SQUARE Other Function Interface ICs 240

Reset All

Part	Manufacturer	Interface IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Display Mode	Surface Mount	Maximum Supply Voltage	No. of Functions	No. of Channels	Technology	Maximum Supply Current	Nominal Supply Voltage	Maximum Supply Voltage-1	Power Supplies (V)	Nominal Negative Supply Voltage	Package Style (Meter)	Package Equivalence Code	No. of Segments	Minimum Supply Voltage-1	No. of Backplanes	Sub-Category	Minimum Supply Voltage	Terminal Pitch	Maximum Operating Temperature	Nominal Supply Voltage-1	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
MAX3374EEBL	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	BALL	8	FBGA	SQUARE	PLASTIC/EPOXY		YES				BICMOS				1.8/5		GRID ARRAY, FINE PITCH	BGA8,3X3,20				Other Interface ICs		.5 mm	85 Cel		-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B8	1			Not Qualified		e0
MAX3376EEBL	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	BALL	8	FBGA	SQUARE	PLASTIC/EPOXY		YES				BICMOS				1.8/5		GRID ARRAY, FINE PITCH	BGA8,3X3,20				Other Interface ICs		.5 mm	85 Cel		-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B8	1			Not Qualified		e0
PCF8534AHL/1,518	NXP Semiconductors		INDUSTRIAL	GULL WING	80	QFP	SQUARE	PLASTIC/EPOXY	SEGMENT	YES				CMOS	.02 mA			2/5,3/6		FLATPACK	QFP80,.55SQ,20	60		4-BP	Other Interface ICs		.5 mm	85 Cel		-40 Cel		QUAD	S-PQFP-G80				Not Qualified
PCF8578HT/1,518	NXP Semiconductors		INDUSTRIAL	GULL WING	64	QFP	SQUARE	PLASTIC/EPOXY	SEGMENT	YES				CMOS	.05 mA			3/5		FLATPACK	TQFP64,.47SQ	32		32-BP	Other Interface ICs		.5 mm	85 Cel		-40 Cel		QUAD	S-PQFP-G64	3			Not Qualified				260
IP4853CX24/P,135	NXP Semiconductors		OTHER	BALL	24	FBGA	SQUARE	PLASTIC/EPOXY		YES						1.8 V		1.8		GRID ARRAY, FINE PITCH	BGA24,5X5,16				Other Interface ICs		.4 mm	85 Cel		-30 Cel		BOTTOM	S-PBGA-B24				Not Qualified
LC75852W-TLM-E	Onsemi		INDUSTRIAL	GULL WING	64	QFP	SQUARE	PLASTIC/EPOXY	SEGMENT	YES				CMOS	2.5 mA	5 V		5		FLATPACK	QFP64,.47SQ,20	43		2-BP	Other Interface ICs		.5 mm	85 Cel		-40 Cel	TIN BISMUTH	QUAD	S-PQFP-G64	4			Not Qualified		e6	30	260
LV5609LP-TE-L-E	Onsemi		COMMERCIAL EXTENDED	NO LEAD	24	QCCN	SQUARE	PLASTIC/EPOXY		YES				BICMOS		3.3 V		3.3		CHIP CARRIER	LCC24,.13SQ,20				Other Interface ICs		.5 mm	80 Cel		-20 Cel		QUAD	S-PQCC-N24	1			Not Qualified			30	260
DLPA200PFCT	Texas Instruments	INTERFACE CIRCUIT	COMMERCIAL EXTENDED	GULL WING	80	TFQFP	SQUARE	PLASTIC/EPOXY		YES	13.2 V	1				12 V				FLATPACK, THIN PROFILE, FINE PITCH						10.8 V	.5 mm	75 Cel		0 Cel		QUAD	S-PQFP-G80		1.2 mm	12 mm	Not Qualified			NOT SPECIFIED	NOT SPECIFIED	12 mm
DLPA200PFC	Texas Instruments	INTERFACE CIRCUIT	COMMERCIAL EXTENDED	GULL WING	80	TFQFP	SQUARE	PLASTIC/EPOXY		YES	13.2 V	1				12 V				FLATPACK, THIN PROFILE, FINE PITCH						10.8 V	.5 mm	75 Cel		0 Cel		QUAD	S-PQFP-G80	2	1.2 mm	12 mm	Not Qualified			30	260	12 mm
PCA9512BDP,118	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY		YES	5.5 V	1			3.6 mA	3.3 V		3/5		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP8,.19				Other Interface ICs	2.7 V	.65 mm	85 Cel		-40 Cel		DUAL	S-PDSO-G8	1	1.1 mm	3 mm	Not Qualified			30	260	3 mm
NCP1093MNRG	Onsemi	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	10	HVSON	SQUARE	PLASTIC/EPOXY		YES	57 V	1								SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE						0 V	.5 mm	85 Cel		-40 Cel	MATTE TIN	DUAL	S-PDSO-N10	3	1 mm	3 mm	Not Qualified		e3	30	260	3 mm
NCP1094MNG	Onsemi	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	10	HVSON	SQUARE	PLASTIC/EPOXY		YES	57 V	1								SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE						0 V	.5 mm	85 Cel		-40 Cel		DUAL	S-PDSO-N10		1 mm	3 mm	Not Qualified					3 mm
NCP1094MNRG	Onsemi	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	10	HVSON	SQUARE	PLASTIC/EPOXY		YES	57 V	1								SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE						0 V	.5 mm	85 Cel		-40 Cel	MATTE TIN	DUAL	S-PDSO-N10	3	1 mm	3 mm	Not Qualified		e3	30	260	3 mm
TX517IZCQ	Texas Instruments	INTERFACE CIRCUIT	OTHER	BALL	144	BGA	SQUARE	PLASTIC/EPOXY		YES	5.25 V	1				2.5 V	5.25 V	+-5,2.5	-5 V	GRID ARRAY	BGA144(UNSPEC)		4.75 V		Other Interface ICs	2.38 V		85 Cel	5 V	0 Cel		BOTTOM	S-PBGA-B144	3		13 mm	Not Qualified			30	260	13 mm
MFRC52201HN1,151	NXP Semiconductors	INTERFACE CIRCUIT	OTHER	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY		YES	3.6 V	1				3.3 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE						2.5 V	.5 mm	85 Cel		-25 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	QUAD	S-PQCC-N32	1	1 mm	5 mm			e4	30	260	5 mm
PCA9701HF,118	NXP Semiconductors	INTERFACE CIRCUIT	AUTOMOTIVE	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY		YES	5.5 V	1				3.3 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE						2.5 V	.5 mm	125 Cel		-40 Cel	NICKEL PALLADIUM GOLD	QUAD	S-PQCC-N24	1	.8 mm	4 mm			e4	30	260	4 mm
TPS65155RKPR	Texas Instruments	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY		YES	6 V	1				5 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE						3 V	.4 mm	85 Cel		-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	QUAD	S-PQCC-N40	2	1 mm	5 mm			e4	NOT SPECIFIED	260	5 mm
LM8335TLE/NOPB	Texas Instruments	INTERFACE CIRCUIT	OTHER	BALL	16	VFBGA	SQUARE	PLASTIC/EPOXY		YES	3.6 V	1				1.8 V				GRID ARRAY, VERY THIN PROFILE, FINE PITCH						1.65 V	.5 mm	85 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B16	1	.675 mm	1.96 mm			e1	30	260	1.96 mm
HI-8425PQIF	Holt Integrated Circuits	INTERFACE CIRCUIT		GULL WING	44	QFP	SQUARE	PLASTIC/EPOXY		YES	5.5 V	1		SOI-CMOS		3.3 V				FLATPACK	QFP44,.5SQ,32					3 V	.8 mm	85 Cel		-40 Cel	Matte Tin (Sn)	QUAD	S-PQFP-G44	3	2.7 mm	10 mm			e3	40	260	10 mm
DRV2604YZFT	Texas Instruments	INTERFACE CIRCUIT	INDUSTRIAL	BALL	9	VFBGA	SQUARE	UNSPECIFIED		YES	5.5 V	1				3.6 V				GRID ARRAY, VERY THIN PROFILE, FINE PITCH						2.5 V	.5 mm	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	S-XBGA-B9	1	.625 mm	1.44 mm			e1	30	260	1.44 mm
ST8034HCQR	STMicroelectronics	INTERFACE CIRCUIT	OTHER	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED		YES	3.6 V	1				3.3 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE						2.7 V	.5 mm	85 Cel		-25 Cel		QUAD	S-XQCC-N24		1 mm	4 mm				NOT SPECIFIED	NOT SPECIFIED	4 mm
DS110DF111SQE/NOPB	Texas Instruments	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY		YES	2.625 V	1	2			2.5 V	3.6 V			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20		3 V			2.375 V	.5 mm	85 Cel	3.3 V	-40 Cel	MATTE TIN	QUAD	S-PQCC-N24	3	.8 mm	4 mm		ALSO OPERATES WITH 3V TO 3.6V	e3	30	260	4 mm
PCA9509ADP,118	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY		YES	2 V	1				1.1 V				SMALL OUTLINE, THIN PROFILE, SHRINK PITCH						.8 V	.65 mm	85 Cel		-40 Cel		DUAL	S-PDSO-G8	1	1.1 mm	3 mm				30	260	3 mm
PCA9509AGM,125	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	BUTT	8	VBCC	SQUARE	PLASTIC/EPOXY		YES	2 V	1				1.1 V				CHIP CARRIER, VERY THIN PROFILE						.8 V	.5 mm	85 Cel		-40 Cel		BOTTOM	S-PBCC-B8	1	.5 mm	1.6 mm				30	260	1.6 mm
PCA9511ADMR2G	Onsemi	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY		YES	5.5 V	1								SMALL OUTLINE, THIN PROFILE, SHRINK PITCH						2.7 V	.65 mm	85 Cel		-40 Cel	TIN	DUAL	S-PDSO-G8	1	1.1 mm	3 mm			e3	30	260	3 mm
DRV2604LYZFR	Texas Instruments	INTERFACE CIRCUIT	INDUSTRIAL	BALL	9	VFBGA	SQUARE	UNSPECIFIED		YES	5.2 V	1				3.6 V				GRID ARRAY, VERY THIN PROFILE, FINE PITCH						2 V	.5 mm	85 Cel		-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	S-XBGA-B9	1	.625 mm	1.44 mm			e1	30	260	1.44 mm
DRV2604LYZFT	Texas Instruments	INTERFACE CIRCUIT	INDUSTRIAL	BALL	9	VFBGA	SQUARE	UNSPECIFIED		YES	5.2 V	1				3.6 V				GRID ARRAY, VERY THIN PROFILE, FINE PITCH						2 V	.5 mm	85 Cel		-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	S-XBGA-B9	1	.625 mm	1.44 mm			e1	30	260	1.44 mm
L99DZ81EPTR	STMicroelectronics	INTERFACE CIRCUIT		GULL WING	64	HTFQFP	SQUARE	PLASTIC/EPOXY		YES	5.5 V	1				5 V	28 V			FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH			5 V			4.5 V	.5 mm		13.5 V			QUAD	S-PQFP-G64	3	1.2 mm	10 mm						10 mm
L99DZ81EP	STMicroelectronics	INTERFACE CIRCUIT		GULL WING	64	HTFQFP	SQUARE	PLASTIC/EPOXY		YES	5.5 V	1				5 V	28 V			FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH			5 V			4.5 V	.5 mm		13.5 V			QUAD	S-PQFP-G64	3	1.2 mm	10 mm						10 mm
ST8034CQR	STMicroelectronics	INTERFACE CIRCUIT		NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED		YES	5.5 V	1				3.3 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC16,.12SQ,20					2.7 V	.5 mm	85 Cel		-25 Cel		QUAD	S-XQCC-N16		.8 mm	2.9 mm				NOT SPECIFIED	NOT SPECIFIED	2.9 mm
SEC1110-A5-02-TR	Microchip Technology	INTERFACE CIRCUIT		NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED		YES	5.5 V	1				5 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC16,.2SQ,32					3.6 V	.8 mm	70 Cel		0 Cel	MATTE TIN	QUAD	S-XQCC-N16		1 mm	5 mm						5 mm
SEC1210-CN-02-TR	Microchip Technology	INTERFACE CIRCUIT		NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED		YES	5.5 V	1				5 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.2SQ,25					3.6 V	.65 mm	70 Cel		0 Cel	MATTE TIN	QUAD	S-XQCC-N24		1 mm	5 mm						5 mm
SEC1210-CN-02NC-TR	Microchip Technology	INTERFACE CIRCUIT		NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED		YES	5.5 V	1				5 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.2SQ,25					3.6 V	.65 mm	70 Cel		0 Cel	MATTE TIN	QUAD	S-XQCC-N24		1 mm	5 mm						5 mm
SEC1210-CN-02NC	Microchip Technology	INTERFACE CIRCUIT		NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED		YES	5.5 V	1				5 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.2SQ,25					3.6 V	.65 mm	70 Cel		0 Cel	MATTE TIN	QUAD	S-XQCC-N24		1 mm	5 mm						5 mm
SEC1210-CN-02	Microchip Technology	INTERFACE CIRCUIT		NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED		YES	5.5 V	1				5 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.2SQ,25					3.6 V	.65 mm	70 Cel		0 Cel	MATTE TIN	QUAD	S-XQCC-N24		1 mm	5 mm						5 mm
ADN2531ACPZ	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED		YES	3.6 V	1				3.3 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE						3 V	.5 mm	100 Cel		-40 Cel	Tin (Sn)	QUAD	S-XQCC-N16	3	.9 mm	3 mm			e3	30	260	3 mm
ADN2873ACPZ-R7	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED		YES	3.6 V	1				3.3 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE						3 V	.5 mm	85 Cel		-40 Cel	MATTE TIN	QUAD	S-XQCC-N24	3	1 mm	4 mm			e3	30	260	4 mm
LC898119XC-MH	Onsemi	INTERFACE CIRCUIT		BALL	25	VFBGA	SQUARE	PLASTIC/EPOXY		YES	3.6 V	1		CMOS		3 V	3.6 V			GRID ARRAY, VERY THIN PROFILE, FINE PITCH			2.6 V			2.6 V	.4 mm				TIN SILVER COPPER	BOTTOM	S-PBGA-B25	1	.675 mm	2 mm			e1	30	260	2 mm
DLPA200PFP	Texas Instruments	INTERFACE CIRCUIT	COMMERCIAL EXTENDED	GULL WING	80	HTFQFP	SQUARE	PLASTIC/EPOXY		YES	13.2 V	1				12 V				FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH						10.8 V	.5 mm	75 Cel		0 Cel		QUAD	S-PQFP-G80		1.2 mm	12 mm				NOT SPECIFIED	NOT SPECIFIED	12 mm
MAX3735AEGG	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED		YES	3.63 V	1		BIPOLAR		3.3 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE						2.97 V	.5 mm	85 Cel		-40 Cel	TIN LEAD	QUAD	S-XQCC-N24	1	1 mm	4 mm			e0			4 mm
L9660TR	STMicroelectronics	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY		YES	5.1 V	1				5 V				FLATPACK, LOW PROFILE, FINE PITCH						4.9 V	.5 mm	95 Cel		-40 Cel	MATTE TIN	QUAD	S-PQFP-G64	3	1.6 mm	10 mm			e3		260	10 mm
L9660	STMicroelectronics	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY		YES	5.1 V	1				5 V				FLATPACK, LOW PROFILE, FINE PITCH						4.9 V	.5 mm	95 Cel		-40 Cel		QUAD	S-PQFP-G64		1.6 mm	10 mm				NOT SPECIFIED	NOT SPECIFIED	10 mm
PCA9614DP,118	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY		YES	5.5 V	1				3.3 V	5.5 V			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			3 V			2.3 V	.5 mm	85 Cel	5 V	-40 Cel		DUAL	S-PDSO-G10	1	1.1 mm	3 mm					260	3 mm
MAX3667ECJ	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	32	LQFP	SQUARE	PLASTIC/EPOXY		YES	3.465 V	1		BIPOLAR		3.3 V		3.3/5		FLATPACK, LOW PROFILE	QFP32,.35SQ,32				Display Drivers	3.135 V	.8 mm	85 Cel		-40 Cel	TIN LEAD	QUAD	S-PQFP-G32	1	1.6 mm	7 mm	Not Qualified	CAN ALSO OPERATE WITH A 5V SUPPLY	e0			7 mm
MAX253CUA	Maxim Integrated	INTERFACE CIRCUIT	COMMERCIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY		YES	5.5 V	1		CMOS		5 V		5		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP8,.19				Other Interface ICs	4.5 V	.65 mm	70 Cel		0 Cel	TIN LEAD	DUAL	S-PDSO-G8	1	1.1 mm	3 mm	Not Qualified		e0	20	240	3 mm
MAX3867ECM	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY		YES	5.5 V	1		BIPOLAR		3.3 V		3.3/5		FLATPACK, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20				Display Drivers	3.14 V	.5 mm	85 Cel		-40 Cel	TIN LEAD	QUAD	S-PQFP-G48	1	1.6 mm	7 mm	Not Qualified		e0			7 mm
PCA9306AMUTCG	Onsemi	INTERFACE CIRCUIT	MILITARY	NO LEAD	8	VQCCN	SQUARE	UNSPECIFIED		YES		1								CHIP CARRIER	LCC8,.06SQ,20				Other Interface ICs		.5 mm	125 Cel		-55 Cel	NICKEL GOLD PALLADIUM	QUAD	S-XQCC-N8	1	.6 mm	1.6 mm	Not Qualified			30	260	1.6 mm
PCA9655EMTTXG	Onsemi	INTERFACE CIRCUIT	MILITARY	NO LEAD	24	HVQCCN	SQUARE	PLASTIC/EPOXY		YES	5.5 V	1				2.3 V				SMALL OUTLINE						1.65 V	.5 mm	125 Cel		-55 Cel	MATTE TIN	DUAL	S-PDSO-N24	1	.8 mm	4 mm	Not Qualified		e3	30	260	4 mm

Other Function Interface ICs

Other function interface ICs are electronic components that provide specific functions for interfacing different devices in electronic systems. They are designed to facilitate the exchange of data and signals between various components of the system.

Other function interface ICs can be classified into several types based on their specific functions and applications. Some of the most common types of interface ICs include:

1. Voltage level translators - These ICs are used to convert voltage levels between different devices in electronic systems, ensuring that signals are compatible and can be correctly interpreted.

2. Real-time clock (RTC) ICs - These ICs are used to keep track of time and date in electronic systems, and they typically include a battery backup to ensure that the clock remains accurate even if the main power supply is lost.

3. Touchscreen controllers - These ICs are used to interface with touchscreens and enable touch-based input in electronic systems.

Other function interface ICs can also include USB controllers, Ethernet controllers, and Bluetooth controllers, among other components. They are typically characterized by their data rate, power consumption, and specific functions.