| Part | RoHS | Manufacturer | Memory IC Type | Temperature Grade | No. of Terminals | Package Code | Package Shape | Package Body Material | Surface Mount | No. of Functions | Technology | Screening Level | Terminal Form | Parallel or Serial | Operating Mode | Sector Size (Words) | Maximum Supply Current | No. of Words | Input/Output Type | Nominal Supply Voltage / Vsup (V) | Mixed Memory Type | Toggle Bit | Power Supplies (V) | Memory Width | Package Style (Meter) | Package Equivalence Code | Alternate Memory Width | Sub-Category | Minimum Data Retention Time | Terminal Pitch | Maximum Operating Temperature | Reverse Pinout | Output Characteristics | Organization | No. of Words Code | Minimum Operating Temperature | No. of Sectors/Size | Command User Interface | Terminal Finish | Ready or Busy | Terminal Position | No. of Ports | Write Protection | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Supply Voltage (Vsup) | Maximum Seated Height | Endurance | Maximum Clock Frequency (fCLK) | Width | Qualification | Maximum Write Cycle Time (tWC) | Serial Bus Type | Boot Block | Memory Density | Minimum Supply Voltage (Vsup) | Additional Features | Page Size (words) | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Type | Maximum Standby Current | Length | Common Flash Interface | Maximum Access Time | Programming Voltage (V) | Data Polling |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
|
Micron Technology |
FLASH |
INDUSTRIAL |
48 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
8K,64K |
25 mA |
2097152 words |
3 |
YES |
3/3.3 |
16 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA48,6X8,32 |
8 |
Flash Memories |
.8 mm |
85 Cel |
2MX16 |
2M |
-40 Cel |
8,63 |
YES |
TIN SILVER COPPER |
YES |
BOTTOM |
R-PBGA-B48 |
3.6 V |
1 mm |
6 mm |
Not Qualified |
BOTTOM |
33554432 bit |
2.7 V |
8/16 |
e1 |
NOR TYPE |
.00012 Amp |
8 mm |
YES |
65 ns |
3 |
YES |
|||||||||||||||||
|
|
Micron Technology |
FLASH |
INDUSTRIAL |
48 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
64K |
25 mA |
2097152 words |
3 |
YES |
3/3.3 |
16 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA48,6X8,32 |
8 |
Flash Memories |
.8 mm |
85 Cel |
2MX16 |
2M |
-40 Cel |
64 |
YES |
TIN SILVER COPPER |
YES |
BOTTOM |
R-PBGA-B48 |
3.6 V |
1 mm |
6 mm |
Not Qualified |
33554432 bit |
2.7 V |
8/16 |
e1 |
NOR TYPE |
.00012 Amp |
8 mm |
YES |
65 ns |
3 |
YES |
||||||||||||||||||
|
|
Micron Technology |
FLASH |
INDUSTRIAL |
48 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
8K,64K |
25 mA |
4194304 words |
3 |
YES |
3/3.3 |
16 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA48,6X8,32 |
8 |
Flash Memories |
.8 mm |
85 Cel |
4MX16 |
4M |
-40 Cel |
8,127 |
YES |
TIN SILVER COPPER |
YES |
BOTTOM |
R-PBGA-B48 |
3.6 V |
1 mm |
6 mm |
Not Qualified |
BOTTOM |
67108864 bit |
2.7 V |
8/16 |
e1 |
NOR TYPE |
.00012 Amp |
8 mm |
YES |
60 ns |
3 |
YES |
|||||||||||||||||
|
|
Micron Technology |
FLASH |
INDUSTRIAL |
48 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
64K |
25 mA |
4194304 words |
3 |
YES |
3/3.3 |
16 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA48,6X8,32 |
8 |
Flash Memories |
.8 mm |
85 Cel |
4MX16 |
4M |
-40 Cel |
128 |
YES |
TIN SILVER COPPER |
YES |
BOTTOM |
R-PBGA-B48 |
3.6 V |
1 mm |
6 mm |
Not Qualified |
67108864 bit |
2.7 V |
8/16 |
e1 |
NOR TYPE |
.00012 Amp |
8 mm |
YES |
65 ns |
3 |
YES |
||||||||||||||||||
|
|
Micron Technology |
FLASH |
INDUSTRIAL |
48 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
64K |
25 mA |
4194304 words |
3 |
YES |
3/3.3 |
16 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA48,6X8,32 |
8 |
Flash Memories |
.8 mm |
85 Cel |
4MX16 |
4M |
-40 Cel |
128 |
YES |
TIN SILVER COPPER |
YES |
BOTTOM |
R-PBGA-B48 |
3.6 V |
1 mm |
6 mm |
Not Qualified |
67108864 bit |
2.7 V |
8/16 |
e1 |
NOR TYPE |
.00012 Amp |
8 mm |
YES |
65 ns |
3 |
YES |
||||||||||||||||||
|
|
Micron Technology |
FLASH |
INDUSTRIAL |
48 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
64K |
25 mA |
4194304 words |
3 |
YES |
3/3.3 |
16 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA48,6X8,32 |
8 |
Flash Memories |
.8 mm |
85 Cel |
4MX16 |
4M |
-40 Cel |
128 |
YES |
TIN SILVER COPPER |
YES |
BOTTOM |
R-PBGA-B48 |
3.6 V |
1 mm |
6 mm |
Not Qualified |
67108864 bit |
2.7 V |
8/16 |
e1 |
NOR TYPE |
.00012 Amp |
8 mm |
YES |
65 ns |
3 |
YES |
||||||||||||||||||
|
|
Micron Technology |
FLASH |
INDUSTRIAL |
48 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
8K,64K |
25 mA |
4194304 words |
3 |
YES |
3/3.3 |
16 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA48,6X8,32 |
8 |
Flash Memories |
.8 mm |
85 Cel |
4MX16 |
4M |
-40 Cel |
8,127 |
YES |
Tin/Silver/Copper (Sn/Ag/Cu) |
YES |
BOTTOM |
R-PBGA-B48 |
3.6 V |
1 mm |
6 mm |
Not Qualified |
TOP |
67108864 bit |
2.7 V |
8/16 |
e1 |
30 |
260 |
NOR TYPE |
.00012 Amp |
8 mm |
YES |
65 ns |
3 |
YES |
|||||||||||||||
|
|
Micron Technology |
FLASH |
INDUSTRIAL |
48 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
8K,64K |
25 mA |
4194304 words |
3 |
YES |
3/3.3 |
16 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA48,6X8,32 |
8 |
Flash Memories |
.8 mm |
85 Cel |
4MX16 |
4M |
-40 Cel |
8,127 |
YES |
TIN SILVER COPPER |
YES |
BOTTOM |
R-PBGA-B48 |
3.6 V |
1 mm |
6 mm |
Not Qualified |
TOP |
67108864 bit |
2.7 V |
8/16 |
e1 |
NOR TYPE |
.00012 Amp |
8 mm |
YES |
65 ns |
3 |
YES |
|||||||||||||||||
|
|
Micron Technology |
FLASH |
COMMERCIAL |
63 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
128K |
20 mA |
268435456 words |
1.8 |
NO |
1.8 |
8 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA63,10X12,32 |
Flash Memories |
.8 mm |
70 Cel |
256MX8 |
256M |
0 Cel |
2K |
YES |
YES |
BOTTOM |
R-PBGA-B63 |
1.95 V |
1 mm |
9 mm |
Not Qualified |
2147483648 bit |
1.7 V |
2K |
30 |
260 |
SLC NAND TYPE |
.00005 Amp |
11 mm |
25 ns |
1.8 |
NO |
||||||||||||||||||||
|
|
Micron Technology |
FLASH |
COMMERCIAL |
63 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
64K |
20 mA |
134217728 words |
1.8 |
NO |
1.8 |
16 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA63,10X12,32 |
Flash Memories |
.8 mm |
70 Cel |
128MX16 |
128M |
0 Cel |
2K |
YES |
YES |
BOTTOM |
R-PBGA-B63 |
1.95 V |
1 mm |
10.5 mm |
Not Qualified |
2147483648 bit |
1.7 V |
1K |
30 |
260 |
SLC NAND TYPE |
.00005 Amp |
13 mm |
25 ns |
1.8 |
NO |
||||||||||||||||||||
|
|
Micron Technology |
FLASH |
COMMERCIAL |
63 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
128K |
20 mA |
536870912 words |
1.8 |
NO |
1.8 |
8 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA63,10X12,32 |
Flash Memories |
.8 mm |
70 Cel |
512MX8 |
512M |
0 Cel |
4K |
YES |
YES |
BOTTOM |
R-PBGA-B63 |
1.95 V |
1 mm |
10.5 mm |
Not Qualified |
4294967296 bit |
1.7 V |
2K |
30 |
260 |
SLC NAND TYPE |
.00005 Amp |
13 mm |
25 ns |
NO |
|||||||||||||||||||||
|
|
Micron Technology |
FLASH |
INDUSTRIAL |
63 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
64K |
35 mA |
268435456 words |
3.3 |
NO |
3.3 |
16 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA63,10X12,32 |
Flash Memories |
.8 mm |
85 Cel |
256MX16 |
256M |
-40 Cel |
4K |
YES |
YES |
BOTTOM |
R-PBGA-B63 |
3.6 V |
1 mm |
9 mm |
Not Qualified |
4294967296 bit |
2.7 V |
1K |
30 |
260 |
SLC NAND TYPE |
.0001 Amp |
11 mm |
25 ns |
NO |
|||||||||||||||||||||
|
|
Micron Technology |
FLASH |
COMMERCIAL |
63 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
64K |
35 mA |
268435456 words |
3.3 |
NO |
3.3 |
16 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA63,10X12,32 |
Flash Memories |
.8 mm |
70 Cel |
256MX16 |
256M |
0 Cel |
4K |
YES |
YES |
BOTTOM |
R-PBGA-B63 |
3.6 V |
1 mm |
9 mm |
Not Qualified |
4294967296 bit |
2.7 V |
1K |
30 |
260 |
SLC NAND TYPE |
.0001 Amp |
11 mm |
25 ns |
NO |
|||||||||||||||||||||
|
|
Micron Technology |
FLASH |
COMMERCIAL |
63 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
64K |
20 mA |
268435456 words |
1.8 |
NO |
1.8 |
16 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA63,10X12,32 |
Flash Memories |
.8 mm |
70 Cel |
256MX16 |
256M |
0 Cel |
4K |
YES |
TIN SILVER COPPER |
YES |
BOTTOM |
R-PBGA-B63 |
1.95 V |
1 mm |
9 mm |
Not Qualified |
4294967296 bit |
1.7 V |
1K |
e1 |
SLC NAND TYPE |
.00005 Amp |
11 mm |
25 ns |
NO |
|||||||||||||||||||||
|
|
Micron Technology |
FLASH |
INDUSTRIAL |
63 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
64K |
20 mA |
268435456 words |
1.8 |
NO |
1.8 |
16 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA63,10X12,32 |
Flash Memories |
.8 mm |
85 Cel |
256MX16 |
256M |
-40 Cel |
4K |
YES |
YES |
BOTTOM |
R-PBGA-B63 |
1.95 V |
1 mm |
10.5 mm |
Not Qualified |
4294967296 bit |
1.7 V |
1K |
NOT SPECIFIED |
NOT SPECIFIED |
SLC NAND TYPE |
.00005 Amp |
13 mm |
25 ns |
NO |
|||||||||||||||||||||
|
|
Micron Technology |
FLASH |
COMMERCIAL |
63 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
64K |
20 mA |
268435456 words |
1.8 |
NO |
1.8 |
16 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA63,10X12,32 |
Flash Memories |
.8 mm |
70 Cel |
256MX16 |
256M |
0 Cel |
4K |
YES |
YES |
BOTTOM |
R-PBGA-B63 |
1.95 V |
1 mm |
10.5 mm |
Not Qualified |
4294967296 bit |
1.7 V |
1K |
30 |
260 |
SLC NAND TYPE |
.00005 Amp |
13 mm |
25 ns |
NO |
|||||||||||||||||||||
|
|
Micron Technology |
FLASH |
INDUSTRIAL |
63 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
128K |
20 mA |
1073741824 words |
1.8 |
NO |
1.8 |
8 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA63,10X12,32 |
Flash Memories |
.8 mm |
85 Cel |
1GX8 |
1G |
-40 Cel |
8K |
YES |
TIN SILVER COPPER |
YES |
BOTTOM |
R-PBGA-B63 |
1.95 V |
1 mm |
9 mm |
Not Qualified |
8589934592 bit |
1.7 V |
2K |
e1 |
SLC NAND TYPE |
.00005 Amp |
11 mm |
25 ns |
NO |
|||||||||||||||||||||
|
|
Micron Technology |
FLASH |
COMMERCIAL |
63 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
128K |
20 mA |
1073741824 words |
1.8 |
NO |
1.8 |
8 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA63,10X12,32 |
Flash Memories |
.8 mm |
70 Cel |
1GX8 |
1G |
0 Cel |
8K |
YES |
YES |
BOTTOM |
R-PBGA-B63 |
1.95 V |
1 mm |
9 mm |
Not Qualified |
8589934592 bit |
1.7 V |
2K |
30 |
260 |
SLC NAND TYPE |
.00005 Amp |
11 mm |
25 ns |
NO |
|||||||||||||||||||||
|
|
Micron Technology |
FLASH |
INDUSTRIAL |
63 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
64K |
35 mA |
536870912 words |
3.3 |
NO |
3.3 |
16 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA63,10X12,32 |
Flash Memories |
.8 mm |
85 Cel |
512MX16 |
512M |
-40 Cel |
8K |
YES |
YES |
BOTTOM |
R-PBGA-B63 |
3.6 V |
1 mm |
9 mm |
Not Qualified |
8589934592 bit |
2.7 V |
1K |
30 |
260 |
SLC NAND TYPE |
.0001 Amp |
11 mm |
25 ns |
3.3 |
NO |
||||||||||||||||||||
|
|
Micron Technology |
FLASH |
INDUSTRIAL |
63 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
64K |
20 mA |
536870912 words |
1.8 |
NO |
1.8 |
16 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA63,10X12,32 |
Flash Memories |
.8 mm |
85 Cel |
512MX16 |
512M |
-40 Cel |
8K |
YES |
YES |
BOTTOM |
R-PBGA-B63 |
1.95 V |
1 mm |
9 mm |
Not Qualified |
8589934592 bit |
1.7 V |
1K |
30 |
260 |
SLC NAND TYPE |
.00005 Amp |
11 mm |
25 ns |
NO |
|||||||||||||||||||||
|
|
Micron Technology |
FLASH |
INDUSTRIAL |
63 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
134217728 words |
1.8 |
8 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.8 mm |
85 Cel |
128MX8 |
128M |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B63 |
1.95 V |
1 mm |
9 mm |
1073741824 bit |
1.7 V |
e1 |
SLC NAND TYPE |
11 mm |
25 ns |
1.8 |
|||||||||||||||||||||||||||||||||
|
|
Micron Technology |
FLASH |
INDUSTRIAL |
63 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
268435456 words |
1.8 |
8 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.8 mm |
85 Cel |
256MX8 |
256M |
-40 Cel |
Tin/Silver/Copper (Sn/Ag/Cu) |
BOTTOM |
R-PBGA-B63 |
1.95 V |
1 mm |
9 mm |
2147483648 bit |
1.7 V |
e1 |
30 |
260 |
SLC NAND TYPE |
11 mm |
1.8 |
||||||||||||||||||||||||||||||||
|
|
Micron Technology |
FLASH |
COMMERCIAL |
63 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
268435456 words |
1.8 |
8 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.8 mm |
70 Cel |
256MX8 |
256M |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B63 |
1.95 V |
1 mm |
10.5 mm |
2147483648 bit |
1.7 V |
e1 |
SLC NAND TYPE |
13 mm |
1.8 |
||||||||||||||||||||||||||||||||||
|
|
Micron Technology |
FLASH CARD |
INDUSTRIAL |
169 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.5 mm |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B169 |
.8 mm |
14 mm |
e1 |
18 mm |
3.3 |
|||||||||||||||||||||||||||||||||||||||||||||||
|
Micron Technology |
FLASH |
COMMERCIAL |
63 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
134217728 words |
1.8 |
8 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.8 mm |
70 Cel |
128MX8 |
128M |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B63 |
1.95 V |
1 mm |
10.5 mm |
1073741824 bit |
1.65 V |
e1 |
SLC NAND TYPE |
13 mm |
1.8 |
|||||||||||||||||||||||||||||||||||
|
|
Micron Technology |
FLASH |
INDUSTRIAL |
63 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
134217728 words |
1.8 |
8 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.8 mm |
85 Cel |
128MX8 |
128M |
-40 Cel |
Tin/Silver/Copper (Sn/Ag/Cu) |
BOTTOM |
R-PBGA-B63 |
1.95 V |
1 mm |
10.5 mm |
1073741824 bit |
1.65 V |
e1 |
SLC NAND TYPE |
13 mm |
1.8 |
||||||||||||||||||||||||||||||||||
|
Micron Technology |
FLASH |
COMMERCIAL |
63 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
67108864 words |
1.8 |
16 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.8 mm |
70 Cel |
64MX16 |
64M |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B63 |
1.95 V |
1 mm |
10.5 mm |
1073741824 bit |
1.65 V |
e1 |
SLC NAND TYPE |
13 mm |
1.8 |
|||||||||||||||||||||||||||||||||||
|
Micron Technology |
FLASH |
INDUSTRIAL |
63 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
67108864 words |
1.8 |
16 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.8 mm |
85 Cel |
64MX16 |
64M |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B63 |
1.95 V |
1 mm |
10.5 mm |
1073741824 bit |
1.65 V |
e1 |
SLC NAND TYPE |
13 mm |
1.8 |
|||||||||||||||||||||||||||||||||||
|
|
Micron Technology |
FLASH |
INDUSTRIAL |
63 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
128K |
20 mA |
134217728 words |
1.8 |
NO |
1.8 |
8 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA63,10X12,32 |
Flash Memories |
.8 mm |
85 Cel |
128MX8 |
128M |
-40 Cel |
1K |
YES |
TIN SILVER COPPER |
YES |
BOTTOM |
R-PBGA-B63 |
1.95 V |
1 mm |
9 mm |
Not Qualified |
1073741824 bit |
1.7 V |
2K |
e1 |
SLC NAND TYPE |
.00005 Amp |
11 mm |
25 ns |
1.8 |
NO |
||||||||||||||||||||
|
|
Micron Technology |
FLASH CARD |
INDUSTRIAL |
169 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
17179869184 words |
3.3 |
8 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA169,14X28,20 |
.5 mm |
85 Cel |
16GX8 |
16G |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B169 |
3.6 V |
.8 mm |
52 MHz |
14 mm |
137438953472 bit |
2.7 V |
e1 |
MLC NAND TYPE |
18 mm |
3.3 |
||||||||||||||||||||||||||||||||
|
|
Micron Technology |
FLASH |
INDUSTRIAL |
63 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
256K |
35 mA |
2147483648 words |
3.3 |
NO |
3/3.3 |
8 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA63,10X12,32 |
Flash Memories |
.8 mm |
85 Cel |
2GX8 |
2G |
-40 Cel |
8K |
YES |
YES |
BOTTOM |
R-PBGA-B63 |
3.6 V |
1 mm |
9 mm |
Not Qualified |
17179869184 bit |
2.7 V |
4K |
NOT SPECIFIED |
NOT SPECIFIED |
SLC NAND TYPE |
.0001 Amp |
11 mm |
25 ns |
2.7 |
NO |
||||||||||||||||||||
|
|
Micron Technology |
FLASH |
COMMERCIAL |
63 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
64K |
20 mA |
134217728 words |
1.8 |
NO |
1.8 |
16 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA63,10X12,32 |
Flash Memories |
.8 mm |
70 Cel |
128MX16 |
128M |
0 Cel |
2K |
YES |
TIN SILVER COPPER |
YES |
BOTTOM |
R-PBGA-B63 |
1.95 V |
1 mm |
9 mm |
Not Qualified |
2147483648 bit |
1.7 V |
1K |
e1 |
30 |
260 |
SLC NAND TYPE |
.00005 Amp |
11 mm |
25 ns |
1.8 |
NO |
||||||||||||||||||
|
|
Micron Technology |
FLASH |
COMMERCIAL |
63 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
64K |
20 mA |
134217728 words |
1.8 |
NO |
1.8 |
16 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA63,10X12,32 |
Flash Memories |
.8 mm |
70 Cel |
128MX16 |
128M |
0 Cel |
2K |
YES |
Tin/Silver/Copper (Sn/Ag/Cu) |
YES |
BOTTOM |
R-PBGA-B63 |
1.95 V |
1 mm |
9 mm |
Not Qualified |
2147483648 bit |
1.7 V |
1K |
e1 |
30 |
260 |
SLC NAND TYPE |
.00005 Amp |
11 mm |
25 ns |
1.8 |
NO |
||||||||||||||||||
|
|
Micron Technology |
FLASH |
INDUSTRIAL |
63 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
128K |
20 mA |
134217728 words |
1.8 |
NO |
8 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA63,10X12,32 |
10 |
.8 mm |
85 Cel |
128MX8 |
128M |
-40 Cel |
1K |
YES |
Tin/Silver/Copper (Sn/Ag/Cu) |
YES |
BOTTOM |
HARDWARE |
R-PBGA-B63 |
1.95 V |
1 mm |
100000 Write/Erase Cycles |
9 mm |
1073741824 bit |
1.7 V |
2K |
e1 |
30 |
260 |
SLC NAND TYPE |
.00005 Amp |
11 mm |
1.8 |
NO |
|||||||||||||||||||
|
|
Macronix |
FLASH |
INDUSTRIAL |
12 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
SERIAL |
SYNCHRONOUS |
8388608 words |
1.8 |
4 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
2 |
.5 mm |
85 Cel |
8MX4 |
8M |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B12 |
3 |
2 V |
.48 mm |
104 MHz |
33554432 bit |
1.65 V |
ALSO IT CAN BE CONFIGURED AS 32M X 1 BIT |
e1 |
1.8 |
|||||||||||||||||||||||||||||||||
|
|
Macronix |
FLASH |
INDUSTRIAL |
63 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
268435456 words |
3 |
8 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.8 mm |
85 Cel |
256MX8 |
256M |
-40 Cel |
BOTTOM |
R-PBGA-B63 |
3.6 V |
1 mm |
9 mm |
2147483648 bit |
2.7 V |
NOT SPECIFIED |
NOT SPECIFIED |
SLC NAND TYPE |
11 mm |
3 |
||||||||||||||||||||||||||||||||||
|
|
Micron Technology |
FLASH |
INDUSTRIAL |
63 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
SERIAL |
SYNCHRONOUS |
1073741824 words |
3.3 |
1 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.8 mm |
85 Cel |
1GX1 |
1G |
-40 Cel |
Tin/Silver/Copper (Sn/Ag/Cu) |
BOTTOM |
R-PBGA-B63 |
3.6 V |
1 mm |
50 MHz |
9 mm |
1073741824 bit |
2.7 V |
e1 |
30 |
260 |
SLC NAND TYPE |
11 mm |
2.7 |
|||||||||||||||||||||||||||||||
|
|
Micron Technology |
FLASH CARD |
OTHER |
153 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
4294967296 words |
3.3 |
NO |
8 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA153,14X14,20 |
.5 mm |
85 Cel |
4GX8 |
4G |
-25 Cel |
NO |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B153 |
3.6 V |
.8 mm |
52 MHz |
11.5 mm |
34359738368 bit |
2.7 V |
e1 |
MLC NAND TYPE |
13 mm |
3.3 |
NO |
|||||||||||||||||||||||||||||
|
|
Micron Technology |
FLASH |
56 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
128K |
50 mA |
16777216 words |
3 |
YES |
16 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA56,8X8,32 |
8 |
20 |
.8 mm |
85 Cel |
3-STATE |
16MX16 |
16M |
-40 Cel |
256 |
YES |
YES |
BOTTOM |
R-PBGA-B56 |
3.6 V |
1 mm |
100000 Write/Erase Cycles |
7 mm |
.00006 ms |
268435456 bit |
2.7 V |
16 |
NOT SPECIFIED |
NOT SPECIFIED |
NOR TYPE |
.000135 Amp |
9 mm |
YES |
70 ns |
3 |
YES |
||||||||||||||||||
|
|
Micron Technology |
FLASH |
56 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
128K |
50 mA |
16777216 words |
3 |
YES |
16 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA56,8X8,32 |
8 |
20 |
.8 mm |
85 Cel |
3-STATE |
16MX16 |
16M |
-40 Cel |
256 |
YES |
YES |
BOTTOM |
R-PBGA-B56 |
3.6 V |
1 mm |
100000 Write/Erase Cycles |
7 mm |
.00006 ms |
268435456 bit |
2.7 V |
16 |
NOT SPECIFIED |
NOT SPECIFIED |
NOR TYPE |
.000135 Amp |
9 mm |
YES |
70 ns |
3 |
YES |
||||||||||||||||||
|
|
Integrated Silicon Solution |
FLASH |
153 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
AEC-Q100 |
BALL |
SERIAL |
SYNCHRONOUS |
55 mA |
34359738368 words |
3.3 |
8 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA153,14X14,20 |
.5 mm |
105 Cel |
3-STATE |
32GX8 |
32G |
-40 Cel |
BOTTOM |
HARDWARE/SOFTWARE |
R-PBGA-B153 |
3.6 V |
1 mm |
200 MHz |
11.5 mm |
274877906944 bit |
2.7 V |
NOT SPECIFIED |
NOT SPECIFIED |
TLC NAND TYPE |
.00003 Amp |
13 mm |
3.3 |
||||||||||||||||||||||||||||
|
|
Micron Technology |
FLASH CARD |
OTHER |
153 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
8589934592 words |
3.3 |
NO |
8 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA153,14X14,20 |
.5 mm |
85 Cel |
OPEN-DRAIN |
8GX8 |
8G |
-25 Cel |
NO |
BOTTOM |
R-PBGA-B153 |
3.6 V |
1 mm |
11.5 mm |
68719476736 bit |
2.7 V |
ALSO AVAILABE WITH TAPE AND REEL |
NOT SPECIFIED |
NOT SPECIFIED |
MLC NAND TYPE |
13 mm |
NO |
|||||||||||||||||||||||||||||
|
|
Micron Technology |
FLASH CARD |
OTHER |
153 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
4294967296 words |
3.3 |
NO |
8 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA153,14X14,20 |
.5 mm |
85 Cel |
OPEN-DRAIN |
4GX8 |
4G |
-25 Cel |
NO |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B153 |
3.6 V |
1 mm |
11.5 mm |
34359738368 bit |
2.7 V |
ALSO AVAILABE WITH TAPE AND REEL |
30 |
260 |
MLC NAND TYPE |
13 mm |
NO |
||||||||||||||||||||||||||||
|
|
Micron Technology |
FLASH |
INDUSTRIAL |
63 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
128K |
20 mA |
1073741824 words |
1.8 |
NO |
1.8 |
16 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA63,10X12,32 |
Flash Memories |
.8 mm |
85 Cel |
1GX16 |
1G |
-40 Cel |
8K |
YES |
YES |
BOTTOM |
R-PBGA-B63 |
1.95 V |
1 mm |
9 mm |
Not Qualified |
17179869184 bit |
1.7 V |
2K |
MLC NAND TYPE |
.00005 Amp |
11 mm |
30 ns |
1.8 |
NO |
||||||||||||||||||||||
|
|
Micron Technology |
FLASH |
INDUSTRIAL |
63 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
134217728 words |
3.3 |
8 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.8 mm |
85 Cel |
128MX8 |
128M |
-40 Cel |
BOTTOM |
R-PBGA-B63 |
3.6 V |
1 mm |
9 mm |
1073741824 bit |
2.7 V |
NOT SPECIFIED |
NOT SPECIFIED |
SLC NAND TYPE |
11 mm |
3.3 |
||||||||||||||||||||||||||||||||||
|
|
Micron Technology |
FLASH |
INDUSTRIAL |
63 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
128K |
35 mA |
134217728 words |
3.3 |
NO |
3.3 |
8 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA63,10X12,32 |
Flash Memories |
.8 mm |
85 Cel |
128MX8 |
128M |
-40 Cel |
1K |
YES |
YES |
BOTTOM |
R-PBGA-B63 |
3.6 V |
1 mm |
9 mm |
Not Qualified |
1073741824 bit |
2.7 V |
2K |
30 |
260 |
SLC NAND TYPE |
.0001 Amp |
11 mm |
25 ns |
3.3 |
NO |
||||||||||||||||||||
|
|
Micron Technology |
FLASH |
COMMERCIAL |
63 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
128K |
20 mA |
134217728 words |
1.8 |
NO |
1.8 |
8 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA63,10X12,32 |
Flash Memories |
.8 mm |
70 Cel |
128MX8 |
128M |
0 Cel |
1K |
YES |
YES |
BOTTOM |
R-PBGA-B63 |
1.95 V |
1 mm |
9 mm |
Not Qualified |
1073741824 bit |
1.7 V |
2K |
SLC NAND TYPE |
.00005 Amp |
11 mm |
25 ns |
1.8 |
NO |
||||||||||||||||||||||
|
|
Micron Technology |
FLASH |
INDUSTRIAL |
63 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
128K |
20 mA |
134217728 words |
1.8 |
NO |
1.8 |
8 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA63,10X12,32 |
Flash Memories |
.8 mm |
85 Cel |
128MX8 |
128M |
-40 Cel |
1K |
YES |
TIN SILVER COPPER |
YES |
BOTTOM |
R-PBGA-B63 |
1.95 V |
1 mm |
10.5 mm |
Not Qualified |
1073741824 bit |
1.7 V |
2K |
e1 |
SLC NAND TYPE |
.00005 Amp |
13 mm |
25 ns |
1.8 |
NO |
Flash memory is a type of non-volatile computer memory that is commonly used in digital devices such as USB drives, solid-state drives, and digital cameras. It is a type of EEPROM (Electrically Erasable Programmable Read-Only Memory) that allows data to be erased and reprogrammed in blocks instead of one byte at a time. Flash memory uses a floating gate transistor to store data, which allows it to retain information even when the power is turned off.
Flash memory is widely used in digital devices because of its high capacity, small size, and fast access times. It is also more durable than other types of memory, such as hard disk drives, because it has no moving parts. This makes it ideal for use in portable devices that may be subject to physical shock or vibration.
There are two types of flash memory: NOR flash and NAND flash. NOR flash is faster than NAND flash, but it has lower density and higher cost per bit. NOR flash is typically used for code storage, such as firmware or boot code, because it provides faster access times. NAND flash has higher density and lower cost per bit, which makes it ideal for data storage applications.
Flash memory has a limited lifespan, as it can only be erased and reprogrammed a limited number of times. This is because the process of erasing and reprogramming the memory causes wear and tear on the floating gate transistor. However, modern flash memory devices have a sophisticated wear-leveling algorithm that distributes writes evenly across the memory, which extends the lifespan of the device.