| Part | RoHS | Manufacturer | Memory IC Type | Temperature Grade | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | Surface Mount | No. of Functions | Technology | Screening Level | Terminal Form | Parallel or Serial | Operating Mode | Sector Size (Words) | Maximum Supply Current | No. of Words | Input/Output Type | Nominal Supply Voltage / Vsup (V) | Toggle Bit | Power Supplies (V) | Memory Width | Package Style (Meter) | Package Equivalence Code | Alternate Memory Width | Sub-Category | Minimum Data Retention Time | Terminal Pitch | Maximum Operating Temperature | Reverse Pinout | Output Characteristics | Organization | No. of Words Code | Minimum Operating Temperature | No. of Sectors/Size | Command User Interface | Terminal Finish | I2C Control Byte | Ready or Busy | Terminal Position | No. of Ports | Write Protection | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Supply Voltage (Vsup) | Maximum Seated Height | Endurance | Maximum Clock Frequency (fCLK) | Width | Qualification | Maximum Write Cycle Time (tWC) | Serial Bus Type | Boot Block | Memory Density | Minimum Supply Voltage (Vsup) | Additional Features | Page Size (words) | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Type | Maximum Standby Current | Length | Common Flash Interface | Maximum Access Time | Programming Voltage (V) | Data Polling |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
|
Microchip Technology |
EEPROM |
INDUSTRIAL |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
AEC-Q100 |
THROUGH-HOLE |
SERIAL |
SYNCHRONOUS |
10 mA |
1048576 words |
5 |
8 |
IN-LINE |
DIP8,.3 |
200 |
2.54 mm |
85 Cel |
3-STATE |
1MX1 |
1M |
-40 Cel |
Matte Tin (Sn) |
DUAL |
1 |
HARDWARE/SOFTWARE |
R-PDIP-T8 |
5.5 V |
5.334 mm |
1000000 Write/Erase Cycles |
20 MHz |
7.62 mm |
Not Qualified |
6 ms |
SPI |
8388608 bit |
4.5 V |
OPERTAES WITH 2.5VMIN @ 10MHZ |
e3 |
.000012 Amp |
9.271 mm |
5 |
||||||||||||||||||||||
|
|
Microchip Technology |
EEPROM |
COMMERCIAL |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
TS 16949 |
THROUGH-HOLE |
SERIAL |
SYNCHRONOUS |
3 mA |
8192 words |
5 |
3/5 |
8 |
IN-LINE |
DIP8,.3 |
EEPROMs |
200 |
2.54 mm |
70 Cel |
OPEN-DRAIN |
8KX8 |
8K |
0 Cel |
MATTE TIN |
1010DDDR |
DUAL |
1 |
R-PDIP-T8 |
6 V |
4.32 mm |
1000000 Write/Erase Cycles |
.1 MHz |
7.62 mm |
Not Qualified |
5 ms |
I2C |
65536 bit |
2.5 V |
e3 |
.000005 Amp |
9.46 mm |
5 |
|||||||||||||||||||||
|
|
Microchip Technology |
EEPROM |
COMMERCIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
TS 16949 |
GULL WING |
SERIAL |
SYNCHRONOUS |
3 mA |
8192 words |
5 |
3/5 |
8 |
SMALL OUTLINE |
SOP8,.3 |
EEPROMs |
200 |
1.27 mm |
70 Cel |
OPEN-DRAIN |
8KX8 |
8K |
0 Cel |
Matte Tin (Sn) - annealed |
1010DDDR |
DUAL |
1 |
R-PDSO-G8 |
1 |
6 V |
2.03 mm |
1000000 Write/Erase Cycles |
.1 MHz |
5.25 mm |
Not Qualified |
5 ms |
I2C |
65536 bit |
2.5 V |
e3 |
40 |
260 |
.000005 Amp |
5.28 mm |
5 |
||||||||||||||||||
|
Atmel |
EEPROM |
COMMERCIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
30 mA |
2048 words |
5 |
NO |
5 |
8 |
CHIP CARRIER |
LDCC32,.5X.6 |
EEPROMs |
10 |
1.27 mm |
70 Cel |
3-STATE |
2KX8 |
2K |
0 Cel |
NO |
TIN LEAD |
QUAD |
R-PQCC-J32 |
2 |
5.5 V |
3.55 mm |
10000 Write/Erase Cycles |
11.43 mm |
Not Qualified |
1 ms |
16384 bit |
4.5 V |
AUTOMATIC WRITE; 10K ENDURANCE WRITE CYCLES; DATA RETENTION = 10 YEARS |
e0 |
225 |
.0001 Amp |
13.97 mm |
200 ns |
5 |
YES |
||||||||||||||||||||
|
Atmel |
EEPROM |
INDUSTRIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
45 mA |
2048 words |
5 |
NO |
5 |
8 |
CHIP CARRIER |
LDCC32,.5X.6 |
EEPROMs |
10 |
1.27 mm |
85 Cel |
3-STATE |
2KX8 |
2K |
-40 Cel |
NO |
TIN LEAD |
QUAD |
R-PQCC-J32 |
2 |
5.5 V |
3.55 mm |
10000 Write/Erase Cycles |
11.43 mm |
Not Qualified |
1 ms |
16384 bit |
4.5 V |
AUTOMATIC WRITE; 10K ENDURANCE WRITE CYCLES; DATA RETENTION = 10 YEARS |
e0 |
225 |
.0001 Amp |
13.97 mm |
200 ns |
5 |
YES |
||||||||||||||||||||
|
Atmel |
EEPROM |
COMMERCIAL |
24 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
30 mA |
2048 words |
5 |
NO |
5 |
8 |
SMALL OUTLINE |
SOP24,.4 |
EEPROMs |
10 |
1.27 mm |
70 Cel |
3-STATE |
2KX8 |
2K |
0 Cel |
NO |
TIN LEAD |
DUAL |
R-PDSO-G24 |
5.5 V |
2.65 mm |
10000 Write/Erase Cycles |
7.5 mm |
Not Qualified |
1 ms |
16384 bit |
4.5 V |
AUTOMATIC WRITE; 10K ENDURANCE WRITE CYCLES; DATA RETENTION = 10 YEARS |
e0 |
.0001 Amp |
15.4 mm |
200 ns |
5 |
YES |
||||||||||||||||||||||
|
Atmel |
EEPROM |
COMMERCIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
15 mA |
32768 words |
3.3 |
YES |
3.3 |
8 |
CHIP CARRIER |
LDCC32,.5X.6 |
EEPROMs |
1.27 mm |
70 Cel |
3-STATE |
32KX8 |
32K |
0 Cel |
NO |
TIN LEAD |
QUAD |
R-PQCC-J32 |
2 |
3.465 V |
3.55 mm |
10000 Write/Erase Cycles |
11.43 mm |
Not Qualified |
10 ms |
262144 bit |
3.135 V |
AUTOMATIC WRITE |
64 |
e0 |
225 |
.00002 Amp |
13.97 mm |
200 ns |
3 |
YES |
||||||||||||||||||||
|
Atmel |
EEPROM |
COMMERCIAL |
28 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
15 mA |
32768 words |
3.3 |
YES |
3.3 |
8 |
IN-LINE |
DIP28,.6 |
EEPROMs |
2.54 mm |
70 Cel |
3-STATE |
32KX8 |
32K |
0 Cel |
NO |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDIP-T28 |
3.465 V |
5.59 mm |
10000 Write/Erase Cycles |
15.24 mm |
Not Qualified |
10 ms |
262144 bit |
3.135 V |
AUTOMATIC WRITE |
64 |
e0 |
.00002 Amp |
36.95 mm |
250 ns |
3 |
YES |
||||||||||||||||||||||
|
Atmel |
EEPROM |
INDUSTRIAL |
28 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
15 mA |
32768 words |
3.3 |
YES |
3.3 |
8 |
IN-LINE |
DIP28,.6 |
EEPROMs |
2.54 mm |
85 Cel |
3-STATE |
32KX8 |
32K |
-40 Cel |
NO |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDIP-T28 |
3.465 V |
5.59 mm |
10000 Write/Erase Cycles |
15.24 mm |
Not Qualified |
10 ms |
262144 bit |
3.135 V |
AUTOMATIC WRITE |
64 |
e0 |
.00005 Amp |
36.95 mm |
250 ns |
3 |
YES |
||||||||||||||||||||||
|
|
Microchip Technology |
EEPROM |
COMMERCIAL |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
TS 16949 |
THROUGH-HOLE |
SERIAL |
SYNCHRONOUS |
3 mA |
8192 words |
5 |
2/5 |
8 |
IN-LINE |
DIP8,.3 |
EEPROMs |
200 |
2.54 mm |
70 Cel |
OPEN-DRAIN |
8KX8 |
8K |
0 Cel |
MATTE TIN |
1010DDDR |
DUAL |
1 |
R-PDIP-T8 |
6 V |
4.32 mm |
1000000 Write/Erase Cycles |
.1 MHz |
7.62 mm |
Not Qualified |
5 ms |
I2C |
65536 bit |
1.8 V |
e3 |
.000005 Amp |
9.46 mm |
5 |
|||||||||||||||||||||
|
|
Microchip Technology |
EEPROM |
COMMERCIAL |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
TS 16949 |
THROUGH-HOLE |
SERIAL |
SYNCHRONOUS |
3 mA |
8192 words |
5 |
5 |
8 |
IN-LINE |
DIP8,.3 |
EEPROMs |
200 |
2.54 mm |
70 Cel |
OPEN-DRAIN |
8KX8 |
8K |
0 Cel |
MATTE TIN |
1010DDDR |
DUAL |
1 |
R-PDIP-T8 |
6 V |
4.32 mm |
1000000 Write/Erase Cycles |
.4 MHz |
7.62 mm |
Not Qualified |
5 ms |
I2C |
65536 bit |
4.5 V |
e3 |
.000005 Amp |
9.46 mm |
5 |
|||||||||||||||||||||
|
|
Microchip Technology |
EEPROM |
COMMERCIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
TS 16949 |
GULL WING |
SERIAL |
SYNCHRONOUS |
3 mA |
8192 words |
5 |
5 |
8 |
SMALL OUTLINE |
SOP8,.3 |
EEPROMs |
200 |
1.27 mm |
70 Cel |
OPEN-DRAIN |
8KX8 |
8K |
0 Cel |
Matte Tin (Sn) - annealed |
1010DDDR |
DUAL |
1 |
R-PDSO-G8 |
1 |
6 V |
2.03 mm |
1000000 Write/Erase Cycles |
.4 MHz |
5.25 mm |
Not Qualified |
5 ms |
I2C |
65536 bit |
4.5 V |
e3 |
40 |
260 |
.000005 Amp |
5.28 mm |
5 |
||||||||||||||||||
|
STMicroelectronics |
EEPROM |
INDUSTRIAL |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
SERIAL |
SYNCHRONOUS |
2 mA |
2048 words |
5 |
3/5 |
8 |
IN-LINE |
DIP8,.3 |
EEPROMs |
40 |
2.54 mm |
85 Cel |
OPEN-DRAIN |
2KX8 |
2K |
-40 Cel |
TIN LEAD |
1010MMMR |
DUAL |
HARDWARE |
R-PDIP-T8 |
5.5 V |
5.33 mm |
1000000 Write/Erase Cycles |
.4 MHz |
7.62 mm |
Not Qualified |
5 ms |
I2C |
16384 bit |
2.5 V |
e0 |
.000001 Amp |
9.27 mm |
||||||||||||||||||||||||
|
STMicroelectronics |
EEPROM |
INDUSTRIAL |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
SERIAL |
SYNCHRONOUS |
2 mA |
2048 words |
5 |
5 |
8 |
IN-LINE |
DIP8,.3 |
EEPROMs |
40 |
2.54 mm |
85 Cel |
OPEN-DRAIN |
2KX8 |
2K |
-40 Cel |
TIN LEAD |
1010MMMR |
DUAL |
HARDWARE |
R-PDIP-T8 |
5.5 V |
5.33 mm |
1000000 Write/Erase Cycles |
.4 MHz |
7.62 mm |
Not Qualified |
5 ms |
I2C |
16384 bit |
4.5 V |
e0 |
.000001 Amp |
9.27 mm |
||||||||||||||||||||||||
|
STMicroelectronics |
EEPROM |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
2 mA |
2048 words |
5 |
3/5 |
8 |
SMALL OUTLINE |
SOP8,.25 |
EEPROMs |
40 |
1.27 mm |
85 Cel |
OPEN-DRAIN |
2KX8 |
2K |
-40 Cel |
TIN LEAD |
1010MMMR |
DUAL |
HARDWARE |
R-PDSO-G8 |
5.5 V |
1.75 mm |
1000000 Write/Erase Cycles |
.4 MHz |
3.9 mm |
Not Qualified |
5 ms |
I2C |
16384 bit |
2.5 V |
e0 |
.000001 Amp |
4.9 mm |
||||||||||||||||||||||||
|
STMicroelectronics |
EEPROM |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
2 mA |
2048 words |
5 |
3/5 |
8 |
SMALL OUTLINE |
SOP8,.25 |
EEPROMs |
40 |
1.27 mm |
85 Cel |
OPEN-DRAIN |
2KX8 |
2K |
-40 Cel |
TIN LEAD |
1010MMMR |
DUAL |
HARDWARE |
R-PDSO-G8 |
5.5 V |
1.75 mm |
1000000 Write/Erase Cycles |
.4 MHz |
3.9 mm |
Not Qualified |
5 ms |
I2C |
16384 bit |
2.5 V |
e0 |
.000001 Amp |
4.9 mm |
||||||||||||||||||||||||
|
STMicroelectronics |
EEPROM |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
2 mA |
2048 words |
5 |
5 |
8 |
SMALL OUTLINE |
SOP8,.25 |
EEPROMs |
40 |
1.27 mm |
85 Cel |
OPEN-DRAIN |
2KX8 |
2K |
-40 Cel |
TIN LEAD |
1010MMMR |
DUAL |
HARDWARE |
R-PDSO-G8 |
5.5 V |
1.75 mm |
1000000 Write/Erase Cycles |
.4 MHz |
3.9 mm |
Not Qualified |
5 ms |
I2C |
16384 bit |
4.5 V |
e0 |
.000001 Amp |
4.9 mm |
||||||||||||||||||||||||
|
STMicroelectronics |
EEPROM |
INDUSTRIAL |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
SERIAL |
SYNCHRONOUS |
2 mA |
1024 words |
5 |
3/5 |
8 |
IN-LINE |
DIP8,.3 |
EEPROMs |
40 |
2.54 mm |
85 Cel |
OPEN-DRAIN |
1KX8 |
1K |
-40 Cel |
TIN LEAD |
1010DMMR |
DUAL |
HARDWARE |
R-PDIP-T8 |
5.5 V |
5.33 mm |
1000000 Write/Erase Cycles |
.4 MHz |
7.62 mm |
Not Qualified |
5 ms |
I2C |
8192 bit |
2.5 V |
e0 |
.000001 Amp |
9.27 mm |
||||||||||||||||||||||||
|
STMicroelectronics |
EEPROM |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
2 mA |
1024 words |
5 |
3/5 |
8 |
SMALL OUTLINE |
SOP8,.25 |
EEPROMs |
40 |
1.27 mm |
85 Cel |
OPEN-DRAIN |
1KX8 |
1K |
-40 Cel |
TIN LEAD |
1010DMMR |
DUAL |
HARDWARE |
R-PDSO-G8 |
5.5 V |
1.75 mm |
1000000 Write/Erase Cycles |
.4 MHz |
3.9 mm |
Not Qualified |
5 ms |
I2C |
8192 bit |
2.5 V |
e0 |
.000001 Amp |
4.9 mm |
||||||||||||||||||||||||
|
STMicroelectronics |
EEPROM |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
2 mA |
1024 words |
5 |
3/5 |
8 |
SMALL OUTLINE |
SOP8,.25 |
EEPROMs |
40 |
1.27 mm |
85 Cel |
OPEN-DRAIN |
1KX8 |
1K |
-40 Cel |
TIN LEAD |
1010DMMR |
DUAL |
HARDWARE |
R-PDSO-G8 |
5.5 V |
1.75 mm |
1000000 Write/Erase Cycles |
.4 MHz |
3.9 mm |
Not Qualified |
5 ms |
I2C |
8192 bit |
2.5 V |
e0 |
.000001 Amp |
4.9 mm |
||||||||||||||||||||||||
|
Toshiba |
EEPROM |
COMMERCIAL |
48 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
2147483648 words |
3.3 |
8 |
SMALL OUTLINE, THIN PROFILE |
.5 mm |
70 Cel |
2GX8 |
2G |
0 Cel |
DUAL |
R-PDSO-G48 |
3.6 V |
1.2 mm |
12 mm |
17179869184 bit |
2.7 V |
18.4 mm |
3 |
|||||||||||||||||||||||||||||||||||||||
|
Toshiba |
EEPROM |
COMMERCIAL |
48 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
4294967296 words |
3.3 |
8 |
SMALL OUTLINE, THIN PROFILE |
.5 mm |
70 Cel |
4GX8 |
4G |
0 Cel |
DUAL |
R-PDSO-G48 |
3.6 V |
1.2 mm |
12 mm |
34359738368 bit |
2.7 V |
18.4 mm |
3 |
|||||||||||||||||||||||||||||||||||||||
|
Toshiba |
EEPROM |
INDUSTRIAL |
48 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
4294967296 words |
3.3 |
8 |
SMALL OUTLINE, THIN PROFILE |
.5 mm |
85 Cel |
4GX8 |
4G |
-40 Cel |
DUAL |
R-PDSO-G48 |
3.6 V |
1.2 mm |
12 mm |
34359738368 bit |
2.7 V |
18.4 mm |
3 |
|||||||||||||||||||||||||||||||||||||||
|
|
Onsemi |
EEPROM |
INDUSTRIAL |
5 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
SERIAL |
SYNCHRONOUS |
2048 words |
2.5 |
8 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.4 mm |
85 Cel |
2KX8 |
2K |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B5 |
1 |
3.6 V |
.33 mm |
.4 MHz |
.8 mm |
5 ms |
16384 bit |
1.7 V |
FOR WRITE OPERATION-1.8V TO 3.6V SUPPLY |
e1 |
30 |
260 |
1.2 mm |
3 |
||||||||||||||||||||||||||||||
|
|
Microchip Technology |
EEPROM |
INDUSTRIAL |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
TS 16949 |
THROUGH-HOLE |
SERIAL |
SYNCHRONOUS |
3 mA |
512 words |
2.5 |
8 |
IN-LINE |
DIP8,.3 |
200 |
1.27 mm |
85 Cel |
OPEN-DRAIN |
512X8 |
512 |
-40 Cel |
MATTE TIN |
1010DDMR |
DUAL |
1 |
R-PDIP-T8 |
5.5 V |
5.334 mm |
1000000 Write/Erase Cycles |
1 MHz |
7.62 mm |
5 ms |
I2C |
4096 bit |
2.2 V |
1.7V TO 1.8V @ 0.1MHz AND 1.8V TO 2.2V @ 0.4MHz |
e3 |
.000001 Amp |
9.271 mm |
2.5 |
|||||||||||||||||||||||
|
Atmel |
EEPROM |
COMMERCIAL |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
SERIAL |
SYNCHRONOUS |
3 mA |
8192 words |
5 |
5 |
8 |
IN-LINE |
DIP8,.3 |
EEPROMs |
100 |
2.54 mm |
70 Cel |
OPEN-DRAIN |
8KX8 |
8K |
0 Cel |
TIN LEAD |
1010DDDR |
DUAL |
HARDWARE |
R-PDIP-T8 |
5.5 V |
5.33 mm |
1000000 Write/Erase Cycles |
.4 MHz |
7.62 mm |
Not Qualified |
10 ms |
I2C |
65536 bit |
4.5 V |
DATA RETENTION: 100 YEARS |
e0 |
.000035 Amp |
9.59 mm |
|||||||||||||||||||||||
|
Atmel |
EEPROM |
COMMERCIAL |
28 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
MIL-STD-883 |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
50 mA |
32768 words |
5 |
YES |
5 |
8 |
IN-LINE |
DIP28,.6 |
EEPROMs |
10 |
2.54 mm |
70 Cel |
3-STATE |
32KX8 |
32K |
0 Cel |
NO |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDIP-T28 |
1 |
5.5 V |
4.826 mm |
10000 Write/Erase Cycles |
15.24 mm |
Not Qualified |
10 ms |
262144 bit |
4.5 V |
AUTOMATIC WRITE |
64 |
e0 |
30 |
225 |
.0002 Amp |
37.0205 mm |
150 ns |
5 |
YES |
|||||||||||||||||
|
Atmel |
EEPROM |
INDUSTRIAL |
28 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
MIL-STD-883 |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
50 mA |
32768 words |
5 |
YES |
5 |
8 |
IN-LINE |
DIP28,.6 |
EEPROMs |
2.54 mm |
85 Cel |
3-STATE |
32KX8 |
32K |
-40 Cel |
NO |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDIP-T28 |
5.5 V |
4.826 mm |
10000 Write/Erase Cycles |
15.24 mm |
Not Qualified |
10 ms |
262144 bit |
4.5 V |
AUTOMATIC WRITE |
64 |
e0 |
30 |
240 |
.0002 Amp |
37.0205 mm |
150 ns |
5 |
YES |
|||||||||||||||||||
|
Atmel |
EEPROM |
INDUSTRIAL |
28 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
MIL-STD-883 |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
50 mA |
32768 words |
5 |
YES |
5 |
8 |
IN-LINE |
DIP28,.6 |
EEPROMs |
2.54 mm |
85 Cel |
3-STATE |
32KX8 |
32K |
-40 Cel |
NO |
TIN LEAD |
DUAL |
R-PDIP-T28 |
1 |
5.5 V |
4.826 mm |
10000 Write/Erase Cycles |
15.24 mm |
Not Qualified |
3 ms |
262144 bit |
4.5 V |
AUTOMATIC WRITE |
64 |
e0 |
.0002 Amp |
37.0205 mm |
150 ns |
5 |
YES |
||||||||||||||||||||
|
Atmel |
EEPROM |
COMMERCIAL |
28 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
MIL-STD-883 |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
80 mA |
32768 words |
5 |
YES |
5 |
8 |
IN-LINE |
DIP28,.6 |
EEPROMs |
2.54 mm |
70 Cel |
3-STATE |
32KX8 |
32K |
0 Cel |
NO |
TIN LEAD |
DUAL |
R-PDIP-T28 |
1 |
5.5 V |
4.826 mm |
10000 Write/Erase Cycles |
15.24 mm |
Not Qualified |
10 ms |
262144 bit |
4.5 V |
AUTOMATIC WRITE |
64 |
e0 |
.0003 Amp |
37.0205 mm |
120 ns |
5 |
YES |
||||||||||||||||||||
|
Atmel |
EEPROM |
INDUSTRIAL |
28 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
MIL-STD-883 |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
80 mA |
32768 words |
5 |
YES |
5 |
8 |
IN-LINE |
DIP28,.6 |
EEPROMs |
2.54 mm |
85 Cel |
3-STATE |
32KX8 |
32K |
-40 Cel |
NO |
TIN LEAD |
DUAL |
R-PDIP-T28 |
1 |
5.5 V |
4.826 mm |
10000 Write/Erase Cycles |
15.24 mm |
Not Qualified |
10 ms |
262144 bit |
4.5 V |
AUTOMATIC WRITE |
64 |
e0 |
37.0205 mm |
70 ns |
5 |
YES |
|||||||||||||||||||||
|
Atmel |
EEPROM |
INDUSTRIAL |
28 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
MIL-STD-883 |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
80 mA |
32768 words |
5 |
YES |
5 |
8 |
IN-LINE |
DIP28,.6 |
EEPROMs |
2.54 mm |
85 Cel |
3-STATE |
32KX8 |
32K |
-40 Cel |
NO |
TIN LEAD |
DUAL |
R-PDIP-T28 |
1 |
5.5 V |
4.826 mm |
100000 Write/Erase Cycles |
15.24 mm |
Not Qualified |
10 ms |
262144 bit |
4.5 V |
AUTOMATIC WRITE |
64 |
e0 |
.0003 Amp |
37.0205 mm |
120 ns |
5 |
YES |
||||||||||||||||||||
|
Atmel |
EEPROM |
COMMERCIAL |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
SERIAL |
SYNCHRONOUS |
6 mA |
128 words |
5 |
5 |
8 |
IN-LINE |
DIP8,.3 |
EEPROMs |
100 |
2.54 mm |
70 Cel |
3-STATE |
128X8 |
128 |
0 Cel |
TIN LEAD |
DUAL |
HARDWARE/SOFTWARE |
R-PDIP-T8 |
5.5 V |
5.33 mm |
1000000 Write/Erase Cycles |
3 MHz |
7.62 mm |
Not Qualified |
5 ms |
SPI |
1024 bit |
4.5 V |
4-WIRE SERIAL INTERFACE |
e0 |
.0001 Amp |
9.59 mm |
||||||||||||||||||||||||
|
Atmel |
EEPROM |
COMMERCIAL |
28 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
MIL-STD-883 |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
50 mA |
32768 words |
5 |
YES |
5 |
8 |
SMALL OUTLINE |
SOP28,.4 |
EEPROMs |
1.27 mm |
70 Cel |
3-STATE |
32KX8 |
32K |
0 Cel |
NO |
TIN LEAD |
DUAL |
R-PDSO-G28 |
2 |
5.5 V |
2.65 mm |
100000 Write/Erase Cycles |
7.5 mm |
Not Qualified |
10 ms |
262144 bit |
4.5 V |
AUTOMATIC WRITE |
64 |
e0 |
240 |
.0002 Amp |
17.9 mm |
150 ns |
5 |
YES |
|||||||||||||||||||
|
Atmel |
EEPROM |
INDUSTRIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
MIL-STD-883 |
J BEND |
PARALLEL |
ASYNCHRONOUS |
50 mA |
32768 words |
5 |
YES |
5 |
8 |
CHIP CARRIER |
LDCC32,.5X.6 |
EEPROMs |
1.27 mm |
85 Cel |
3-STATE |
32KX8 |
32K |
-40 Cel |
NO |
TIN LEAD |
QUAD |
R-PQCC-J32 |
2 |
5.5 V |
3.556 mm |
10000 Write/Erase Cycles |
11.43 mm |
Not Qualified |
10 ms |
262144 bit |
4.5 V |
AUTOMATIC WRITE |
64 |
e0 |
225 |
.0002 Amp |
13.97 mm |
150 ns |
5 |
YES |
|||||||||||||||||||
|
Atmel |
EEPROM |
COMMERCIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
MIL-STD-883 |
J BEND |
PARALLEL |
ASYNCHRONOUS |
50 mA |
32768 words |
5 |
YES |
5 |
8 |
CHIP CARRIER |
LDCC32,.5X.6 |
EEPROMs |
1.27 mm |
70 Cel |
3-STATE |
32KX8 |
32K |
0 Cel |
NO |
TIN LEAD |
QUAD |
R-PQCC-J32 |
2 |
5.5 V |
3.556 mm |
10000 Write/Erase Cycles |
11.43 mm |
Not Qualified |
10 ms |
262144 bit |
4.5 V |
AUTOMATIC WRITE |
64 |
e0 |
225 |
.0002 Amp |
13.97 mm |
200 ns |
5 |
YES |
|||||||||||||||||||
|
Atmel |
EEPROM |
INDUSTRIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
MIL-STD-883 |
J BEND |
PARALLEL |
ASYNCHRONOUS |
80 mA |
32768 words |
5 |
YES |
5 |
8 |
CHIP CARRIER |
LDCC32,.5X.6 |
EEPROMs |
1.27 mm |
85 Cel |
3-STATE |
32KX8 |
32K |
-40 Cel |
NO |
TIN LEAD |
QUAD |
R-PQCC-J32 |
2 |
5.5 V |
3.556 mm |
10000 Write/Erase Cycles |
11.43 mm |
Not Qualified |
10 ms |
262144 bit |
4.5 V |
AUTOMATIC WRITE |
64 |
e0 |
225 |
.0003 Amp |
13.97 mm |
120 ns |
5 |
YES |
|||||||||||||||||||
|
Atmel |
EEPROM |
INDUSTRIAL |
44 |
QCCN |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
YES |
1 |
CMOS |
NO LEAD |
PARALLEL |
ASYNCHRONOUS |
50 mA |
524288 words |
5 |
YES |
5 |
8 |
CHIP CARRIER |
LCC44,.65SQ |
EEPROMs |
1.27 mm |
85 Cel |
3-STATE |
512KX8 |
512K |
-40 Cel |
NO |
TIN LEAD |
QUAD |
S-CQCC-N44 |
1 |
5.5 V |
2.74 mm |
16.55 mm |
Not Qualified |
10 ms |
4194304 bit |
4.5 V |
AUTOMATIC WRITE |
256 |
e0 |
.003 Amp |
16.55 mm |
200 ns |
5 |
YES |
||||||||||||||||||||||
|
|
Microchip Technology |
EEPROM |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
TS 16949 |
GULL WING |
SERIAL |
SYNCHRONOUS |
2 mA |
64 words |
5 |
5 |
16 |
SMALL OUTLINE |
SOP8,.25 |
EEPROMs |
200 |
1.27 mm |
85 Cel |
NO |
TOTEM POLE |
64X16 |
64 |
-40 Cel |
MATTE TIN |
YES |
DUAL |
1 |
SOFTWARE |
R-PDSO-G8 |
1 |
5.5 V |
1.75 mm |
1000000 Write/Erase Cycles |
3 MHz |
3.9 mm |
Not Qualified |
6 ms |
MICROWIRE |
1024 bit |
4.5 V |
1000000 ERASE/WRITE CYCLES; DATA RETENTION > 200 YEARS |
e3 |
30 |
260 |
.000001 Amp |
4.9 mm |
||||||||||||||||
|
|
Microchip Technology |
EEPROM |
COMMERCIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
3 mA |
256 words |
5 |
8 |
SMALL OUTLINE |
SOP8,.23 |
200 |
1.27 mm |
70 Cel |
OPEN-DRAIN |
256X8 |
256 |
0 Cel |
MATTE TIN |
1010XXXR |
DUAL |
1 |
HARDWARE |
R-PDSO-G8 |
1 |
5.5 V |
1.75 mm |
1000000 Write/Erase Cycles |
.4 MHz |
3.9 mm |
Not Qualified |
10 ms |
I2C |
2048 bit |
4.5 V |
e3 |
30 |
260 |
.0001 Amp |
4.9 mm |
5 |
||||||||||||||||||||
|
|
Microchip Technology |
EEPROM |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
GULL WING |
SERIAL |
SYNCHRONOUS |
3 mA |
32768 words |
2.5 |
1.8/5 |
8 |
SMALL OUTLINE |
SOP8,.3 |
EEPROMs |
200 |
1.27 mm |
85 Cel |
NO |
OPEN-DRAIN |
32KX8 |
32K |
-40 Cel |
MATTE TIN |
1010DDDR |
DUAL |
1 |
HARDWARE |
R-PDSO-G8 |
1 |
5.5 V |
2.03 mm |
1000000 Write/Erase Cycles |
.4 MHz |
5.25 mm |
Not Qualified |
5 ms |
I2C |
262144 bit |
1.7 V |
e3 |
260 |
.000005 Amp |
5.26 mm |
2.5 |
|||||||||||||||||
|
|
Microchip Technology |
EEPROM |
COMMERCIAL |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
SERIAL |
SYNCHRONOUS |
3 mA |
128 words |
5 |
3/5 |
8 |
IN-LINE |
DIP8,.3 |
EEPROMs |
200 |
2.54 mm |
70 Cel |
OPEN-DRAIN |
128X8 |
128 |
0 Cel |
MATTE TIN |
1010XXXR |
DUAL |
1 |
R-PDIP-T8 |
5.5 V |
4.32 mm |
1000000 Write/Erase Cycles |
.4 MHz |
7.62 mm |
Not Qualified |
10 ms |
I2C |
1024 bit |
4.5 V |
e3 |
.0001 Amp |
9.46 mm |
5 |
||||||||||||||||||||||
|
|
Microchip Technology |
EEPROM |
AUTOMOTIVE |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
TS 16949 |
GULL WING |
SERIAL |
SYNCHRONOUS |
5 mA |
512 words |
5 |
5 |
8 |
SMALL OUTLINE |
SOP8,.23 |
EEPROMs |
200 |
1.27 mm |
125 Cel |
512X8 |
512 |
-40 Cel |
MATTE TIN |
DUAL |
1 |
HARDWARE |
R-PDSO-G8 |
1 |
5.5 V |
1.75 mm |
1000000 Write/Erase Cycles |
3 MHz |
3.9 mm |
Not Qualified |
5 ms |
SPI |
4096 bit |
4.5 V |
e3 |
30 |
260 |
.000005 Amp |
4.9 mm |
5 |
|||||||||||||||||||
|
|
Microchip Technology |
EEPROM |
INDUSTRIAL |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
TS 16949 |
THROUGH-HOLE |
SERIAL |
SYNCHRONOUS |
2 mA |
512 words |
2.5 |
YES |
3/5 |
8 |
IN-LINE |
DIP8,.3 |
EEPROMs |
200 |
2.54 mm |
85 Cel |
NO |
TOTEM POLE |
512X8 |
512 |
-40 Cel |
MATTE TIN |
YES |
DUAL |
1 |
SOFTWARE |
R-PDIP-T8 |
5.5 V |
5.33 mm |
1000000 Write/Erase Cycles |
1 MHz |
7.62 mm |
Not Qualified |
6 ms |
MICROWIRE |
4096 bit |
1.8 V |
1000000 ERASE/WRITE CYCLES MIN; DATA RETENTION > 200 YEARS |
e3 |
.000001 Amp |
9.27 mm |
||||||||||||||||||
|
|
Microchip Technology |
EEPROM |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
TS 16949 |
GULL WING |
SERIAL |
SYNCHRONOUS |
2 mA |
256 words |
5 |
YES |
3/5 |
8 |
SMALL OUTLINE |
SOP8,.25 |
EEPROMs |
200 |
1.27 mm |
85 Cel |
NO |
TOTEM POLE |
256X8 |
256 |
-40 Cel |
MATTE TIN |
YES |
DUAL |
1 |
SOFTWARE |
R-PDSO-G8 |
1 |
5.5 V |
1.75 mm |
1000000 Write/Erase Cycles |
2 MHz |
3.9 mm |
Not Qualified |
6 ms |
MICROWIRE |
2048 bit |
2.5 V |
1000000 ERASE/WRITE CYCLES MIN; DATA RETENTION > 200 YEARS |
e3 |
30 |
260 |
.000001 Amp |
4.9 mm |
|||||||||||||||
|
Atmel |
EEPROM |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
3 mA |
256 words |
5 |
5 |
8 |
SMALL OUTLINE |
SOP8,.25 |
EEPROMs |
100 |
1.27 mm |
85 Cel |
OPEN-DRAIN |
256X8 |
256 |
-40 Cel |
TIN LEAD |
1010DDDR |
DUAL |
HARDWARE |
R-PDSO-G8 |
5.5 V |
1.73 mm |
1000000 Write/Erase Cycles |
.4 MHz |
3.9 mm |
Not Qualified |
10 ms |
I2C |
2048 bit |
4.5 V |
2-WIRE SERIAL INTERFACE |
e0 |
.000018 Amp |
4.89 mm |
|||||||||||||||||||||||
|
Atmel |
EEPROM |
INDUSTRIAL |
8 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
3 mA |
1024 words |
5 |
5 |
8 |
SMALL OUTLINE |
SOP8,.25 |
EEPROMs |
100 |
1.27 mm |
85 Cel |
OPEN-DRAIN |
1KX8 |
1K |
-40 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDSO-G8 |
5.5 V |
1.73 mm |
1000000 Write/Erase Cycles |
.4 MHz |
3.9 mm |
Not Qualified |
10 ms |
I2C |
8192 bit |
4.5 V |
2-WIRE SERIAL INTERFACE |
e0 |
30 |
240 |
.000018 Amp |
4.89 mm |
|||||||||||||||||||||||
|
|
STMicroelectronics |
EEPROM |
INDUSTRIAL |
8 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
8 mA |
65536 words |
2.5 |
2/5 |
8 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP8,.25 |
EEPROMs |
40 |
.65 mm |
85 Cel |
64KX8 |
64K |
-40 Cel |
DUAL |
HARDWARE/SOFTWARE |
R-PDSO-G8 |
5.5 V |
1.2 mm |
1000000 Write/Erase Cycles |
5 MHz |
3 mm |
Not Qualified |
5 ms |
SPI |
524288 bit |
1.8 V |
NOT SPECIFIED |
NOT SPECIFIED |
.000005 Amp |
4.4 mm |
EEPROM, or Electrically Erasable Programmable Read-Only Memory, is a type of non-volatile computer memory that can store and retrieve data even when the power is turned off. EEPROM is commonly used in digital devices, such as computers, mobile phones, and digital cameras, to store configuration data, firmware, and other important information.
EEPROM works by storing data in a grid of memory cells that can be individually programmed and erased using electrical signals. Each memory cell consists of a transistor and a floating gate. The floating gate can hold an electric charge, which determines the state of the memory cell. To write data to the EEPROM, an electrical signal is applied to the transistor, which charges or discharges the floating gate. To read data from the EEPROM, an electrical signal is applied to the transistor, which determines the state of the floating gate.
One of the advantages of EEPROM is that it is non-volatile, which means that it can store data even when the power is turned off. This makes it ideal for storing critical data, such as system settings and firmware, that must be retained even in the absence of power.
EEPROM can also be reprogrammed and erased many times, which makes it a versatile and flexible memory technology. EEPROM can be programmed and erased in blocks or individually, depending on the specific requirements of the application.
One of the disadvantages of EEPROM is that it is slower than other types of computer memory, such as RAM or cache memory. EEPROM access times are measured in microseconds, which is much slower than access times for other types of memory. This makes EEPROM less suitable for applications that require high-speed data access.