FBGA Microprocessors 218

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	On Chip Data RAM Width	Address Bus Width	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	RAM Words	Width	Additional Features	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Nominal Supply Voltage	No. of DMA Channels	Sub-Category	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	Low Power Mode	JESD-609 Code
AM5K2E04XABDA4	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	1089	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	8	16			GRID ARRAY, FINE PITCH		.95 V	100 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	3.55 mm	2097152	27 mm		YES	64		30	245	27 mm	CMOS	1 V	5		.8 mm	FLOATING POINT	S-PBGA-B1089	4		1400 rpm	YES	e1
66AK2E02ABDA4	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	1089	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		16			GRID ARRAY, FINE PITCH		.95 V	100 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	3.55 mm		27 mm		YES	16		30	245	27 mm	CMOS	1 V			.8 mm	FLOATING POINT	S-PBGA-B1089	4		1400 rpm	YES	e1
66AK2E05XABD25	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	1089	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	8	16			GRID ARRAY, FINE PITCH		.95 V	85 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	3.55 mm	2097152	27 mm		YES	16		30	245	27 mm	CMOS	1 V	5		.8 mm	FLOATING POINT	S-PBGA-B1089	4		1250 rpm	YES	e1
66AK2E05XABD4	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	1089	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	8	16			GRID ARRAY, FINE PITCH		.95 V	85 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	3.55 mm	2097152	27 mm		YES	16		30	245	27 mm	CMOS	1 V	5		.8 mm	FLOATING POINT	S-PBGA-B1089	4		1400 rpm	YES	e1
66AK2E05XABDA25	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	1089	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	8	16			GRID ARRAY, FINE PITCH		.95 V	100 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	3.55 mm	2097152	27 mm		YES	16		30	245	27 mm	CMOS	1 V	5		.8 mm	FLOATING POINT	S-PBGA-B1089	4		1250 rpm	YES	e1
66AK2E05XABDA4	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	1089	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	8	16			GRID ARRAY, FINE PITCH		.95 V	100 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	3.55 mm	2097152	27 mm		YES	16		30	245	27 mm	CMOS	1 V	5		.8 mm	FLOATING POINT	S-PBGA-B1089	4		1400 rpm	YES	e1
X66AK2E05XABD25	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	1089	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		16			GRID ARRAY, FINE PITCH		.95 V	85 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	3.55 mm		27 mm		YES	16		30	245	27 mm	CMOS	1 V			.8 mm	FLOATING POINT	S-PBGA-B1089	4		1250 rpm	YES	e1
TMS320DM8127BCYE0	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	684	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.16 V		28	32		GRID ARRAY, FINE PITCH		1.05 V	90 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	3.06 mm		23 mm		YES	16	30 MHz	30	250	23 mm	CMOS	1.1 V			.8 mm	FLOATING POINT	S-PBGA-B684	4		600 rpm	YES	e1
TMS320DM8127BCYE2	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	684	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.42 V		28	32		GRID ARRAY, FINE PITCH		1.28 V	90 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	3.06 mm		23 mm		YES	16	30 MHz	30	250	23 mm	CMOS	1.35 V			.8 mm	FLOATING POINT	S-PBGA-B684	4		1000 rpm	YES	e1
TMS320DM8127BCYE3	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	684	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.42 V		28	32		GRID ARRAY, FINE PITCH		1.28 V	90 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	3.06 mm		23 mm		YES	16	30 MHz	30	250	23 mm	CMOS	1.35 V			.8 mm	FLOATING POINT	S-PBGA-B684	4		1000 rpm	YES	e1
TMS320DM8127BCYED1	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	684	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V		28	32		GRID ARRAY, FINE PITCH		1.14 V	90 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	3.06 mm		23 mm		YES	16	30 MHz	30	250	23 mm	CMOS	1.2 V			.8 mm	FLOATING POINT	S-PBGA-B684	4		720 rpm	YES	e1
AM1707BZKB4	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	256	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V		16	32	1.3,1.8/3.3	GRID ARRAY, FINE PITCH	BGA256,16X16,40	1.14 V	90 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	2.05 mm		17 mm		YES	16	20 MHz	30	260	17 mm	CMOS	1.2 V		Microprocessors	.5 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	456 rpm	YES	e1
XAM3894CYG	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	1031	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		16	32		GRID ARRAY, FINE PITCH		.95 V	85 Cel	0 Cel		BOTTOM	3.31 mm		25 mm		YES	16	27 MHz			25 mm	CMOS	1 V			.65 mm	FLOATING POINT	S-PBGA-B1031		Not Qualified	1500 rpm	YES
TMS320C6474FGUN2	Texas Instruments	MICROPROCESSOR	OTHER	BALL	561	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.2 V		14	32	1.1,1.8	GRID ARRAY, FINE PITCH	BGA561,27X27,32	.9 V	95 Cel	0 Cel	TIN LEAD	BOTTOM	3.3 mm	8192	23 mm		YES	32	625 MHz	20	220	23 mm	CMOS	1.1 V		Digital Signal Processors	.8 mm	FLOATING POINT	S-PBGA-B561	4	Not Qualified	1200 rpm	YES	e0
TMS320C6474FGUNA	Texas Instruments	MICROPROCESSOR	INDUSTRIAL	BALL	561	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.2 V	8	14	32	1.1,1.8	GRID ARRAY, FINE PITCH	BGA561,27X27,32	.9 V	100 Cel	-40 Cel	TIN LEAD	BOTTOM	3.3 mm	8192	23 mm		YES	32	625 MHz	20	220	23 mm	CMOS	1.1 V	64	Digital Signal Processors	.8 mm	FLOATING POINT	S-PBGA-B561	4	Not Qualified	1000 rpm	YES	e0
TMS320C6474FGUN	Texas Instruments	MICROPROCESSOR	OTHER	BALL	561	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.2 V		14	32	1.1,1.8	GRID ARRAY, FINE PITCH	BGA561,27X27,32	.9 V	100 Cel	0 Cel	TIN LEAD	BOTTOM	3.3 mm	8192	23 mm		YES	32	625 MHz	20	220	23 mm	CMOS	1.1 V		Digital Signal Processors	.8 mm	FLOATING POINT	S-PBGA-B561	4	Not Qualified	1000 rpm	YES	e0
TMS320C6474FZUNA	Texas Instruments	MICROPROCESSOR		BALL	561	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.2 V		14	32	1.1,1.8	GRID ARRAY, FINE PITCH	BGA561,27X27,32	.9 V			TIN SILVER COPPER	BOTTOM	3.3 mm	8192	23 mm		YES	32	625 MHz	30	245	23 mm	CMOS	1.1 V		Digital Signal Processors	.8 mm	FLOATING POINT	S-PBGA-B561	4	Not Qualified	1000 rpm	YES	e1
AM1707DZKBT3	Texas Instruments	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	256	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V		13	32	1.2,1.8/3.3	GRID ARRAY, FINE PITCH	BGA256,16X16,40	1.14 V	125 Cel	-40 Cel		BOTTOM	2.05 mm		17 mm		YES	16	30 MHz	NOT SPECIFIED	NOT SPECIFIED	17 mm	CMOS	1.2 V		Microprocessors	.5 mm	FIXED POINT	S-PBGA-B256		Not Qualified	375 rpm	YES
AM1707BZKB3	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	256	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V		16	32	1.2,1.8/3.3	GRID ARRAY, FINE PITCH	BGA256,16X16,40	1.14 V	90 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	2.05 mm		17 mm		YES	16	20 MHz	30	260	17 mm	CMOS	1.2 V		Microprocessors	.5 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	375 rpm	YES	e1
AM5706BCBDDAS	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	538	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.2 V		16			GRID ARRAY, FINE PITCH		1.11 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM			17 mm	ALSO OPERATES AT 0.85 V TO 1.15 V AFTER AVS ENABLED	YES	32	38.4 MHz	30	260	17 mm	CMOS	1.15 V			.65 mm	FIXED POINT	S-PBGA-B538	3		500 rpm	YES	e1
AM5729BABCXA	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY	NO	YES	1.2 V		16			GRID ARRAY, FINE PITCH	BGA760,28X28,31	1.11 V	105 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	2.96 mm		23 mm	ALSO HAVING 16-BIT ADDRESS AND 32-BIT DATA BUS OF EMIF2	YES	32	32 MHz		250	23 mm	CMOS	1.15 V			.8 mm	FIXED POINT	S-PBGA-B760	3		1500 rpm	YES	e1
AM5729BABCXEAR	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY	NO	YES	1.2 V		16			GRID ARRAY, FINE PITCH	BGA760,28X28,31	1.11 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.96 mm		23 mm	ALSO HAVING 16-BIT ADDRESS AND 32-BIT DATA BUS OF EMIF2	YES	32	32 MHz	30	250	23 mm	CMOS	1.15 V			.8 mm	FIXED POINT	S-PBGA-B760	3		1500 rpm	YES	e1
AM5729BABCXEA	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY	NO	YES	1.2 V		16			GRID ARRAY, FINE PITCH	BGA760,28X28,31	1.11 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.96 mm		23 mm	ALSO HAVING 16-BIT ADDRESS AND 32-BIT DATA BUS OF EMIF2	YES	32	32 MHz	30	250	23 mm	CMOS	1.15 V			.8 mm	FIXED POINT	S-PBGA-B760	3		1500 rpm	YES	e1
AM5729BABCX	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY	NO	YES	1.2 V		16			GRID ARRAY, FINE PITCH	BGA760,28X28,31	1.11 V	90 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	2.96 mm		23 mm	ALSO HAVING 16-BIT ADDRESS AND 32-BIT DATA BUS OF EMIF2	YES	32	32 MHz	30	250	23 mm	CMOS	1.15 V			.8 mm	FIXED POINT	S-PBGA-B760	3		1500 rpm	YES	e1
TMS320DM8127BCYED3	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	684	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.42 V		28	32		GRID ARRAY, FINE PITCH		1.28 V	90 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	3.06 mm		23 mm		YES	16	30 MHz	30	250	23 mm	CMOS	1.35 V			.8 mm	FLOATING POINT	S-PBGA-B684	4		1000 rpm	YES	e1
TMS320DM8127SCYE0	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	684	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.16 V	8	28	32		GRID ARRAY, FINE PITCH		1.05 V	90 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	3.06 mm	851968	23 mm		YES	16	30 MHz	30	250	23 mm	CMOS	1.1 V	72		.8 mm	FLOATING POINT	S-PBGA-B684	4		1000 rpm	YES	e1
TMS320DM8127SCYE1	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	684	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	8	28	32		GRID ARRAY, FINE PITCH		1.14 V	90 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	3.06 mm	851968	23 mm		YES	16	30 MHz	30	250	23 mm	CMOS	1.2 V	72		.8 mm	FLOATING POINT	S-PBGA-B684	4		1000 rpm	YES	e1
TMS320DM8127SCYE2	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	684	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.42 V	8	28	32		GRID ARRAY, FINE PITCH		1.28 V	90 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	3.06 mm	851968	23 mm		YES	16	30 MHz	30	250	23 mm	CMOS	1.35 V	72		.8 mm	FLOATING POINT	S-PBGA-B684	4		1000 rpm	YES	e1
TMS320DM8127SCYE3	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	684	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.42 V	8	28	32		GRID ARRAY, FINE PITCH		1.28 V	90 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	3.06 mm	851968	23 mm		YES	16	30 MHz	30	250	23 mm	CMOS	1.35 V	72		.8 mm	FLOATING POINT	S-PBGA-B684	4		1000 rpm	YES	e1
TMS320DM8127SCYED0	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	684	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.16 V	8	28	32		GRID ARRAY, FINE PITCH		1.05 V	90 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	3.06 mm	851968	23 mm		YES	16	30 MHz	30	250	23 mm	CMOS	1.1 V	72		.8 mm	FLOATING POINT	S-PBGA-B684	4		1000 rpm	YES	e1
TMS320DM8127SCYED2	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	684	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.42 V	8	28	32		GRID ARRAY, FINE PITCH		1.28 V	90 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	3.06 mm	851968	23 mm		YES	16	30 MHz	30	250	23 mm	CMOS	1.35 V	72		.8 mm	FLOATING POINT	S-PBGA-B684	4		1000 rpm	YES	e1
TMS320DM8127SCYED3	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	684	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.42 V	8	28	32		GRID ARRAY, FINE PITCH		1.28 V	90 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	3.06 mm	851968	23 mm		YES	16	30 MHz	30	250	23 mm	CMOS	1.35 V	72		.8 mm	FLOATING POINT	S-PBGA-B684	4		1000 rpm	YES	e1
XAM5728AABCXE	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY	NO	YES	1.2 V		16			GRID ARRAY, FINE PITCH		1.11 V	90 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	2.55 mm		23 mm		YES	32	38.4 MHz	30	250	23 mm	CMOS	1.15 V			.8 mm	FLOATING POINT	S-PBGA-B760	3		1500 rpm	YES	e1
XAM5718ABCXE	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY	NO	YES	1.2 V		16			GRID ARRAY, FINE PITCH		1.11 V	90 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	2.96 mm		23 mm		YES	32	38.4 MHz	30	250	23 mm	CMOS	1.15 V			.8 mm	FLOATING POINT	S-PBGA-B760	3		1500 rpm	YES	e1
MCIMX6D6AVT10ADR	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES				32		GRID ARRAY, FINE PITCH			125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.16 mm		21 mm	64-BIT BUS WIDTH AVAILABLE	YES			40	260	21 mm	CMOS				.8 mm	FIXED POINT	S-PBGA-B624	3		1000 rpm	NO	e1
T2080NXE8TTB	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	896	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES				64		GRID ARRAY, FINE PITCH			105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.61 mm		25 mm		NO			30	250	25 mm	CMOS				.8 mm	FIXED POINT	S-PBGA-B896	3		1800 rpm	NO	e1
XAM5728BABCXE	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY	NO	YES	1.2 V		16			GRID ARRAY, FINE PITCH		1.11 V	90 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	2.55 mm		23 mm		YES	32	38.4 MHz	30	250	23 mm	CMOS	1.15 V			.8 mm	FLOATING POINT	S-PBGA-B760	3		1500 rpm	YES	e1
MCIMX6DP4AVT1AA	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.5 V		26	32		GRID ARRAY, FINE PITCH		1.35 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.16 mm		21 mm	24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE	YES	64		40	260	21 mm	CMOS				.8 mm	FLOATING POINT	S-PBGA-B624	3		1000 rpm	YES	e1
MCIMX6DP6AVT1AA	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.5 V		26	32		GRID ARRAY, FINE PITCH		1.35 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.16 mm		21 mm	24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE	YES	64		40	260	21 mm	CMOS				.8 mm	FLOATING POINT	S-PBGA-B624	3		1000 rpm	YES	e1
MCIMX6QP4AVT1AA	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.5 V		26	32		GRID ARRAY, FINE PITCH		1.35 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.16 mm		21 mm	24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE	YES	64		40	260	21 mm	CMOS				.8 mm	FLOATING POINT	S-PBGA-B624	3		1000 rpm	YES	e1
MCIMX6QP4AVT8AA	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.5 V		26	32		GRID ARRAY, FINE PITCH		1.225 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.16 mm		21 mm	24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE	YES	64		40	260	21 mm	CMOS	1.4 V			.8 mm	FLOATING POINT	S-PBGA-B624	3		852 rpm	YES	e1
MCIMX6QP6AVT1AA	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.5 V		26	32		GRID ARRAY, FINE PITCH		1.35 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.16 mm		21 mm	24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE	YES	64		40	260	21 mm	CMOS				.8 mm	FLOATING POINT	S-PBGA-B624	3		1000 rpm	YES	e1
AM5726BABCXAR	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY	NO	YES	1.2 V		16			GRID ARRAY, FINE PITCH	BGA760,28X28,31	1.11 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.55 mm		23 mm		YES	32	38.4 MHz	30	250	23 mm	CMOS	1.15 V			.8 mm	FLOATING POINT	S-PBGA-B760	3		1500 rpm	YES	e1
AM5726BABCXA	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY	NO	YES	1.2 V		16			GRID ARRAY, FINE PITCH	BGA760,28X28,31	1.11 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.55 mm		23 mm		YES	32	38.4 MHz	30	250	23 mm	CMOS	1.15 V			.8 mm	FLOATING POINT	S-PBGA-B760	3		1500 rpm	YES	e1
AM5726BABCXEA	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY	NO	YES	1.2 V		16			GRID ARRAY, FINE PITCH	BGA760,28X28,31	1.11 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.55 mm		23 mm		YES	32	38.4 MHz	30	250	23 mm	CMOS	1.15 V			.8 mm	FLOATING POINT	S-PBGA-B760	3		1500 rpm	YES	e1
AM5726BABCX	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY	NO	YES	1.2 V		16			GRID ARRAY, FINE PITCH	BGA760,28X28,31	1.11 V	90 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	2.55 mm		23 mm		YES	32	38.4 MHz	30	250	23 mm	CMOS	1.15 V			.8 mm	FLOATING POINT	S-PBGA-B760	3		1500 rpm	YES	e1
AM5728BABCXA	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY	NO	YES	1.2 V		16			GRID ARRAY, FINE PITCH		1.11 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.55 mm		23 mm		YES	32	38.4 MHz	30	250	23 mm	CMOS	1.15 V			.8 mm	FLOATING POINT	S-PBGA-B760	3		1500 rpm	YES	e1
AM5728BABCXEA	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY	NO	YES	1.2 V		16			GRID ARRAY, FINE PITCH	BGA760,28X28,31	1.11 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.55 mm		23 mm		YES	32	38.4 MHz	30	250	23 mm	CMOS	1.15 V			.8 mm	FLOATING POINT	S-PBGA-B760	3		1500 rpm	YES	e1

Microprocessors

A microprocessor is a small electronic component that serves as the central processing unit (CPU) of a computer or other electronic device. It is a programmable device that is capable of executing instructions and performing calculations.

Microprocessors are typically made up of millions of transistors and other components, all of which work together to perform complex calculations and operations. They are designed to be highly efficient, with the ability to process vast amounts of data quickly and accurately.

Microprocessors are used in a wide range of electronic devices, including computers, smartphones, tablets, and game consoles. They are also used in industrial control systems, medical devices, and other specialized applications.

One of the key advantages of microprocessors is their flexibility. They can be programmed to perform a wide range of functions and can be easily reprogrammed or updated as needed. This makes them ideal for a wide range of applications, from simple calculators to complex data processing systems.