SQUARE Digital Signal Processors (DSPs) 2,107

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	On Chip Data RAM Width	Screening Level	Address Bus Width	DAC Channels	Bit Size	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	CPU Family	No. of External Interrupts	Minimum Operating Temperature	Terminal Finish	ADC Channels	Terminal Position	DMA Channels	Digital To Analog Convertors	Maximum Seated Height	ROM Words	RAM Words	Width	Data EEPROM Size	Additional Features	Boundary Scan	Peripherals	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Internal Bus Architecture	Length	No. of Timers	RAM Bytes	Technology	Analog To Digital Convertors	Maximum Supply Current	Nominal Supply Voltage	No. of DMA Channels	PWM Channels	No. of Serial I/Os	Connectivity	ROM Programmability	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Speed	Low Power Mode	Barrel Shifter	JESD-609 Code	On Chip Program ROM Width	No. of I/O Lines
DSPIC33EP128GS804-I/ML	Microchip Technology	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	NO LEAD	44	HVQCCN	SQUARE	PLASTIC/EPOXY	NO	YES	3.6 V	8	TS 16949	0	YES	16	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC44,.31SQ,25	3 V	85 Cel		4	-40 Cel	MATTE TIN	YES	QUAD	YES	1-Ch 12-Bit	1 mm	131072	8192	8 mm	0		YES	COMPARATOR(4), DMA(4), PWM(16), TIMER(5), WDT	0	60 MHz			MULTIPLE	8 mm	7	8192	CMOS	17-Ch 12-Bit	75 mA	3.3 V	4	YES	4	CAN(2), I2C(2), SPI(3), UART(2)	FLASH	.65 mm	FIXED POINT	S-PQCC-N44			YES	YES	e3	24	33
DSPIC33EP128GS804T-I/ML	Microchip Technology	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	NO LEAD	44	HVQCCN	SQUARE	PLASTIC/EPOXY	NO	YES	3.6 V	8	TS 16949	0	YES	16	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC44,.31SQ,25	3 V	85 Cel		4	-40 Cel	MATTE TIN	YES	QUAD	YES	1-Ch 12-Bit	1 mm	131072	8192	8 mm	0		YES	COMPARATOR(4), DMA(4), PWM(16), TIMER(5), WDT	0	60 MHz			MULTIPLE	8 mm	7	8192	CMOS	17-Ch 12-Bit	75 mA	3.3 V	4	YES	4	CAN(2), I2C(2), SPI(3), UART(2)	FLASH	.65 mm	FIXED POINT	S-PQCC-N44			YES	YES	e3	24	33
DSPIC33EP128GS805-E/PT	Microchip Technology	DIGITAL SIGNAL PROCESSOR, OTHER	AUTOMOTIVE	GULL WING	48	TFQFP	SQUARE	PLASTIC/EPOXY	NO	YES	3.6 V	8	AEC-Q100; TS 16949	0	YES	16	FLATPACK, THIN PROFILE, FINE PITCH	TQFP48,.35SQ	3 V	125 Cel		4	-40 Cel	MATTE TIN	YES	QUAD	YES	1-Ch 12-Bit	1.2 mm	131072	8192	7 mm	0		YES	COMPARATOR(4), DMA(4), PWM(16), TIMER(5), WDT	0	60 MHz			MULTIPLE	7 mm	7	8192	CMOS	17-Ch 12-Bit	75 mA	3.3 V	4	YES	4	CAN(2), I2C(2), SPI(3), UART(2)	FLASH	.5 mm	FIXED POINT	S-PQFP-G48			YES	YES	e3	24	33
DSPIC33EP128GS805-I/PT	Microchip Technology	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	GULL WING	48	TFQFP	SQUARE	PLASTIC/EPOXY	NO	YES	3.6 V	8	TS 16949	0	YES	16	FLATPACK, THIN PROFILE, FINE PITCH	TQFP48,.35SQ	3 V	85 Cel		4	-40 Cel	MATTE TIN	YES	QUAD	YES	1-Ch 12-Bit	1.2 mm	131072	8192	7 mm	0		YES	COMPARATOR(4), DMA(4), PWM(16), TIMER(5), WDT	0	60 MHz			MULTIPLE	7 mm	7	8192	CMOS	17-Ch 12-Bit	75 mA	3.3 V	4	YES	4	CAN(2), I2C(2), SPI(3), UART(2)	FLASH	.5 mm	FIXED POINT	S-PQFP-G48			YES	YES	e3	24	33
DSPIC33EP128GS806-I/PT	Microchip Technology	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	GULL WING	64	TFQFP	SQUARE	PLASTIC/EPOXY	NO	YES	3.6 V	8	TS 16949	0	YES	16	FLATPACK, THIN PROFILE, FINE PITCH	TQFP64,.47SQ	3 V	85 Cel		4	-40 Cel	MATTE TIN	YES	QUAD	YES	2-Ch 12-Bit	1.2 mm	131072	8192	10 mm	0		YES	COMPARATOR(4), DMA(4), PWM(16), TIMER(5), WDT	0	60 MHz			MULTIPLE	10 mm	7	8192	CMOS	22-Ch 12-Bit	75 mA	3.3 V	4	YES	4	CAN(2), I2C(2), SPI(3), UART(2)	FLASH	.5 mm	FIXED POINT	S-PQFP-G64			YES	YES	e3	24	51
DSPIC33EP128GS808-E/PT	Microchip Technology	DIGITAL SIGNAL PROCESSOR, OTHER	AUTOMOTIVE	GULL WING	80	TQFP	SQUARE	PLASTIC/EPOXY	NO	YES	3.6 V	8	AEC-Q100; TS 16949	0	YES	16	FLATPACK, THIN PROFILE	TQFP80,.55SQ	3 V	125 Cel		4	-40 Cel	MATTE TIN	YES	QUAD	YES	2-Ch 12-Bit	1.2 mm	131072	8192	12 mm	0		YES	COMPARATOR(4), DMA(4), PWM(16), TIMER(5), WDT	0	60 MHz			MULTIPLE	12 mm	7	8192	CMOS	22-Ch 12-Bit	75 mA	3.3 V	4	YES	4	CAN(2), I2C(2), SPI(3), UART(2)	FLASH	.5 mm	FIXED POINT	S-PQFP-G80			YES	YES	e3	24	67
DSPIC33EP128GS808T-I/PT	Microchip Technology	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	GULL WING	80	TQFP	SQUARE	PLASTIC/EPOXY	NO	YES	3.6 V	8	TS 16949	0	YES	16	FLATPACK, THIN PROFILE	TQFP80,.55SQ	3 V	85 Cel		4	-40 Cel	MATTE TIN	YES	QUAD	YES	2-Ch 12-Bit	1.2 mm	131072	8192	12 mm	0		YES	COMPARATOR(4), DMA(4), PWM(16), TIMER(5), WDT	0	60 MHz			MULTIPLE	12 mm	7	8192	CMOS	22-Ch 12-Bit	75 mA	3.3 V	4	YES	4	CAN(2), I2C(2), SPI(3), UART(2)	FLASH	.5 mm	FIXED POINT	S-PQFP-G80			YES	YES	e3	24	67
DSPIC33EP64GS708-E/PT	Microchip Technology	DIGITAL SIGNAL PROCESSOR, OTHER	AUTOMOTIVE	GULL WING	80	TQFP	SQUARE	PLASTIC/EPOXY	NO	YES	3.6 V	8	AEC-Q100; TS 16949	0	YES	16	FLATPACK, THIN PROFILE	TQFP80,.55SQ	3 V	125 Cel		4	-40 Cel	MATTE TIN	YES	QUAD	NO	2-Ch 12-Bit	1.2 mm	65536	8192	12 mm	0		YES	COMPARATOR(4), PWM(16), TIMER(5), WDT	0	60 MHz			MULTIPLE	12 mm	7	8192	CMOS	22-Ch 12-Bit	75 mA	3.3 V	0	YES	4	I2C(2), SPI(3), UART(2)	FLASH	.5 mm	FIXED POINT	S-PQFP-G80			YES	YES	e3	24	67
DSPIC33EP64GS806-E/PT	Microchip Technology	DIGITAL SIGNAL PROCESSOR, OTHER	AUTOMOTIVE	GULL WING	64	TFQFP	SQUARE	PLASTIC/EPOXY	NO	YES	3.6 V	8	AEC-Q100; TS 16949	0	YES	16	FLATPACK, THIN PROFILE, FINE PITCH	TQFP64,.47SQ	3 V	125 Cel		4	-40 Cel	MATTE TIN	YES	QUAD	YES	2-Ch 12-Bit	1.2 mm	65536	8192	10 mm	0		YES	COMPARATOR(4), DMA(4), PWM(16), TIMER(5), WDT	0	60 MHz			MULTIPLE	10 mm	7	8192	CMOS	22-Ch 12-Bit	75 mA	3.3 V	4	YES	4	CAN(2), I2C(2), SPI(3), UART(2)	FLASH	.5 mm	FIXED POINT	S-PQFP-G64			YES	YES	e3	24	51
DSPIC33EP64GS806-I/PT	Microchip Technology	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	GULL WING	64	TFQFP	SQUARE	PLASTIC/EPOXY	NO	YES	3.6 V	8	TS 16949	0	YES	16	FLATPACK, THIN PROFILE, FINE PITCH	TQFP64,.47SQ	3 V	85 Cel		4	-40 Cel	MATTE TIN	YES	QUAD	YES	2-Ch 12-Bit	1.2 mm	65536	8192	10 mm	0		YES	COMPARATOR(4), DMA(4), PWM(16), TIMER(5), WDT	0	60 MHz			MULTIPLE	10 mm	7	8192	CMOS	22-Ch 12-Bit	75 mA	3.3 V	4	YES	4	CAN(2), I2C(2), SPI(3), UART(2)	FLASH	.5 mm	FIXED POINT	S-PQFP-G64		70 rpm	YES	YES	e3	24	51
DSPIC33EP64GS808-E/PT	Microchip Technology	DIGITAL SIGNAL PROCESSOR, OTHER	AUTOMOTIVE	GULL WING	80	TQFP	SQUARE	PLASTIC/EPOXY	NO	YES	3.6 V	8	AEC-Q100; TS 16949	0	YES	16	FLATPACK, THIN PROFILE	TQFP80,.55SQ	3 V	125 Cel		4	-40 Cel	MATTE TIN	YES	QUAD	YES	2-Ch 12-Bit	1.2 mm	65536	8192	12 mm	0		YES	COMPARATOR(4), DMA(4), PWM(16), TIMER(5), WDT	0	60 MHz			MULTIPLE	12 mm	7	8192	CMOS	22-Ch 12-Bit	75 mA	3.3 V	4	YES	4	CAN(2), I2C(2), SPI(3), UART(2)	FLASH	.5 mm	FIXED POINT	S-PQFP-G80			YES	YES	e3	24	67
DSPIC33EP32GS502-E/2N	Microchip Technology	DIGITAL SIGNAL PROCESSOR, CONTROLLER	AUTOMOTIVE	NO LEAD	28	HVQCCN	SQUARE	PLASTIC/EPOXY		YES	3.6 V		AEC-Q100; TS 16949	0		16	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC28,.24SQ,25	3 V	125 Cel			-40 Cel	MATTE TIN		QUAD			.55 mm			6 mm					0	60 MHz				6 mm			CMOS			3.3 V					FLASH	.65 mm		S-PQCC-N28					e3	8
DFDF2812ZHHAR	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	179	LFBGA	SQUARE	PLASTIC/EPOXY	NO	YES	2 V	16		19		32	GRID ARRAY, LOW PROFILE, FINE PITCH		1.81 V	85 Cel	C28X	3	-40 Cel	TIN SILVER COPPER		BOTTOM			1.4 mm		18432	12 mm		1.8V NOMINAL AVAILBALE @135MHZ	YES		16	35 MHz	30	260	MULTIPLE	12 mm	8	36864	CMOS		230 mA	1.9 V		YES			OTPROM	.8 mm	FIXED POINT	S-PBGA-B179	3		YES	NO	e1	16
DVC5416PGE160IDWLD	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	GULL WING	144	LFQFP	SQUARE	PLASTIC/EPOXY		YES	1.65 V			23			FLATPACK, LOW PROFILE, FINE PITCH		1.55 V	100 Cel			-40 Cel	NICKEL PALLADIUM GOLD		QUAD			1.6 mm			20 mm			YES		16	20 MHz	30	260	MULTIPLE	20 mm			CMOS			1.6 V						.5 mm	FIXED POINT	S-PQFP-G144	1		YES	YES	e4
TMSDVC5402PGE100G4	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	GULL WING	144	LFQFP	SQUARE	PLASTIC/EPOXY		YES	1.98 V			20			FLATPACK, LOW PROFILE, FINE PITCH		1.71 V	100 Cel			-40 Cel	NICKEL PALLADIUM GOLD		QUAD			1.6 mm			20 mm			YES		16	20 MHz	30	260	MULTIPLE	20 mm			CMOS			1.8 V						.5 mm	FIXED POINT	S-PQFP-G144	2		YES	YES	e4
TNETV2665FIBZWT4	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.26 V			13			GRID ARRAY, LOW PROFILE, FINE PITCH		1.14 V	90 Cel			0 Cel	TIN SILVER COPPER		BOTTOM			1.4 mm			16 mm			YES		32	30 MHz	30	260	MULTIPLE	16 mm			CMOS			1.2 V						.8 mm	FIXED POINT	S-PBGA-B361	3		YES	NO	e1
TNETV2665FIBZWT6	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.26 V			13			GRID ARRAY, LOW PROFILE, FINE PITCH		1.14 V	90 Cel			0 Cel	TIN SILVER COPPER		BOTTOM			1.4 mm			16 mm			YES		32	30 MHz	30	260	MULTIPLE	16 mm			CMOS			1.2 V						.8 mm	FIXED POINT	S-PBGA-B361	3		YES	NO	e1
TNETV2665FIBZWT7	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.26 V			13			GRID ARRAY, LOW PROFILE, FINE PITCH		1.14 V	90 Cel			0 Cel	TIN SILVER COPPER		BOTTOM			1.4 mm			16 mm			YES		32	30 MHz	30	260	MULTIPLE	16 mm			CMOS			1.2 V						.8 mm	FIXED POINT	S-PBGA-B361	3		YES	NO	e1
TNETV2665FIBZWTA6	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.26 V			13			GRID ARRAY, LOW PROFILE, FINE PITCH		1.14 V	90 Cel			0 Cel	TIN SILVER COPPER		BOTTOM			1.4 mm			16 mm			YES		32	30 MHz	30	260	MULTIPLE	16 mm			CMOS			1.2 V						.8 mm	FIXED POINT	S-PBGA-B361	3		YES	NO	e1
TNETV2665FIDZWT4	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.26 V			13			GRID ARRAY, LOW PROFILE, FINE PITCH		1.14 V	90 Cel			0 Cel	TIN SILVER COPPER		BOTTOM			1.4 mm			16 mm			YES		32	30 MHz	30	260	MULTIPLE	16 mm			CMOS			1.2 V						.8 mm	FIXED POINT	S-PBGA-B361	3		YES	NO	e1
TNETV2665FIDZWT6	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.26 V			13			GRID ARRAY, LOW PROFILE, FINE PITCH		1.14 V	90 Cel			0 Cel	TIN SILVER COPPER		BOTTOM			1.4 mm			16 mm			YES		32	30 MHz	30	260	MULTIPLE	16 mm			CMOS			1.2 V						.8 mm	FIXED POINT	S-PBGA-B361	3		YES	NO	e1
TNETV2665FIDZWT7	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.26 V			13			GRID ARRAY, LOW PROFILE, FINE PITCH		1.14 V	90 Cel			0 Cel	TIN SILVER COPPER		BOTTOM			1.4 mm			16 mm			YES		32	30 MHz	30	260	MULTIPLE	16 mm			CMOS			1.2 V						.8 mm	FIXED POINT	S-PBGA-B361	3		YES	NO	e1
TNETV2665VIDZWT4	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.26 V			13			GRID ARRAY, LOW PROFILE, FINE PITCH		1.14 V	90 Cel			0 Cel	TIN SILVER COPPER		BOTTOM			1.4 mm			16 mm			YES		32	30 MHz	30	260	MULTIPLE	16 mm			CMOS			1.2 V						.8 mm	FIXED POINT	S-PBGA-B361	3		YES	NO	e1
TNETV2665VIDZWT6	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.26 V			13			GRID ARRAY, LOW PROFILE, FINE PITCH		1.14 V	90 Cel			0 Cel	TIN SILVER COPPER		BOTTOM			1.4 mm			16 mm			YES		32	30 MHz	30	260	MULTIPLE	16 mm			CMOS			1.2 V						.8 mm	FIXED POINT	S-PBGA-B361	3		YES	NO	e1
TNETV2665VIDZWT7	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	OTHER	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.26 V			13			GRID ARRAY, LOW PROFILE, FINE PITCH		1.14 V	90 Cel			0 Cel	TIN SILVER COPPER		BOTTOM			1.4 mm			16 mm			YES		32	30 MHz	30	260	MULTIPLE	16 mm			CMOS			1.2 V						.8 mm	FIXED POINT	S-PBGA-B361	3		YES	NO	e1
TX5416PGE	Texas Instruments	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	GULL WING	144	LFQFP	SQUARE	PLASTIC/EPOXY		YES				23			FLATPACK, LOW PROFILE, FINE PITCH			100 Cel			-40 Cel	NICKEL PALLADIUM GOLD		QUAD			1.6 mm			20 mm			YES		16	20 MHz	30	260	MULTIPLE	20 mm			CMOS									.5 mm	FIXED POINT	S-PQFP-G144	1		YES	YES	e4
ADSP-21571BSWZ-4	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	GULL WING	176	HLFQFP	SQUARE	PLASTIC/EPOXY		YES	1.15 V						FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH		1.05 V	85 Cel			-40 Cel			QUAD			1.6 mm			24 mm			YES				30	260	MULTIPLE	24 mm			CMOS			1.1 V						.5 mm	FIXED POINT	S-PQFP-G176			YES	YES
ADSP-21571BSWZ-5	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	GULL WING	176	HLFQFP	SQUARE	PLASTIC/EPOXY		YES	1.2 V						FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH		1.1 V	85 Cel			-40 Cel	MATTE TIN		QUAD			1.6 mm			24 mm			YES				30	260	MULTIPLE	24 mm			CMOS			1.15 V						.5 mm	FIXED POINT	S-PQFP-G176	3		YES	YES	e3
ADSP-21571CSWZ-4	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	GULL WING	176	HLFQFP	SQUARE	PLASTIC/EPOXY		YES	1.15 V						FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH		1.05 V	105 Cel			-40 Cel			QUAD			1.6 mm			24 mm			YES				30	260	MULTIPLE	24 mm			CMOS			1.1 V						.5 mm	FIXED POINT	S-PQFP-G176			YES	YES
ADSP-21571CSWZ-5	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	GULL WING	176	HLFQFP	SQUARE	PLASTIC/EPOXY		YES	1.2 V						FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH		1.1 V	100 Cel			-40 Cel			QUAD			1.6 mm			24 mm			YES				30	260	MULTIPLE	24 mm			CMOS			1.15 V						.5 mm	FIXED POINT	S-PQFP-G176			YES	YES
ADSP-21571KSWZ-4	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	GULL WING	176	HLFQFP	SQUARE	PLASTIC/EPOXY		YES	1.15 V						FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH		1.05 V	70 Cel			0 Cel			QUAD			1.6 mm			24 mm			YES				30	260	MULTIPLE	24 mm			CMOS			1.1 V						.5 mm	FIXED POINT	S-PQFP-G176			YES	YES
ADSP-21571KSWZ-5	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	GULL WING	176	HLFQFP	SQUARE	PLASTIC/EPOXY		YES	1.2 V						FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH		1.1 V	70 Cel			0 Cel	MATTE TIN		QUAD			1.6 mm			24 mm			YES				30	260	MULTIPLE	24 mm			CMOS			1.15 V						.5 mm	FIXED POINT	S-PQFP-G176	3		YES	YES	e3
ADSP-21573BBCZ-4	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.15 V			16			GRID ARRAY, LOW PROFILE, FINE PITCH		1.05 V	85 Cel			-40 Cel			BOTTOM			1.5 mm			17 mm			YES		16		30	260	MULTIPLE	17 mm			CMOS			1.1 V						.8 mm	FIXED POINT	S-PBGA-B400			YES	YES
ADSP-21573BBCZ-5	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.2 V			16			GRID ARRAY, LOW PROFILE, FINE PITCH		1.1 V	85 Cel			-40 Cel			BOTTOM			1.5 mm			17 mm			YES		16		30	260	MULTIPLE	17 mm			CMOS			1.15 V						.8 mm	FIXED POINT	S-PBGA-B400			YES	YES
ADSP-21573CBCZ-4	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.15 V			16			GRID ARRAY, LOW PROFILE, FINE PITCH		1.05 V	100 Cel			-40 Cel	TIN SILVER COPPER		BOTTOM			1.5 mm			17 mm			YES		16		30	260	MULTIPLE	17 mm			CMOS			1.1 V						.8 mm	FIXED POINT	S-PBGA-B400	3		YES	YES	e1
ADSP-21573CBCZ-5	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.2 V			16			GRID ARRAY, LOW PROFILE, FINE PITCH		1.1 V	95 Cel			-40 Cel			BOTTOM			1.5 mm			17 mm			YES		16		30	260	MULTIPLE	17 mm			CMOS			1.15 V						.8 mm	FIXED POINT	S-PBGA-B400			YES	YES
ADSP-21573KBCZ-4	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.15 V			16			GRID ARRAY, LOW PROFILE, FINE PITCH		1.05 V	70 Cel			0 Cel	TIN SILVER COPPER		BOTTOM			1.5 mm			17 mm			YES		16		30	260	MULTIPLE	17 mm			CMOS			1.1 V						.8 mm	FIXED POINT	S-PBGA-B400	3		YES	YES	e1
ADSP-21573KBCZ-5	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.2 V			16			GRID ARRAY, LOW PROFILE, FINE PITCH		1.1 V	70 Cel			0 Cel			BOTTOM			1.5 mm			17 mm			YES		16		30	260	MULTIPLE	17 mm			CMOS			1.15 V						.8 mm	FIXED POINT	S-PBGA-B400	3		YES	YES
ADSP-SC570BSWZ-42	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	GULL WING	176	HLFQFP	SQUARE	PLASTIC/EPOXY		YES	1.15 V						FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH		1.05 V	85 Cel			-40 Cel	MATTE TIN		QUAD			1.6 mm			24 mm			YES				30	260	MULTIPLE	24 mm			CMOS			1.1 V						.5 mm	FIXED POINT	S-PQFP-G176	3		YES	YES	e3
ADSP-SC570BSWZ-4	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	GULL WING	176	HLFQFP	SQUARE	PLASTIC/EPOXY		YES	1.15 V						FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH		1.05 V	85 Cel			-40 Cel	MATTE TIN		QUAD			1.6 mm			24 mm			YES				30	260	MULTIPLE	24 mm			CMOS			1.1 V						.5 mm	FIXED POINT	S-PQFP-G176	3		YES	YES	e3
ADSP-SC570CSWZ-42	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	GULL WING	176	HLFQFP	SQUARE	PLASTIC/EPOXY		YES	1.15 V						FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH		1.05 V	105 Cel			-40 Cel	MATTE TIN		QUAD			1.6 mm			24 mm			YES				30	260	MULTIPLE	24 mm			CMOS			1.1 V						.5 mm	FIXED POINT	S-PQFP-G176	3		YES	YES	e3
ADSP-SC570CSWZ-4	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	GULL WING	176	HLFQFP	SQUARE	PLASTIC/EPOXY		YES	1.15 V						FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH		1.05 V	105 Cel			-40 Cel	MATTE TIN		QUAD			1.6 mm			24 mm			YES				30	260	MULTIPLE	24 mm			CMOS			1.1 V						.5 mm	FIXED POINT	S-PQFP-G176	3		YES	YES	e3
ADSP-SC570KSWZ-42	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	GULL WING	176	HLFQFP	SQUARE	PLASTIC/EPOXY		YES	1.15 V						FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH		1.05 V	70 Cel			0 Cel	MATTE TIN		QUAD			1.6 mm			24 mm			YES				30	260	MULTIPLE	24 mm			CMOS			1.1 V						.5 mm	FIXED POINT	S-PQFP-G176	3		YES	YES	e3
ADSP-SC570KSWZ-4	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	GULL WING	176	HLFQFP	SQUARE	PLASTIC/EPOXY		YES	1.15 V						FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH		1.05 V	70 Cel			0 Cel	MATTE TIN		QUAD			1.6 mm			24 mm			YES				30	260	MULTIPLE	24 mm			CMOS			1.1 V						.5 mm	FIXED POINT	S-PQFP-G176	3		YES	YES	e3
ADSP-SC571BSWZ-3	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	GULL WING	176	HLFQFP	SQUARE	PLASTIC/EPOXY		YES							FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH			85 Cel			-40 Cel	MATTE TIN		QUAD			1.6 mm			24 mm			YES				30	260	MULTIPLE	24 mm			CMOS									.5 mm	FIXED POINT	S-PQFP-G176	3		YES	YES	e3
ADSP-SC571BSWZ-4	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	GULL WING	176	HLFQFP	SQUARE	PLASTIC/EPOXY		YES	1.15 V						FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH		1.05 V	85 Cel			-40 Cel	MATTE TIN		QUAD			1.6 mm			24 mm			YES				30	260	MULTIPLE	24 mm			CMOS			1.1 V						.5 mm	FIXED POINT	S-PQFP-G176	3		YES	YES	e3
ADSP-SC571BSWZ-5	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	GULL WING	176	HLFQFP	SQUARE	PLASTIC/EPOXY		YES	1.2 V						FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH		1.1 V	85 Cel			-40 Cel	MATTE TIN		QUAD			1.6 mm			24 mm			YES				30	260	MULTIPLE	24 mm			CMOS			1.15 V						.5 mm	FIXED POINT	S-PQFP-G176	3		YES	YES	e3
ADSP-SC571CSWZ-3	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	GULL WING	176	HLFQFP	SQUARE	PLASTIC/EPOXY		YES							FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH			105 Cel			-40 Cel	MATTE TIN		QUAD			1.6 mm			24 mm			YES				30	260	MULTIPLE	24 mm			CMOS									.5 mm	FIXED POINT	S-PQFP-G176	3		YES	YES	e3

Digital Signal Processors (DSPs)

Digital Signal Processors (DSPs) are specialized microprocessors that are designed to perform mathematical operations on digital signals. They are used in a variety of applications that require real-time signal processing, such as audio and video processing, telecommunications, and image processing. DSPs are capable of performing complex mathematical operations, such as filtering, convolution, and correlation, on digital signals at high speeds, making them an essential component of modern signal processing systems.

DSPs are optimized for digital signal processing tasks and are designed to handle large amounts of data at high speeds. They typically have a specialized architecture that includes dedicated hardware for performing mathematical operations on digital signals, as well as specialized memory and I/O interfaces that are optimized for signal processing applications.

DSPs are used in a wide range of applications, including audio and video compression, speech recognition, image and video processing, and radar and sonar systems. They are also used in telecommunications systems, such as cell phones and modems, to process signals in real time. DSPs are also used in scientific and engineering applications, such as biomedical research and industrial automation.