Ball Analog-to-Digital Converters 169

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Part RoHS Manufacturer Converter Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material No. of Analog In Channels Surface Mount Maximum Supply Voltage Maximum Analog Input Voltage Sample Rate No. of Functions Technology Screening Level Nominal Bandwidth No. of Bits Maximum Supply Current Maximum Linearity Error (EL) Nominal Supply Voltage Output Bit Code Power Supplies (V) Nominal Negative Supply Voltage Package Style (Meter) Package Equivalence Code Sub-Category Minimum Supply Voltage Terminal Pitch Maximum Operating Temperature Minimum Analog Input Voltage Output Format Minimum Operating Temperature Terminal Finish Sample and Hold/Track and Hold Terminal Position Maximum Conversion Time JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Input Bit Code

ADC12SJ1600AAVTQ1

Texas Instruments

Analog To Digital Converter, Proprietary Method

Automotive

Ball

144

HFBGA

Square

Plastic/Epoxy

1

Yes

800 mV

1600 MHz

1

AEC-Q100

12

0.046387 %

1.9 V

Offset Binary

Grid Array, Heat Sink/Slug, Fine Pitch

BGA144,12X12,32

0.031 in (0.8 mm)

125 °C (257 °F)

-800 mV

Serial

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B144

3

0.076 in (1.94 mm)

0.394 in (10 mm)

Peak-to-peak input voltage range: 0.8 V

e1

30 s

260 °C (500 °F)

0.394 in (10 mm)

ADC12DJ1600AAVTQ1

Texas Instruments

Analog To Digital Converter, Proprietary Method

Automotive

Ball

144

HFBGA

Square

Plastic/Epoxy

2

Yes

800 mV

1600 MHz

1

AEC-Q100

12

0.04638 %

1.9 V

Offset Binary

Grid Array, Heat Sink/Slug, Fine Pitch

BGA144,12X12,32

0.031 in (0.8 mm)

125 °C (257 °F)

-800 mV

Serial

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B144

3

0.076 in (1.94 mm)

0.394 in (10 mm)

Peak-to-peak input voltage range: 0.8 V

e1

30 s

260 °C (500 °F)

0.394 in (10 mm)

ADC12SJ1600AAVQ1

Texas Instruments

Analog To Digital Converter, Proprietary Method

Automotive

Ball

144

HFBGA

Square

Plastic/Epoxy

1

Yes

800 mV

1600 MHz

1

AEC-Q100

12

0.046387 %

1.1 V

Offset Binary, 2's Complement Binary

Grid Array, Heat Sink/Slug, Fine Pitch

BGA144,12X12,32

0.031 in (0.8 mm)

125 °C (257 °F)

-800 mV

Serial

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B144

3

0.076 in (1.94 mm)

0.394 in (10 mm)

Peak-to-peak input voltage range: 0.8 V

e1

30 s

260 °C (500 °F)

0.394 in (10 mm)

ADC09QJ1300AAVQ1

Texas Instruments

Analog To Digital Converter, Proprietary Method

Automotive

Ball

144

FBGA

Square

Plastic/Epoxy

4

Yes

800 mV

1300 MHz

1

AEC-Q100

9

0.09765 %

1.1 V

Offset Binary, 2's Complement Binary

Grid Array, Fine Pitch

BGA144,12X12,32

0.031 in (0.8 mm)

125 °C (257 °F)

-800 mV

Serial

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B144

3

0.076 in (1.94 mm)

0.394 in (10 mm)

Peak-to-peak input voltage range: 0.8 V

e1

30 s

260 °C (500 °F)

0.394 in (10 mm)

ADAQ4003BBCZ

Analog Devices

Data Acquisition Device, Wireless

Automotive

Ball

49

FBGA

Square

Plastic/Epoxy

1

Yes

22.044 V

2 MHz

1

18

0.0008 %

1.8 V

2's Complement Binary

Grid Array, Fine Pitch

BGA49,7X7,32

0.031 in (0.8 mm)

125 °C (257 °F)

-5.28 V

Serial

-40 °C (-40 °F)

Bottom

320 ns

S-PBGA-B49

3

0.096 in (2.432 mm)

0.276 in (7 mm)

30 s

260 °C (500 °F)

0.276 in (7 mm)

ADC09QJ1300AAVTQ1

Texas Instruments

Analog To Digital Converter, Proprietary Method

Automotive

Ball

144

FBGA

Square

Plastic/Epoxy

4

Yes

800 mV

1300 MHz

1

AEC-Q100

9

0.09765 %

1.1 V

Offset Binary, 2's Complement Binary

Grid Array, Fine Pitch

BGA144,12X12,32

0.031 in (0.8 mm)

125 °C (257 °F)

-800 mV

Serial

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B144

3

0.076 in (1.94 mm)

0.394 in (10 mm)

Peak-to-peak input voltage range: 0.8 V

e1

30 s

260 °C (500 °F)

0.394 in (10 mm)

AD9209BBPZ-4G

Analog Devices

Analog To Digital Converter, Proprietary Method

Ball

324

HFBGA

Square

Plastic/Epoxy

4

Yes

1.4 V

4000 MHz

1

12

0.12207 %

2 V

Binary

Grid Array, Heat Sink/Slug, Fine Pitch

BGA324,18X18,32

0.031 in (0.8 mm)

120 °C (248 °F)

-1.4 V

Serial

-40 °C (-40 °F)

Bottom

S-PBGA-B324

0.068 in (1.72 mm)

0.591 in (15 mm)

0.591 in (15 mm)

AD9207BBPZ-6G

Analog Devices

Analog To Digital Converter, Proprietary Method

Ball

324

BGA

Square

Plastic/Epoxy

2

Yes

1.475 V

6000 MHz

1

12

350 mA

0.033691 %

1 V

Binary

Grid Array

BGA324,18X18,32

0.031 in (0.8 mm)

120 °C (248 °F)

-1.475 V

Serial

-40 °C (-40 °F)

Bottom

S-PBGA-B324

3

0.068 in (1.72 mm)

0.591 in (15 mm)

260 °C (500 °F)

0.591 in (15 mm)

ADAQ4001BBCZ

Analog Devices

Data Acquisition Device

Ball

49

FBGA

Square

Plastic/Epoxy

1

Yes

12.705 V

2 MHz

1

16

0.00119 %

1.8 V

2’s Complement Hexadecimal

Grid Array, Fine Pitch

BGA49,7X7,20

0.02 in (0.5 mm)

125 °C (257 °F)

-5.28 V

Serial

-40 °C (-40 °F)

Bottom

320 ns

S-PBGA-B49

3

0.096 in (2.432 mm)

0.276 in (7 mm)

30 s

260 °C (500 °F)

0.276 in (7 mm)

ADAQ4001BBCZ-RL13

Analog Devices

Data Acquisition Device

Ball

49

FBGA

Square

Plastic/Epoxy

1

Yes

12.705 V

2 MHz

1

16

0.00119 %

1.8 V

2’s Complement Hexadecimal

Grid Array, Fine Pitch

BGA49,7X7,20

0.02 in (0.5 mm)

125 °C (257 °F)

-5.28 V

Serial

-40 °C (-40 °F)

Bottom

320 ns

S-PBGA-B49

3

0.096 in (2.432 mm)

0.276 in (7 mm)

30 s

260 °C (500 °F)

0.276 in (7 mm)

ADC09DJ1300AAVQ1

Texas Instruments

Analog To Digital Converter, Proprietary Method

Automotive

Ball

144

FBGA

Square

Plastic/Epoxy

2

Yes

800 mV

1300 MHz

1

AEC-Q100

9

0.06445 %

1.1 V

Offset Binary, 2's Complement Binary

Grid Array, Fine Pitch

BGA144,12X12,32

0.031 in (0.8 mm)

125 °C (257 °F)

-800 mV

Serial

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B144

3

0.076 in (1.94 mm)

0.394 in (10 mm)

Peak-to-peak input voltage range: 0.8 V

e1

30 s

260 °C (500 °F)

0.394 in (10 mm)

ADC09SJ1300AAVQ1

Texas Instruments

Analog To Digital Converter, Proprietary Method

Automotive

Ball

144

FBGA

Square

Plastic/Epoxy

1

Yes

800 mV

1300 MHz

1

AEC-Q100

9

0.06445 %

1.1 V

Offset Binary, 2's Complement Binary

Grid Array, Fine Pitch

BGA144,12X12,32

0.031 in (0.8 mm)

125 °C (257 °F)

-800 mV

Serial

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B144

3

0.076 in (1.94 mm)

0.394 in (10 mm)

Peak-to-peak input voltage range: 0.8 V

e1

30 s

260 °C (500 °F)

0.394 in (10 mm)

ADC09SJ1300AAVTQ1

Texas Instruments

Analog To Digital Converter, Proprietary Method

Automotive

Ball

144

FBGA

Square

Plastic/Epoxy

1

Yes

800 mV

1300 MHz

1

AEC-Q100

9

0.06445 %

1.1 V

Offset Binary, 2's Complement Binary

Grid Array, Fine Pitch

BGA144,12X12,32

0.031 in (0.8 mm)

125 °C (257 °F)

-800 mV

Serial

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B144

3

0.076 in (1.94 mm)

0.394 in (10 mm)

Peak-to-peak input voltage range: 0.8 V

e1

30 s

260 °C (500 °F)

0.394 in (10 mm)

ADC09DJ1300AAVTQ1

Texas Instruments

Analog To Digital Converter, Proprietary Method

Automotive

Ball

144

FBGA

Square

Plastic/Epoxy

2

Yes

800 mV

1300 MHz

1

AEC-Q100

9

0.06445 %

1.1 V

Offset Binary, 2's Complement Binary

Grid Array, Fine Pitch

BGA144,12X12,32

0.031 in (0.8 mm)

125 °C (257 °F)

-800 mV

Serial

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B144

3

0.076 in (1.94 mm)

0.394 in (10 mm)

Peak-to-peak input voltage range: 0.8 V

e1

30 s

260 °C (500 °F)

0.394 in (10 mm)

AD9699BBPZRL-3000

Analog Devices

Analog To Digital Converter, Proprietary Method

Ball

196

HLFBGA

Square

Plastic/Epoxy

1

Yes

1.54 V

3000 MHz

1

14

408.5 mA

0.11047 %

975 mV

Offset Binary, 2's Complement Binary

Grid Array, Heat Sink/Slug, Low Profile, Fine Pitch

BGA196,14X14,32

0.031 in (0.8 mm)

105 °C (221 °F)

-1.54 V

Serial

-40 °C (-40 °F)

Sample

Bottom

S-PBGA-B196

0.06 in (1.53 mm)

0.472 in (12 mm)

0.472 in (12 mm)

AD9699BBPZ-3000

Analog Devices

Analog To Digital Converter, Proprietary Method

Ball

196

HLFBGA

Square

Plastic/Epoxy

1

Yes

1.54 V

3000 MHz

1

14

408.5 mA

0.11047 %

975 mV

Offset Binary, 2's Complement Binary

Grid Array, Heat Sink/Slug, Low Profile, Fine Pitch

BGA196,14X14,32

0.031 in (0.8 mm)

105 °C (221 °F)

-1.54 V

Serial

-40 °C (-40 °F)

Sample

Bottom

S-PBGA-B196

0.06 in (1.53 mm)

0.472 in (12 mm)

0.472 in (12 mm)

ADAQ23876BBCZ

Analog Devices

Data Acquisition Device, Wireless

Ball

100

FBGA

Square

Plastic/Epoxy

1

Yes

11 V

15 MHz

1

16

52 mA

0.00125 %

5 V

2's Complement Binary

Grid Array, Fine Pitch

BGA100,10X10,32

0.031 in (0.8 mm)

85 °C (185 °F)

-11 V

Serial

-40 °C (-40 °F)

Sample

Bottom

63 ns

S-PBGA-B100

0.093 in (2.368 mm)

0.354 in (9 mm)

0.354 in (9 mm)

ADAQ23878BBCZ

Analog Devices

Data Acquisition Device, Wireless

Ball

100

FBGA

Square

Plastic/Epoxy

1

Yes

11 V

15 MHz

1

18

52 mA

0.00078 %

5 V

2's Complement Binary

Grid Array, Fine Pitch

BGA100,10X10,32

0.031 in (0.8 mm)

85 °C (185 °F)

-11 V

Serial

-40 °C (-40 °F)

Sample

Bottom

63 ns

S-PBGA-B100

0.093 in (2.368 mm)

0.354 in (9 mm)

0.354 in (9 mm)

ADC12DJ4000RFAAVT

Texas Instruments

Analog To Digital Converter, Proprietary Method

Ball

144

FBGA

Square

Plastic/Epoxy

2

Yes

800 mV

8000 MHz

1

12

0.024414063 %

1.1 V

2’s Complement, Offset Binary

Grid Array, Fine Pitch

BGA144,12X12,32

0.031 in (0.8 mm)

85 °C (185 °F)

-800 mV

Serial

-40 °C (-40 °F)

Tin Silver Copper

Track

Bottom

S-PBGA-B144

3

0.076 in (1.94 mm)

0.394 in (10 mm)

Peak-to-peak input voltage range: 0.8 V

e1

30 s

260 °C (500 °F)

0.394 in (10 mm)

ADC12DJ4000RFAAV

Texas Instruments

Analog To Digital Converter, Proprietary Method

Ball

144

FBGA

Square

Plastic/Epoxy

2

Yes

800 mV

8000 MHz

1

12

0.024414063 %

1.1 V

2’s Complement, Offset Binary

Grid Array, Fine Pitch

BGA144,12X12,32

0.031 in (0.8 mm)

85 °C (185 °F)

-800 mV

Serial

-40 °C (-40 °F)

Tin Silver Copper

Track

Bottom

S-PBGA-B144

3

0.076 in (1.94 mm)

0.394 in (10 mm)

Peak-to-peak input voltage range: 0.8 V

e1

30 s

260 °C (500 °F)

0.394 in (10 mm)

ADC12DJ5200RFZEG

Texas Instruments

Analog To Digital Converter, Proprietary Method

Ball

144

Rectangular

Plastic/Epoxy

2

Yes

825 mV

5200 MHz

1

12

950 μA

0.048828125 %

1.1 V

Offset Binary, 2's Complement Binary

85 °C (185 °F)

-825 mV

Serial

-40 °C (-40 °F)

Tin Lead

Track

Bottom

R-PBGA-B144

3

Peak-to-peak input voltage range: 0.825 V

e0

235 °C (455 °F)

ADC12DJ5200RFZEGT

Texas Instruments

Analog To Digital Converter, Proprietary Method

Ball

144

Rectangular

Plastic/Epoxy

2

Yes

825 mV

5200 MHz

1

12

950 μA

0.048828125 %

1.1 V

Offset Binary, 2's Complement Binary

85 °C (185 °F)

-825 mV

Serial

-40 °C (-40 °F)

Tin Lead

Track

Bottom

R-PBGA-B144

3

Peak-to-peak input voltage range: 0.825 V

e0

235 °C (455 °F)

ADC12DJ4000RFZEGT

Texas Instruments

Analog To Digital Converter, Proprietary Method

Ball

144

Rectangular

Plastic/Epoxy

2

Yes

800 mV

4000 MHz

1

12

850 μA

0.024414063 %

1.1 V

Offset Binary, 2's Complement Binary

85 °C (185 °F)

-800 mV

Serial

-40 °C (-40 °F)

Tin Lead

Track

Bottom

R-PBGA-B144

3

Peak-to-peak input voltage range: 0.8 V

e0

235 °C (455 °F)

ADC12DJ4000RFZEG

Texas Instruments

Analog To Digital Converter, Proprietary Method

Ball

144

Rectangular

Plastic/Epoxy

2

Yes

800 mV

4000 MHz

1

12

850 μA

0.024414063 %

1.1 V

Offset Binary, 2's Complement Binary

85 °C (185 °F)

-800 mV

Serial

-40 °C (-40 °F)

Tin Lead

Track

Bottom

R-PBGA-B144

3

Peak-to-peak input voltage range: 0.8 V

e0

235 °C (455 °F)

ADS52J91ZZE

Texas Instruments

Analog To Digital Converter, Proprietary Method

Ball

198

Rectangular

Plastic/Epoxy

32

Yes

2 V

65 MHz

1

14

0.018310547 %

1.8 V

Binary

70 °C (158 °F)

-2 V

Serial

0 °C (32 °F)

Tin Silver Copper

Bottom

R-PBGA-B198

3

Peak-to-peak input voltage range: 2 V

e1

30 s

260 °C (500 °F)

ADC08DJ5200RFAAV

Texas Instruments

Analog To Digital Converter, Pipelined

Ball

144

HFBGA

Square

Plastic/Epoxy

1

Yes

825 mV

1040 MHz

1

8

0.0390625 %

1.1 V

2’s Complement, Offset Binary

Grid Array, Heat Sink/Slug, Fine Pitch

BGA144,12X12,32

0.031 in (0.8 mm)

85 °C (185 °F)

-825 mV

Serial, Parallel, Word

-40 °C (-40 °F)

Tin Silver Copper

Track

Bottom

S-PBGA-B144

3

0.076 in (1.94 mm)

0.394 in (10 mm)

Peak-to-peak input voltage range: 0.825 V

e1

260 °C (500 °F)

0.394 in (10 mm)

ADC08DJ5200RFAAVT

Texas Instruments

Analog To Digital Converter, Pipelined

Ball

144

HFBGA

Square

Plastic/Epoxy

1

Yes

825 mV

1040 MHz

1

8

0.0390625 %

1.1 V

2’s Complement, Offset Binary

Grid Array, Heat Sink/Slug, Fine Pitch

BGA144,12X12,32

0.031 in (0.8 mm)

85 °C (185 °F)

-825 mV

Serial, Parallel, Word

-40 °C (-40 °F)

Tin Silver Copper

Track

Bottom

S-PBGA-B144

3

0.076 in (1.94 mm)

0.394 in (10 mm)

Peak-to-peak input voltage range: 0.825 V

e1

260 °C (500 °F)

0.394 in (10 mm)

ADC09SJ800AAVQ1

Texas Instruments

Analog To Digital Converter, Proprietary Method

Ball

144

FBGA

Square

Plastic/Epoxy

1

Yes

800 mV

800 MHz

1

AEC-Q100

9

0.09765 %

1.1 V

Offset Binary, 2's Complement Binary

Grid Array, Fine Pitch

BGA144,12X12,32

0.031 in (0.8 mm)

125 °C (257 °F)

-800 mV

Serial

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B144

3

0.076 in (1.94 mm)

0.394 in (10 mm)

Peak-to-peak input voltage range: 0.8 V

e1

30 s

260 °C (500 °F)

0.394 in (10 mm)

ADC09SJ800AAVTQ1

Texas Instruments

Analog To Digital Converter, Proprietary Method

Ball

144

FBGA

Square

Plastic/Epoxy

1

Yes

800 mV

800 MHz

1

AEC-Q100

9

0.09765 %

1.1 V

Offset Binary, 2's Complement Binary

Grid Array, Fine Pitch

BGA144,12X12,32

0.031 in (0.8 mm)

125 °C (257 °F)

-800 mV

Serial

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B144

3

0.076 in (1.94 mm)

0.394 in (10 mm)

Peak-to-peak input voltage range: 0.8 V

e1

260 °C (500 °F)

0.394 in (10 mm)

ADC12DJ800AAVTQ1

Texas Instruments

Analog To Digital Converter, Proprietary Method

Ball

144

FBGA

Square

Plastic/Epoxy

2

Yes

800 mV

800 MHz

1

AEC-Q100

12

0.046386 %

1.1 V

2’s Complement, Offset Binary

Grid Array, Fine Pitch

BGA144,12X12,32

0.031 in (0.8 mm)

125 °C (257 °F)

-800 mV

Serial

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B144

3

0.076 in (1.94 mm)

0.394 in (10 mm)

Peak-to-peak input voltage range: 0.8 V

e1

260 °C (500 °F)

0.394 in (10 mm)

ADC09QJ800AAVQ1

Texas Instruments

Analog To Digital Converter, Proprietary Method

Ball

144

FBGA

Square

Plastic/Epoxy

4

Yes

800 mV

800 MHz

1

AEC-Q100

9

0.09765 %

1.1 V

Offset Binary, 2's Complement Binary

Grid Array, Fine Pitch

BGA144,12X12,32

0.031 in (0.8 mm)

125 °C (257 °F)

-800 mV

Serial

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B144

3

0.076 in (1.94 mm)

0.394 in (10 mm)

Peak-to-peak input voltage range: 0.8 V

e1

30 s

260 °C (500 °F)

0.394 in (10 mm)

ADC12SJ800AAVQ1

Texas Instruments

Analog To Digital Converter, Proprietary Method

Ball

144

FBGA

Square

Plastic/Epoxy

1

Yes

800 mV

800 MHz

1

AEC-Q100

12

0.046386 %

1.1 V

2’s Complement, Offset Binary

Grid Array, Fine Pitch

BGA144,12X12,32

0.031 in (0.8 mm)

125 °C (257 °F)

-800 mV

Serial

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B144

3

0.076 in (1.94 mm)

0.394 in (10 mm)

Peak-to-peak input voltage range: 0.8 V

e1

30 s

260 °C (500 °F)

0.394 in (10 mm)

ADC12QJ800AAVQ1

Texas Instruments

Analog To Digital Converter, Proprietary Method

Ball

144

FBGA

Square

Plastic/Epoxy

4

Yes

800 mV

800 MHz

1

AEC-Q100

12

0.046386 %

1.1 V

2’s Complement, Offset Binary

Grid Array, Fine Pitch

BGA144,12X12,32

0.031 in (0.8 mm)

125 °C (257 °F)

-800 mV

Serial

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B144

3

0.076 in (1.94 mm)

0.394 in (10 mm)

Peak-to-peak input voltage range: 0.8 V

e1

30 s

260 °C (500 °F)

0.394 in (10 mm)

ADC12QJ800AAVTQ1

Texas Instruments

Analog To Digital Converter, Proprietary Method

Ball

144

FBGA

Square

Plastic/Epoxy

4

Yes

800 mV

800 MHz

1

AEC-Q100

12

0.046386 %

1.1 V

2’s Complement, Offset Binary

Grid Array, Fine Pitch

BGA144,12X12,32

0.031 in (0.8 mm)

125 °C (257 °F)

-800 mV

Serial

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B144

3

0.076 in (1.94 mm)

0.394 in (10 mm)

Peak-to-peak input voltage range: 0.8 V

e1

260 °C (500 °F)

0.394 in (10 mm)

ADC12SJ800AAVTQ1

Texas Instruments

Analog To Digital Converter, Proprietary Method

Ball

144

FBGA

Square

Plastic/Epoxy

1

Yes

800 mV

800 MHz

1

AEC-Q100

12

0.046386 %

1.1 V

2’s Complement, Offset Binary

Grid Array, Fine Pitch

BGA144,12X12,32

0.031 in (0.8 mm)

125 °C (257 °F)

-800 mV

Serial

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B144

3

0.076 in (1.94 mm)

0.394 in (10 mm)

Peak-to-peak input voltage range: 0.8 V

e1

260 °C (500 °F)

0.394 in (10 mm)

ADC09QJ800AAVTQ1

Texas Instruments

Analog To Digital Converter, Proprietary Method

Ball

144

FBGA

Square

Plastic/Epoxy

4

Yes

800 mV

800 MHz

1

AEC-Q100

9

0.09765 %

1.1 V

Offset Binary, 2's Complement Binary

Grid Array, Fine Pitch

BGA144,12X12,32

0.031 in (0.8 mm)

125 °C (257 °F)

-800 mV

Serial

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B144

3

0.076 in (1.94 mm)

0.394 in (10 mm)

Peak-to-peak input voltage range: 0.8 V

e1

260 °C (500 °F)

0.394 in (10 mm)

ADC12DJ800AAVQ1

Texas Instruments

Analog To Digital Converter, Proprietary Method

Ball

144

FBGA

Square

Plastic/Epoxy

2

Yes

800 mV

800 MHz

1

AEC-Q100

12

0.046386 %

1.1 V

2’s Complement, Offset Binary

Grid Array, Fine Pitch

BGA144,12X12,32

0.031 in (0.8 mm)

125 °C (257 °F)

-800 mV

Serial

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B144

3

0.076 in (1.94 mm)

0.394 in (10 mm)

Peak-to-peak input voltage range: 0.8 V

e1

30 s

260 °C (500 °F)

0.394 in (10 mm)

AD4630-24BBCZ

Analog Devices

Analog To Digital Converter, Successive Approximation

Ball

64

FBGA

Square

Plastic/Epoxy

2

Yes

5.07 V

2 MHz

1

24

0.00009 %

1.8 V

Binary

Grid Array, Fine Pitch

BGA64,8X8,32

0.031 in (0.8 mm)

125 °C (257 °F)

-5.07 V

Serial

-40 °C (-40 °F)

Track

Bottom

300 ns

S-PBGA-B64

4

0.076 in (1.92 mm)

0.276 in (7 mm)

30 s

260 °C (500 °F)

0.276 in (7 mm)

ADC09SJ800AAVT

Texas Instruments

Analog To Digital Converter, Proprietary Method

Ball

144

FBGA

Square

Plastic/Epoxy

1

Yes

800 mV

800 MHz

1

9

0.09765 %

1.1 V

2’s Complement, Offset Binary

Grid Array, Fine Pitch

BGA144,12X12,32

0.031 in (0.8 mm)

85 °C (185 °F)

-800 mV

Serial

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B144

3

0.076 in (1.94 mm)

0.394 in (10 mm)

Peak-to-peak input voltage range: 0.8 V

e1

30 s

260 °C (500 °F)

0.394 in (10 mm)

ADC09QJ1300AAVT

Texas Instruments

Analog To Digital Converter, Proprietary Method

Ball

144

HFBGA

Square

Plastic/Epoxy

4

Yes

800 mV

1300 MHz

1

9

0.064453125 %

1.1 V

2’s Complement, Offset Binary

Grid Array, Heat Sink/Slug, Fine Pitch

BGA144,12X12,32

0.031 in (0.8 mm)

85 °C (185 °F)

-800 mV

Serial

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B144

3

0.076 in (1.94 mm)

0.394 in (10 mm)

Peak-to-peak input voltage range: 0.8 V

e1

30 s

260 °C (500 °F)

0.394 in (10 mm)

ADC09DJ800AAVT

Texas Instruments

Analog To Digital Converter, Proprietary Method

Ball

144

FBGA

Square

Plastic/Epoxy

2

Yes

800 mV

800 MHz

1

9

0.09765 %

1.1 V

2’s Complement, Offset Binary

Grid Array, Fine Pitch

BGA144,12X12,32

0.031 in (0.8 mm)

85 °C (185 °F)

-800 mV

Serial

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B144

3

0.076 in (1.94 mm)

0.394 in (10 mm)

Peak-to-peak input voltage range: 0.8 V

e1

30 s

260 °C (500 °F)

0.394 in (10 mm)

ADC09SJ1300AAVT

Texas Instruments

Analog To Digital Converter, Proprietary Method

Ball

144

HFBGA

Square

Plastic/Epoxy

1

Yes

800 mV

1300 MHz

1

9

0.064453125 %

1.1 V

2’s Complement, Offset Binary

Grid Array, Heat Sink/Slug, Fine Pitch

BGA144,12X12,32

0.031 in (0.8 mm)

85 °C (185 °F)

-800 mV

Serial

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B144

3

0.076 in (1.94 mm)

0.394 in (10 mm)

Peak-to-peak input voltage range: 0.8 V

e1

30 s

260 °C (500 °F)

0.394 in (10 mm)

ADC09SJ1300AAV

Texas Instruments

Analog To Digital Converter, Proprietary Method

Ball

144

HFBGA

Square

Plastic/Epoxy

1

Yes

800 mV

1300 MHz

1

9

0.064453125 %

1.1 V

2’s Complement, Offset Binary

Grid Array, Heat Sink/Slug, Fine Pitch

BGA144,12X12,32

0.031 in (0.8 mm)

85 °C (185 °F)

-800 mV

Serial

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B144

3

0.076 in (1.94 mm)

0.394 in (10 mm)

Peak-to-peak input voltage range: 0.8 V

e1

30 s

260 °C (500 °F)

0.394 in (10 mm)

ADC09QJ800AAVT

Texas Instruments

Analog To Digital Converter, Proprietary Method

Ball

144

FBGA

Square

Plastic/Epoxy

4

Yes

800 mV

800 MHz

1

9

0.09765 %

1.1 V

2’s Complement, Offset Binary

Grid Array, Fine Pitch

BGA144,12X12,32

0.031 in (0.8 mm)

85 °C (185 °F)

-800 mV

Serial

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B144

3

0.076 in (1.94 mm)

0.394 in (10 mm)

Peak-to-peak input voltage range: 0.8 V

e1

30 s

260 °C (500 °F)

0.394 in (10 mm)

ADC09QJ800AAV

Texas Instruments

Analog To Digital Converter, Proprietary Method

Ball

144

FBGA

Square

Plastic/Epoxy

4

Yes

800 mV

800 MHz

1

9

0.09765 %

1.1 V

2’s Complement, Offset Binary

Grid Array, Fine Pitch

BGA144,12X12,32

0.031 in (0.8 mm)

85 °C (185 °F)

-800 mV

Serial

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B144

3

0.076 in (1.94 mm)

0.394 in (10 mm)

Peak-to-peak input voltage range: 0.8 V

e1

30 s

260 °C (500 °F)

0.394 in (10 mm)

ADC09QJ1300AAV

Texas Instruments

Analog To Digital Converter, Proprietary Method

Ball

144

HFBGA

Square

Plastic/Epoxy

4

Yes

800 mV

1300 MHz

1

9

0.064453125 %

1.1 V

2’s Complement, Offset Binary

Grid Array, Heat Sink/Slug, Fine Pitch

BGA144,12X12,32

0.031 in (0.8 mm)

85 °C (185 °F)

-800 mV

Serial

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B144

3

0.076 in (1.94 mm)

0.394 in (10 mm)

Peak-to-peak input voltage range: 0.8 V

e1

30 s

260 °C (500 °F)

0.394 in (10 mm)

ADC09DJ1300AAVT

Texas Instruments

Analog To Digital Converter, Proprietary Method

Ball

144

HFBGA

Square

Plastic/Epoxy

2

Yes

800 mV

1300 MHz

1

9

0.064453125 %

1.1 V

2’s Complement, Offset Binary

Grid Array, Heat Sink/Slug, Fine Pitch

BGA144,12X12,32

0.031 in (0.8 mm)

85 °C (185 °F)

-800 mV

Serial

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B144

3

0.076 in (1.94 mm)

0.394 in (10 mm)

Peak-to-peak input voltage range: 0.8 V

e1

30 s

260 °C (500 °F)

0.394 in (10 mm)

ADC09DJ1300AAV

Texas Instruments

Analog To Digital Converter, Proprietary Method

Ball

144

HFBGA

Square

Plastic/Epoxy

2

Yes

800 mV

1300 MHz

1

9

0.064453125 %

1.1 V

2’s Complement, Offset Binary

Grid Array, Heat Sink/Slug, Fine Pitch

BGA144,12X12,32

0.031 in (0.8 mm)

85 °C (185 °F)

-800 mV

Serial

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B144

3

0.075 in (1.91 mm)

0.394 in (10 mm)

Peak-to-peak input voltage range: 0.8 V

e1

30 s

260 °C (500 °F)

0.394 in (10 mm)

Analog-to-Digital Converters

Analog-to-digital converters (ADCs) are electronic devices that convert continuous analog signals into digital signals, which can be processed by digital circuits, microcontrollers, or computers. ADCs are essential components in many electronic systems, as they allow the measurement and processing of physical signals, such as temperature, pressure, light, and sound.

ADCs work by sampling the analog signal at regular intervals and quantizing the sampled signal into a series of digital values. The sampling rate and the resolution of the ADC determine the accuracy and the bandwidth of the digital signal. ADCs may also include features such as amplification, filtering, or signal conditioning, to improve the accuracy and stability of the digital signal.

ADCs can be classified based on their architecture and their application. The most common types of ADCs are successive approximation ADCs, delta-sigma ADCs, and pipeline ADCs. Each type has its advantages and limitations, depending on the application and the required performance.

ADCs are used in a wide range of applications, from consumer electronics, such as smartphones and digital cameras, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of physical signals into digital signals, allowing the processing, storage, and transmission of data in electronic systems.

Overall, ADCs are essential components in many electronic systems, providing the necessary signal conversion for a wide range of applications. Their accuracy, speed, and resolution determine the performance and the functionality of many electronic devices and systems.