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Part RoHS Manufacturer Interface IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Display Mode Surface Mount Maximum Supply Voltage Maximum Output Current No. of Functions No. of Channels Technology Screening Level No. of Bits Built-in Protections Interface Standard Maximum Supply Current No. of Digits/Characters Output Latch/Register Nominal Supply Voltage Maximum Supply Voltage-1 Turn-on Time Power Supplies (V) Nominal Negative Supply Voltage Maximum Delay Package Style (Meter) Package Equivalence Code No. of Segments Minimum Supply Voltage-1 No. of Backplanes Sub-Category Minimum Supply Voltage Terminal Pitch Maximum Operating Temperature Nominal Supply Voltage-1 Output Characteristics Minimum Operating Temperature Driver No. of Bits Terminal Finish Terminal Position JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Nominal Output Peak Current Limit Width Turn-off Time Qualification Output Polarity Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Maximum Receive Delay

MC33SB0400ES

NXP Semiconductors

INTERFACE CIRCUIT

AUTOMOTIVE

NO LEAD

48

HQCCN

SQUARE

UNSPECIFIED

YES

5.25 V

1

MOS

5 V

CHIP CARRIER, HEAT SINK/SLUG

4.75 V

125 Cel

-40 Cel

TIN

QUAD

S-XQCC-N48

3

e3

40

260

PI3EQX4951STZDE

Diodes Incorporated

INTERFACE CIRCUIT

COMMERCIAL

NO LEAD

20

HVQCCN

SQUARE

UNSPECIFIED

YES

3.6 V

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

3 V

.5 mm

70 Cel

0 Cel

QUAD

S-XQCC-N20

.8 mm

4 mm

4 mm

IP4856CX25/CZ

Nexperia

INTERFACE CIRCUIT

INDUSTRIAL

BALL

25

VFBGA

SQUARE

PLASTIC/EPOXY

YES

3.6 V

1

1.8 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

1.7 V

.4 mm

85 Cel

-40 Cel

BOTTOM

S-PBGA-B25

1

.55 mm

2.05 mm

VSUPPLY VOLTAGE IS FROM 2.8 TO 3.6

30

260

2.05 mm

IP4855CX25/CAZ

Nexperia

INTERFACE CIRCUIT

INDUSTRIAL

BALL

25

VFBGA

SQUARE

PLASTIC/EPOXY

YES

3.6 V

1

1.8 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

1.1 V

.4 mm

85 Cel

-40 Cel

BOTTOM

S-PBGA-B25

.5 mm

2.04 mm

VSUPPLY VOLTAGE IS FROM 2.5 TO 5.5

NOT SPECIFIED

NOT SPECIFIED

2.04 mm

IP4855CX25Z

Nexperia

INTERFACE CIRCUIT

INDUSTRIAL

BALL

25

VFBGA

SQUARE

PLASTIC/EPOXY

YES

3.6 V

1

1.8 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

1.1 V

.4 mm

85 Cel

-40 Cel

BOTTOM

S-PBGA-B25

.5 mm

2.04 mm

VSUPPLY VOLTAGE IS FROM 2.5 TO 5.5

NOT SPECIFIED

NOT SPECIFIED

2.04 mm

TPD2S701QDSKRQ1

Texas Instruments

INTERFACE CIRCUIT

AUTOMOTIVE

NO LEAD

10

HVSON

SQUARE

PLASTIC/EPOXY

YES

7 V

1

AEC-Q100

5 V

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

4.5 V

.5 mm

125 Cel

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

S-PDSO-N10

2

.8 mm

2.5 mm

e4

30

260

2.5 mm

TLE9263QXV33XUMA1

Infineon Technologies

INTERFACE CIRCUIT

NO LEAD

48

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

28 V

1

AEC-Q100

13.5 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

5.5 V

.5 mm

QUAD

S-PQCC-N48

3

.9 mm

7 mm

7 mm

MADR-009150

M/a-com Technology Solutions

INTERFACE CIRCUIT

INDUSTRIAL

NO LEAD

16

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

3.6 V

1

GENERAL PURPOSE

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC16,.12SQ,20

3 V

.5 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

S-PQCC-N16

1

1 mm

3 mm

e4

3 mm

DS250DF410ABMR

Texas Instruments

INTERFACE CIRCUIT

INDUSTRIAL

BALL

101

TFBGA

SQUARE

PLASTIC/EPOXY

YES

1

4

GRID ARRAY, THIN PROFILE, FINE PITCH

.5 mm

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

S-PBGA-B101

3

1.03 mm

6 mm

e1

30

260

6 mm

DS250DF410ABMT

Texas Instruments

INTERFACE CIRCUIT

INDUSTRIAL

BALL

101

TFBGA

SQUARE

PLASTIC/EPOXY

YES

1

4

GRID ARRAY, THIN PROFILE, FINE PITCH

.5 mm

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

S-PBGA-B101

3

1.03 mm

6 mm

e1

30

260

6 mm

TLE9260QXXUMA1

Infineon Technologies

INTERFACE CIRCUIT

NO LEAD

48

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

28 V

1

AEC-Q100

13.5 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

5.5 V

.5 mm

QUAD

S-PQCC-N48

.9 mm

7 mm

7 mm

TLE9260QXXUMA2

Infineon Technologies

INTERFACE CIRCUIT

NO LEAD

48

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

28 V

1

AEC-Q100

13.5 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

5.5 V

.5 mm

QUAD

S-PQCC-N48

3

.9 mm

7 mm

7 mm

TLE9262QXV33XUMA1

Infineon Technologies

INTERFACE CIRCUIT

NO LEAD

48

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

28 V

1

AEC-Q100

13.5 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

5.5 V

.5 mm

QUAD

S-PQCC-N48

.9 mm

7 mm

NOT SPECIFIED

NOT SPECIFIED

7 mm

TLE9262QXXUMA1

Infineon Technologies

INTERFACE CIRCUIT

NO LEAD

48

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

28 V

1

AEC-Q100

13.5 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

5.5 V

.5 mm

QUAD

S-PQCC-N48

.9 mm

7 mm

7 mm

TLE9263QXXUMA1

Infineon Technologies

INTERFACE CIRCUIT

NO LEAD

48

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

28 V

1

AEC-Q100

13.5 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

5.5 V

.5 mm

QUAD

S-PQCC-N48

.9 mm

7 mm

7 mm

TLE92623QXV33XUMA1

Infineon Technologies

INTERFACE CIRCUIT

NO LEAD

48

HVQCCN

SQUARE

UNSPECIFIED

YES

28 V

1

AEC-Q100

13.5 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

5.5 V

.5 mm

QUAD

S-XQCC-N48

.9 mm

7 mm

NOT SPECIFIED

NOT SPECIFIED

7 mm

TLE92623QXXUMA2

Infineon Technologies

INTERFACE CIRCUIT

NO LEAD

48

HVQCCN

SQUARE

UNSPECIFIED

YES

28 V

1

AEC-Q100

13.5 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

5.5 V

.5 mm

QUAD

S-XQCC-N48

.9 mm

7 mm

NOT SPECIFIED

NOT SPECIFIED

7 mm

TLE92633QXV33XUMA1

Infineon Technologies

INTERFACE CIRCUIT

NO LEAD

48

HVQCCN

SQUARE

UNSPECIFIED

YES

28 V

1

AEC-Q100

13.5 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

5.5 V

.5 mm

QUAD

S-XQCC-N48

.9 mm

7 mm

NOT SPECIFIED

NOT SPECIFIED

7 mm

TLE92633BQXV33XUMA1

Infineon Technologies

INTERFACE CIRCUIT

NO LEAD

48

HVQCCN

SQUARE

UNSPECIFIED

YES

28 V

1

AEC-Q100

13.5 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

5.5 V

.5 mm

TIN

QUAD

S-XQCC-N48

3

.9 mm

7 mm

e3

7 mm

TLE92633BQXXUMA1

Infineon Technologies

INTERFACE CIRCUIT

NO LEAD

48

HVQCCN

SQUARE

UNSPECIFIED

YES

28 V

1

AEC-Q100

13.5 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

5.5 V

.5 mm

TIN

QUAD

S-XQCC-N48

3

.9 mm

7 mm

e3

7 mm

PI2EQX6814NJEX

Diodes Incorporated

INTERFACE CIRCUIT

INDUSTRIAL

BALL

100

LBGA

SQUARE

PLASTIC/EPOXY

YES

1.26 V

1

1.2 V

GRID ARRAY, LOW PROFILE

BGA100,10X10,40

1.14 V

1 mm

85 Cel

-40 Cel

BOTTOM

S-PBGA-B100

1.7 mm

11 mm

11 mm

PI2EQX6814NJE

Diodes Incorporated

INTERFACE CIRCUIT

INDUSTRIAL

BALL

100

LBGA

SQUARE

PLASTIC/EPOXY

YES

1.26 V

1

1.2 V

GRID ARRAY, LOW PROFILE

BGA100,10X10,40

1.14 V

1 mm

85 Cel

-40 Cel

BOTTOM

S-PBGA-B100

1.7 mm

11 mm

11 mm

PI3EQX6801ZDEX

Diodes Incorporated

INTERFACE CIRCUIT

INDUSTRIAL

NO LEAD

20

HVQCCN

SQUARE

UNSPECIFIED

YES

1.575 V

1

1.5 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

1.425 V

.5 mm

85 Cel

-40 Cel

Nickel/Palladium/Gold (Ni/Pd/Au)

QUAD

S-XQCC-N20

1

.8 mm

4 mm

ALSO OPERATE WITH 3.3V SUPPLY

e4

30

260

4 mm

PR5331C3HN/C370Y

NXP Semiconductors

INTERFACE CIRCUIT

NO LEAD

40

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

3.6 V

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC40,.24SQ,20

2.5 V

.5 mm

85 Cel

-30 Cel

QUAD

S-PQCC-N40

2

1 mm

6 mm

260

6 mm

PTN5110HQZ

NXP Semiconductors

INTERFACE CIRCUIT

NO LEAD

16

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

5.5 V

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC16,.1SQ,16

2.7 V

.4 mm

85 Cel

-40 Cel

QUAD

S-PQCC-N16

1

.4 mm

2.6 mm

260

2.6 mm

PTN5110THQZ

NXP Semiconductors

INTERFACE CIRCUIT

NO LEAD

16

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

5.5 V

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC16,.1SQ,16

2.7 V

.4 mm

85 Cel

-40 Cel

QUAD

S-PQCC-N16

1

.4 mm

2.6 mm

260

2.6 mm

TDA8026ET/C3K

NXP Semiconductors

INTERFACE CIRCUIT

BALL

64

TFBGA

SQUARE

PLASTIC/EPOXY

YES

5.5 V

1

3.3 V

GRID ARRAY, THIN PROFILE, FINE PITCH

BGA64,8X8,32

2.7 V

.8 mm

85 Cel

-25 Cel

BOTTOM

S-PBGA-B64

2

1.2 mm

7 mm

260

7 mm

2746595

Phoenix Contact

INTERFACE CIRCUIT

INDUSTRIAL

GULL WING

44

QFP

SQUARE

PLASTIC/EPOXY

YES

5.5 V

1

5 V

FLATPACK

4.5 V

85 Cel

-40 Cel

QUAD

S-PQFP-G44

NOT SPECIFIED

NOT SPECIFIED

DS150DF1610FB/NOPB

Texas Instruments

INTERFACE CIRCUIT

OTHER

BALL

196

BGA

SQUARE

PLASTIC/EPOXY

YES

2.625 V

1

16

2.5 V

GRID ARRAY

2.375 V

1 mm

85 Cel

-10 Cel

TIN SILVER COPPER

BOTTOM

S-PBGA-B196

4

2.94 mm

15.05 mm

e1

30

245

15.05 mm

DS250DF210ABMR

Texas Instruments

INTERFACE CIRCUIT

INDUSTRIAL

BALL

101

TFBGA

SQUARE

PLASTIC/EPOXY

YES

1

2

GRID ARRAY, THIN PROFILE, FINE PITCH

.5 mm

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

S-PBGA-B101

3

1.03 mm

6 mm

e1

30

260

6 mm

MC33SB0401ES

NXP Semiconductors

INTERFACE CIRCUIT

NO LEAD

48

HVQCCN

SQUARE

UNSPECIFIED

YES

20 V

1

SMARTMOS

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC48(UNSPEC)

6 V

125 Cel

-40 Cel

TIN

QUAD

S-XQCC-N48

3

e3

40

260

PR5331C3HN/C360,518

NXP Semiconductors

INTERFACE CIRCUIT

OTHER

NO LEAD

40

HQCCN

SQUARE

PLASTIC/EPOXY

YES

3.6 V

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG

2.5 V

85 Cel

-30 Cel

QUAD

S-PQCC-N40

PM8562B-F3EI

Microchip Technology

INTERFACE CIRCUIT

SQUARE

UNSPECIFIED

1

TIN SILVER COPPER

e1

TSB41BA3FTPFPEP

Texas Instruments

INTERFACE CIRCUIT

INDUSTRIAL

GULL WING

80

HTFQFP

SQUARE

PLASTIC/EPOXY

YES

2 V

1

1.85 V

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

QFP80,.55SQ,20

1.75 V

.5 mm

110 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

S-PQFP-G80

3

1.2 mm

12 mm

e4

30

260

12 mm

TSB82AF15TPZTEP

Texas Instruments

INTERFACE CIRCUIT

INDUSTRIAL

GULL WING

100

TFQFP

SQUARE

PLASTIC/EPOXY

YES

1.6 V

1

1.5 V

FLATPACK, THIN PROFILE, FINE PITCH

TQFP100,.63SQ

1.4 V

.5 mm

110 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

S-PQFP-G100

3

1.2 mm

14 mm

e4

30

260

14 mm

SN65DSI86ZXHR

Texas Instruments

INTERFACE CIRCUIT

INDUSTRIAL

BALL

64

VFBGA

SQUARE

PLASTIC/EPOXY

YES

1.26 V

1

1.2 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA64,9X9,20

1.14 V

.5 mm

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

S-PBGA-B64

3

1 mm

5 mm

30

260

5 mm

TUSB216IRWBT

Texas Instruments

INTERFACE CIRCUIT

INDUSTRIAL

NO LEAD

12

VQCCN

SQUARE

PLASTIC/EPOXY

YES

6.5 V

1

1

36 mA

5 V

CHIP CARRIER, VERY THIN PROFILE

LCC12,.062SQ,16

2.3 V

.4 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

S-PQCC-N12

2

.4 mm

1.6 mm

e4

30

260

1.6 mm

2988117

Phoenix Contact

DIGITAL I/O MODULE

INDUSTRIAL

GULL WING

64

SQUARE

PLASTIC/EPOXY

YES

3.63 V

1

3.3 V

2.97 V

85 Cel

-40 Cel

QUAD

S-PQFP-G64

PI6ULS5V9617BUEX

Diodes Incorporated

INTERFACE CIRCUIT

INDUSTRIAL

GULL WING

8

TSSOP

SQUARE

PLASTIC/EPOXY

YES

5.5 V

1

CMOS

.95 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP8,.19

.6 V

.65 mm

85 Cel

-40 Cel

DUAL

S-PDSO-G8

1.1 mm

3 mm

IT ALSO REQUIRES 2.2 TO 5.5 V

3 mm

TC9595XBG(EL)

Toshiba

INTERFACE CIRCUIT

BALL

80

SQUARE

PLASTIC/EPOXY

YES

1

BOTTOM

S-PBGA-B80

TUSB216RWBTQ1

Texas Instruments

INTERFACE CIRCUIT

NO LEAD

12

VQCCN

SQUARE

PLASTIC/EPOXY

YES

6.5 V

1

1

AEC-Q100

36 mA

5 V

CHIP CARRIER, VERY THIN PROFILE

LCC12,.06SQ,16

2.3 V

.4 mm

105 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

S-PQCC-N12

2

.4 mm

1.6 mm

e4

260

1.6 mm

TCA9537DGSR

Texas Instruments

INTERFACE CIRCUIT

GULL WING

10

SOP

SQUARE

PLASTIC/EPOXY

YES

5.5 V

1

1.8 V

SMALL OUTLINE

1.65 V

.5 mm

125 Cel

-40 Cel

MATTE TIN

DUAL

S-PDSO-G10

1

1.1 mm

3 mm

e3

260

3 mm

TLE9274QXXUMA2

Infineon Technologies

INTERFACE CIRCUIT

NO LEAD

48

HVQCCN

SQUARE

UNSPECIFIED

YES

28 V

1

AEC-Q100

13.5 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC48,.27SQ,20

4.5 V

.5 mm

150 Cel

-40 Cel

TIN

QUAD

S-XQCC-N48

3

.9 mm

7 mm

e3

7 mm

HDL6M05585

Ablic

ULTRASOUND PULSER

NO LEAD

68

HVQCCN

SQUARE

UNSPECIFIED

YES

5.25 V

1

SOI-CMOS

1.8 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC68,.4SQ,20

1.7 V

.5 mm

75 Cel

0 Cel

QUAD

S-XQCC-N68

.95 mm

10.2 mm

Operating Supply in Clock mode is 2.4V to 3.6V

260

10.2 mm

PI3EQX501IZAEX

Diodes Incorporated

INTERFACE CIRCUIT

NO LEAD

8

HVSON

SQUARE

PLASTIC/EPOXY

YES

3.6 V

1

3.3 V

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

SOLCC8,.08,20

3 V

.5 mm

85 Cel

-40 Cel

DUAL

S-PDSO-N8

.8 mm

2 mm

2 mm

PTN5110NTHQZ

NXP Semiconductors

INTERFACE CIRCUIT

NO LEAD

16

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

5.5 V

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC16,.1SQ,16

2.7 V

.4 mm

85 Cel

-40 Cel

TIN

QUAD

S-PQCC-N16

1

.4 mm

2.6 mm

e3

30

260

2.6 mm

DS560DF410AMNR

Texas Instruments

INTERFACE CIRCUIT

BALL

81

SQUARE

PLASTIC/EPOXY

YES

4

4

1.2 V

BGA81(UNSPEC)

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

S-PBGA-B81

3

IT ALSO HAS 1.8V SUPPLY VOLTAGE

e1

260

DS560DF410AMNT

Texas Instruments

INTERFACE CIRCUIT

BALL

81

SQUARE

PLASTIC/EPOXY

YES

4

4

1.2 V

BGA81(UNSPEC)

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

S-PBGA-B81

3

IT ALSO HAS 1.8V SUPPLY VOLTAGE

e1

260

Other Function Interface ICs

Other function interface ICs are electronic components that provide specific functions for interfacing different devices in electronic systems. They are designed to facilitate the exchange of data and signals between various components of the system.

Other function interface ICs can be classified into several types based on their specific functions and applications. Some of the most common types of interface ICs include:

1. Voltage level translators - These ICs are used to convert voltage levels between different devices in electronic systems, ensuring that signals are compatible and can be correctly interpreted.

2. Real-time clock (RTC) ICs - These ICs are used to keep track of time and date in electronic systems, and they typically include a battery backup to ensure that the clock remains accurate even if the main power supply is lost.

3. Touchscreen controllers - These ICs are used to interface with touchscreens and enable touch-based input in electronic systems.

Other function interface ICs can also include USB controllers, Ethernet controllers, and Bluetooth controllers, among other components. They are typically characterized by their data rate, power consumption, and specific functions.