| Part | RoHS | Manufacturer | Memory IC Type | Temperature Grade | No. of Terminals | Package Code | Package Shape | Package Body Material | Surface Mount | No. of Functions | Technology | Screening Level | Terminal Form | Parallel or Serial | Operating Mode | Sector Size (Words) | Maximum Supply Current | No. of Words | Input/Output Type | Nominal Supply Voltage / Vsup (V) | Mixed Memory Type | Toggle Bit | Power Supplies (V) | Memory Width | Package Style (Meter) | Package Equivalence Code | Alternate Memory Width | Sub-Category | Minimum Data Retention Time | Terminal Pitch | Maximum Operating Temperature | Reverse Pinout | Output Characteristics | Organization | No. of Words Code | Minimum Operating Temperature | No. of Sectors/Size | Command User Interface | Terminal Finish | Ready or Busy | Terminal Position | No. of Ports | Write Protection | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Supply Voltage (Vsup) | Maximum Seated Height | Endurance | Maximum Clock Frequency (fCLK) | Width | Qualification | Maximum Write Cycle Time (tWC) | Serial Bus Type | Boot Block | Memory Density | Minimum Supply Voltage (Vsup) | Additional Features | Page Size (words) | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Type | Maximum Standby Current | Length | Common Flash Interface | Maximum Access Time | Programming Voltage (V) | Data Polling |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
|
Sharp Corporation |
FLASH |
INDUSTRIAL |
56 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
1048576 words |
5 |
16 |
SMALL OUTLINE, THIN PROFILE |
8 |
.5 mm |
85 Cel |
1MX16 |
1M |
-40 Cel |
Tin/Bismuth (Sn/Bi) |
DUAL |
R-PDSO-G56 |
3 |
5.5 V |
1.19 mm |
14 mm |
Not Qualified |
16777216 bit |
4.5 V |
e6 |
10 |
250 |
NOR TYPE |
18.4 mm |
90 ns |
5 |
||||||||||||||||||||||||||||
|
|
Atmel |
FLASH |
INDUSTRIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
8K,112K,8K |
15 mA |
131072 words |
3 |
YES |
3/3.3 |
8 |
CHIP CARRIER |
LDCC32,.5X.6 |
Flash Memories |
1.27 mm |
85 Cel |
128KX8 |
128K |
-40 Cel |
1,1,1 |
NO |
MATTE TIN |
QUAD |
R-PQCC-J32 |
2 |
3.6 V |
3.556 mm |
11.43 mm |
Not Qualified |
20 ms |
BOTTOM/TOP |
1048576 bit |
2.7 V |
e3 |
245 |
NOR TYPE |
.00005 Amp |
13.97 mm |
120 ns |
2.7 |
YES |
||||||||||||||||||
|
|
Atmel |
FLASH |
INDUSTRIAL |
32 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
256 |
40 mA |
524288 words |
5 |
YES |
5 |
8 |
SMALL OUTLINE, THIN PROFILE |
TSSOP32,.8,20 |
Flash Memories |
.5 mm |
85 Cel |
512KX8 |
512K |
-40 Cel |
2K |
NO |
MATTE TIN |
DUAL |
R-PDSO-G32 |
3 |
5.5 V |
1.2 mm |
8 mm |
Not Qualified |
10 ms |
BOTTOM/TOP |
4194304 bit |
4.5 V |
256 |
e3 |
260 |
NOR TYPE |
.0003 Amp |
18.4 mm |
90 ns |
5 |
YES |
|||||||||||||||||
|
|
Atmel |
FLASH |
INDUSTRIAL |
32 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
256 |
15 mA |
262144 words |
3.3 |
YES |
3.3 |
8 |
SMALL OUTLINE, THIN PROFILE |
TSSOP32,.8,20 |
Flash Memories |
.5 mm |
85 Cel |
256KX8 |
256K |
-40 Cel |
1K |
NO |
Matte Tin (Sn) |
DUAL |
R-PDSO-G32 |
3 |
3.6 V |
1.2 mm |
8 mm |
Not Qualified |
20 ms |
BOTTOM/TOP |
2097152 bit |
3 V |
e3 |
30 |
260 |
NOR TYPE |
.00005 Amp |
18.4 mm |
100 ns |
3 |
YES |
|||||||||||||||||
|
|
Atmel |
FLASH |
INDUSTRIAL |
32 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
128 |
15 mA |
65536 words |
3.3 |
YES |
3.3 |
8 |
SMALL OUTLINE, THIN PROFILE |
TSSOP32,.8,20 |
Flash Memories |
.5 mm |
85 Cel |
64KX8 |
64K |
-40 Cel |
512 |
NO |
MATTE TIN |
DUAL |
R-PDSO-G32 |
3 |
3.6 V |
1.2 mm |
10000 Write/Erase Cycles |
8 mm |
Not Qualified |
20 ms |
524288 bit |
3 V |
128 |
e3 |
260 |
NOR TYPE |
.00005 Amp |
18.4 mm |
120 ns |
3 |
YES |
|||||||||||||||||
|
|
Atmel |
FLASH |
INDUSTRIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
128 |
50 mA |
65536 words |
5 |
YES |
5 |
8 |
CHIP CARRIER |
LDCC32,.5X.6 |
Flash Memories |
1.27 mm |
85 Cel |
64KX8 |
64K |
-40 Cel |
512 |
NO |
Matte Tin (Sn) |
QUAD |
R-PQCC-J32 |
2 |
5.25 V |
3.556 mm |
10000 Write/Erase Cycles |
11.43 mm |
Not Qualified |
10 ms |
524288 bit |
4.75 V |
128 |
e3 |
40 |
245 |
NOR TYPE |
.0003 Amp |
13.97 mm |
70 ns |
5 |
YES |
||||||||||||||||
|
|
Atmel |
FLASH |
INDUSTRIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
128 |
50 mA |
65536 words |
5 |
YES |
5 |
8 |
CHIP CARRIER |
LDCC32,.5X.6 |
Flash Memories |
1.27 mm |
85 Cel |
3-STATE |
64KX8 |
64K |
-40 Cel |
512 |
NO |
Matte Tin (Sn) |
QUAD |
R-PQCC-J32 |
2 |
5.5 V |
3.556 mm |
10000 Write/Erase Cycles |
11.43 mm |
Not Qualified |
10 ms |
524288 bit |
4.5 V |
AUTOMATIC WRITE; HARDWARE & SOFTWARE DATA PROTECTION |
128 |
e3 |
40 |
245 |
NOR TYPE |
.0003 Amp |
13.97 mm |
90 ns |
5 |
YES |
||||||||||||||
|
|
Atmel |
FLASH |
INDUSTRIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
8K,112K,8K |
50 mA |
131072 words |
5 |
YES |
5 |
8 |
CHIP CARRIER |
LDCC32,.5X.6 |
Flash Memories |
1.27 mm |
85 Cel |
3-STATE |
128KX8 |
128K |
-40 Cel |
1,1,1 |
NO |
Matte Tin (Sn) |
QUAD |
R-PQCC-J32 |
2 |
5.5 V |
3.556 mm |
11.43 mm |
Not Qualified |
10 ms |
BOTTOM/TOP |
1048576 bit |
4.5 V |
e3 |
40 |
245 |
NOR TYPE |
.00003 Amp |
13.97 mm |
90 ns |
5 |
YES |
||||||||||||||||
|
|
Atmel |
FLASH |
INDUSTRIAL |
32 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
256 |
40 mA |
262144 words |
5 |
YES |
5 |
8 |
SMALL OUTLINE, THIN PROFILE |
TSSOP32,.8,20 |
Flash Memories |
.5 mm |
85 Cel |
256KX8 |
256K |
-40 Cel |
1K |
NO |
MATTE TIN |
DUAL |
R-PDSO-G32 |
3 |
5.5 V |
1.2 mm |
8 mm |
Not Qualified |
10 ms |
BOTTOM/TOP |
2097152 bit |
4.5 V |
e3 |
260 |
NOR TYPE |
.0003 Amp |
18.4 mm |
70 ns |
5 |
YES |
||||||||||||||||||
|
|
Atmel |
FLASH |
INDUSTRIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
8K,112K,8K |
50 mA |
131072 words |
5 |
YES |
5 |
8 |
CHIP CARRIER |
LDCC32,.5X.6 |
Flash Memories |
1.27 mm |
85 Cel |
128KX8 |
128K |
-40 Cel |
1,1,1 |
NO |
Matte Tin (Sn) |
QUAD |
R-PQCC-J32 |
2 |
5.25 V |
3.556 mm |
11.43 mm |
Not Qualified |
10 ms |
BOTTOM/TOP |
1048576 bit |
4.75 V |
e3 |
40 |
245 |
NOR TYPE |
.00003 Amp |
13.97 mm |
70 ns |
5 |
YES |
|||||||||||||||||
|
|
Macronix |
FLASH |
INDUSTRIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
64K |
30 mA |
524288 words |
3 |
YES |
3/3.3 |
8 |
CHIP CARRIER |
LDCC32,.5X.6 |
Flash Memories |
1.27 mm |
85 Cel |
512KX8 |
512K |
-40 Cel |
8 |
YES |
Tin (Sn) |
QUAD |
R-PQCC-J32 |
3.6 V |
3.55 mm |
11.43 mm |
Not Qualified |
4194304 bit |
2.7 V |
e3 |
NOR TYPE |
.000005 Amp |
14.05 mm |
YES |
90 ns |
3 |
YES |
|||||||||||||||||||||
|
|
Macronix |
FLASH |
INDUSTRIAL |
48 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
16K,8K,32K,64K |
30 mA |
4194304 words |
3 |
YES |
3/3.3 |
16 |
SMALL OUTLINE, THIN PROFILE |
TSSOP48,.8,20 |
8 |
Flash Memories |
.5 mm |
85 Cel |
4MX16 |
4M |
-40 Cel |
1,2,1,7 |
YES |
Tin (Sn) |
YES |
DUAL |
R-PDSO-G48 |
3 |
3.6 V |
1.2 mm |
12 mm |
Not Qualified |
BOTTOM |
67108864 bit |
2.7 V |
e3 |
NOR TYPE |
.000005 Amp |
18.4 mm |
YES |
70 ns |
3 |
YES |
|||||||||||||||||
|
|
Macronix |
FLASH |
INDUSTRIAL |
48 |
LFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
16K,8K,32K,64K |
30 mA |
8388608 words |
3 |
YES |
3/3.3 |
16 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA48,6X8,32 |
8 |
Flash Memories |
.8 mm |
85 Cel |
8MX16 |
8M |
-40 Cel |
1,2,1,15 |
YES |
TIN SILVER COPPER |
YES |
BOTTOM |
R-PBGA-B48 |
3.6 V |
1.3 mm |
6 mm |
Not Qualified |
BOTTOM |
134217728 bit |
2.7 V |
e1 |
NOR TYPE |
.000005 Amp |
8 mm |
YES |
70 ns |
3 |
YES |
||||||||||||||||||
|
|
STMicroelectronics |
FLASH |
INDUSTRIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
16K |
20 mA |
131072 words |
5 |
YES |
5 |
8 |
CHIP CARRIER |
LDCC32,.5X.6 |
Flash Memories |
1.27 mm |
85 Cel |
128KX8 |
128K |
-40 Cel |
8 |
YES |
Matte Tin (Sn) |
QUAD |
R-PQCC-J32 |
5.5 V |
3.56 mm |
100000 Write/Erase Cycles |
11.43 mm |
Not Qualified |
1048576 bit |
4.5 V |
e3 |
40 |
250 |
NOR TYPE |
.0001 Amp |
13.97 mm |
70 ns |
5 |
YES |
|||||||||||||||||||
|
|
Micron Technology |
FLASH |
INDUSTRIAL |
48 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
128K |
30 mA |
536870912 words |
3.3 |
NO |
3/3.3 |
8 |
SMALL OUTLINE, THIN PROFILE |
TSSOP48,.8,20 |
Flash Memories |
.5 mm |
85 Cel |
512MX8 |
512M |
-40 Cel |
4K |
YES |
MATTE TIN |
YES |
DUAL |
R-PDSO-G48 |
3.6 V |
1.2 mm |
12 mm |
Not Qualified |
4294967296 bit |
2.7 V |
2K |
e3 |
SLC NAND TYPE |
.0001 Amp |
18.4 mm |
18 ns |
2.7 |
NO |
||||||||||||||||||||
|
|
STMicroelectronics |
FLASH |
INDUSTRIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
16K |
20 mA |
131072 words |
5 |
YES |
5 |
8 |
CHIP CARRIER |
LDCC32,.5X.6 |
Flash Memories |
1.27 mm |
85 Cel |
128KX8 |
128K |
-40 Cel |
8 |
YES |
Matte Tin (Sn) |
QUAD |
R-PQCC-J32 |
5.5 V |
3.56 mm |
100000 Write/Erase Cycles |
11.43 mm |
Not Qualified |
1048576 bit |
4.5 V |
e3 |
40 |
250 |
NOR TYPE |
.0001 Amp |
13.97 mm |
45 ns |
5 |
YES |
|||||||||||||||||||
|
|
STMicroelectronics |
FLASH |
INDUSTRIAL |
32 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
16K |
20 mA |
131072 words |
5 |
YES |
5 |
8 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP32,.8,20 |
Flash Memories |
.5 mm |
85 Cel |
128KX8 |
128K |
-40 Cel |
8 |
YES |
TIN/TIN BISMUTH |
DUAL |
R-PDSO-G32 |
5.5 V |
1.2 mm |
100000 Write/Erase Cycles |
8 mm |
Not Qualified |
1048576 bit |
4.5 V |
e3/e6 |
NOT SPECIFIED |
NOT SPECIFIED |
NOR TYPE |
.0001 Amp |
18.4 mm |
70 ns |
5 |
YES |
|||||||||||||||||||
|
|
STMicroelectronics |
FLASH |
INDUSTRIAL |
48 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
16K,8K,32K,64K |
20 mA |
131072 words |
5 |
YES |
5 |
16 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP48,.8,20 |
8 |
Flash Memories |
.5 mm |
85 Cel |
128KX16 |
128K |
-40 Cel |
1,2,1,3 |
YES |
MATTE TIN/TIN BISMUTH |
YES |
DUAL |
R-PDSO-G48 |
5.5 V |
1.2 mm |
100000 Write/Erase Cycles |
12 mm |
Not Qualified |
BOTTOM |
2097152 bit |
4.5 V |
BOTTOM BOOT BLOCK |
e3/e6 |
40 |
260 |
NOR TYPE |
.0001 Amp |
18.4 mm |
70 ns |
5 |
YES |
|||||||||||||||
|
|
STMicroelectronics |
FLASH |
INDUSTRIAL |
48 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
16K,8K,32K,64K |
20 mA |
131072 words |
5 |
YES |
5 |
16 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP48,.8,20 |
8 |
Flash Memories |
.5 mm |
85 Cel |
128KX16 |
128K |
-40 Cel |
1,2,1,3 |
YES |
MATTE TIN/TIN BISMUTH |
YES |
DUAL |
R-PDSO-G48 |
5.5 V |
1.2 mm |
100000 Write/Erase Cycles |
12 mm |
Not Qualified |
TOP |
2097152 bit |
4.5 V |
TOP BOOT BLOCK |
e3/e6 |
40 |
260 |
NOR TYPE |
.0001 Amp |
18.4 mm |
70 ns |
5 |
YES |
|||||||||||||||
|
|
STMicroelectronics |
FLASH |
INDUSTRIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
64K |
20 mA |
524288 words |
5 |
YES |
5 |
8 |
CHIP CARRIER |
LDCC32,.5X.6 |
Flash Memories |
1.27 mm |
85 Cel |
512KX8 |
512K |
-40 Cel |
8 |
YES |
MATTE TIN |
QUAD |
R-PQCC-J32 |
5.5 V |
3.56 mm |
100000 Write/Erase Cycles |
11.43 mm |
Not Qualified |
4194304 bit |
4.5 V |
e3 |
NOR TYPE |
.0001 Amp |
13.97 mm |
45 ns |
5 |
YES |
|||||||||||||||||||||
|
|
STMicroelectronics |
FLASH |
INDUSTRIAL |
32 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
64K |
20 mA |
524288 words |
5 |
YES |
5 |
8 |
SMALL OUTLINE, THIN PROFILE |
TSSOP32,.8,20 |
Flash Memories |
.5 mm |
85 Cel |
512KX8 |
512K |
-40 Cel |
8 |
YES |
TIN/TIN BISMUTH |
DUAL |
R-PDSO-G32 |
5.5 V |
1.2 mm |
100000 Write/Erase Cycles |
8 mm |
Not Qualified |
4194304 bit |
4.5 V |
e3/e6 |
NOT SPECIFIED |
NOT SPECIFIED |
NOR TYPE |
.0001 Amp |
18.4 mm |
70 ns |
5 |
YES |
|||||||||||||||||||
|
|
STMicroelectronics |
FLASH |
INDUSTRIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
64K |
20 mA |
524288 words |
3.3 |
YES |
3.3 |
8 |
CHIP CARRIER |
LDCC32,.5X.6 |
Flash Memories |
1.27 mm |
85 Cel |
512KX8 |
512K |
-40 Cel |
8 |
YES |
MATTE TIN |
QUAD |
R-PQCC-J32 |
3.6 V |
3.56 mm |
100000 Write/Erase Cycles |
11.43 mm |
Not Qualified |
4194304 bit |
3 V |
e3 |
NOR TYPE |
.0001 Amp |
13.97 mm |
55 ns |
3 |
YES |
|||||||||||||||||||||
|
|
STMicroelectronics |
FLASH |
INDUSTRIAL |
32 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
64K |
20 mA |
524288 words |
3.3 |
YES |
3/3.3 |
8 |
SMALL OUTLINE, THIN PROFILE |
TSSOP32,.8,20 |
Flash Memories |
.5 mm |
85 Cel |
512KX8 |
512K |
-40 Cel |
8 |
YES |
TIN/TIN BISMUTH |
DUAL |
R-PDSO-G32 |
3.6 V |
1.2 mm |
100000 Write/Erase Cycles |
8 mm |
Not Qualified |
4194304 bit |
2.7 V |
e3/e6 |
NOT SPECIFIED |
NOT SPECIFIED |
NOR TYPE |
.0001 Amp |
18.4 mm |
70 ns |
2.7 |
YES |
|||||||||||||||||||
|
|
STMicroelectronics |
FLASH |
INDUSTRIAL |
48 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
16K,8K,32K,64K |
20 mA |
131072 words |
3.3 |
YES |
3/3.3 |
16 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP48,.8,20 |
8 |
Flash Memories |
.5 mm |
85 Cel |
128KX16 |
128K |
-40 Cel |
1,2,1,3 |
YES |
MATTE TIN/TIN BISMUTH |
YES |
DUAL |
R-PDSO-G48 |
3.6 V |
1.2 mm |
100000 Write/Erase Cycles |
12 mm |
Not Qualified |
BOTTOM |
2097152 bit |
2.7 V |
BOTTOM BOOT BLOCK |
e3/e6 |
40 |
260 |
NOR TYPE |
.0001 Amp |
20 mm |
70 ns |
2.7 |
YES |
|||||||||||||||
|
|
STMicroelectronics |
FLASH |
INDUSTRIAL |
48 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
16K,8K,32K,64K |
20 mA |
131072 words |
3.3 |
YES |
3/3.3 |
16 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP48,.8,20 |
8 |
Flash Memories |
.5 mm |
85 Cel |
128KX16 |
128K |
-40 Cel |
1,2,1,3 |
YES |
MATTE TIN/TIN BISMUTH |
YES |
DUAL |
R-PDSO-G48 |
3.6 V |
1.2 mm |
100000 Write/Erase Cycles |
12 mm |
Not Qualified |
TOP |
2097152 bit |
2.7 V |
TOP BOOT BLOCK |
e3/e6 |
40 |
260 |
NOR TYPE |
.0001 Amp |
20 mm |
70 ns |
2.7 |
YES |
|||||||||||||||
|
|
Atmel |
FLASH |
INDUSTRIAL |
48 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
8K,64K |
25 mA |
1048576 words |
3 |
YES |
3/3.3 |
16 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP48,.8,20 |
8 |
Flash Memories |
.5 mm |
85 Cel |
1MX16 |
1M |
-40 Cel |
8,31 |
YES |
MATTE TIN |
YES |
DUAL |
R-PDSO-G48 |
3 |
3.6 V |
1.2 mm |
12 mm |
Not Qualified |
BOTTOM |
16777216 bit |
2.65 V |
e3 |
260 |
NOR TYPE |
.000025 Amp |
18.4 mm |
YES |
70 ns |
3 |
YES |
||||||||||||||||
|
|
STMicroelectronics |
FLASH |
INDUSTRIAL |
48 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
16K,8K,32K,64K |
20 mA |
262144 words |
5 |
YES |
5 |
16 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP48,.8,20 |
8 |
Flash Memories |
.5 mm |
85 Cel |
256KX16 |
256K |
-40 Cel |
1,2,1,7 |
YES |
MATTE TIN/TIN BISMUTH |
YES |
DUAL |
R-PDSO-G48 |
5.5 V |
1.2 mm |
100000 Write/Erase Cycles |
12 mm |
Not Qualified |
BOTTOM |
4194304 bit |
4.5 V |
BOTTOM BOOT BLOCK |
e3/e6 |
40 |
260 |
NOR TYPE |
.0001 Amp |
18.4 mm |
70 ns |
5 |
YES |
|||||||||||||||
|
|
STMicroelectronics |
FLASH |
INDUSTRIAL |
48 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
16K,8K,32K,64K |
20 mA |
262144 words |
5 |
YES |
5 |
16 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP48,.8,20 |
8 |
Flash Memories |
.5 mm |
85 Cel |
256KX16 |
256K |
-40 Cel |
1,2,1,7 |
YES |
YES |
DUAL |
R-PDSO-G48 |
5.5 V |
1.2 mm |
100000 Write/Erase Cycles |
12 mm |
Not Qualified |
TOP |
4194304 bit |
4.5 V |
TOP BOOT BLOCK |
e3/e6 |
40 |
260 |
NOR TYPE |
.0001 Amp |
18.4 mm |
70 ns |
5 |
YES |
||||||||||||||||
|
|
STMicroelectronics |
FLASH |
INDUSTRIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
16K |
20 mA |
131072 words |
3.3 |
YES |
3/3.3 |
8 |
CHIP CARRIER |
LDCC32,.5X.6 |
Flash Memories |
1.27 mm |
85 Cel |
128KX8 |
128K |
-40 Cel |
8 |
YES |
MATTE TIN |
QUAD |
R-PQCC-J32 |
3.6 V |
3.56 mm |
100000 Write/Erase Cycles |
11.43 mm |
Not Qualified |
1048576 bit |
2.7 V |
e3 |
NOR TYPE |
.0001 Amp |
13.97 mm |
70 ns |
2.7 |
YES |
|||||||||||||||||||||
|
|
STMicroelectronics |
FLASH |
INDUSTRIAL |
32 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
16K |
20 mA |
131072 words |
3.3 |
YES |
3/3.3 |
8 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP32,.8,20 |
Flash Memories |
.5 mm |
85 Cel |
128KX8 |
128K |
-40 Cel |
8 |
YES |
TIN/TIN BISMUTH |
DUAL |
R-PDSO-G32 |
3.6 V |
1.2 mm |
100000 Write/Erase Cycles |
8 mm |
Not Qualified |
1048576 bit |
2.7 V |
e3/e6 |
NOT SPECIFIED |
NOT SPECIFIED |
NOR TYPE |
.0001 Amp |
18.4 mm |
70 ns |
2.7 |
YES |
|||||||||||||||||||
|
|
Macronix |
FLASH |
INDUSTRIAL |
48 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
8K,64K |
100 mA |
2097152 words |
3 |
YES |
3/3.3 |
16 |
SMALL OUTLINE, THIN PROFILE |
TSSOP48,.8,20 |
8 |
Flash Memories |
.5 mm |
85 Cel |
2MX16 |
2M |
-40 Cel |
8,63 |
YES |
TIN |
YES |
DUAL |
R-PDSO-G48 |
3.6 V |
1.2 mm |
12 mm |
Not Qualified |
BOTTOM |
33554432 bit |
2.7 V |
BOTTOM BOOT BLOCK |
8/16 |
e3 |
NOR TYPE |
.0001 Amp |
18.4 mm |
YES |
70 ns |
3 |
YES |
||||||||||||||||
|
|
STMicroelectronics |
FLASH |
INDUSTRIAL |
44 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
16K,8K,32K,64K |
20 mA |
262144 words |
5 |
YES |
5 |
16 |
SMALL OUTLINE |
SOP44,.63 |
8 |
Flash Memories |
1.27 mm |
85 Cel |
256KX16 |
256K |
-40 Cel |
1,2,1,7 |
YES |
TIN/NICKEL PALLADIUM GOLD |
YES |
DUAL |
R-PDSO-G44 |
5.5 V |
2.62 mm |
100000 Write/Erase Cycles |
13.3 mm |
Not Qualified |
BOTTOM |
4194304 bit |
4.5 V |
BOTTOM BOOT BLOCK |
e3/e4 |
NOT SPECIFIED |
NOT SPECIFIED |
NOR TYPE |
.0001 Amp |
28.2 mm |
70 ns |
5 |
YES |
|||||||||||||||
|
|
STMicroelectronics |
FLASH |
INDUSTRIAL |
44 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
16K,8K,32K,64K |
20 mA |
262144 words |
5 |
YES |
5 |
16 |
SMALL OUTLINE |
SOP44,.63 |
8 |
Flash Memories |
1.27 mm |
85 Cel |
256KX16 |
256K |
-40 Cel |
1,2,1,7 |
YES |
TIN/NICKEL PALLADIUM GOLD |
YES |
DUAL |
R-PDSO-G44 |
5.5 V |
2.62 mm |
100000 Write/Erase Cycles |
13.3 mm |
Not Qualified |
TOP |
4194304 bit |
4.5 V |
TOP BOOT BLOCK |
e3/e4 |
NOT SPECIFIED |
NOT SPECIFIED |
NOR TYPE |
.0001 Amp |
28.2 mm |
70 ns |
5 |
YES |
|||||||||||||||
|
|
Integrated Silicon Solution |
FLASH |
INDUSTRIAL |
8 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
NO LEAD |
SERIAL |
SYNCHRONOUS |
8388608 words |
3 |
8 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
1 |
1.27 mm |
105 Cel |
8MX8 |
8M |
-40 Cel |
Tin (Sn) |
DUAL |
R-PDSO-N8 |
3.6 V |
.8 mm |
166 MHz |
6 mm |
67108864 bit |
2.7 V |
e3 |
30 |
260 |
8 mm |
3 |
|||||||||||||||||||||||||||||||
|
|
Macronix |
FLASH |
INDUSTRIAL |
24 |
LBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
SERIAL |
SYNCHRONOUS |
35 mA |
67108864 words |
1.8 |
8 |
GRID ARRAY, LOW PROFILE |
BGA24,5X5,40 |
4 |
20 |
1 mm |
85 Cel |
64MX8 |
64M |
-40 Cel |
BOTTOM |
HARDWARE/SOFTWARE |
R-PBGA-B24 |
2 V |
1.2 mm |
166 MHz |
6 mm |
SPI |
536870912 bit |
1.65 V |
IT CAN ALSO CONFIGURED AS 256M X 2 AND 512M X 1 |
NOR TYPE |
.00018 Amp |
8 mm |
1.8 |
|||||||||||||||||||||||||||
|
|
Micron Technology |
FLASH CARD |
INDUSTRIAL |
100 |
TBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
137438953472 words |
8 |
GRID ARRAY, THIN PROFILE |
1 mm |
105 Cel |
128GX8 |
128G |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B100 |
3.6 V |
1.2 mm |
14 mm |
1099511627776 bit |
2.7 V |
e1 |
30 |
260 |
18 mm |
2.7 |
||||||||||||||||||||||||||||||||||
|
|
Micron Technology |
FLASH CARD |
INDUSTRIAL |
100 |
TBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
137438953472 words |
8 |
GRID ARRAY, THIN PROFILE |
1 mm |
85 Cel |
128GX8 |
128G |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B100 |
3.6 V |
1.2 mm |
14 mm |
1099511627776 bit |
2.7 V |
e1 |
30 |
260 |
18 mm |
2.7 |
||||||||||||||||||||||||||||||||||
|
|
Micron Technology |
FLASH CARD |
INDUSTRIAL |
153 |
TFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
137438953472 words |
8 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
.5 mm |
105 Cel |
128GX8 |
128G |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B153 |
3.6 V |
1.2 mm |
11.5 mm |
1099511627776 bit |
2.7 V |
e1 |
30 |
260 |
13 mm |
2.7 |
||||||||||||||||||||||||||||||||||
|
|
Micron Technology |
FLASH CARD |
INDUSTRIAL |
153 |
TFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
137438953472 words |
8 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
.5 mm |
85 Cel |
128GX8 |
128G |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B153 |
3.6 V |
1.2 mm |
11.5 mm |
1099511627776 bit |
2.7 V |
e1 |
30 |
260 |
13 mm |
2.7 |
||||||||||||||||||||||||||||||||||
|
|
Micron Technology |
FLASH CARD |
INDUSTRIAL |
100 |
TBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
17179869184 words |
8 |
GRID ARRAY, THIN PROFILE |
1 mm |
105 Cel |
16GX8 |
16G |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B100 |
3.6 V |
1.2 mm |
14 mm |
137438953472 bit |
2.7 V |
e1 |
30 |
260 |
18 mm |
2.7 |
||||||||||||||||||||||||||||||||||
|
|
Micron Technology |
FLASH CARD |
INDUSTRIAL |
100 |
TBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
17179869184 words |
8 |
GRID ARRAY, THIN PROFILE |
1 mm |
85 Cel |
16GX8 |
16G |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B100 |
3.6 V |
1.2 mm |
14 mm |
137438953472 bit |
2.7 V |
e1 |
30 |
260 |
18 mm |
2.7 |
||||||||||||||||||||||||||||||||||
|
|
Micron Technology |
FLASH CARD |
INDUSTRIAL |
153 |
TFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
34359738368 words |
8 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
.5 mm |
105 Cel |
32GX8 |
32G |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B153 |
3.6 V |
1.2 mm |
11.5 mm |
274877906944 bit |
2.7 V |
e1 |
30 |
260 |
13 mm |
2.7 |
||||||||||||||||||||||||||||||||||
|
|
Micron Technology |
FLASH CARD |
INDUSTRIAL |
153 |
TFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
34359738368 words |
8 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
.5 mm |
85 Cel |
32GX8 |
32G |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B153 |
3.6 V |
1.2 mm |
11.5 mm |
274877906944 bit |
2.7 V |
e1 |
30 |
260 |
13 mm |
2.7 |
||||||||||||||||||||||||||||||||||
|
|
Micron Technology |
FLASH CARD |
INDUSTRIAL |
100 |
TBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
34359738368 words |
NO |
8 |
GRID ARRAY, THIN PROFILE |
BGA100,10X15,40 |
1 mm |
105 Cel |
32GX8 |
32G |
-40 Cel |
NO |
TIN SILVER COPPER |
YES |
BOTTOM |
HARDWARE |
R-PBGA-B100 |
3.6 V |
1.2 mm |
200 MHz |
14 mm |
274877906944 bit |
2.7 V |
e1 |
30 |
260 |
NAND TYPE |
18 mm |
2.7 |
NO |
||||||||||||||||||||||||||
|
|
Micron Technology |
FLASH CARD |
INDUSTRIAL |
100 |
TBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
34359738368 words |
NO |
8 |
GRID ARRAY, THIN PROFILE |
BGA100,10X15,40 |
1 mm |
85 Cel |
32GX8 |
32G |
-40 Cel |
NO |
TIN SILVER COPPER |
YES |
BOTTOM |
HARDWARE |
R-PBGA-B100 |
3.6 V |
1.2 mm |
200 MHz |
14 mm |
274877906944 bit |
2.7 V |
e1 |
30 |
260 |
NAND TYPE |
18 mm |
2.7 |
NO |
||||||||||||||||||||||||||
|
|
Micron Technology |
FLASH CARD |
INDUSTRIAL |
153 |
TFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
68719476736 words |
8 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
.5 mm |
105 Cel |
64GX8 |
64G |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B153 |
3.6 V |
1.2 mm |
11.5 mm |
549755813888 bit |
2.7 V |
30 |
260 |
13 mm |
2.7 |
|||||||||||||||||||||||||||||||||||
|
|
Micron Technology |
FLASH CARD |
INDUSTRIAL |
153 |
TFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
68719476736 words |
8 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
.5 mm |
85 Cel |
64GX8 |
64G |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B153 |
3.6 V |
1.2 mm |
11.5 mm |
549755813888 bit |
2.7 V |
e1 |
30 |
260 |
13 mm |
2.7 |
||||||||||||||||||||||||||||||||||
|
|
Micron Technology |
FLASH CARD |
INDUSTRIAL |
100 |
TBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
68719476736 words |
8 |
GRID ARRAY, THIN PROFILE |
1 mm |
105 Cel |
64GX8 |
64G |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B100 |
3.6 V |
1.2 mm |
14 mm |
549755813888 bit |
2.7 V |
e1 |
30 |
260 |
18 mm |
2.7 |
Flash memory is a type of non-volatile computer memory that is commonly used in digital devices such as USB drives, solid-state drives, and digital cameras. It is a type of EEPROM (Electrically Erasable Programmable Read-Only Memory) that allows data to be erased and reprogrammed in blocks instead of one byte at a time. Flash memory uses a floating gate transistor to store data, which allows it to retain information even when the power is turned off.
Flash memory is widely used in digital devices because of its high capacity, small size, and fast access times. It is also more durable than other types of memory, such as hard disk drives, because it has no moving parts. This makes it ideal for use in portable devices that may be subject to physical shock or vibration.
There are two types of flash memory: NOR flash and NAND flash. NOR flash is faster than NAND flash, but it has lower density and higher cost per bit. NOR flash is typically used for code storage, such as firmware or boot code, because it provides faster access times. NAND flash has higher density and lower cost per bit, which makes it ideal for data storage applications.
Flash memory has a limited lifespan, as it can only be erased and reprogrammed a limited number of times. This is because the process of erasing and reprogramming the memory causes wear and tear on the floating gate transistor. However, modern flash memory devices have a sophisticated wear-leveling algorithm that distributes writes evenly across the memory, which extends the lifespan of the device.