Xilinx EEPROM 198

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Part RoHS Manufacturer Memory IC Type Temperature Grade No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Surface Mount No. of Functions Technology Screening Level Terminal Form Parallel or Serial Operating Mode Sector Size (Words) Maximum Supply Current No. of Words Input/Output Type Nominal Supply Voltage / Vsup (V) Toggle Bit Power Supplies (V) Memory Width Package Style (Meter) Package Equivalence Code Alternate Memory Width Sub-Category Minimum Data Retention Time Terminal Pitch Maximum Operating Temperature Reverse Pinout Output Characteristics Organization No. of Words Code Minimum Operating Temperature No. of Sectors/Size Command User Interface Terminal Finish I2C Control Byte Ready or Busy Terminal Position No. of Ports Write Protection JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Supply Voltage (Vsup) Maximum Seated Height Endurance Maximum Clock Frequency (fCLK) Width Qualification Maximum Write Cycle Time (tWC) Serial Bus Type Boot Block Memory Density Minimum Supply Voltage (Vsup) Additional Features Page Size (words) JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Type Maximum Standby Current Length Common Flash Interface Maximum Access Time Programming Voltage (V) Data Polling

XC1765ESOG8C

Xilinx

CONFIGURATION MEMORY

COMMERCIAL

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

SERIAL

SYNCHRONOUS

10 mA

65536 words

COMMON

5

5

1

SMALL OUTLINE

SOP8,.25

OTP ROMs

1.27 mm

70 Cel

3-STATE

64KX1

64K

0 Cel

Matte Tin (Sn)

DUAL

R-PDSO-G8

3

5.25 V

1.7272 mm

10 MHz

3.937 mm

Not Qualified

65536 bit

4.75 V

USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS

e3

30

250

.00005 Amp

4.9276 mm

XC1701L-PDG8C

Xilinx

CONFIGURATION MEMORY

COMMERCIAL

8

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

1

CMOS

THROUGH-HOLE

SERIAL

SYNCHRONOUS

10 mA

1048576 words

COMMON

3.3

3.3

1

IN-LINE

DIP8,.3

OTP ROMs

2.54 mm

70 Cel

3-STATE

1MX1

1M

0 Cel

Matte Tin (Sn)

DUAL

R-PDIP-T8

1

3.6 V

4.5974 mm

15 MHz

7.62 mm

Not Qualified

1048576 bit

3 V

USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS

e3

30

250

.00005 Amp

9.3599 mm

XC1701L-PCG20C

Xilinx

CONFIGURATION MEMORY

COMMERCIAL

20

QCCJ

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

J BEND

SERIAL

SYNCHRONOUS

10 mA

1048576 words

COMMON

3.3

3.3

1

CHIP CARRIER

LDCC20,.4SQ

OTP ROMs

1.27 mm

70 Cel

3-STATE

1MX1

1M

0 Cel

Matte Tin (Sn)

QUAD

S-PQCC-J20

3

3.6 V

4.572 mm

15 MHz

8.9662 mm

Not Qualified

1048576 bit

3 V

USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS

e3

30

245

.00005 Amp

8.9662 mm

XQF32PVOG48M

Xilinx

CONFIGURATION MEMORY

MILITARY

48

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL/SERIAL

SYNCHRONOUS

40 mA

33554432 words

1.8

1.8/3.3,1.8

1

SMALL OUTLINE

TSSOP48,.8,20

Flash Memories

20

.5 mm

125 Cel

32MX1

32M

-55 Cel

NICKEL PALLADIUM GOLD

DUAL

R-PDSO-G48

3

2 V

20000 Write/Erase Cycles

Not Qualified

33554432 bit

1.65 V

e4

30

260

NOR TYPE

30 ns

XC17128EPCG20C

Xilinx

CONFIGURATION MEMORY

COMMERCIAL

20

QCCJ

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

J BEND

SERIAL

SYNCHRONOUS

10 mA

131072 words

COMMON

5

5

1

CHIP CARRIER

LDCC20,.4SQ

OTP ROMs

1.27 mm

70 Cel

3-STATE

128KX1

128K

0 Cel

Matte Tin (Sn)

QUAD

S-PQCC-J20

3

5.25 V

4.572 mm

15 MHz

8.9662 mm

Not Qualified

131072 bit

4.75 V

USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS

e3

30

245

.00005 Amp

8.9662 mm

XC17128EVOG8C

Xilinx

CONFIGURATION MEMORY

COMMERCIAL

8

TSOP2

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

SERIAL

SYNCHRONOUS

10 mA

131072 words

COMMON

5

5

1

SMALL OUTLINE, THIN PROFILE

TSOP8,.25

OTP ROMs

1.27 mm

70 Cel

3-STATE

128KX1

128K

0 Cel

Matte Tin (Sn)

DUAL

R-PDSO-G8

3

5.25 V

1.1938 mm

15 MHz

3.937 mm

Not Qualified

131072 bit

4.75 V

USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS

e3

30

260

.00005 Amp

4.9276 mm

EEPROM

EEPROM, or Electrically Erasable Programmable Read-Only Memory, is a type of non-volatile computer memory that can store and retrieve data even when the power is turned off. EEPROM is commonly used in digital devices, such as computers, mobile phones, and digital cameras, to store configuration data, firmware, and other important information.

EEPROM works by storing data in a grid of memory cells that can be individually programmed and erased using electrical signals. Each memory cell consists of a transistor and a floating gate. The floating gate can hold an electric charge, which determines the state of the memory cell. To write data to the EEPROM, an electrical signal is applied to the transistor, which charges or discharges the floating gate. To read data from the EEPROM, an electrical signal is applied to the transistor, which determines the state of the floating gate.

One of the advantages of EEPROM is that it is non-volatile, which means that it can store data even when the power is turned off. This makes it ideal for storing critical data, such as system settings and firmware, that must be retained even in the absence of power.

EEPROM can also be reprogrammed and erased many times, which makes it a versatile and flexible memory technology. EEPROM can be programmed and erased in blocks or individually, depending on the specific requirements of the application.

One of the disadvantages of EEPROM is that it is slower than other types of computer memory, such as RAM or cache memory. EEPROM access times are measured in microseconds, which is much slower than access times for other types of memory. This makes EEPROM less suitable for applications that require high-speed data access.