SQUARE Digital Signal Processors (DSPs) 2,107

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	On Chip Data RAM Width	Screening Level	Address Bus Width	DAC Channels	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	No. of External Interrupts	Minimum Operating Temperature	Terminal Finish	ADC Channels	Terminal Position	DMA Channels	Maximum Seated Height	ROM Words	RAM Words	Width	Data EEPROM Size	Additional Features	Boundary Scan	Peripherals	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Internal Bus Architecture	Length	No. of Timers	RAM Bytes	Technology	Analog To Digital Convertors	Maximum Supply Current	Nominal Supply Voltage	No. of DMA Channels	PWM Channels	No. of Serial I/Os	Sub-Category	Connectivity	ROM Programmability	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	Low Power Mode	Barrel Shifter	JESD-609 Code	On Chip Program ROM Width	No. of I/O Lines
DSPIC33FJ128MC804-H/ML	Microchip Technology	DIGITAL SIGNAL PROCESSOR, CONTROLLER	AUTOMOTIVE	NO LEAD	44	HVQCCN	SQUARE	PLASTIC/EPOXY	NO	YES	3.6 V	16		0		16	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC44,.31SQ,25	3 V	150 Cel	3	-40 Cel	MATTE TIN		QUAD		1 mm			8 mm			YES		0		40	260		8 mm	5		CMOS		76 mA	3.3 V	8		2	Digital Signal Processors		FLASH	.65 mm	FLOATING POINT	S-PQCC-N44	1	Not Qualified		YES		e3	24
DSPIC33FJ128MC804-H/PT	Microchip Technology	DIGITAL SIGNAL PROCESSOR, CONTROLLER	AUTOMOTIVE	GULL WING	44	TQFP	SQUARE	PLASTIC/EPOXY	NO	YES	3.6 V	16		0		16	3.3	FLATPACK, THIN PROFILE	TQFP44,.39SQ,31	3 V	150 Cel	3	-40 Cel	MATTE TIN		QUAD		1.2 mm			10 mm			YES		0		40	260		10 mm	5		CMOS		76 mA	3.3 V	8		2	Digital Signal Processors		FLASH	.8 mm	FLOATING POINT	S-PQFP-G44	3	Not Qualified		YES		e3	24
DSPIC33FJ64MC804-H/ML	Microchip Technology	DIGITAL SIGNAL PROCESSOR, CONTROLLER	AUTOMOTIVE	NO LEAD	44	HVQCCN	SQUARE	PLASTIC/EPOXY	NO	YES	3.6 V	16		0		16	3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC44,.31SQ,25	3 V	150 Cel	3	-40 Cel	MATTE TIN		QUAD		1 mm			8 mm			YES		0		40	260		8 mm	5		CMOS		76 mA	3.3 V	8		2	Digital Signal Processors		FLASH	.65 mm	FLOATING POINT	S-PQCC-N44	1	Not Qualified		YES		e3	24
DSPIC30F2010-20E/MM	Microchip Technology	DIGITAL SIGNAL PROCESSOR, OTHER	AUTOMOTIVE	NO LEAD	28	HVQCCN	SQUARE	PLASTIC/EPOXY	NO	YES	5.5 V	8	TS 16949	0	NO	16	3/5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC28,.24SQ,25	3 V	125 Cel	3	-40 Cel	Matte Tin (Sn) - annealed	YES	QUAD	NO	1 mm	4096	512	6 mm	1K		NO	BOD, POR, PWM(8), QEI, TIMER(3), WDT	0	40 MHz	40	260	MULTIPLE	6 mm	5	512	CMOS	6-Ch 10-Bit	150 mA	5 V		YES	2	Digital Signal Processors	I2C, SPI, UART	FLASH	.65 mm	FIXED POINT	S-PQCC-N28	1	Not Qualified	20 rpm	YES	YES	e3	24	20
TMS320C6202BZNY250	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	384	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.57 V	8		22		32	1.5,3.3	GRID ARRAY, FINE PITCH	BGA384,22X22,32	1.43 V	90 Cel	4	0 Cel	TIN SILVER COPPER		BOTTOM		2.35 mm		131072	18 mm		ALSO REQUIRES 3.3V SUPPLY	YES		32	250 MHz	30	260	MULTIPLE	18 mm	2		CMOS			1.5 V	4			Digital Signal Processors		MROM	.8 mm	FIXED POINT	S-PBGA-B384	4	Not Qualified		YES	NO	e1	8
TMS320C6416TBZLZ7	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	532	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.24 V			23		32	1.2,3.3	GRID ARRAY, FINE PITCH	BGA532,26X26,32	1.16 V	90 Cel		0 Cel	TIN SILVER COPPER		BOTTOM		3.25 mm		16384	23 mm		ALSO REQUIRES 3.3V SUPPLY	YES		64	75 MHz	30	260	MULTIPLE	23 mm			CMOS			1.2 V				Digital Signal Processors			.8 mm	FIXED POINT	S-PBGA-B532	4	Not Qualified		YES	NO	e1
SM320C26BFJM	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	MILITARY	J BEND	68	QCCJ	SQUARE	CERAMIC, METAL-SEALED COFIRED		YES	5.5 V		38535Q/M;38534H;883B	16		16	5	CHIP CARRIER	LDCC68,1.0SQ	4.5 V	125 Cel		-55 Cel			QUAD		3.68 mm		1568	24.13 mm			NO		16	40 MHz	NOT SPECIFIED	NOT SPECIFIED	MULTIPLE	24.13 mm			CMOS		185 mA	5 V				Digital Signal Processors			1.27 mm	FLOATING POINT	S-CQCC-J68		Not Qualified		NO	YES
TMS32C6713BPYPA200	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	GULL WING	208	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V			22		32	1.2,3.3	FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP208,1.2SQ,20	1.14 V	105 Cel	4	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)		QUAD		1.6 mm		65536	28 mm		ALSO OPERATES AT 3.3V SUPPLY	YES		32	200 MHz	NOT SPECIFIED	260	MULTIPLE	28 mm	2		CMOS			1.2 V	16			Digital Signal Processors			.5 mm	FLOATING POINT	S-PQFP-G208	4	Not Qualified		YES	NO	e4
ADSP-21368BBPZ-2A	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	256	LBGA	SQUARE	PLASTIC/EPOXY		YES	1.26 V			24		32	1.2,3.3	GRID ARRAY, LOW PROFILE	BGA256,20X20,50	1.14 V	85 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM		1.7 mm		65536	27 mm		ALSO REQUIRES 3.3V SUPPLY	YES		32	55.56 MHz		260	MULTIPLE	27 mm			CMOS			1.2 V				Digital Signal Processors			1.27 mm	FLOATING POINT	S-PBGA-B256	3	Not Qualified		NO	YES	e1
ADSP-21368KBPZ-2A	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	256	LBGA	SQUARE	PLASTIC/EPOXY		YES	1.26 V			24		32	1.2,3.3	GRID ARRAY, LOW PROFILE	BGA256,20X20,50	1.14 V	70 Cel		0 Cel	TIN SILVER COPPER		BOTTOM		1.7 mm		65536	27 mm		ALSO REQUIRES 3.3V SUPPLY	YES		32	55.56 MHz		260	MULTIPLE	27 mm			CMOS			1.2 V				Digital Signal Processors			1.27 mm	FLOATING POINT	S-PBGA-B256	3	Not Qualified		NO	YES	e1
ADSP-21369BBPZ-2A	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	256	LBGA	SQUARE	PLASTIC/EPOXY		YES	1.26 V			24		32	1.2,3.3	GRID ARRAY, LOW PROFILE	BGA256,20X20,50	1.14 V	85 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM		1.7 mm		65536	27 mm		ALSO REQUIRES 3.3V SUPPLY	YES		32	55.56 MHz		260	MULTIPLE	27 mm			CMOS			1.2 V				Digital Signal Processors			1.27 mm	FLOATING POINT	S-PBGA-B256	3	Not Qualified		NO	YES	e1
ADSP-21369KBPZ-2A	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	256	LBGA	SQUARE	PLASTIC/EPOXY		YES	1.26 V			24		32	1.2,3.3	GRID ARRAY, LOW PROFILE	BGA256,20X20,50	1.14 V	70 Cel		0 Cel	TIN SILVER COPPER		BOTTOM		1.7 mm		65536	27 mm		ALSO REQUIRES 3.3V SUPPLY	YES		32	55.56 MHz	30	260	MULTIPLE	27 mm			CMOS			1.2 V				Digital Signal Processors			1.27 mm	FLOATING POINT	S-PBGA-B256	3	Not Qualified		NO	YES	e1
TMS32C6711DZDPA167	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	272	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V			22		32	1.2,3.3	GRID ARRAY	BGA272,20X20,50	1.14 V	105 Cel	4	-40 Cel	TIN SILVER COPPER		BOTTOM		2.57 mm			27 mm		ALSO REQUIRES 3.3V SUPPLY	YES		32	167 MHz	30	260	MULTIPLE	27 mm	2		CMOS			1.2 V	16			Digital Signal Processors		FLASH	1.27 mm	FLOATING POINT	S-PBGA-B272	3	Not Qualified		YES	NO	e1
ADSP-BF522KBCZ-3C2	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY		YES	3.6 V					32	3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,23X23,20	1.8 V	70 Cel		0 Cel	TIN SILVER COPPER		BOTTOM		1.4 mm			12 mm			YES				30	260	SINGLE	12 mm			CMOS			3.3 V				Microprocessors			.5 mm	FIXED POINT	S-PBGA-B289	3	Not Qualified	300 rpm	YES	NO	e1
ADSP-BF522KBCZ-4C2	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY		YES	3.6 V					32	3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,23X23,20	1.8 V	70 Cel		0 Cel	TIN SILVER COPPER		BOTTOM		1.4 mm			12 mm			YES				30	260	SINGLE	12 mm			CMOS			3.3 V				Microprocessors			.5 mm	FIXED POINT	S-PBGA-B289	3	Not Qualified	400 rpm	YES	NO	e1
ADSP-BF523KBCZ-5C2	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY		YES	3.6 V					32	3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,23X23,20	1.8 V	70 Cel		0 Cel	TIN SILVER COPPER		BOTTOM		1.4 mm			12 mm			YES				30	260	SINGLE	12 mm			CMOS			3.3 V				Microprocessors			.5 mm	FIXED POINT	S-PBGA-B289	3	Not Qualified	533 rpm	YES	NO	e1
ADSP-BF523KBCZ-6C2	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY		YES	3.6 V					32	3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,23X23,20	1.8 V	70 Cel		0 Cel			BOTTOM		1.4 mm			12 mm			YES				NOT SPECIFIED	NOT SPECIFIED	SINGLE	12 mm			CMOS			3.3 V				Microprocessors			.5 mm	FIXED POINT	S-PBGA-B289		Not Qualified	600 rpm	YES	NO
ADSP-BF524KBCZ-3C2	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY		YES	3.6 V					32	3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,23X23,20	1.8 V	70 Cel		0 Cel	TIN SILVER COPPER		BOTTOM		1.4 mm			12 mm			YES					260	SINGLE	12 mm			CMOS			3.3 V				Microprocessors			.5 mm	FIXED POINT	S-PBGA-B289	3	Not Qualified	300 rpm	YES	NO	e1
ADSP-BF524KBCZ-4C2	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY		YES	3.6 V					32	3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,23X23,20	1.8 V	70 Cel		0 Cel	TIN SILVER COPPER		BOTTOM		1.4 mm			12 mm			YES					260	SINGLE	12 mm			CMOS			3.3 V				Microprocessors			.5 mm	FIXED POINT	S-PBGA-B289	3	Not Qualified	400 rpm	YES	NO	e1
ADSP-BF525KBCZ-5C2	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY		YES	3.6 V					32	3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,23X23,20	1.8 V	70 Cel		0 Cel			BOTTOM		1.4 mm			12 mm			YES				NOT SPECIFIED	NOT SPECIFIED	SINGLE	12 mm			CMOS			3.3 V				Microprocessors			.5 mm	FIXED POINT	S-PBGA-B289		Not Qualified	533 rpm	YES	NO
ADSP-BF525KBCZ-6C2	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY		YES	3.6 V					32	3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,23X23,20	1.8 V	70 Cel		0 Cel	TIN SILVER COPPER		BOTTOM		1.4 mm			12 mm			YES						SINGLE	12 mm			CMOS			3.3 V				Microprocessors			.5 mm	FIXED POINT	S-PBGA-B289	3	Not Qualified	600 rpm	YES	NO	e1
ADSP-BF526KBCZ-3C2	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY		YES	3.6 V					32	3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,23X23,20	1.8 V	70 Cel		0 Cel	TIN SILVER COPPER		BOTTOM		1.4 mm			12 mm			YES						SINGLE	12 mm			CMOS			3.3 V				Microprocessors			.5 mm	FIXED POINT	S-PBGA-B289	3	Not Qualified	300 rpm	YES	NO	e1
ADSP-BF526KBCZ-4C2	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY		YES	3.6 V					32	3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,23X23,20	1.8 V	70 Cel		0 Cel	TIN SILVER COPPER		BOTTOM		1.4 mm			12 mm			YES						SINGLE	12 mm			CMOS			3.3 V				Microprocessors			.5 mm	FIXED POINT	S-PBGA-B289	3	Not Qualified	400 rpm	YES	NO	e1
ADSP-BF527KBCZ-5C2	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY		YES	3.6 V					32	3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,23X23,20	1.8 V	70 Cel		0 Cel	TIN SILVER COPPER		BOTTOM		1.4 mm			12 mm			YES				30	260	SINGLE	12 mm			CMOS			3.3 V				Microprocessors			.5 mm	FIXED POINT	S-PBGA-B289	3	Not Qualified	533 rpm	YES	NO	e1
ADSP-BF527KBCZ-6C2	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY		YES	3.6 V					32	3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,23X23,20	1.8 V	70 Cel		0 Cel			BOTTOM		1.4 mm			12 mm			YES				NOT SPECIFIED	NOT SPECIFIED	SINGLE	12 mm			CMOS			3.3 V				Microprocessors			.5 mm	FIXED POINT	S-PBGA-B289		Not Qualified	600 rpm	YES	NO
TMS320C6748EZCED4E	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.05 V			14				GRID ARRAY, LOW PROFILE, FINE PITCH		.95 V	90 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM		1.3 mm			13 mm		1.2V ,1.1V AND 1.3 VOLT NOMINAL FREQUENCY ALSO AVAILABLE	YES		16	30 MHz	30	260	MULTIPLE	13 mm			CMOS			1 V							.65 mm	FIXED POINT	S-PBGA-B361	3			YES	NO	e1
DSPIC33CK128MP202-E/2N	Microchip Technology	DIGITAL SIGNAL PROCESSOR, CONTROLLER	INDUSTRIAL	NO LEAD	28	HVQCCN	SQUARE	PLASTIC/EPOXY	NO	YES	3.6 V	8	AEC-Q100			16		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC28,.24SQ,25	3 V	125 Cel	4	-40 Cel	MATTE TIN		QUAD		.55 mm		16384	6 mm			YES			64 MHz		260	MULTIPLE	6 mm	2		CMOS		42.5 mA	3.3 V	4		4			FLASH	.65 mm	FIXED POINT	S-PQCC-N28	1			YES	YES	e3	24
DSPIC33CK128MP202-I/2N	Microchip Technology	DIGITAL SIGNAL PROCESSOR, CONTROLLER	INDUSTRIAL	NO LEAD	28	HVQCCN	SQUARE	PLASTIC/EPOXY	NO	YES	3.6 V	8				16		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC28,.24SQ,25	3 V	85 Cel	4	-40 Cel	Matte Tin (Sn)		QUAD		.55 mm		16384	6 mm			YES			64 MHz			MULTIPLE	6 mm	2		CMOS		35 mA	3.3 V	4		4			FLASH	.65 mm	FIXED POINT	S-PQCC-N28				YES	YES	e3	24
DSPIC33CK128MP205-I/PT	Microchip Technology	DIGITAL SIGNAL PROCESSOR, CONTROLLER	INDUSTRIAL	GULL WING	48	TFQFP	SQUARE	PLASTIC/EPOXY	NO	YES	3.6 V	8				16		FLATPACK, THIN PROFILE, FINE PITCH	QFP48,.35SQ,20	3 V	85 Cel	4	-40 Cel	Matte Tin (Sn)		QUAD		1.2 mm		16384	7 mm			YES			64 MHz			MULTIPLE	7 mm	2		CMOS		35 mA	3.3 V	4		4			FLASH	.5 mm	FIXED POINT	S-PQFP-G48				YES	YES	e3	24
DSPIC33CK128MP206-E/MR	Microchip Technology	DIGITAL SIGNAL PROCESSOR, CONTROLLER	AUTOMOTIVE	NO LEAD	64	HVQCCN	SQUARE	PLASTIC/EPOXY	NO	YES	3.6 V	8	AEC-Q100			16		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC64,.35SQ,20	3 V	125 Cel	4	-40 Cel	Matte Tin (Sn)		QUAD		1 mm		16384	9 mm			YES			64 MHz			MULTIPLE	9 mm	2		CMOS		42.5 mA	3.3 V	4		4			FLASH	.5 mm	FIXED POINT	S-PQCC-N64				YES	YES	e3	24
DSPIC33CK128MP502-E/2N	Microchip Technology	DIGITAL SIGNAL PROCESSOR, CONTROLLER	INDUSTRIAL	NO LEAD	28	HVQCCN	SQUARE	PLASTIC/EPOXY	NO	YES	3.6 V	8	AEC-Q100			16		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC28,.24SQ,25	3 V	125 Cel	4	-40 Cel	Matte Tin (Sn)		QUAD		.55 mm		16384	6 mm			YES			64 MHz			MULTIPLE	6 mm	2		CMOS		42.5 mA	3.3 V	4		4			FLASH	.65 mm	FIXED POINT	S-PQCC-N28				YES	YES	e3	24
DSPIC33CK128MP503-E/M5	Microchip Technology	DIGITAL SIGNAL PROCESSOR, CONTROLLER	AUTOMOTIVE	NO LEAD	36	HVQCCN	SQUARE	PLASTIC/EPOXY	NO	YES	3.6 V	8	AEC-Q100			16		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC36,.2SQ,16	3 V	125 Cel	4	-40 Cel	Matte Tin (Sn)		QUAD		.6 mm		16384	5 mm			YES			64 MHz			MULTIPLE	5 mm	2		CMOS		42.5 mA	3.3 V	4		4			FLASH	.4 mm	FIXED POINT	S-PQCC-N36				YES	YES	e3	24
DSPIC33CK128MP505-I/PT	Microchip Technology	DIGITAL SIGNAL PROCESSOR, CONTROLLER	INDUSTRIAL	GULL WING	48	TFQFP	SQUARE	PLASTIC/EPOXY	NO	YES	3.6 V	8				16		FLATPACK, THIN PROFILE, FINE PITCH	QFP48,.35SQ,20	3 V	85 Cel	4	-40 Cel	Matte Tin (Sn)		QUAD		1.2 mm		16384	7 mm			YES			64 MHz			MULTIPLE	7 mm	2		CMOS		35 mA	3.3 V	4		4			FLASH	.5 mm	FIXED POINT	S-PQFP-G48				YES	YES	e3	24
DSPIC33CK128MP506-E/MR	Microchip Technology	DIGITAL SIGNAL PROCESSOR, CONTROLLER	AUTOMOTIVE	NO LEAD	64	HVQCCN	SQUARE	PLASTIC/EPOXY	NO	YES	3.6 V	8	AEC-Q100			16		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC64,.35SQ,20	3 V	125 Cel	4	-40 Cel	Matte Tin (Sn)		QUAD		1 mm		16384	9 mm			YES			64 MHz			MULTIPLE	9 mm	2		CMOS		42.5 mA	3.3 V	4		4			FLASH	.5 mm	FIXED POINT	S-PQCC-N64				YES	YES	e3	24
DSPIC33CK128MP506-E/PT	Microchip Technology	DIGITAL SIGNAL PROCESSOR, CONTROLLER	AUTOMOTIVE	GULL WING	64	TFQFP	SQUARE	PLASTIC/EPOXY	NO	YES	3.6 V	8	AEC-Q100			16		FLATPACK, THIN PROFILE, FINE PITCH	QFP64,.47SQ,20	3 V	125 Cel	4	-40 Cel	Matte Tin (Sn)		QUAD		1.2 mm		16384	10 mm			YES			64 MHz			MULTIPLE	10 mm	2		CMOS		42.5 mA	3.3 V	4		4			FLASH	.5 mm	FIXED POINT	S-PQFP-G64				YES	YES	e3	24
DSPIC33CK128MP506-I/MR	Microchip Technology	DIGITAL SIGNAL PROCESSOR, CONTROLLER	INDUSTRIAL	NO LEAD	64	HVQCCN	SQUARE	PLASTIC/EPOXY	NO	YES	3.6 V	8				16		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC64,.35SQ,20	3 V	85 Cel	4	-40 Cel	Matte Tin (Sn)		QUAD		1 mm		16384	9 mm			YES			64 MHz			MULTIPLE	9 mm	2		CMOS		35 mA	3.3 V	4		4			FLASH	.5 mm	FIXED POINT	S-PQCC-N64				YES	YES	e3	24
DSPIC33CK128MP508-I/PT	Microchip Technology	DIGITAL SIGNAL PROCESSOR, CONTROLLER	INDUSTRIAL	GULL WING	80	TFQFP	SQUARE	PLASTIC/EPOXY	NO	YES	3.6 V	8				16		FLATPACK, THIN PROFILE, FINE PITCH	QFP80,.55SQ,20	3 V	85 Cel	4	-40 Cel	Matte Tin (Sn)		QUAD		1.2 mm		16384	12 mm			YES			64 MHz			MULTIPLE	12 mm	2		CMOS		35 mA	3.3 V	4		4			FLASH	.5 mm	FIXED POINT	S-PQFP-G80				YES	YES	e3	24
DSPIC33CK256MP202-I/2N	Microchip Technology	DIGITAL SIGNAL PROCESSOR, CONTROLLER	INDUSTRIAL	NO LEAD	28	HVQCCN	SQUARE	PLASTIC/EPOXY	NO	YES	3.6 V	8				16		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC28,.24SQ,25	3 V	85 Cel	4	-40 Cel	Matte Tin (Sn)		QUAD		.55 mm		24576	6 mm			YES			64 MHz			MULTIPLE	6 mm	2		CMOS		35 mA	3.3 V	4		4			FLASH	.65 mm	FIXED POINT	S-PQCC-N28				YES	YES	e3	24
DSPIC33CK256MP203-I/M5	Microchip Technology	DIGITAL SIGNAL PROCESSOR, CONTROLLER	INDUSTRIAL	NO LEAD	36	HVQCCN	SQUARE	PLASTIC/EPOXY	NO	YES	3.6 V	8				16		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC36,.2SQ,16	3 V	85 Cel	4	-40 Cel	Matte Tin (Sn)		QUAD		.6 mm		24576	5 mm			YES			64 MHz			MULTIPLE	5 mm	2		CMOS		35 mA	3.3 V	4		4			FLASH	.4 mm	FIXED POINT	S-PQCC-N36				YES	YES	e3	24
DSPIC33CK256MP205-I/PT	Microchip Technology	DIGITAL SIGNAL PROCESSOR, CONTROLLER	INDUSTRIAL	GULL WING	48	TFQFP	SQUARE	PLASTIC/EPOXY	NO	YES	3.6 V	8				16		FLATPACK, THIN PROFILE, FINE PITCH	QFP48,.35SQ,20	3 V	85 Cel	4	-40 Cel	Matte Tin (Sn)		QUAD		1.2 mm		24576	7 mm			YES			64 MHz			MULTIPLE	7 mm	2		CMOS		35 mA	3.3 V	4		4			FLASH	.5 mm	FIXED POINT	S-PQFP-G48				YES	YES	e3	24
DSPIC33CK256MP206-E/MR	Microchip Technology	DIGITAL SIGNAL PROCESSOR, CONTROLLER	AUTOMOTIVE	NO LEAD	64	HVQCCN	SQUARE	PLASTIC/EPOXY	NO	YES	3.6 V	8	AEC-Q100			16		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC64,.35SQ,20	3 V	125 Cel	4	-40 Cel	Matte Tin (Sn)		QUAD		1 mm		24576	9 mm			YES			64 MHz			MULTIPLE	9 mm	2		CMOS		42.5 mA	3.3 V	4		4			FLASH	.5 mm	FIXED POINT	S-PQCC-N64				YES	YES	e3	24
DSPIC33CK256MP206-I/MR	Microchip Technology	DIGITAL SIGNAL PROCESSOR, CONTROLLER	INDUSTRIAL	NO LEAD	64	HVQCCN	SQUARE	PLASTIC/EPOXY	NO	YES	3.6 V	8				16		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC64,.35SQ,20	3 V	85 Cel	4	-40 Cel	Matte Tin (Sn)		QUAD		1 mm		24576	9 mm			YES			64 MHz			MULTIPLE	9 mm	2		CMOS		35 mA	3.3 V	4		4			FLASH	.5 mm	FIXED POINT	S-PQCC-N64				YES	YES	e3	24
DSPIC33CK256MP206-I/PT	Microchip Technology	DIGITAL SIGNAL PROCESSOR, CONTROLLER	INDUSTRIAL	GULL WING	64	TFQFP	SQUARE	PLASTIC/EPOXY	NO	YES	3.6 V	8				16		FLATPACK, THIN PROFILE, FINE PITCH	QFP64,.47SQ,20	3 V	85 Cel	4	-40 Cel	Matte Tin (Sn)		QUAD		1.2 mm		24576	10 mm			YES			64 MHz			MULTIPLE	10 mm	2		CMOS		35 mA	3.3 V	4		4			FLASH	.5 mm	FIXED POINT	S-PQFP-G64				YES	YES	e3	24
DSPIC33CK256MP502-E/2N	Microchip Technology	DIGITAL SIGNAL PROCESSOR, CONTROLLER	AUTOMOTIVE	NO LEAD	28	HVQCCN	SQUARE	PLASTIC/EPOXY	NO	YES	3.6 V	8	AEC-Q100			16		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC28,.24SQ,25	3 V	125 Cel	4	-40 Cel	Matte Tin (Sn)		QUAD		.55 mm		24576	6 mm			YES			64 MHz			MULTIPLE	6 mm	2		CMOS		42.5 mA	3.3 V	4		4			FLASH	.65 mm	FIXED POINT	S-PQCC-N28				YES	YES	e3	24
DSPIC33CK256MP502-I/2N	Microchip Technology	DIGITAL SIGNAL PROCESSOR, CONTROLLER	INDUSTRIAL	NO LEAD	28	HVQCCN	SQUARE	PLASTIC/EPOXY	NO	YES	3.6 V	8				16		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC28,.24SQ,25	3 V	85 Cel	4	-40 Cel	Matte Tin (Sn)		QUAD		.55 mm		24576	6 mm			YES			64 MHz			MULTIPLE	6 mm	2		CMOS		35 mA	3.3 V	4		4			FLASH	.65 mm	FIXED POINT	S-PQCC-N28				YES	YES	e3	24
DSPIC33CK256MP503-E/M5	Microchip Technology	DIGITAL SIGNAL PROCESSOR, CONTROLLER	AUTOMOTIVE	NO LEAD	36	HVQCCN	SQUARE	PLASTIC/EPOXY	NO	YES	3.6 V	8	AEC-Q100			16		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC36,.2SQ,16	3 V	125 Cel	4	-40 Cel	Matte Tin (Sn)		QUAD		.6 mm		24576	5 mm			YES			64 MHz			MULTIPLE	5 mm	2		CMOS		42.5 mA	3.3 V	4		4			FLASH	.4 mm	FIXED POINT	S-PQCC-N36				YES	YES	e3	24
DSPIC33CK256MP503-I/M5	Microchip Technology	DIGITAL SIGNAL PROCESSOR, CONTROLLER	INDUSTRIAL	NO LEAD	36	HVQCCN	SQUARE	PLASTIC/EPOXY	NO	YES	3.6 V	8				16		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC36,.2SQ,16	3 V	85 Cel	4	-40 Cel	Matte Tin (Sn)		QUAD		.6 mm		24576	5 mm			YES			64 MHz			MULTIPLE	5 mm	2		CMOS		35 mA	3.3 V	4		4			FLASH	.4 mm	FIXED POINT	S-PQCC-N36				YES	YES	e3	24
DSPIC33CK256MP505-I/PT	Microchip Technology	DIGITAL SIGNAL PROCESSOR, CONTROLLER	INDUSTRIAL	GULL WING	48	TFQFP	SQUARE	PLASTIC/EPOXY	NO	YES	3.6 V	8				16		FLATPACK, THIN PROFILE, FINE PITCH	QFP48,.35SQ,20	3 V	85 Cel	4	-40 Cel	Matte Tin (Sn)		QUAD		1.2 mm		24576	7 mm			YES			64 MHz			MULTIPLE	7 mm	2		CMOS		35 mA	3.3 V	4		4			FLASH	.5 mm	FIXED POINT	S-PQFP-G48				YES	YES	e3	24

Digital Signal Processors (DSPs)

Digital Signal Processors (DSPs) are specialized microprocessors that are designed to perform mathematical operations on digital signals. They are used in a variety of applications that require real-time signal processing, such as audio and video processing, telecommunications, and image processing. DSPs are capable of performing complex mathematical operations, such as filtering, convolution, and correlation, on digital signals at high speeds, making them an essential component of modern signal processing systems.

DSPs are optimized for digital signal processing tasks and are designed to handle large amounts of data at high speeds. They typically have a specialized architecture that includes dedicated hardware for performing mathematical operations on digital signals, as well as specialized memory and I/O interfaces that are optimized for signal processing applications.

DSPs are used in a wide range of applications, including audio and video compression, speech recognition, image and video processing, and radar and sonar systems. They are also used in telecommunications systems, such as cell phones and modems, to process signals in real time. DSPs are also used in scientific and engineering applications, such as biomedical research and industrial automation.