automotive

Ball

16

BGA

Square

Plastic/Epoxy

8

Yes

5.5 V

250 kHz

1

16

1.6 mA

0.0061 %

3.3 V

Binary

Grid Array

1.65 V

125 °C (257 °F)

0 mV

Serial

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B16

1

e1

30 s

260 °C (500 °F)

ADC12DL3200ALJ

Texas Instruments

Analog To Digital Converter, Proprietary Method

Industrial

Ball

256

BGA

Square

Plastic/Epoxy

2

Yes

800 mV

3200 MHz

1

12

1.3 A

1.1 V

2's Complement Binary

Grid Array

BGA256,16X16,39

0.039 in (1 mm)

85 °C (185 °F)

-800 mV

Serial

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B256

3

0.13 in (3.31 mm)

0.669 in (17 mm)

Peak-to-peak input voltage range: 0.8 V

e0

20 s

220 °C (428 °F)

0.669 in (17 mm)

MCP37D21-80E/TE

Microchip Technology

Analog To Digital Converter, Pipelined

Automotive

Ball

121

TFBGA

Square

Plastic/Epoxy

8

Yes

4.46 V

80 MHz

1

AEC-Q100

14

173 mA

1.2 V

Offset Binary, 2's Complement Binary

Grid Array, Thin Profile, Fine Pitch

BGA121,11X11,25

0.026 in (0.65 mm)

125 °C (257 °F)

-4.46 V

Parallel, Word

-40 °C (-40 °F)

Sample

Bottom

12.5 ns

S-PBGA-B121

0.043 in (1.08 mm)

0.315 in (8 mm)

0.315 in (8 mm)

ADC12QJ1600AAVQ1

Texas Instruments

Analog To Digital Converter, Proprietary Method

Automotive

Ball

144

FBGA

Square

Plastic/Epoxy

4

Yes

800 mV

1600 MHz

1

AEC-Q100

12

100 mA

1.1 V

Offset Binary, 2's Complement Binary

Grid Array, Fine Pitch

BGA144,12X12,32

0.031 in (0.8 mm)

125 °C (257 °F)

-800 mV

Serial

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B144

3

0.076 in (1.94 mm)

0.394 in (10 mm)

Peak-to-peak input voltage range: 0.8 V

e1

30 s

260 °C (500 °F)

0.394 in (10 mm)

ADC12QJ1600AAVTQ1

Texas Instruments

Analog To Digital Converter, Proprietary Method

Automotive

Ball

144

FBGA

Square

Plastic/Epoxy

4

Yes

800 mV

1600 MHz

1

AEC-Q100

12

100 mA

1.1 V

Offset Binary, 2's Complement Binary

Grid Array, Fine Pitch

BGA144,12X12,32

0.031 in (0.8 mm)

125 °C (257 °F)

-800 mV

Serial

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B144

3

0.076 in (1.94 mm)

0.394 in (10 mm)

Peak-to-peak input voltage range: 0.8 V

e1

30 s

260 °C (500 °F)

0.394 in (10 mm)

MCP37D11-80E/TE

Microchip Technology

Analog To Digital Converter, Proprietary Method

Automotive

Ball

121

TFBGA

Square

Plastic/Epoxy

8

Yes

2.975 V

80 MHz

1

AEC-Q100

12

173 mA

1.2 V

2’s Complement, Offset Binary

Grid Array, Thin Profile, Fine Pitch

BGA121,11X11,25

0.026 in (0.65 mm)

125 °C (257 °F)

-2.975 V

Serial

-40 °C (-40 °F)

Bottom

4 ns

S-PBGA-B121

0.043 in (1.08 mm)

0.315 in (8 mm)

0.315 in (8 mm)

ADC12DJ1600AAVQ1

Texas Instruments

Analog To Digital Converter, Proprietary Method

Automotive

Ball

144

HFBGA

Square

Plastic/Epoxy

2

Yes

800 mV

1600 MHz

1

AEC-Q100

12

0.04638 %

1.9 V

Offset Binary

Grid Array, Heat Sink/Slug, Fine Pitch

BGA144,12X12,32

0.031 in (0.8 mm)

125 °C (257 °F)

-800 mV

Serial

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B144

3

0.076 in (1.94 mm)

0.394 in (10 mm)

Peak-to-peak input voltage range: 0.8 V

e1

30 s

260 °C (500 °F)

0.394 in (10 mm)

Analog-to-Digital Converters

Analog-to-digital converters (ADCs) are electronic devices that convert continuous analog signals into digital signals, which can be processed by digital circuits, microcontrollers, or computers. ADCs are essential components in many electronic systems, as they allow the measurement and processing of physical signals, such as temperature, pressure, light, and sound.

ADCs work by sampling the analog signal at regular intervals and quantizing the sampled signal into a series of digital values. The sampling rate and the resolution of the ADC determine the accuracy and the bandwidth of the digital signal. ADCs may also include features such as amplification, filtering, or signal conditioning, to improve the accuracy and stability of the digital signal.

ADCs can be classified based on their architecture and their application. The most common types of ADCs are successive approximation ADCs, delta-sigma ADCs, and pipeline ADCs. Each type has its advantages and limitations, depending on the application and the required performance.

ADCs are used in a wide range of applications, from consumer electronics, such as smartphones and digital cameras, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of physical signals into digital signals, allowing the processing, storage, and transmission of data in electronic systems.

Overall, ADCs are essential components in many electronic systems, providing the necessary signal conversion for a wide range of applications. Their accuracy, speed, and resolution determine the performance and the functionality of many electronic devices and systems.