| Part | RoHS | Manufacturer | Memory IC Type | Temperature Grade | No. of Terminals | Package Code | Refresh Cycles | Package Shape | Total Dose (V) | Package Body Material | Surface Mount | No. of Functions | Technology | Screening Level | Nominal Negative Supply Voltage | Terminal Form | Parallel or Serial | Operating Mode | Maximum Supply Current | No. of Words | Self Refresh | Input/Output Type | Nominal Supply Voltage / Vsup (V) | Power Supplies (V) | Memory Width | Package Style (Meter) | Package Equivalence Code | Alternate Memory Width | Sub-Category | Terminal Pitch | Maximum Operating Temperature | Reverse Pinout | Output Characteristics | Organization | No. of Words Code | Minimum Standby Voltage | Minimum Operating Temperature | Terminal Finish | Terminal Position | No. of Ports | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Supply Voltage (Vsup) | Maximum Seated Height | Maximum Clock Frequency (fCLK) | Width | Qualification | Memory Density | Minimum Supply Voltage (Vsup) | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Output Enable | Maximum Standby Current | Length | Maximum Access Time |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
|
Cypress Semiconductor |
STANDARD SRAM |
INDUSTRIAL |
36 |
SOJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
90 mA |
524288 words |
COMMON |
5 |
5 |
8 |
SMALL OUTLINE |
SOJ36,.44 |
SRAMs |
1.27 mm |
85 Cel |
3-STATE |
512KX8 |
512K |
2 V |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
DUAL |
R-PDSO-J36 |
3 |
5.5 V |
3.7592 mm |
10.16 mm |
Not Qualified |
4194304 bit |
4.5 V |
e4 |
40 |
260 |
.01 Amp |
23.495 mm |
10 ns |
||||||||||||
|
|
Cypress Semiconductor |
STANDARD SRAM |
INDUSTRIAL |
48 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
175 mA |
1048576 words |
COMMON |
3.3 |
3.3 |
16 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA48,6X8,30 |
SRAMs |
.75 mm |
85 Cel |
3-STATE |
1MX16 |
1M |
2 V |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B48 |
3 |
3.6 V |
1 mm |
8 mm |
Not Qualified |
16777216 bit |
3 V |
e1 |
40 |
260 |
.025 Amp |
9.5 mm |
10 ns |
||||||||||||
|
|
Cypress Semiconductor |
STANDARD SRAM |
INDUSTRIAL |
54 |
TSOP2 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
175 mA |
1048576 words |
COMMON |
3.3 |
3.3 |
16 |
SMALL OUTLINE, THIN PROFILE |
TSOP54,.46,32 |
SRAMs |
.8 mm |
85 Cel |
3-STATE |
1MX16 |
1M |
2 V |
-40 Cel |
Matte Tin (Sn) |
DUAL |
R-PDSO-G54 |
3 |
3.6 V |
1.2 mm |
10.16 mm |
Not Qualified |
16777216 bit |
3 V |
e3 |
20 |
260 |
.025 Amp |
22.415 mm |
10 ns |
||||||||||||
|
|
Cypress Semiconductor |
STANDARD SRAM |
INDUSTRIAL |
54 |
TSOP2 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
175 mA |
2097152 words |
COMMON |
3.3 |
3.3 |
8 |
SMALL OUTLINE, THIN PROFILE |
TSOP54,.46,32 |
SRAMs |
.8 mm |
85 Cel |
3-STATE |
2MX8 |
2M |
2 V |
-40 Cel |
Matte Tin (Sn) |
DUAL |
R-PDSO-G54 |
3 |
3.6 V |
1.2 mm |
10.16 mm |
Not Qualified |
16777216 bit |
3 V |
e3 |
20 |
260 |
.025 Amp |
22.415 mm |
10 ns |
||||||||||||
|
|
Cypress Semiconductor |
STANDARD SRAM |
INDUSTRIAL |
28 |
SOJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
80 mA |
32768 words |
COMMON |
5 |
5 |
8 |
SMALL OUTLINE |
SOJ28,.34 |
SRAMs |
1.27 mm |
85 Cel |
3-STATE |
32KX8 |
32K |
2 V |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
DUAL |
R-PDSO-J28 |
3 |
5.5 V |
3.556 mm |
7.5 mm |
Not Qualified |
262144 bit |
4.5 V |
e4 |
30 |
260 |
.00015 Amp |
17.907 mm |
15 ns |
||||||||||||
|
|
Cypress Semiconductor |
STANDARD SRAM |
INDUSTRIAL |
28 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
80 mA |
32768 words |
COMMON |
5 |
5 |
8 |
SMALL OUTLINE, THIN PROFILE |
TSSOP28,.53,22 |
SRAMs |
.55 mm |
85 Cel |
3-STATE |
32KX8 |
32K |
2 V |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G28 |
3 |
5.5 V |
1.2 mm |
8 mm |
Not Qualified |
262144 bit |
4.5 V |
e4 |
30 |
260 |
.003 Amp |
11.8 mm |
10 ns |
||||||||||||
|
|
Micron Technology |
INDUSTRIAL |
54 |
FBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
BALL |
35 mA |
2097152 words |
COMMON |
1.8,1.8/3.3 |
16 |
GRID ARRAY, FINE PITCH |
BGA54,6X9,30 |
Other Memory ICs |
.75 mm |
105 Cel |
3-STATE |
2MX16 |
2M |
-40 Cel |
MATTE TIN |
BOTTOM |
R-PBGA-B54 |
1 |
Not Qualified |
33554432 bit |
e3 |
.00011 Amp |
70 ns |
|||||||||||||||||||||||||
|
|
Onsemi |
STANDARD SRAM |
INDUSTRIAL |
44 |
LSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
16 mA |
131072 words |
COMMON |
3 |
2.5/3.3 |
16 |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
TSOP44,.46,32 |
SRAMs |
.8 mm |
85 Cel |
3-STATE |
128KX16 |
128K |
1.8 V |
-40 Cel |
MATTE TIN |
DUAL |
R-PDSO-G44 |
1 |
3.6 V |
1.25 mm |
10.16 mm |
Not Qualified |
2097152 bit |
2.3 V |
e3 |
.00001 Amp |
18.41 mm |
70 ns |
||||||||||||||
|
|
Integrated Device Technology |
MULTI-PORT SRAM |
INDUSTRIAL |
80 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
275 mA |
32768 words |
COMMON |
5 |
5 |
8 |
FLATPACK |
QFP80,.64SQ |
SRAMs |
.635 mm |
85 Cel |
3-STATE |
32KX8 |
32K |
4.5 V |
-40 Cel |
Matte Tin (Sn) - annealed |
QUAD |
2 |
S-PQFP-G80 |
3 |
5.5 V |
Not Qualified |
262144 bit |
4.5 V |
e3 |
30 |
260 |
.01 Amp |
20 ns |
||||||||||||||
|
Integrated Device Technology |
MULTI-PORT SRAM |
INDUSTRIAL |
100 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
250 mA |
4096 words |
COMMON |
5 |
5 |
16 |
FLATPACK |
QFP100,.63SQ,20 |
SRAMs |
.5 mm |
85 Cel |
3-STATE |
4KX16 |
4K |
2 V |
-40 Cel |
TIN LEAD |
QUAD |
2 |
S-PQFP-G100 |
3 |
Not Qualified |
65536 bit |
e0 |
20 |
240 |
.004 Amp |
55 ns |
||||||||||||||||||
|
Integrated Device Technology |
MULTI-PORT SRAM |
INDUSTRIAL |
100 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
190 mA |
8192 words |
COMMON |
3.3 |
3.3 |
16 |
FLATPACK |
QFP100,.63SQ,20 |
SRAMs |
.5 mm |
85 Cel |
3-STATE |
8KX16 |
8K |
3 V |
-40 Cel |
Tin/Lead (Sn85Pb15) |
QUAD |
2 |
S-PQFP-G100 |
3 |
Not Qualified |
131072 bit |
e0 |
20 |
240 |
.015 Amp |
25 ns |
||||||||||||||||||
|
|
Cypress Semiconductor |
STANDARD SRAM |
INDUSTRIAL |
54 |
TSOP2 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
275 mA |
1048576 words |
COMMON |
3.3 |
3.3 |
16 |
SMALL OUTLINE, THIN PROFILE |
TSOP54,.46,32 |
SRAMs |
.8 mm |
85 Cel |
3-STATE |
1MX16 |
1M |
2 V |
-40 Cel |
Matte Tin (Sn) |
DUAL |
R-PDSO-G54 |
3 |
3.6 V |
1.2 mm |
10.16 mm |
Not Qualified |
16777216 bit |
3 V |
e3 |
20 |
260 |
.05 Amp |
22.415 mm |
10 ns |
||||||||||||
|
|
Integrated Silicon Solution |
APPLICATION SPECIFIC SRAM |
INDUSTRIAL |
48 |
TFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
35 mA |
262144 words |
COMMON |
3 |
2.5/3.3 |
16 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
BGA48,6X8,30 |
SRAMs |
.75 mm |
85 Cel |
3-STATE |
256KX16 |
256K |
2 V |
-40 Cel |
MATTE TIN |
BOTTOM |
R-PBGA-B48 |
1 |
3.6 V |
1.2 mm |
6 mm |
Not Qualified |
4194304 bit |
2.4 V |
e3 |
.006 Amp |
8 mm |
10 ns |
||||||||||||||
|
|
Integrated Silicon Solution |
APPLICATION SPECIFIC SRAM |
INDUSTRIAL |
48 |
TFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
45 mA |
262144 words |
COMMON |
3 |
2.5/3.3 |
16 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
BGA48,6X8,30 |
SRAMs |
.75 mm |
85 Cel |
3-STATE |
256KX16 |
256K |
2 V |
-40 Cel |
MATTE TIN |
BOTTOM |
R-PBGA-B48 |
1 |
3.6 V |
1.2 mm |
6 mm |
Not Qualified |
4194304 bit |
2.4 V |
e3 |
.006 Amp |
8 mm |
8 ns |
||||||||||||||
|
|
Integrated Silicon Solution |
APPLICATION SPECIFIC SRAM |
INDUSTRIAL |
48 |
TFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
45 mA |
262144 words |
COMMON |
3.3 |
2.5/3.3 |
16 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
BGA48,6X8,30 |
SRAMs |
.75 mm |
85 Cel |
3-STATE |
256KX16 |
256K |
2 V |
-40 Cel |
MATTE TIN |
BOTTOM |
R-PBGA-B48 |
1 |
3.63 V |
1.2 mm |
6 mm |
Not Qualified |
4194304 bit |
2.97 V |
e3 |
.006 Amp |
8 mm |
8 ns |
||||||||||||||
|
|
Integrated Silicon Solution |
APPLICATION SPECIFIC SRAM |
INDUSTRIAL |
44 |
TSOP2 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
45 mA |
262144 words |
COMMON |
3 |
2.5/3.3 |
16 |
SMALL OUTLINE, THIN PROFILE |
TSOP44,.46,32 |
SRAMs |
.8 mm |
85 Cel |
3-STATE |
256KX16 |
256K |
2 V |
-40 Cel |
MATTE TIN |
DUAL |
R-PDSO-G44 |
1 |
3.6 V |
1.2 mm |
10.16 mm |
Not Qualified |
4194304 bit |
2.4 V |
e3 |
.006 Amp |
18.41 mm |
8 ns |
||||||||||||||
|
|
Integrated Silicon Solution |
APPLICATION SPECIFIC SRAM |
INDUSTRIAL |
44 |
TSOP2 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
45 mA |
262144 words |
COMMON |
3.3 |
2.5/3.3 |
16 |
SMALL OUTLINE, THIN PROFILE |
TSOP44,.46,32 |
SRAMs |
.8 mm |
85 Cel |
3-STATE |
256KX16 |
256K |
2 V |
-40 Cel |
MATTE TIN |
DUAL |
R-PDSO-G44 |
1 |
3.63 V |
1.2 mm |
10.16 mm |
Not Qualified |
4194304 bit |
2.97 V |
e3 |
.006 Amp |
18.41 mm |
8 ns |
||||||||||||||
|
|
Cypress Semiconductor |
MULTI-PORT SRAM |
INDUSTRIAL |
52 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
305 mA |
1024 words |
COMMON |
5 |
5 |
8 |
FLATPACK |
QFP52,.52SQ |
SRAMs |
.65 mm |
85 Cel |
3-STATE |
1KX8 |
1K |
4.5 V |
-40 Cel |
MATTE TIN |
QUAD |
2 |
S-PQFP-G52 |
3 |
5.5 V |
2.5 mm |
10 mm |
Not Qualified |
8192 bit |
4.5 V |
e3 |
260 |
.015 Amp |
10 mm |
15 ns |
||||||||||||
|
|
Alliance Memory |
STANDARD SRAM |
INDUSTRIAL |
32 |
TSOP2 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
524288 words |
3 |
8 |
SMALL OUTLINE, THIN PROFILE |
1.27 mm |
85 Cel |
512KX8 |
512K |
-40 Cel |
DUAL |
R-PDSO-G32 |
3 |
3.6 V |
1.2 mm |
11.76 mm |
4194304 bit |
2.7 V |
e3/e6 |
40 |
260 |
20.95 mm |
55 ns |
||||||||||||||||||||||
|
|
Microchip Technology |
STANDARD SRAM |
INDUSTRIAL |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
TS 16949 |
THROUGH-HOLE |
SERIAL |
SYNCHRONOUS |
10 mA |
131072 words |
COMMON/SEPARATE |
1.8/2 |
8 |
IN-LINE |
DIP8,.3 |
SRAMs |
2.54 mm |
85 Cel |
3-STATE |
128KX8 |
128K |
1.7 V |
-40 Cel |
MATTE TIN |
DUAL |
1 |
R-PDIP-T8 |
2.2 V |
5.334 mm |
20 MHz |
7.62 mm |
Not Qualified |
1048576 bit |
1.7 V |
e3 |
NO |
.000004 Amp |
9.271 mm |
|||||||||||||
|
|
Microchip Technology |
STANDARD SRAM |
INDUSTRIAL |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
SERIAL |
SYNCHRONOUS |
10 mA |
65536 words |
COMMON |
8 |
IN-LINE |
DIP8,.3 |
2.54 mm |
85 Cel |
3-STATE |
64KX8 |
64K |
2.5 V |
-40 Cel |
MATTE TIN |
DUAL |
1 |
R-PDIP-T8 |
5.5 V |
5.334 mm |
20 MHz |
7.62 mm |
524288 bit |
2.5 V |
e3 |
NO |
.00001 Amp |
9.271 mm |
|||||||||||||||||
|
|
Integrated Silicon Solution |
STANDARD SRAM |
INDUSTRIAL |
44 |
TSOP2 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
25 mA |
65536 words |
COMMON |
3 |
2.5/3.3 |
16 |
SMALL OUTLINE, THIN PROFILE |
TSOP44,.46,32 |
SRAMs |
.8 mm |
85 Cel |
3-STATE |
64KX16 |
64K |
2 V |
-40 Cel |
DUAL |
R-PDSO-G44 |
3.6 V |
1.2 mm |
10.16 mm |
Not Qualified |
1048576 bit |
2.4 V |
.004 Amp |
18.41 mm |
10 ns |
|||||||||||||||||
|
|
Alliance Memory |
STANDARD SRAM |
INDUSTRIAL |
48 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
160 mA |
2097152 words |
COMMON |
3 |
3/3.3 |
8 |
SMALL OUTLINE, THIN PROFILE |
TSSOP48,.8,20 |
SRAMs |
.5 mm |
85 Cel |
3-STATE |
2MX8 |
2M |
1.5 V |
-40 Cel |
DUAL |
R-PDSO-G48 |
3 |
3.6 V |
1.2 mm |
12 mm |
Not Qualified |
16777216 bit |
2.7 V |
e3/e6 |
.04 Amp |
18.4 mm |
10 ns |
|||||||||||||||
|
|
Alliance Memory |
STANDARD SRAM |
INDUSTRIAL |
48 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
160 mA |
2097152 words |
COMMON |
3 |
3/3.3 |
8 |
SMALL OUTLINE, THIN PROFILE |
TSSOP48,.8,20 |
SRAMs |
.5 mm |
85 Cel |
3-STATE |
2MX8 |
2M |
1.5 V |
-40 Cel |
DUAL |
R-PDSO-G48 |
3 |
3.6 V |
1.2 mm |
12 mm |
Not Qualified |
16777216 bit |
2.7 V |
e3/e6 |
.04 Amp |
18.4 mm |
10 ns |
|||||||||||||||
|
|
Alliance Memory |
STANDARD SRAM |
INDUSTRIAL |
48 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
80 mA |
2097152 words |
COMMON |
3 |
3/3.3 |
16 |
SMALL OUTLINE, THIN PROFILE |
TSSOP48,.8,20 |
8 |
SRAMs |
.5 mm |
85 Cel |
3-STATE |
2MX16 |
2M |
1.2 V |
-40 Cel |
DUAL |
R-PDSO-G48 |
3 |
3.6 V |
1.2 mm |
12 mm |
Not Qualified |
33554432 bit |
2.7 V |
e3/e6 |
.002 Amp |
18.4 mm |
55 ns |
||||||||||||||
|
|
Alliance Memory |
STANDARD SRAM |
INDUSTRIAL |
48 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
160 mA |
1048576 words |
COMMON |
3.3 |
16 |
SMALL OUTLINE, THIN PROFILE |
TSSOP48,.8,20 |
.5 mm |
85 Cel |
3-STATE |
1MX16 |
1M |
1.5 V |
-40 Cel |
DUAL |
1 |
R-PDSO-G48 |
3 |
3.6 V |
1.2 mm |
12 mm |
16777216 bit |
2.7 V |
e3/e6 |
40 |
260 |
YES |
.04 Amp |
18.4 mm |
10 ns |
||||||||||||||
|
|
Integrated Silicon Solution |
CACHE SRAM |
INDUSTRIAL |
100 |
LQFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
220 mA |
262144 words |
COMMON |
3.3 |
2.5/3.3,3.3 |
18 |
FLATPACK, LOW PROFILE |
QFP100,.63X.87 |
SRAMs |
.65 mm |
85 Cel |
3-STATE |
256KX18 |
256K |
3.14 V |
-40 Cel |
MATTE TIN |
QUAD |
R-PQFP-G100 |
3 |
3.465 V |
1.6 mm |
200 MHz |
14 mm |
Not Qualified |
4718592 bit |
3.135 V |
e3 |
10 |
260 |
.085 Amp |
20 mm |
3.1 ns |
|||||||||||
|
|
Integrated Silicon Solution |
CACHE SRAM |
INDUSTRIAL |
165 |
TBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
2097152 words |
COMMON |
2.5 |
2.5 |
36 |
GRID ARRAY, THIN PROFILE |
BGA165,11X15,40 |
SRAMs |
1 mm |
85 Cel |
3-STATE |
2MX36 |
2M |
2.38 V |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B165 |
3 |
2.625 V |
1.2 mm |
250 MHz |
13 mm |
Not Qualified |
75497472 bit |
2.375 V |
e1 |
10 |
260 |
15 mm |
2.6 ns |
|||||||||||||
|
|
Renesas Electronics |
DDR SRAM |
INDUSTRIAL |
165 |
LBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
1048576 words |
1.8 |
18 |
GRID ARRAY, LOW PROFILE |
1 mm |
85 Cel |
1MX18 |
1M |
-40 Cel |
TIN BISMUTH |
BOTTOM |
R-PBGA-B165 |
1.9 V |
1.46 mm |
13 mm |
18874368 bit |
1.7 V |
e6 |
15 mm |
.45 ns |
||||||||||||||||||||||||
|
|
Renesas Electronics |
QDR SRAM |
INDUSTRIAL |
165 |
LBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
1048576 words |
1.8 |
18 |
GRID ARRAY, LOW PROFILE |
1 mm |
85 Cel |
1MX18 |
1M |
-40 Cel |
TIN BISMUTH |
BOTTOM |
R-PBGA-B165 |
1.9 V |
1.46 mm |
13 mm |
18874368 bit |
1.7 V |
e6 |
15 mm |
.45 ns |
||||||||||||||||||||||||
|
|
Renesas Electronics |
QDR SRAM |
INDUSTRIAL |
165 |
LBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
524288 words |
1.8 |
36 |
GRID ARRAY, LOW PROFILE |
1 mm |
85 Cel |
512KX36 |
512K |
-40 Cel |
TIN BISMUTH |
BOTTOM |
R-PBGA-B165 |
1.9 V |
1.46 mm |
13 mm |
18874368 bit |
1.7 V |
e6 |
15 mm |
.45 ns |
||||||||||||||||||||||||
|
|
Renesas Electronics |
DDR SRAM |
INDUSTRIAL |
165 |
LBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
1048576 words |
1.8 |
36 |
GRID ARRAY, LOW PROFILE |
1 mm |
85 Cel |
1MX36 |
1M |
-40 Cel |
TIN BISMUTH |
BOTTOM |
R-PBGA-B165 |
1.9 V |
1.46 mm |
13 mm |
37748736 bit |
1.7 V |
e6 |
15 mm |
.45 ns |
||||||||||||||||||||||||
|
|
Renesas Electronics |
QDR SRAM |
INDUSTRIAL |
165 |
LBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
2097152 words |
1.8 |
18 |
GRID ARRAY, LOW PROFILE |
1 mm |
85 Cel |
2MX18 |
2M |
-40 Cel |
TIN BISMUTH |
BOTTOM |
R-PBGA-B165 |
1.9 V |
1.46 mm |
13 mm |
37748736 bit |
1.7 V |
e6 |
15 mm |
.45 ns |
||||||||||||||||||||||||
|
|
Renesas Electronics |
QDR SRAM |
INDUSTRIAL |
165 |
LBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
2097152 words |
1.8 |
18 |
GRID ARRAY, LOW PROFILE |
1 mm |
85 Cel |
2MX18 |
2M |
-40 Cel |
TIN BISMUTH |
BOTTOM |
R-PBGA-B165 |
1.9 V |
1.46 mm |
13 mm |
37748736 bit |
1.7 V |
e6 |
15 mm |
.45 ns |
||||||||||||||||||||||||
|
|
Renesas Electronics |
QDR SRAM |
INDUSTRIAL |
165 |
LBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
1048576 words |
1.8 |
36 |
GRID ARRAY, LOW PROFILE |
1 mm |
85 Cel |
1MX36 |
1M |
-40 Cel |
TIN BISMUTH |
BOTTOM |
R-PBGA-B165 |
1.9 V |
1.46 mm |
13 mm |
37748736 bit |
1.7 V |
e6 |
15 mm |
.45 ns |
||||||||||||||||||||||||
|
|
Cypress Semiconductor |
STANDARD SRAM |
INDUSTRIAL |
28 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
50 mA |
32768 words |
COMMON |
5 |
5 |
8 |
SMALL OUTLINE, THIN PROFILE |
TSSOP28,.53,22 |
SRAMs |
.55 mm |
85 Cel |
3-STATE |
32KX8 |
32K |
2 V |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G28 |
3 |
5.5 V |
1.2 mm |
8 mm |
Not Qualified |
262144 bit |
4.5 V |
e4 |
30 |
260 |
.00001 Amp |
11.8 mm |
55 ns |
||||||||||||
|
|
Cypress Semiconductor |
STANDARD SRAM |
INDUSTRIAL |
44 |
TSOP2 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
90 mA |
524288 words |
COMMON |
3.3 |
3.3 |
8 |
SMALL OUTLINE, THIN PROFILE |
TSOP44,.46,32 |
SRAMs |
.8 mm |
85 Cel |
3-STATE |
512KX8 |
512K |
2 V |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
DUAL |
R-PDSO-G44 |
3 |
3.6 V |
1.194 mm |
10.16 mm |
Not Qualified |
4194304 bit |
3 V |
e4 |
20 |
260 |
.01 Amp |
18.415 mm |
10 ns |
||||||||||||
|
|
Winbond Electronics |
PSEUDO STATIC RAM |
INDUSTRIAL |
54 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
40 mA |
16777216 words |
COMMON |
1.8 |
1.8 |
16 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA54,6X9,30 |
Other Memory ICs |
.75 mm |
85 Cel |
3-STATE |
16MX16 |
16M |
1.7 V |
-40 Cel |
BOTTOM |
1 |
R-PBGA-B54 |
1.95 V |
1 mm |
6 mm |
Not Qualified |
268435456 bit |
1.7 V |
NOT SPECIFIED |
NOT SPECIFIED |
YES |
.0004 Amp |
8 mm |
70 ns |
|||||||||||||
|
|
Alliance Memory |
STANDARD SRAM |
INDUSTRIAL |
48 |
LFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
1048576 words |
3.3 |
16 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
.75 mm |
85 Cel |
1MX16 |
1M |
-40 Cel |
BOTTOM |
R-PBGA-B48 |
3 |
3.6 V |
1.4 mm |
6 mm |
16777216 bit |
2.7 V |
8 mm |
10 ns |
|||||||||||||||||||||||||
|
|
Alliance Memory |
STANDARD SRAM |
INDUSTRIAL |
36 |
SOJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
524288 words |
3.3 |
8 |
SMALL OUTLINE |
1.27 mm |
85 Cel |
512KX8 |
512K |
-40 Cel |
DUAL |
R-PDSO-J36 |
3 |
3.6 V |
3.7592 mm |
10.16 mm |
4194304 bit |
3 V |
e3/e6 |
23.495 mm |
12 ns |
||||||||||||||||||||||||
|
|
Alliance Memory |
STANDARD SRAM |
INDUSTRIAL |
48 |
LFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
ASYNCHRONOUS |
1048576 words |
3.3 |
8 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
.75 mm |
85 Cel |
1MX8 |
1M |
-40 Cel |
BOTTOM |
R-PBGA-B48 |
3 |
3.6 V |
1.4 mm |
6 mm |
8388608 bit |
2.7 V |
8 mm |
10 ns |
|||||||||||||||||||||||||
|
|
Alliance Memory |
STANDARD SRAM |
INDUSTRIAL |
44 |
TSOP2 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
1048576 words |
3.3 |
8 |
SMALL OUTLINE, THIN PROFILE |
.8 mm |
85 Cel |
1MX8 |
1M |
-40 Cel |
DUAL |
R-PDSO-G44 |
3 |
3.6 V |
1.2 mm |
10.16 mm |
8388608 bit |
2.7 V |
40 |
260 |
18.415 mm |
10 ns |
|||||||||||||||||||||||
|
|
Alliance Memory |
STANDARD SRAM |
INDUSTRIAL |
44 |
TSOP2 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
262144 words |
3.3 |
16 |
SMALL OUTLINE, THIN PROFILE |
.8 mm |
85 Cel |
256KX16 |
256K |
-40 Cel |
DUAL |
R-PDSO-G44 |
3 |
3.6 V |
1.2 mm |
10.16 mm |
4194304 bit |
3 V |
e3/e6 |
18.415 mm |
10 ns |
||||||||||||||||||||||||
|
|
Renesas Electronics |
STANDARD SRAM |
INDUSTRIAL |
44 |
TSOP2 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
524288 words |
5 |
16 |
SMALL OUTLINE, THIN PROFILE |
.8 mm |
85 Cel |
512KX16 |
512K |
-40 Cel |
DUAL |
R-PDSO-G44 |
5.5 V |
1.2 mm |
10.16 mm |
8388608 bit |
4.5 V |
NOT SPECIFIED |
NOT SPECIFIED |
18.41 mm |
55 ns |
||||||||||||||||||||||||
|
|
Integrated Silicon Solution |
STANDARD SRAM |
INDUSTRIAL |
100 |
LQFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
SYNCHRONOUS |
1048576 words |
3.3 |
18 |
FLATPACK, LOW PROFILE |
.65 mm |
85 Cel |
1MX18 |
1M |
-40 Cel |
QUAD |
R-PQFP-G100 |
3.465 V |
1.6 mm |
14 mm |
18874368 bit |
3.135 V |
NOT SPECIFIED |
NOT SPECIFIED |
20 mm |
3 ns |
||||||||||||||||||||||||
|
|
Integrated Device Technology |
CACHE SRAM |
INDUSTRIAL |
119 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
131072 words |
3.3 |
36 |
GRID ARRAY |
85 Cel |
128KX36 |
128K |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B119 |
3 |
3.465 V |
4718592 bit |
3.135 V |
PIPELINED |
e1 |
260 |
3.1 ns |
|||||||||||||||||||||||||
|
Integrated Device Technology |
CACHE SRAM |
INDUSTRIAL |
165 |
TBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
262144 words |
3.3 |
18 |
GRID ARRAY, THIN PROFILE |
1 mm |
85 Cel |
256KX18 |
256K |
-40 Cel |
TIN LEAD |
BOTTOM |
R-PBGA-B165 |
3 |
3.465 V |
1.2 mm |
13 mm |
4718592 bit |
3.135 V |
e0 |
225 |
15 mm |
7.5 ns |
|||||||||||||||||||||||
|
Cypress Semiconductor |
MULTI-PORT SRAM |
INDUSTRIAL |
256 |
LBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
BALL |
PARALLEL |
SYNCHRONOUS |
780 mA |
524288 words |
COMMON |
1.5 |
1.5/1.8 |
36 |
GRID ARRAY, LOW PROFILE |
BGA256,16X16,40 |
SRAMs |
1 mm |
85 Cel |
3-STATE |
512KX36 |
512K |
1.4 V |
-40 Cel |
TIN LEAD |
BOTTOM |
2 |
S-PBGA-B256 |
3 |
1.58 V |
1.7 mm |
167 MHz |
17 mm |
Not Qualified |
18874368 bit |
1.42 V |
PIPELINED OR FLOW-THROUGH ARCHITECTURE, IT CAN ALSO OPERATES AT 1.8V |
e0 |
.35 Amp |
17 mm |
4 ns |
SRAM, or Static Random-Access Memory, is a type of volatile computer memory that stores data as a flip-flop, which retains the data as long as power is supplied to the system. SRAM is commonly used as cache memory and in other applications where high-speed access to data is required.
SRAM is a type of memory that is faster and more expensive than DRAM (Dynamic Random-Access Memory). It is commonly used as cache memory in computer systems and other digital devices to improve the speed of data access. SRAM is also used in applications where high-speed data processing is required, such as in networking equipment, video games, and other high-performance computing applications.
One of the advantages of using SRAM is that it provides faster access to data than other types of memory, such as DRAM. This is because SRAM does not need to be refreshed like DRAM, which makes it faster and more reliable. Additionally, SRAM uses less power than other types of memory, which makes it ideal for use in battery-powered devices.
One of the disadvantages of using SRAM is that it is more expensive and less dense than other types of memory, such as DRAM or flash memory. This means that it is not suitable for applications that require large amounts of memory at a low cost. Additionally, SRAM is volatile, which means that it cannot store data permanently.