Ball Analog-to-Digital Converters 169

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Part RoHS Manufacturer Converter Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material No. of Analog In Channels Surface Mount Maximum Supply Voltage Maximum Analog Input Voltage Sample Rate No. of Functions Technology Screening Level Nominal Bandwidth No. of Bits Maximum Supply Current Maximum Linearity Error (EL) Nominal Supply Voltage Output Bit Code Power Supplies (V) Nominal Negative Supply Voltage Package Style (Meter) Package Equivalence Code Sub-Category Minimum Supply Voltage Terminal Pitch Maximum Operating Temperature Minimum Analog Input Voltage Output Format Minimum Operating Temperature Terminal Finish Sample and Hold/Track and Hold Terminal Position Maximum Conversion Time JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Input Bit Code

ADC09SJ800AAV

Texas Instruments

Analog To Digital Converter, Proprietary Method

Ball

144

FBGA

Square

Plastic/Epoxy

1

Yes

800 mV

800 MHz

1

9

0.09765 %

1.1 V

2’s Complement, Offset Binary

Grid Array, Fine Pitch

BGA144,12X12,32

0.031 in (0.8 mm)

85 °C (185 °F)

-800 mV

Serial

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B144

3

0.076 in (1.94 mm)

0.394 in (10 mm)

Peak-to-peak input voltage range: 0.8 V

e1

30 s

260 °C (500 °F)

0.394 in (10 mm)

ADC09DJ800AAV

Texas Instruments

Analog To Digital Converter, Proprietary Method

Ball

144

FBGA

Square

Plastic/Epoxy

2

Yes

800 mV

800 MHz

1

9

0.09765 %

1.1 V

2’s Complement, Offset Binary

Grid Array, Fine Pitch

BGA144,12X12,32

0.031 in (0.8 mm)

85 °C (185 °F)

-800 mV

Serial

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B144

3

0.076 in (1.94 mm)

0.394 in (10 mm)

Peak-to-peak input voltage range: 0.8 V

e1

30 s

260 °C (500 °F)

0.394 in (10 mm)

ADC12DJ1600AAVT

Texas Instruments

Analog To Digital Converter, Proprietary Method

Ball

144

FBGA

Square

Plastic/Epoxy

2

Yes

800 mV

1600 MHz

1

12

0.046386 %

1.1 V

Offset Binary, 2's Complement Binary

Grid Array, Fine Pitch

BGA144,12X12,32

0.031 in (0.8 mm)

85 °C (185 °F)

-800 mV

Serial

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B144

3

0.076 in (1.94 mm)

0.394 in (10 mm)

Peak-to-peak input voltage range: 0.8 V

e1

30 s

260 °C (500 °F)

0.394 in (10 mm)

ADC12DJ800AAV

Texas Instruments

Analog To Digital Converter, Proprietary Method

Ball

144

HFBGA

Square

Plastic/Epoxy

2

Yes

800 mV

800 MHz

1

12

0.046386719 %

1.1 V

2’s Complement, Offset Binary

Grid Array, Heat Sink/Slug, Fine Pitch

BGA144,12X12,32

0.031 in (0.8 mm)

85 °C (185 °F)

-800 mV

Serial

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-144

3

0.076 in (1.94 mm)

0.394 in (10 mm)

Peak-to-peak input voltage range: 0.8 V

e1

30 s

260 °C (500 °F)

0.394 in (10 mm)

ADC12SJ1600AAV

Texas Instruments

Analog To Digital Converter, Proprietary Method

Ball

144

FBGA

Square

Plastic/Epoxy

1

Yes

800 mV

1600 MHz

1

12

0.046386 %

1.1 V

Offset Binary, 2's Complement Binary

Grid Array, Fine Pitch

BGA144,12X12,32

0.031 in (0.8 mm)

85 °C (185 °F)

-800 mV

Serial

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B144

3

0.076 in (1.94 mm)

0.394 in (10 mm)

Peak-to-peak input voltage range: 0.8 V

e1

30 s

260 °C (500 °F)

0.394 in (10 mm)

ADC12SJ1600AAVT

Texas Instruments

Analog To Digital Converter, Proprietary Method

Ball

144

FBGA

Square

Plastic/Epoxy

1

Yes

800 mV

1600 MHz

1

12

0.046386 %

1.1 V

Offset Binary, 2's Complement Binary

Grid Array, Fine Pitch

BGA144,12X12,32

0.031 in (0.8 mm)

85 °C (185 °F)

-800 mV

Serial

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B144

3

0.076 in (1.94 mm)

0.394 in (10 mm)

Peak-to-peak input voltage range: 0.8 V

e1

30 s

260 °C (500 °F)

0.394 in (10 mm)

ADC12DJ800AAVT

Texas Instruments

Analog To Digital Converter, Proprietary Method

Ball

144

HFBGA

Square

Plastic/Epoxy

2

Yes

800 mV

800 MHz

1

12

0.046386719 %

1.1 V

2’s Complement, Offset Binary

Grid Array, Heat Sink/Slug, Fine Pitch

BGA144,12X12,32

0.031 in (0.8 mm)

85 °C (185 °F)

-800 mV

Serial

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-144

3

0.076 in (1.94 mm)

0.394 in (10 mm)

Peak-to-peak input voltage range: 0.8 V

e1

30 s

260 °C (500 °F)

0.394 in (10 mm)

ADC12QJ800AAV

Texas Instruments

Analog To Digital Converter, Proprietary Method

Ball

144

HFBGA

Square

Plastic/Epoxy

4

Yes

800 mV

800 MHz

1

12

0.046386719 %

1.1 V

2’s Complement, Offset Binary

Grid Array, Heat Sink/Slug, Fine Pitch

BGA144,12X12,32

0.031 in (0.8 mm)

85 °C (185 °F)

-800 mV

Serial

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-144

3

0.076 in (1.94 mm)

0.394 in (10 mm)

Peak-to-peak input voltage range: 0.8 V

e1

30 s

260 °C (500 °F)

0.394 in (10 mm)

ADC12SJ800AAV

Texas Instruments

Analog To Digital Converter, Proprietary Method

Ball

144

HFBGA

Square

Plastic/Epoxy

1

Yes

800 mV

800 MHz

1

12

0.046386719 %

1.1 V

2’s Complement, Offset Binary

Grid Array, Heat Sink/Slug, Fine Pitch

BGA144,12X12,32

0.031 in (0.8 mm)

85 °C (185 °F)

-800 mV

Serial

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-144

3

0.076 in (1.94 mm)

0.394 in (10 mm)

Peak-to-peak input voltage range: 0.8 V

e1

30 s

260 °C (500 °F)

0.394 in (10 mm)

ADC12SJ800AAVT

Texas Instruments

Analog To Digital Converter, Proprietary Method

Ball

144

HFBGA

Square

Plastic/Epoxy

1

Yes

800 mV

800 MHz

1

12

0.046386719 %

1.1 V

2’s Complement, Offset Binary

Grid Array, Heat Sink/Slug, Fine Pitch

BGA144,12X12,32

0.031 in (0.8 mm)

85 °C (185 °F)

-800 mV

Serial

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B144

3

0.076 in (1.94 mm)

0.394 in (10 mm)

Peak-to-peak input voltage range: 0.8 V

e1

30 s

260 °C (500 °F)

0.394 in (10 mm)

ADC12DJ1600AAV

Texas Instruments

Analog To Digital Converter, Proprietary Method

Ball

144

FBGA

Square

Plastic/Epoxy

2

Yes

800 mV

1600 MHz

1

12

0.046386 %

1.1 V

Offset Binary, 2's Complement Binary

Grid Array, Fine Pitch

BGA144,12X12,32

0.031 in (0.8 mm)

85 °C (185 °F)

-800 mV

Serial

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B144

3

0.076 in (1.94 mm)

0.394 in (10 mm)

Peak-to-peak input voltage range: 0.8 V

e1

30 s

260 °C (500 °F)

0.394 in (10 mm)

ADC12QJ1600AAV

Texas Instruments

Analog To Digital Converter, Proprietary Method

Ball

144

FBGA

Square

Plastic/Epoxy

4

Yes

800 mV

1600 MHz

1

12

0.046386 %

1.1 V

Offset Binary, 2's Complement Binary

Grid Array, Fine Pitch

BGA144,12X12,32

0.031 in (0.8 mm)

85 °C (185 °F)

-800 mV

Serial

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B144

3

0.076 in (1.94 mm)

0.394 in (10 mm)

Peak-to-peak input voltage range: 0.8 V

e1

30 s

260 °C (500 °F)

0.394 in (10 mm)

ADC12QJ800AAVT

Texas Instruments

Analog To Digital Converter, Proprietary Method

Ball

144

HFBGA

Square

Plastic/Epoxy

4

Yes

800 mV

800 MHz

1

12

0.046386719 %

1.1 V

2’s Complement, Offset Binary

Grid Array, Heat Sink/Slug, Fine Pitch

BGA144,12X12,32

0.031 in (0.8 mm)

85 °C (185 °F)

-800 mV

Serial

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-144

3

0.076 in (1.94 mm)

0.394 in (10 mm)

Peak-to-peak input voltage range: 0.8 V

e1

30 s

260 °C (500 °F)

0.394 in (10 mm)

ADC12QJ1600AAVT

Texas Instruments

Analog To Digital Converter, Proprietary Method

Ball

144

FBGA

Square

Plastic/Epoxy

4

Yes

800 mV

1600 MHz

1

12

0.046386 %

1.1 V

Offset Binary, 2's Complement Binary

Grid Array, Fine Pitch

BGA144,12X12,32

0.031 in (0.8 mm)

85 °C (185 °F)

-800 mV

Serial

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B144

3

0.075 in (1.91 mm)

0.394 in (10 mm)

Peak-to-peak input voltage range: 0.8 V

e1

30 s

260 °C (500 °F)

0.394 in (10 mm)

ADS7067IYBHR

Texas Instruments

Analog To Digital Converter, Successive Approximation

Ball

16

VFBGA

Rectangular

Plastic/Epoxy

8

Yes

5.5 V

800 kHz

1

16

2.8 mA

0.0061035 %

3.3 V

Binary

Grid Array, Very Thin Profile, Fine Pitch

BGA16,4X4,16

1.65 V

0.016 in (0.4 mm)

125 °C (257 °F)

0 mV

Serial

-40 °C (-40 °F)

Tin Silver Copper

Sample

Bottom

950 ns

S-PBGA-B16

1

0.016 in (0.4 mm)

0.064 in (1.6205 mm)

e1

260 °C (500 °F)

0.064 in (1.6205 mm)

ADS7067IYBHT

Texas Instruments

Analog To Digital Converter, Successive Approximation

Ball

16

VFBGA

Rectangular

Plastic/Epoxy

8

Yes

5.5 V

800 kHz

1

16

2.8 mA

0.0061035 %

3.3 V

Binary

Grid Array, Very Thin Profile, Fine Pitch

BGA16,4X4,16

1.65 V

0.016 in (0.4 mm)

125 °C (257 °F)

0 mV

Serial

-40 °C (-40 °F)

Tin Silver Copper

Sample

Bottom

950 ns

S-PBGA-B16

1

0.016 in (0.4 mm)

0.064 in (1.6205 mm)

e1

260 °C (500 °F)

0.064 in (1.6205 mm)

AFE7906IABJ

Texas Instruments

Analog To Digital Converter, Proprietary Method

Ball

400

FBGA

Square

Plastic/Epoxy

6

Yes

3000 MHz

1

14

1.2 V

Binary

Grid Array, Fine Pitch

BGA400,20X20,32

0.031 in (0.8 mm)

85 °C (185 °F)

Serial

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B400

3

0.104 in (2.65 mm)

0.669 in (17 mm)

RF frequency Range: 5 - 12000 MHz

e1

260 °C (500 °F)

0.669 in (17 mm)

AD9699WBBPZRL-3000

Analog Devices

Analog To Digital Converter, Proprietary Method

Ball

196

HLFBGA

Square

Plastic/Epoxy

1

Yes

1.54 V

3000 MHz

1

AEC-Q100

14

408.5 mA

0.11047 %

975 mV

Offset Binary, 2's Complement Binary

Grid Array, Heat Sink/Slug, Low Profile, Fine Pitch

BGA196,14X14,32

0.031 in (0.8 mm)

105 °C (221 °F)

-1.54 V

Serial

-40 °C (-40 °F)

Sample

Bottom

S-PBGA-B196

0.06 in (1.53 mm)

0.472 in (12 mm)

0.472 in (12 mm)

AFE7906IALK

Texas Instruments

Analog To Digital Converter, Proprietary Method

Ball

400

FBGA

Square

Plastic/Epoxy

6

Yes

3000 MHz

1

14

1.2 V

Binary

Grid Array, Fine Pitch

BGA400,20X20,32

0.031 in (0.8 mm)

85 °C (185 °F)

Serial

-40 °C (-40 °F)

Tin Lead

Bottom

S-PBGA-B400

3

0.104 in (2.65 mm)

0.669 in (17 mm)

RF frequency Range: 5 - 12000 MHz

e0

220 °C (428 °F)

0.669 in (17 mm)

ADC12DJ5200ALREP

Texas Instruments

Analog To Digital Converter, Proprietary Method

Ball

144

FBGA

Square

Plastic/Epoxy

1

Yes

825 mV

10400 MHz

1

12

1.65 mA

0.048828 %

1.1 V

Offset Binary, 2's Complement Binary

Grid Array, Fine Pitch

BGA144,12X12,32

0.031 in (0.8 mm)

125 °C (257 °F)

-825 mV

Serial

-55 °C (-67 °F)

Tin Lead

Bottom

S-PBGA-B144

3

0.075 in (1.91 mm)

0.394 in (10 mm)

Peak-to-peak input voltage range: 0.825 V

e0

235 °C (455 °F)

0.394 in (10 mm)

V62/22611-01XF

Texas Instruments

Analog To Digital Converter, Proprietary Method

Ball

144

FBGA

Square

Plastic/Epoxy

1

Yes

825 mV

10400 MHz

1

12

1.65 mA

0.048828 %

1.1 V

Offset Binary, 2's Complement Binary

Grid Array, Fine Pitch

BGA144,12X12,32

0.031 in (0.8 mm)

125 °C (257 °F)

-825 mV

Serial

-55 °C (-67 °F)

Tin Lead

Bottom

S-PBGA-B144

3

0.075 in (1.91 mm)

0.394 in (10 mm)

Peak-to-peak input voltage range: 0.825 V

e0

235 °C (455 °F)

0.394 in (10 mm)

V62/22610-01XF

Texas Instruments

Analog To Digital Converter, Successive Approximation

Ball

144

FBGA

Square

Plastic/Epoxy

4

Yes

800 mV

1600 MHz

1

12

0.047607 %

1.1 V

Offset Binary, 2's Complement Binary

Grid Array, Fine Pitch

BGA144,12X12,32

0.031 in (0.8 mm)

125 °C (257 °F)

-800 mV

Serial

-55 °C (-67 °F)

Tin Lead

Bottom

S-PBGA-B144

3

0.075 in (1.91 mm)

0.394 in (10 mm)

Peak-to-peak input voltage range: 0.8 V

e0

235 °C (455 °F)

0.394 in (10 mm)

ADC12QJ1600ALREP

Texas Instruments

Analog To Digital Converter, Successive Approximation

Ball

144

FBGA

Square

Plastic/Epoxy

4

Yes

800 mV

1600 MHz

1

12

0.047607 %

1.1 V

Offset Binary, 2's Complement Binary

Grid Array, Fine Pitch

BGA144,12X12,32

0.031 in (0.8 mm)

125 °C (257 °F)

-800 mV

Serial

-55 °C (-67 °F)

Tin Lead

Bottom

S-PBGA-B144

3

0.075 in (1.91 mm)

0.394 in (10 mm)

Peak-to-peak input voltage range: 0.8 V

e0

235 °C (455 °F)

0.394 in (10 mm)

AD4697BCBZ-RL7

Analog Devices

Analog To Digital Converter, Successive Approximation

Ball

36

VFBGA

Square

Plastic/Epoxy

8

Yes

2.6 V

500 kHz

1

16

0.003815 %

5 V

Binary, 2’s Complement Binary

Grid Array, Very Thin Profile, Fine Pitch

BGA36,6X6,20

0.02 in (0.5 mm)

125 °C (257 °F)

-2.4 V

Serial, Parallel, Word

-40 °C (-40 °F)

Bottom

415 ns

S-PBGA-B36

0.022 in (0.56 mm)

0.117 in (2.96 mm)

0.117 in (2.96 mm)

ADC09DJ800AAVTQ1

Texas Instruments

Analog To Digital Converter, Proprietary Method

Ball

144

FBGA

Square

Plastic/Epoxy

2

Yes

1.04 V

800 MHz

1

AEC-Q100

9

0.09765 %

1.1 V

Offset Binary, 2's Complement Binary

Grid Array, Fine Pitch

BGA144,12X12,32

0.031 in (0.8 mm)

125 °C (257 °F)

-1.04 V

Serial

-40 °C (-40 °F)

Tin/Silver/Copper

Bottom

S-PBGA-B144

3

0.075 in (1.91 mm)

0.394 in (10 mm)

Peak-to-peak input voltage range: 0.8 V

e1

0.394 in (10 mm)

Analog-to-Digital Converters

Analog-to-digital converters (ADCs) are electronic devices that convert continuous analog signals into digital signals, which can be processed by digital circuits, microcontrollers, or computers. ADCs are essential components in many electronic systems, as they allow the measurement and processing of physical signals, such as temperature, pressure, light, and sound.

ADCs work by sampling the analog signal at regular intervals and quantizing the sampled signal into a series of digital values. The sampling rate and the resolution of the ADC determine the accuracy and the bandwidth of the digital signal. ADCs may also include features such as amplification, filtering, or signal conditioning, to improve the accuracy and stability of the digital signal.

ADCs can be classified based on their architecture and their application. The most common types of ADCs are successive approximation ADCs, delta-sigma ADCs, and pipeline ADCs. Each type has its advantages and limitations, depending on the application and the required performance.

ADCs are used in a wide range of applications, from consumer electronics, such as smartphones and digital cameras, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of physical signals into digital signals, allowing the processing, storage, and transmission of data in electronic systems.

Overall, ADCs are essential components in many electronic systems, providing the necessary signal conversion for a wide range of applications. Their accuracy, speed, and resolution determine the performance and the functionality of many electronic devices and systems.