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Part	Manufacturer	Interface IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	No. of Functions	No. of Channels	Technology	Maximum Supply Current	Nominal Supply Voltage	Maximum Supply Voltage-1	Power Supplies (V)	Nominal Negative Supply Voltage	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage-1	Sub-Category	Minimum Supply Voltage	Terminal Pitch	Maximum Operating Temperature	Nominal Supply Voltage-1	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
MAX3261CCJ	Maxim Integrated	INTERFACE CIRCUIT	COMMERCIAL	GULL WING	32	TFQFP	SQUARE	PLASTIC/EPOXY	YES	5.25 V	1		BIPOLAR		5 V		5		FLATPACK, THIN PROFILE, FINE PITCH	QFP32,.35SQ,32		Display Drivers	4.75 V	.5 mm	70 Cel		0 Cel	TIN LEAD	QUAD	S-PQFP-G32	1	1.2 mm	5 mm	Not Qualified		e0			5 mm
SN75DP120RHHT	Texas Instruments	INTERFACE CIRCUIT	OTHER	NO LEAD	36	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V	1	1			3.3 V		1.8/3.3,3.3		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC36,.25SQ,20		Line Driver or Receivers	3 V	.5 mm	85 Cel		0 Cel	NICKEL PALLADIUM GOLD	QUAD	S-PQCC-N36	3	1 mm	6 mm	Not Qualified		e4	30	260	6 mm
L9654TR	STMicroelectronics	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	5.1 V	1				5 V				FLATPACK, LOW PROFILE, FINE PITCH				4.9 V	.5 mm	95 Cel		-40 Cel		QUAD	S-PQFP-G48		1.6 mm	7 mm				NOT SPECIFIED	NOT SPECIFIED	7 mm
L9654	STMicroelectronics	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	5.1 V	1				5 V				FLATPACK, LOW PROFILE, FINE PITCH				4.9 V	.5 mm	95 Cel		-40 Cel		QUAD	S-PQFP-G48		1.6 mm	7 mm				NOT SPECIFIED	NOT SPECIFIED	7 mm
MAX3668EHJ	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	32	HTFQFP	SQUARE	PLASTIC/EPOXY	YES	3.6 V	1		BIPOLAR		3.3 V		3.3/5		FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH	TQFP32,.28SQ		Display Drivers	3.14 V	.5 mm	85 Cel		-40 Cel	TIN LEAD	QUAD	S-PQFP-G32	1	1.2 mm	5 mm	Not Qualified		e0			5 mm
AD53508JP	Analog Devices	INTERFACE CIRCUIT	OTHER	J BEND	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES	5.25 V	1				5 V	15.75 V		-10 V	CHIP CARRIER		14 V		4.75 V	1.27 mm	70 Cel	15 V	25 Cel	TIN LEAD	QUAD	S-PQCC-J44	5	4.57 mm	16.5862 mm	Not Qualified		e0		225	16.5862 mm
PCA9615DPJ	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1				3.3 V	5.5 V			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP10,.19,20	3 V		2.3 V	.5 mm	85 Cel	5 V	-40 Cel	NICKEL PALLADIUM GOLD SILVER	DUAL	S-PDSO-G10	1	1.1 mm	3 mm		ALSO REQUIRE VDDB SUPPLY FROM 3V TO 5.5V	e4	30	260	3 mm
PCA9521DP,118	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1		BIPOLAR		5 V		3/5		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP8,.19		Other Interface ICs	2.7 V	.65 mm	85 Cel		-40 Cel		DUAL	S-PDSO-G8		1.1 mm	3 mm	Not Qualified					3 mm
IP4855CX25/P,135	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	BALL	25	VFBGA	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1				4 V		3/5		GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA25,5X5,16		Level Translators	2.5 V	.4 mm	85 Cel		-40 Cel		BOTTOM	S-PBGA-B25		.5 mm	2.04 mm	Not Qualified					2.04 mm
PR5331C3HN/C350,55	NXP Semiconductors	INTERFACE CIRCUIT	OTHER	NO LEAD	40	HQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V	1				3.3 V				CHIP CARRIER, HEAT SINK/SLUG				2.5 V		85 Cel		-30 Cel		QUAD	S-PQCC-N40
PCA9522DP,118	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1		BIPOLAR		3.3 V		3/5		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP8,.19		Other Interface ICs	2.7 V	.65 mm	85 Cel		-40 Cel		DUAL	S-PDSO-G8		1.1 mm	3 mm	Not Qualified					3 mm
PR5331C3HN/C350,51	NXP Semiconductors	INTERFACE CIRCUIT	OTHER	NO LEAD	40	HQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V	1				3.3 V				CHIP CARRIER, HEAT SINK/SLUG				2.5 V		85 Cel		-30 Cel		QUAD	S-PQCC-N40
MAX3869EHJ	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	32	HTFQFP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1				3.3 V		3.3/5		FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH	TQFP32,.28SQ		Display Drivers	3.14 V	.5 mm	85 Cel		-40 Cel	TIN LEAD	QUAD	S-PQFP-G32	1	1.2 mm	5 mm	Not Qualified		e0			5 mm
MAX1740EUB	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	10	HTSSOP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1				3 V	5.5 V			SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH		1.425 V		2.25 V	.5 mm	85 Cel	1.8 V	-40 Cel	TIN LEAD	DUAL	S-PDSO-G10	1	1.1 mm	3 mm	Not Qualified		e0		245	3 mm
MAX1741EUB	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	10	HTSSOP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1				3 V	5.5 V			SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH		1.425 V		2.25 V	.5 mm	85 Cel	1.8 V	-40 Cel	TIN LEAD	DUAL	S-PDSO-G10	1	1.1 mm	3 mm	Not Qualified		e0		245	3 mm
MAX1840EUB	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	10	HTSSOP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1				1.8 V	5.5 V	1.8,1.8/5		SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH	TSSOP10,.19,20	1.4 V	Other Interface ICs	1.7 V	.5 mm	85 Cel	1.8 V	-40 Cel	TIN LEAD	DUAL	S-PDSO-G10	1	1.1 mm	3 mm	Not Qualified		e0		245	3 mm
NB7VPQ16MMNTXG	Onsemi	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	2.625 V	1				1.8 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE				1.71 V	.5 mm	85 Cel		-40 Cel	NICKEL GOLD PALLADIUM	QUAD	S-XQCC-N16	1	1 mm	3 mm	Not Qualified					3 mm
MAX3982UTE-T	Maxim Integrated	INTERFACE CIRCUIT	OTHER	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	3.6 V	1		BIPOLAR		3.3 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE				3 V	.5 mm	85 Cel		0 Cel	TIN LEAD	QUAD	S-XQCC-N16	1	.8 mm	3 mm	Not Qualified		e0			3 mm
HCTL-2017-PLC	Broadcom	INTERFACE CIRCUIT	INDUSTRIAL	J BEND	20	QCCJ	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1		CMOS		5 V		5		CHIP CARRIER	LDCC20,.4SQ		Other Interface ICs	4.5 V	1.27 mm	85 Cel		-40 Cel	MATTE TIN	QUAD	S-PQCC-J20	3	4.572 mm	8.94 mm	Not Qualified		e3		260	8.94 mm
HCTL-2021-PLC	Broadcom	INTERFACE CIRCUIT	INDUSTRIAL	J BEND	20	QCCJ	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1		CMOS		5 V		5		CHIP CARRIER	LDCC20,.4SQ		Other Interface ICs	4.5 V	1.27 mm	85 Cel		-40 Cel	MATTE TIN	QUAD	S-PQCC-J20	3	4.572 mm	8.94 mm	Not Qualified		e3		260	8.94 mm
MAX3646ETG-T	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	3.63 V	1		BIPOLAR		3.3 V		3.3		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20		Display Drivers	2.97 V	.5 mm	85 Cel		-40 Cel	TIN LEAD	QUAD	S-XQCC-N24	1	.8 mm	4 mm	Not Qualified		e0			4 mm
MAX13005EEBE-T	Maxim Integrated	INTERFACE CIRCUIT	INDUSTRIAL	BALL	16	VFBGA	SQUARE	PLASTIC/EPOXY	YES	3.6 V	6		BICMOS		1.65 V		1.8/3.3		GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA16,4X4,20		Other Interface ICs	1.5 V	.5 mm	85 Cel		-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B16	1	.67 mm	2.02 mm	Not Qualified		e0		245	2.02 mm
ADN2531ACPZ-R7	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	UNSPECIFIED	YES	3.6 V	1				3.3 V		3.3		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC16,.12SQ,20		Display Drivers	3 V	.5 mm	100 Cel		-40 Cel	MATTE TIN	QUAD	S-XQCC-N16	1	.9 mm	3 mm	Not Qualified		e3			3 mm
ST6G3237TBR	STMicroelectronics	INTERFACE CIRCUIT	INDUSTRIAL	BALL	25	TFBGA	SQUARE	PLASTIC/EPOXY	YES	3.6 V	1		CMOS		1.8 V				GRID ARRAY, THIN PROFILE, FINE PITCH				1.4 V	.5 mm	85 Cel		-40 Cel		BOTTOM	S-PBGA-B25		1.16 mm	3 mm	Not Qualified			NOT SPECIFIED	NOT SPECIFIED	3 mm
ST6G3238ETBR	STMicroelectronics	INTERFACE CIRCUIT	INDUSTRIAL	BALL	25	TFBGA	SQUARE	UNSPECIFIED	YES	3.6 V	1		CMOS		3 V				GRID ARRAY, THIN PROFILE, FINE PITCH				1.4 V	.5 mm	85 Cel		-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	S-XBGA-B25	3	1.16 mm	3 mm	Not Qualified		e1	30	260	3 mm
PCA9515ADGKRG4	Texas Instruments	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	3.6 V	2		BICMOS		3 V	3.6 V	2.5/3.3		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP8,.19	2.3 V	Line Driver or Receivers	2.3 V	.65 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD	DUAL	S-PDSO-G8	1	1.1 mm	3 mm	Not Qualified		e4	30	260	3 mm
ADN2530YCPZ-500R7	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.53 V	1				3.3 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE				3.07 V	.5 mm	100 Cel		-40 Cel	MATTE TIN	QUAD	S-PQCC-N16	3	.9 mm	3 mm	Not Qualified		e3		260	3 mm
AD9984AKCPZ-140	Analog Devices	INTERFACE CIRCUIT	COMMERCIAL	NO LEAD	64	HVQCCN	SQUARE	UNSPECIFIED	YES	1.9 V	1		CMOS		1.8 V				CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE				1.7 V	.5 mm	70 Cel		0 Cel	MATTE TIN	QUAD	S-XQCC-N64	3	1 mm	9 mm	Not Qualified		e3	30	260	9 mm
AD9984AKSTZ-140	Analog Devices	INTERFACE CIRCUIT	COMMERCIAL	GULL WING	80	LQFP	SQUARE	PLASTIC/EPOXY	YES	1.9 V	1		CMOS		1.8 V				FLATPACK, LOW PROFILE				1.7 V	.65 mm	70 Cel		0 Cel	MATTE TIN	QUAD	S-PQFP-G80	3	1.6 mm	14 mm	Not Qualified		e3		260	14 mm
AD9984AKSTZ-170	Analog Devices	INTERFACE CIRCUIT	COMMERCIAL	GULL WING	80	LQFP	SQUARE	PLASTIC/EPOXY	YES	1.9 V	1		CMOS		1.8 V				FLATPACK, LOW PROFILE				1.7 V	.65 mm	70 Cel		0 Cel	MATTE TIN	QUAD	S-PQFP-G80	3	1.6 mm	14 mm	Not Qualified		e3		260	14 mm
ST6G3238BETBR	STMicroelectronics	INTERFACE CIRCUIT	INDUSTRIAL	BALL	25	TFBGA	SQUARE	PLASTIC/EPOXY	YES	3.6 V	1		CMOS		3 V				GRID ARRAY, THIN PROFILE, FINE PITCH				1.4 V	.5 mm	85 Cel		-40 Cel	NICKEL GOLD	BOTTOM	S-PBGA-B25	3	1.16 mm	3 mm	Not Qualified		e4	30	260	3 mm
P82B96DP,118	NXP Semiconductors	BUS BUFFERS	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	15 V	2		BIPOLAR		5 V		2/15		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP8,.19		Other Interface ICs	2 V	.65 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD	DUAL	S-PDSO-G8	1	1.1 mm	3 mm	Not Qualified		e4	30	260	3 mm
GTL2002DP/DG,118	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1					5.5 V			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP8,.19	0 V		0 V	.65 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD	DUAL	S-PDSO-G8	1	1.1 mm	3 mm	Not Qualified	Also required VDREF 0 to 5.5V	e4		260	3 mm
GTL2010BS,118	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	24	VSON	SQUARE	UNSPECIFIED	YES	2.64 V	10				2.5 V	3.6 V			SMALL OUTLINE, VERY THIN PROFILE		3 V		2.36 V	.5 mm	85 Cel	3.3 V	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	S-XDSO-N24	1	1 mm	4 mm	Not Qualified		e4	30	260	4 mm
PCA9509D,118	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	8	SOP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1		CMOS		5 V		1/4.5,3.3/5		SMALL OUTLINE	SOP8,.25		Line Driver or Receivers	3 V	1.27 mm	85 Cel		-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	DUAL	S-PDSO-G8	1	1.75 mm	3.9 mm	Not Qualified		e4	30	260	4.9 mm
PCA9510DP,118	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1				3.3 V				SMALL OUTLINE, THIN PROFILE, SHRINK PITCH				2.7 V	.65 mm	85 Cel		-40 Cel		DUAL	S-PDSO-G8		1.1 mm	3 mm	Not Qualified					3 mm
PCA9511DP,118	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1			6 mA	3.3 V		3/5		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP8,.19		Other Interface ICs	2.7 V	.65 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD	DUAL	S-PDSO-G8	1	1.1 mm	3 mm	Not Qualified		e4			3 mm
PCA9512DP,118	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1				3.3 V				SMALL OUTLINE, THIN PROFILE, SHRINK PITCH				2.7 V	.65 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD	DUAL	S-PDSO-G8	1	1.1 mm	3 mm	Not Qualified		e4			3 mm
PCA9513DP,118	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1				3.3 V				SMALL OUTLINE, THIN PROFILE, SHRINK PITCH				2.7 V	.65 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD	DUAL	S-PDSO-G8	1	1.1 mm	3 mm	Not Qualified		e4			3 mm
PCA9514DP,118	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1				3.3 V				SMALL OUTLINE, THIN PROFILE, SHRINK PITCH				2.7 V	.65 mm	85 Cel		-40 Cel		DUAL	S-PDSO-G8		1.1 mm	3 mm	Not Qualified					3 mm
PCA9517ADP/DG,118	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1		CMOS		1.2 V	5.5 V	3/5		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP8,.19	2.7 V	Line Driver or Receivers	.9 V	.65 mm	85 Cel	3.3 V	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	S-PDSO-G8	1	1.1 mm	3 mm	Not Qualified		e4			3 mm
PCA9600DP/S911,118	NXP Semiconductors	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	15 V	2				5 V				SMALL OUTLINE, THIN PROFILE, SHRINK PITCH				2.5 V	.65 mm	85 Cel		-40 Cel		DUAL	S-PDSO-G8	1	1.1 mm	3 mm	Not Qualified					3 mm
AD9983AKSTZ-140	Analog Devices	INTERFACE CIRCUIT	COMMERCIAL	GULL WING	80	LQFP	SQUARE	PLASTIC/EPOXY	YES	1.9 V	1		CMOS		1.8 V				FLATPACK, LOW PROFILE				1.7 V	.65 mm	70 Cel		0 Cel	MATTE TIN	QUAD	S-PQFP-G80	3	1.6 mm	14 mm	Not Qualified		e3		260	14 mm
ADN2872ACPZ-R7	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	3.6 V	1				3.3 V		3.3		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20		Display Drivers	3 V	.5 mm	85 Cel		-40 Cel	MATTE TIN	QUAD	S-XQCC-N24	1	1 mm	4 mm	Not Qualified		e3			4 mm
ADN2872ACPZ-RL	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	3.6 V	1				3.3 V		3.3		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20		Display Drivers	3 V	.5 mm	85 Cel		-40 Cel	MATTE TIN	QUAD	S-XQCC-N24	1	1 mm	4 mm	Not Qualified		e3			4 mm
ADN2872ACPZ	Analog Devices	INTERFACE CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	3.6 V	1				3.3 V		3.3		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20		Display Drivers	3 V	.5 mm	85 Cel		-40 Cel	MATTE TIN	QUAD	S-XQCC-N24	1	1 mm	4 mm	Not Qualified		e3			4 mm
PCA9515ADGKTG4	Texas Instruments	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	3.6 V	2		BICMOS		3 V	3.6 V	2.5/3.3		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	DIP8,.3	2.3 V	Line Driver or Receivers	2.3 V	.65 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD	DUAL	S-PDSO-G8	1	1.1 mm	3 mm	Not Qualified		e4	30	260	3 mm
PCA9517DG4	Texas Instruments	INTERFACE CIRCUIT	INDUSTRIAL	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY	YES	5.5 V	1		BICMOS		3 V		3/5		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SOP8,.25		Line Driver or Receivers	2.7 V	.65 mm	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD	DUAL	S-PDSO-G8	1	1.1 mm	3 mm	Not Qualified	IT CAN ALSO OPERATE 0.9 TO 5.5	e4	30	260	3 mm

Other Function Interface ICs

Other function interface ICs are electronic components that provide specific functions for interfacing different devices in electronic systems. They are designed to facilitate the exchange of data and signals between various components of the system.

Other function interface ICs can be classified into several types based on their specific functions and applications. Some of the most common types of interface ICs include:

1. Voltage level translators - These ICs are used to convert voltage levels between different devices in electronic systems, ensuring that signals are compatible and can be correctly interpreted.

2. Real-time clock (RTC) ICs - These ICs are used to keep track of time and date in electronic systems, and they typically include a battery backup to ensure that the clock remains accurate even if the main power supply is lost.

3. Touchscreen controllers - These ICs are used to interface with touchscreens and enable touch-based input in electronic systems.

Other function interface ICs can also include USB controllers, Ethernet controllers, and Bluetooth controllers, among other components. They are typically characterized by their data rate, power consumption, and specific functions.