SQUARE Digital Signal Processors (DSPs) 2,107

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	On Chip Data RAM Width	Screening Level	DAC Channels	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	No. of External Interrupts	Minimum Operating Temperature	Terminal Finish	ADC Channels	Terminal Position	DMA Channels	Maximum Seated Height	ROM Words	RAM Words	Width	Data EEPROM Size	Additional Features	Boundary Scan	Peripherals	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Internal Bus Architecture	Length	No. of Timers	RAM Bytes	Technology	Analog To Digital Convertors	Maximum Supply Current	Nominal Supply Voltage	No. of DMA Channels	PWM Channels	No. of Serial I/Os	Sub-Category	Connectivity	ROM Programmability	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	Low Power Mode	Barrel Shifter	JESD-609 Code	On Chip Program ROM Width	No. of I/O Lines
DSPIC33CK512MP605-E/M7	Microchip Technology	DIGITAL SIGNAL PROCESSOR, CONTROLLER		NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	NO	YES	3.6 V	8	AEC-Q100; ISO 26262		16		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.24SQ,16	3 V	125 Cel	4	-40 Cel			QUAD		.9 mm		65536	6 mm			YES		64 MHz			MULTIPLE	6 mm	1		CMOS		42.5 mA	3.3 V	8		3			FLASH	.4 mm	FIXED POINT	S-PQCC-N48				YES	YES		8
DSPIC33CK512MP605-I/M7	Microchip Technology	DIGITAL SIGNAL PROCESSOR, CONTROLLER		NO LEAD	48	HVQCCN	SQUARE	PLASTIC/EPOXY	NO	YES	3.6 V	8			16		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.24SQ,16	3 V	85 Cel	4	-40 Cel			QUAD		.9 mm		65536	6 mm			YES		64 MHz			MULTIPLE	6 mm	1		CMOS		35 mA	3.3 V	8		3			FLASH	.4 mm	FIXED POINT	S-PQCC-N48				YES	YES		8
ADSP-BF700BCPZ-2	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	NO LEAD	88	HVQCCN	SQUARE	UNSPECIFIED		YES	1.9 V						CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.7 V	85 Cel		-40 Cel	MATTE TIN		QUAD		.9 mm			12 mm		IT ALSO OPERATES AT 3.3V NOM SUPPLY	YES		200 MHz		260	MULTIPLE	12 mm			CMOS			1.8 V							.5 mm	FIXED POINT	S-XQCC-N88	3			YES	YES	e3
ADSP-BF700KCPZ-1	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	NO LEAD	88	HVQCCN	SQUARE	UNSPECIFIED		YES	1.9 V						CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.7 V	70 Cel		0 Cel	MATTE TIN		QUAD		.9 mm			12 mm		IT ALSO OPERATES AT 3.3V NOM SUPPLY	YES		100 MHz		260	MULTIPLE	12 mm			CMOS			1.8 V							.5 mm	FIXED POINT	S-XQCC-N88	3			YES	YES	e3
ADSP-BF700KCPZ-2	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	NO LEAD	88	HVQCCN	SQUARE	UNSPECIFIED		YES	1.9 V						CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.7 V	70 Cel		0 Cel	MATTE TIN		QUAD		.9 mm			12 mm		IT ALSO OPERATES AT 3.3V NOM SUPPLY	YES		200 MHz		260	MULTIPLE	12 mm			CMOS			1.8 V							.5 mm	FIXED POINT	S-XQCC-N88	3			YES	YES	e3
ADSP-BF701BBCZ-2	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	184	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.9 V						GRID ARRAY, LOW PROFILE, FINE PITCH		1.7 V	85 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM		1.7 mm			12 mm		IT ALSO OPERATES AT 3.3V NOM SUPPLY	YES		200 MHz		260	MULTIPLE	12 mm			CMOS			1.8 V							.8 mm	FIXED POINT	S-PBGA-B184	3			YES	YES	e1
ADSP-BF701KBCZ-1	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	184	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.9 V						GRID ARRAY, LOW PROFILE, FINE PITCH		1.7 V	70 Cel		0 Cel	TIN SILVER COPPER		BOTTOM		1.7 mm			12 mm		IT ALSO OPERATES AT 3.3V NOM SUPPLY	YES		100 MHz		260	MULTIPLE	12 mm			CMOS			1.8 V							.8 mm	FIXED POINT	S-PBGA-B184	3			YES	YES	e1
ADSP-BF701KBCZ-2	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	184	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.9 V						GRID ARRAY, LOW PROFILE, FINE PITCH		1.7 V	70 Cel		0 Cel	TIN SILVER COPPER		BOTTOM		1.7 mm			12 mm		IT ALSO OPERATES AT 3.3V NOM SUPPLY	YES		200 MHz		260	MULTIPLE	12 mm			CMOS			1.8 V							.8 mm	FIXED POINT	S-PBGA-B184	3			YES	YES	e1
ADSP-BF702BCPZ-3	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	NO LEAD	88	HVQCCN	SQUARE	UNSPECIFIED		YES	1.9 V						CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.7 V	85 Cel		-40 Cel	MATTE TIN		QUAD		.9 mm			12 mm		IT ALSO OPERATES AT 3.3V NOM SUPPLY	YES		300 MHz		260	MULTIPLE	12 mm			CMOS			1.8 V							.5 mm	FIXED POINT	S-XQCC-N88	3			YES	YES	e3
ADSP-BF702BCPZ-4	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	NO LEAD	88	HVQCCN	SQUARE	UNSPECIFIED		YES	1.9 V						CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.7 V	85 Cel		-40 Cel	MATTE TIN		QUAD		.9 mm			12 mm		IT ALSO OPERATES AT 3.3V NOM SUPPLY	YES		400 MHz		260	MULTIPLE	12 mm			CMOS			1.8 V							.5 mm	FIXED POINT	S-XQCC-N88	3			YES	YES	e3
ADSP-BF702KCPZ-3	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	NO LEAD	88	HVQCCN	SQUARE	UNSPECIFIED		YES	1.9 V						CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.7 V	70 Cel		0 Cel	MATTE TIN		QUAD		.9 mm			12 mm		IT ALSO OPERATES AT 3.3V NOM SUPPLY	YES		300 MHz		260	MULTIPLE	12 mm			CMOS			1.8 V							.5 mm	FIXED POINT	S-XQCC-N88	3			YES	YES	e3
ADSP-BF702KCPZ-4	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	NO LEAD	88	HVQCCN	SQUARE	UNSPECIFIED		YES	1.9 V						CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.7 V	70 Cel		0 Cel	MATTE TIN		QUAD		.9 mm			12 mm		IT ALSO OPERATES AT 3.3V NOM SUPPLY	YES		400 MHz		260	MULTIPLE	12 mm			CMOS			1.8 V							.5 mm	FIXED POINT	S-XQCC-N88	3			YES	YES	e3
ADSP-BF703BBCZ-3	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	184	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.9 V						GRID ARRAY, LOW PROFILE, FINE PITCH		1.7 V	85 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM		1.7 mm			12 mm		IT ALSO OPERATES AT 3.3V NOM SUPPLY	YES		300 MHz		260	MULTIPLE	12 mm			CMOS			1.8 V							.8 mm	FIXED POINT	S-PBGA-B184	3			YES	YES	e1
ADSP-BF703BBCZ-4	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	184	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.9 V						GRID ARRAY, LOW PROFILE, FINE PITCH		1.7 V	85 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM		1.7 mm			12 mm		IT ALSO OPERATES AT 3.3V NOM SUPPLY	YES		400 MHz		260	MULTIPLE	12 mm			CMOS			1.8 V							.8 mm	FIXED POINT	S-PBGA-B184	3			YES	YES	e1
ADSP-BF703KBCZ-3	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	184	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.9 V						GRID ARRAY, LOW PROFILE, FINE PITCH		1.7 V	70 Cel		0 Cel	TIN SILVER COPPER		BOTTOM		1.7 mm			12 mm		IT ALSO OPERATES AT 3.3V NOM SUPPLY	YES		300 MHz		260	MULTIPLE	12 mm			CMOS			1.8 V							.8 mm	FIXED POINT	S-PBGA-B184	3			YES	YES	e1
ADSP-BF703KBCZ-4	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	184	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.9 V						GRID ARRAY, LOW PROFILE, FINE PITCH		1.7 V	70 Cel		0 Cel	TIN SILVER COPPER		BOTTOM		1.7 mm			12 mm		IT ALSO OPERATES AT 3.3V NOM SUPPLY	YES		400 MHz		260	MULTIPLE	12 mm			CMOS			1.8 V							.8 mm	FIXED POINT	S-PBGA-B184	3			YES	YES	e1
ADSP-BF704BCPZ-3	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	NO LEAD	88	HVQCCN	SQUARE	UNSPECIFIED		YES	1.9 V						CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.7 V	85 Cel		-40 Cel	MATTE TIN		QUAD		.9 mm			12 mm		IT ALSO OPERATES AT 3.3V NOM SUPPLY	YES		300 MHz		260	MULTIPLE	12 mm			CMOS			1.8 V							.5 mm	FIXED POINT	S-XQCC-N88	3			YES	YES	e3
ADSP-BF704BCPZ-4	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	NO LEAD	88	HVQCCN	SQUARE	UNSPECIFIED		YES	1.9 V						CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.7 V	85 Cel		-40 Cel	MATTE TIN		QUAD		.9 mm			12 mm		IT ALSO OPERATES AT 3.3V NOM SUPPLY	YES		400 MHz		260	MULTIPLE	12 mm			CMOS			1.8 V							.5 mm	FIXED POINT	S-XQCC-N88	3			YES	YES	e3
ADSP-BF704KCPZ-3	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	NO LEAD	88	HVQCCN	SQUARE	UNSPECIFIED		YES	1.9 V						CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.7 V	70 Cel		0 Cel	MATTE TIN		QUAD		.9 mm			12 mm		IT ALSO OPERATES AT 3.3V NOM SUPPLY	YES		300 MHz		260	MULTIPLE	12 mm			CMOS			1.8 V							.5 mm	FIXED POINT	S-XQCC-N88	3			YES	YES	e3
ADSP-BF704KCPZ-4	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	NO LEAD	88	HVQCCN	SQUARE	UNSPECIFIED		YES	1.9 V						CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.7 V	70 Cel		0 Cel	MATTE TIN		QUAD		.9 mm			12 mm		IT ALSO OPERATES AT 3.3V NOM SUPPLY	YES		400 MHz		260	MULTIPLE	12 mm			CMOS			1.8 V							.5 mm	FIXED POINT	S-XQCC-N88	3			YES	YES	e3
ADSP-BF705BBCZ-3	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	184	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.9 V						GRID ARRAY, LOW PROFILE, FINE PITCH		1.7 V	85 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM		1.7 mm			12 mm		IT ALSO OPERATES AT 3.3V NOM SUPPLY	YES		300 MHz		260	MULTIPLE	12 mm			CMOS			1.8 V							.8 mm	FIXED POINT	S-PBGA-B184	3			YES	YES	e1
ADSP-BF705BBCZ-4	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	184	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.9 V						GRID ARRAY, LOW PROFILE, FINE PITCH		1.7 V	85 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM		1.7 mm			12 mm		IT ALSO OPERATES AT 3.3V NOM SUPPLY	YES		400 MHz		260	MULTIPLE	12 mm			CMOS			1.8 V							.8 mm	FIXED POINT	S-PBGA-B184	3			YES	YES	e1
ADSP-BF705KBCZ-3	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	184	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.9 V						GRID ARRAY, LOW PROFILE, FINE PITCH		1.7 V	70 Cel		0 Cel	TIN SILVER COPPER		BOTTOM		1.7 mm			12 mm		IT ALSO OPERATES AT 3.3V NOM SUPPLY	YES		300 MHz		260	MULTIPLE	12 mm			CMOS			1.8 V							.8 mm	FIXED POINT	S-PBGA-B184	3			YES	YES	e1
ADSP-BF705KBCZ-4	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	184	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.9 V						GRID ARRAY, LOW PROFILE, FINE PITCH		1.7 V	70 Cel		0 Cel	TIN SILVER COPPER		BOTTOM		1.7 mm			12 mm		IT ALSO OPERATES AT 3.3V NOM SUPPLY	YES		400 MHz		260	MULTIPLE	12 mm			CMOS			1.8 V							.8 mm	FIXED POINT	S-PBGA-B184	3			YES	YES	e1
ADSP-BF706BCPZ-3	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	NO LEAD	88	HVQCCN	SQUARE	UNSPECIFIED		YES	1.9 V						CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.7 V	85 Cel		-40 Cel	MATTE TIN		QUAD		.9 mm			12 mm		IT ALSO OPERATES AT 3.3V NOM SUPPLY	YES		300 MHz		260	MULTIPLE	12 mm			CMOS			1.8 V							.5 mm	FIXED POINT	S-XQCC-N88	3			YES	YES	e3
ADSP-BF706KCPZ-3	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	NO LEAD	88	HVQCCN	SQUARE	UNSPECIFIED		YES	1.9 V						CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.7 V	70 Cel		0 Cel	MATTE TIN		QUAD		.9 mm			12 mm		IT ALSO OPERATES AT 3.3V NOM SUPPLY	YES		300 MHz		260	MULTIPLE	12 mm			CMOS			1.8 V							.5 mm	FIXED POINT	S-XQCC-N88	3			YES	YES	e3
ADSP-BF706KCPZ-4	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	NO LEAD	88	HVQCCN	SQUARE	UNSPECIFIED		YES	1.9 V						CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		1.7 V	70 Cel		0 Cel	MATTE TIN		QUAD		.9 mm			12 mm		IT ALSO OPERATES AT 3.3V NOM SUPPLY	YES		400 MHz		260	MULTIPLE	12 mm			CMOS			1.8 V							.5 mm	FIXED POINT	S-XQCC-N88	3			YES	YES	e3
ADSP-BF707BBCZ-3	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	184	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.155 V						GRID ARRAY, LOW PROFILE, FINE PITCH		1.045 V	85 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM		1.7 mm			12 mm			YES		200 MHz	30	260	MULTIPLE	12 mm			CMOS			1.1 V							.8 mm	FIXED POINT	S-PBGA-B184	3			YES	YES	e1
ADSP-BF707BBCZ-4	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	INDUSTRIAL	BALL	184	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.9 V						GRID ARRAY, LOW PROFILE, FINE PITCH		1.7 V	85 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM		1.7 mm			12 mm		IT ALSO OPERATES AT 3.3V NOM SUPPLY	YES		400 MHz		260	MULTIPLE	12 mm			CMOS			1.8 V							.8 mm	FIXED POINT	S-PBGA-B184	3			YES	YES	e1
ADSP-BF707KBCZ-4	Analog Devices	DIGITAL SIGNAL PROCESSOR, OTHER	COMMERCIAL	BALL	184	LFBGA	SQUARE	PLASTIC/EPOXY		YES	1.9 V						GRID ARRAY, LOW PROFILE, FINE PITCH		1.7 V	70 Cel		0 Cel	TIN SILVER COPPER		BOTTOM		1.7 mm			12 mm		IT ALSO OPERATES AT 3.3V NOM SUPPLY	YES		400 MHz		260	MULTIPLE	12 mm			CMOS			1.8 V							.8 mm	FIXED POINT	S-PBGA-B184	3			YES	YES	e1
DSPIC33EP16GS202-E/MM	Microchip Technology	DIGITAL SIGNAL PROCESSOR, CONTROLLER	AUTOMOTIVE	NO LEAD	28	HVQCCN	SQUARE	PLASTIC/EPOXY		YES	3.6 V		TS 16949		16		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC28,.24SQ,25	3 V	125 Cel		-40 Cel	MATTE TIN		QUAD		1 mm			6 mm		OPERATES UPTO 60MIPS; AEC-Q100 (PLANNED)			60 MHz	40	260		6 mm			CMOS			3.3 V						FLASH	.65 mm		S-PQCC-N28	1					e3	8
DSPIC33EP16GS202-I/MM	Microchip Technology	DIGITAL SIGNAL PROCESSOR, CONTROLLER	INDUSTRIAL	NO LEAD	28	HVQCCN	SQUARE	PLASTIC/EPOXY		YES	3.6 V		TS 16949		16		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC28,.24SQ,25	3 V	85 Cel		-40 Cel	MATTE TIN		QUAD		1 mm			6 mm		OPERATES UPTO 70MIPS			60 MHz	40	260		6 mm			CMOS			3.3 V						FLASH	.65 mm		S-PQCC-N28	1					e3	8
DSPIC33EP16GS506-I/PT	Microchip Technology	DIGITAL SIGNAL PROCESSOR, CONTROLLER	INDUSTRIAL	GULL WING	64	TFQFP	SQUARE	PLASTIC/EPOXY	NO	YES	3.6 V	8	TS 16949	NO	16		FLATPACK, THIN PROFILE, FINE PITCH	TQFP64,.47SQ	3 V	85 Cel	4	-40 Cel	MATTE TIN	YES	QUAD	NO	1.2 mm	16384	2048	10 mm	0		YES	BOR, COMPARATOR(4), POR, PWM(10), TIMER(5), WDT	60 MHz	40	260	MULTIPLE	10 mm	7	2048	CMOS	22-Ch 12-Bit; 5-Ch 12-Bit	82 mA	3.3 V		YES	2		I2C(2), IRDA, LIN, SMBUS, SPI(2), UART(2)	FLASH	.5 mm	FIXED POINT	S-PQFP-G64	3			YES	YES	e3	24	53
DSPIC33EP32GS202-I/MM	Microchip Technology	DIGITAL SIGNAL PROCESSOR, CONTROLLER	INDUSTRIAL	NO LEAD	28	HVQCCN	SQUARE	PLASTIC/EPOXY		YES	3.6 V		TS 16949		16		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC28,.24SQ,25	3 V	85 Cel		-40 Cel	MATTE TIN		QUAD		1 mm			6 mm		OPERATES UPTO 70MIPS			60 MHz	40	260		6 mm			CMOS			3.3 V						FLASH	.65 mm		S-PQCC-N28	1					e3	8
DSPIC33EP32GS502-I/MM	Microchip Technology	DIGITAL SIGNAL PROCESSOR, CONTROLLER	INDUSTRIAL	NO LEAD	28	HVQCCN	SQUARE	PLASTIC/EPOXY		YES	3.6 V		TS 16949		16		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC28,.24SQ,25	3 V	85 Cel		-40 Cel	MATTE TIN		QUAD		1 mm			6 mm					60 MHz	40	260		6 mm			CMOS			3.3 V						FLASH	.65 mm		S-PQCC-N28	1					e3	8
DSPIC33EP32GS504-E/ML	Microchip Technology	DIGITAL SIGNAL PROCESSOR, CONTROLLER	AUTOMOTIVE	NO LEAD	44	HVQCCN	SQUARE	PLASTIC/EPOXY		YES	3.6 V		AEC-Q100; TS 16949		16		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC44,.31SQ,25	3 V	125 Cel		-40 Cel	MATTE TIN		QUAD		1 mm			8 mm					60 MHz	40	260		8 mm			CMOS			3.3 V						FLASH	.65 mm		S-PQCC-N44	1					e3	8
DSPIC33EP32GS504-I/PT	Microchip Technology	DIGITAL SIGNAL PROCESSOR, CONTROLLER	INDUSTRIAL	GULL WING	44	TFQFP	SQUARE	PLASTIC/EPOXY	NO	YES	3.6 V	8	TS 16949	NO	16		FLATPACK, THIN PROFILE, FINE PITCH	TQFP44,.47SQ,32	3 V	85 Cel	4	-40 Cel	MATTE TIN	YES	QUAD	NO	1.2 mm	32768	4096	10 mm	0		YES	BOR, COMPARATOR(4), POR, PWM(10), TIMER(5), WDT	60 MHz	40	260	MULTIPLE	10 mm	7	4096	CMOS	19-Ch 12-Bit; 5-Ch 12-Bit	82 mA	3.3 V		YES	2		I2C(2), IRDA, LIN, SMBUS, SPI(2), UART(2)	FLASH	.8 mm	FIXED POINT	S-PQFP-G44	3			YES	YES	e3	24	35
DSPIC33EP32GS506-E/PT	Microchip Technology	DIGITAL SIGNAL PROCESSOR, CONTROLLER	AUTOMOTIVE	GULL WING	64	TFQFP	SQUARE	PLASTIC/EPOXY		YES	3.6 V		AEC-Q100; TS 16949		16		FLATPACK, THIN PROFILE, FINE PITCH	TQFP64,.47SQ	3 V	125 Cel		-40 Cel	MATTE TIN		QUAD		1.2 mm			10 mm					60 MHz	40	260		10 mm			CMOS			3.3 V						FLASH	.5 mm		S-PQFP-G64	3					e3	8
DSPIC33EP32GS506-I/PT	Microchip Technology	DIGITAL SIGNAL PROCESSOR, CONTROLLER	INDUSTRIAL	GULL WING	64	TFQFP	SQUARE	PLASTIC/EPOXY	NO	YES	3.6 V	8	TS 16949	NO	16		FLATPACK, THIN PROFILE, FINE PITCH	TQFP64,.47SQ	3 V	85 Cel	4	-40 Cel	MATTE TIN	YES	QUAD	NO	1.2 mm	32768	4096	10 mm	0		YES	BOR, COMPARATOR(4), POR, PWM(10), TIMER(5), WDT	60 MHz	40	260	MULTIPLE	10 mm	7	4096	CMOS	22-Ch 12-Bit; 5-Ch 12-Bit	82 mA	3.3 V		YES	2		I2C(2), IRDA, LIN, SMBUS, SPI(2), UART(2)	FLASH	.5 mm	FIXED POINT	S-PQFP-G64	3			YES	YES	e3	24	53
DSPIC33EP64GS502-I/MM	Microchip Technology	DIGITAL SIGNAL PROCESSOR, CONTROLLER	INDUSTRIAL	NO LEAD	28	HVQCCN	SQUARE	PLASTIC/EPOXY		YES	3.6 V		TS 16949		16		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC28,.24SQ,25	3 V	85 Cel		-40 Cel	MATTE TIN		QUAD		1 mm			6 mm					60 MHz	40	260		6 mm			CMOS			3.3 V						FLASH	.65 mm		S-PQCC-N28	1					e3	8
DSPIC33EP64GS504-I/ML	Microchip Technology	DIGITAL SIGNAL PROCESSOR, CONTROLLER	INDUSTRIAL	NO LEAD	44	HVQCCN	SQUARE	PLASTIC/EPOXY		YES	3.6 V		TS 16949		16		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC44,.31SQ,25	3 V	85 Cel		-40 Cel	MATTE TIN		QUAD		1 mm			8 mm					60 MHz	40	260		8 mm			CMOS			3.3 V						FLASH	.65 mm		S-PQCC-N44	1					e3	8
DSPIC33EP64GS506-E/PT	Microchip Technology	DIGITAL SIGNAL PROCESSOR, CONTROLLER	AUTOMOTIVE	GULL WING	64	TFQFP	SQUARE	PLASTIC/EPOXY		YES	3.6 V		AEC-Q100; TS 16949		16		FLATPACK, THIN PROFILE, FINE PITCH	TQFP64,.47SQ	3 V	125 Cel		-40 Cel	MATTE TIN		QUAD		1.2 mm			10 mm					60 MHz	40	260		10 mm			CMOS			3.3 V						FLASH	.5 mm		S-PQFP-G64	3					e3	8
DSPIC33EV128GM004-E/PT	Microchip Technology	DIGITAL SIGNAL PROCESSOR, CONTROLLER	AUTOMOTIVE	GULL WING	44	TQFP	SQUARE	PLASTIC/EPOXY	NO	YES	5.5 V	8	AEC-Q100; TS 16949	NO	16	5	FLATPACK, THIN PROFILE	TQFP44,.47SQ,32	4.5 V	125 Cel	3	-40 Cel	MATTE TIN	YES	QUAD	YES	1.2 mm	131072	8192	10 mm	0		NO	BOR, COMPARATOR(5), DMA(4), POR, PWM(6), TIMER(7), WDT	40 MHz			MULTIPLE	10 mm	7	8192	CMOS	24-Ch 12-Bit	350 mA	5 V	4	YES		Digital Signal Processors	I2C, IRDA, LIN, SENT(2), SMBUS, SPI(2), UART(2)	FLASH	.8 mm	FIXED POINT	S-PQFP-G44		Not Qualified	40 rpm	YES	YES	e3	8	35
DSPIC33EV128GM004-I/PT	Microchip Technology	DIGITAL SIGNAL PROCESSOR, CONTROLLER	INDUSTRIAL	GULL WING	44	TQFP	SQUARE	PLASTIC/EPOXY	NO	YES	5.5 V	8	TS 16949	NO	16	5	FLATPACK, THIN PROFILE	TQFP44,.47SQ,32	4.5 V	85 Cel	4	-40 Cel	MATTE TIN	YES	QUAD	YES	1.2 mm	131072	16384	10 mm	0		NO	BOR, COMPARATOR(5), DMA(4), POR, PWM(6), TIMER(7), WDT	40 MHz			MULTIPLE	10 mm	7	8192	CMOS	24-Ch 12-Bit	60 mA	5 V	4	YES		Digital Signal Processors	I2C, IRDA, LIN, SENT(2), SMBUS, SPI(2), UART(2)	FLASH	.8 mm	FIXED POINT	S-PQFP-G44		Not Qualified	70 rpm	YES	YES	e3	8	35
DSPIC33EV128GM004T-I/PT	Microchip Technology	DIGITAL SIGNAL PROCESSOR, CONTROLLER	INDUSTRIAL	GULL WING	44	TQFP	SQUARE	PLASTIC/EPOXY	NO	YES	5.5 V	8	TS 16949	NO	16	5	FLATPACK, THIN PROFILE	TQFP44,.47SQ,32	4.5 V	85 Cel	3	-40 Cel	MATTE TIN	YES	QUAD	YES	1.2 mm	131072	8192	10 mm	0		NO	BOR, COMPARATOR(5), DMA(4), POR, PWM(6), TIMER(7), WDT	40 MHz			MULTIPLE	10 mm	7	8192	CMOS	24-Ch 12-Bit	350 mA	5 V	4	YES		Digital Signal Processors	I2C, IRDA, LIN, SENT(2), SMBUS, SPI(2), UART(2)	FLASH	.8 mm	FIXED POINT	S-PQFP-G44		Not Qualified	40 rpm	YES	YES	e3	8	35
DSPIC33EV128GM006-I/MR	Microchip Technology	DIGITAL SIGNAL PROCESSOR, CONTROLLER	INDUSTRIAL	NO LEAD	64	HVQCCN	SQUARE	PLASTIC/EPOXY	NO	YES	5.5 V	8	TS 16949	NO	16	5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC64,.35SQ,20	4.5 V	85 Cel	3	-40 Cel	MATTE TIN	YES	QUAD	YES	1 mm	131072	8192	9 mm	0		NO	BOR, COMPARATOR(5), DMA(4), POR, PWM(6), TIMER(7), WDT	40 MHz	40	260	MULTIPLE	9 mm	7	8192	CMOS	36-Ch 12-Bit	350 mA	5 V	4	YES		Digital Signal Processors	I2C, IRDA, LIN, SENT(2), SMBUS, SPI(2), UART(2)	FLASH	.5 mm	FIXED POINT	S-PQCC-N64	3	Not Qualified	40 rpm	YES	YES	e3	8	53
DSPIC33EV128GM104-I/ML	Microchip Technology	DIGITAL SIGNAL PROCESSOR, CONTROLLER	INDUSTRIAL	NO LEAD	44	HVQCCN	SQUARE	PLASTIC/EPOXY	NO	YES	5.5 V	8	TS 16949	NO	16	5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC44,.32SQ,25	4.5 V	85 Cel	3	-40 Cel	MATTE TIN	YES	QUAD	YES	1 mm	131072	8192	8 mm	0		NO	BOR, COMPARATOR(5), DMA(4), POR, PWM(6), TIMER(7), WDT	40 MHz			MULTIPLE	8 mm	7	8192	CMOS	24-Ch 12-Bit	350 mA	5 V	4	YES		Digital Signal Processors	CAN, I2C, IRDA, LIN, SENT(2), SMBUS, SPI(2), UART(2)	FLASH	.65 mm	FIXED POINT	S-PQCC-N44		Not Qualified	40 rpm	YES	YES	e3	8	35
DSPIC33EV128GM106T-I/MR	Microchip Technology	DIGITAL SIGNAL PROCESSOR, CONTROLLER	INDUSTRIAL	NO LEAD	64	HVQCCN	SQUARE	PLASTIC/EPOXY	NO	YES	5.5 V	8	TS 16949	NO	16	5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC64,.35SQ,20	4.5 V	85 Cel	3	-40 Cel	MATTE TIN	YES	QUAD	YES	1 mm	131072	8192	9 mm	0		NO	BOR, COMPARATOR(5), DMA(4), POR, PWM(6), TIMER(7), WDT	40 MHz	40	260	MULTIPLE	9 mm	7	8192	CMOS	36-Ch 12-Bit	350 mA	5 V	4	YES		Digital Signal Processors	CAN, I2C, IRDA, LIN, SENT(2), SMBUS, SPI(2), UART(2)	FLASH	.5 mm	FIXED POINT	S-PQCC-N64	3	Not Qualified	40 rpm	YES	YES	e3	8	53

Digital Signal Processors (DSPs)

Digital Signal Processors (DSPs) are specialized microprocessors that are designed to perform mathematical operations on digital signals. They are used in a variety of applications that require real-time signal processing, such as audio and video processing, telecommunications, and image processing. DSPs are capable of performing complex mathematical operations, such as filtering, convolution, and correlation, on digital signals at high speeds, making them an essential component of modern signal processing systems.

DSPs are optimized for digital signal processing tasks and are designed to handle large amounts of data at high speeds. They typically have a specialized architecture that includes dedicated hardware for performing mathematical operations on digital signals, as well as specialized memory and I/O interfaces that are optimized for signal processing applications.

DSPs are used in a wide range of applications, including audio and video compression, speech recognition, image and video processing, and radar and sonar systems. They are also used in telecommunications systems, such as cell phones and modems, to process signals in real time. DSPs are also used in scientific and engineering applications, such as biomedical research and industrial automation.