FBGA Microprocessors 218

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	On Chip Data RAM Width	Screening Level	Address Bus Width	Bit Size	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	No. of External Interrupts	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	RAM Words	Width	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Maximum Supply Current	Nominal Supply Voltage	No. of DMA Channels	No. of Serial I/Os	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Speed	Low Power Mode	JESD-609 Code
T1013NSN7MQA	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	525	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V			16	64	GRID ARRAY, FINE PITCH	BGA525,23X23,32	.97 V	105 Cel	6	0 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm		19 mm	YES	32		40	260	19 mm	CMOS	5 mA	1 V	2	5	.8 mm	FIXED POINT	S-PBGA-B525	3	1200 rpm	YES	e1
T1023NXN7PQA	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	525	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V			16	64	GRID ARRAY, FINE PITCH	BGA525,23X23,32	.97 V	105 Cel	6	-40 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm		19 mm	YES	32		40	260	19 mm	CMOS	5 mA	1 V	2	5	.8 mm	FIXED POINT	S-PBGA-B525	3	1400 rpm	YES	e1
T1013NSE7KQA	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	525	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V			16	64	GRID ARRAY, FINE PITCH	BGA525,23X23,32	.97 V	105 Cel	6	0 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm		19 mm	YES	32		40	260	19 mm	CMOS	5 mA	1 V	2	5	.8 mm	FIXED POINT	S-PBGA-B525	3	1000 rpm	YES	e1
T1013NSN7PQA	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	525	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V			16	64	GRID ARRAY, FINE PITCH	BGA525,23X23,32	.97 V	105 Cel	6	0 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm		19 mm	YES	32		40	260	19 mm	CMOS	5 mA	1 V	2	5	.8 mm	FIXED POINT	S-PBGA-B525	3	1400 rpm	YES	e1
T1013NXE7KQA	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	525	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V			16	64	GRID ARRAY, FINE PITCH	BGA525,23X23,32	.97 V	105 Cel	6	-40 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm		19 mm	YES	32		40	260	19 mm	CMOS	5 mA	1 V	2	5	.8 mm	FIXED POINT	S-PBGA-B525	3	1000 rpm	YES	e1
T1013NXE7MQA	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	525	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V			16	64	GRID ARRAY, FINE PITCH	BGA525,23X23,32	.97 V	105 Cel	6	-40 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm		19 mm	YES	32		40	260	19 mm	CMOS	5 mA	1 V	2	5	.8 mm	FIXED POINT	S-PBGA-B525	3	1200 rpm	YES	e1
T1013NXE7PQA	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	525	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V			16	64	GRID ARRAY, FINE PITCH	BGA525,23X23,32	.97 V	105 Cel	6	-40 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm		19 mm	YES	32		40	260	19 mm	CMOS	5 mA	1 V	2	5	.8 mm	FIXED POINT	S-PBGA-B525	3	1400 rpm	YES	e1
T1023NSN7PQA	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	525	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V			16	64	GRID ARRAY, FINE PITCH	BGA525,23X23,32	.97 V	105 Cel	6	0 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm		19 mm	YES	32		40	260	19 mm	CMOS	5 mA	1 V	2	5	.8 mm	FIXED POINT	S-PBGA-B525	3	1400 rpm	YES	e1
T1023NSE7PQA	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	525	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V			16	64	GRID ARRAY, FINE PITCH	BGA525,23X23,32	.97 V	105 Cel	6	0 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm		19 mm	YES	32		40	260	19 mm	CMOS	5 mA	1 V	2	5	.8 mm	FIXED POINT	S-PBGA-B525	3	1400 rpm	YES	e1
T1023NSE7KQA	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	525	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V			16	64	GRID ARRAY, FINE PITCH	BGA525,23X23,32	.97 V	105 Cel	6	0 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm		19 mm	YES	32		40	260	19 mm	CMOS	5 mA	1 V	2	5	.8 mm	FIXED POINT	S-PBGA-B525	3	1000 rpm	YES	e1
T1013NXN7PQA	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	525	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V			16	64	GRID ARRAY, FINE PITCH	BGA525,23X23,32	.97 V	105 Cel	6	-40 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm		19 mm	YES	32		40	260	19 mm	CMOS	5 mA	1 V	2	5	.8 mm	FIXED POINT	S-PBGA-B525	3	1400 rpm	YES	e1
T1013NXN7MQA	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	525	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V			16	64	GRID ARRAY, FINE PITCH	BGA525,23X23,32	.97 V	105 Cel	6	-40 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm		19 mm	YES	32		40	260	19 mm	CMOS	5 mA	1 V	2	5	.8 mm	FIXED POINT	S-PBGA-B525	3	1200 rpm	YES	e1
T1013NXN7KQA	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	525	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V			16	64	GRID ARRAY, FINE PITCH	BGA525,23X23,32	.97 V	105 Cel	6	-40 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm		19 mm	YES	32		40	260	19 mm	CMOS	5 mA	1 V	2	5	.8 mm	FIXED POINT	S-PBGA-B525	3	1000 rpm	YES	e1
T1013NSE7PQA	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	525	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V			16	64	GRID ARRAY, FINE PITCH	BGA525,23X23,32	.97 V	105 Cel	6	0 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm		19 mm	YES	32		40	260	19 mm	CMOS	5 mA	1 V	2	5	.8 mm	FIXED POINT	S-PBGA-B525	3	1400 rpm	YES	e1
T1023NSN7MQA	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	525	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V			16	64	GRID ARRAY, FINE PITCH	BGA525,23X23,32	.97 V	105 Cel	6	0 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm		19 mm	YES	32		40	260	19 mm	CMOS	5 mA	1 V	2	5	.8 mm	FIXED POINT	S-PBGA-B525	3	1200 rpm	YES	e1
LS1028AXE7KQA	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	448	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V	8		14	64	GRID ARRAY, FINE PITCH	BGA448,30x30,30	.97 V	105 Cel		-40 Cel		BOTTOM	2.61 mm	262144	17 mm	YES	32		40	260	17 mm	CMOS		1 V	1	33	.75 mm	FIXED-POINT	S-PBGA-B448	3	1000 rpm	YES
TDA4VM88TGBALFR	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	827	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	.84 V	8		0	64	GRID ARRAY, FINE PITCH	BGA827,29X29,32	.76 V	105 Cel	1	-40 Cel	TIN SILVER COPPER	BOTTOM	2.8 mm	9961472	24 mm	YES	32	27 MHz		250	24 mm	CMOS		.8 V		26	.8 mm	FLOATING-POINT	S-PBGA-B827	3	2000 rpm	YES	e1
DRA829VMTGBALFR	Texas Instruments	MICROPROCESSOR, RISC		BALL	827	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	.84 V	8		0	64	GRID ARRAY, FINE PITCH	BGA827,29X29,32	.76 V	105 Cel	1	-40 Cel	TIN SILVER COPPER	BOTTOM	2.8 mm	3670016	24 mm	YES	32	27 MHz		250	24 mm	CMOS		.8 V		31	.8 mm	FIXED POINT	S-PBGA-B827	3	2000 rpm	YES	e1
TDA4VM88TGBALFRQ1	Texas Instruments	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	827	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	.84 V	8	AEC-Q100	0	64	GRID ARRAY, FINE PITCH	BGA827,29X29,32	.76 V	125 Cel	1	-40 Cel	TIN SILVER COPPER	BOTTOM	2.8 mm	9961472	24 mm	YES	32	27 MHz		250	24 mm	CMOS		.8 V		26	.8 mm	FLOATING-POINT	S-PBGA-B827	3	2000 rpm	YES	e1
DRA829JMTGBALFR	Texas Instruments	MICROPROCESSOR, RISC		BALL	827	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	.84 V	8		0	64	GRID ARRAY, FINE PITCH	BGA827,29X29,32	.76 V	105 Cel	1	-40 Cel	TIN SILVER COPPER	BOTTOM	2.8 mm	9961472	24 mm	YES	32	27 MHz		250	24 mm	CMOS		.8 V		31	.8 mm	FIXED POINT	S-PBGA-B827	3	2000 rpm	YES	e1
DRA829JMTGBALFRQ1	Texas Instruments	MICROPROCESSOR, RISC		BALL	827	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	.84 V	8	AEC-Q100	0	64	GRID ARRAY, FINE PITCH	BGA827,29X29,32	.76 V	125 Cel	1	-40 Cel	TIN SILVER COPPER	BOTTOM	2.8 mm	9961472	24 mm	YES	32	27 MHz		250	24 mm	CMOS		.8 V		31	.8 mm	FIXED POINT	S-PBGA-B827	3	2000 rpm	YES	e1
T2080NXN8MQB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	896	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.055 V			16	64	GRID ARRAY, FINE PITCH	BGA896,30X30,32	.995 V	105 Cel	12	-40 Cel		BOTTOM	2.61 mm		25 mm	YES	64		30	250	25 mm	CMOS		1.025 V		8	.8 mm	FIXED POINT	S-PBGA-B896	3	1200 rpm	NO
T2080NXE8P1B	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	896	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.055 V			16	64	GRID ARRAY, FINE PITCH	BGA896,30X30,32	.995 V	105 Cel	12	-40 Cel		BOTTOM	2.61 mm		25 mm	YES	64		30	250	25 mm	CMOS		1.025 V		8	.8 mm	FIXED POINT	S-PBGA-B896	3	1533 rpm	NO
T2080NXE8MQB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	896	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.055 V			16	64	GRID ARRAY, FINE PITCH	BGA896,30X30,32	.995 V	105 Cel	12	-40 Cel		BOTTOM	2.61 mm		25 mm	YES	64		30	250	25 mm	CMOS		1.025 V		8	.8 mm	FIXED POINT	S-PBGA-B896	3	1200 rpm	NO
FS32V234CTN1VUB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	621	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	8	AEC-Q100	0	64	GRID ARRAY, FINE PITCH	BGA621,25X25,25	.95 V	125 Cel	1	-40 Cel		BOTTOM	2.44 mm	4194304	17 mm	YES	0	40 MHz	40	260	17 mm	CMOS		1 V	32	0	.65 mm	FLOATING POINT	S-PBGA-B621	3	1000 rpm	YES
FS32V232CTN1VUB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	621	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	8	AEC-Q100	0	64	GRID ARRAY, FINE PITCH	BGA621,25X25,25	.95 V	125 Cel	1	-40 Cel		BOTTOM	2.44 mm	4194304	17 mm	YES	0	40 MHz	40	260	17 mm	CMOS		1 V	32	0	.65 mm	FLOATING POINT	S-PBGA-B621	3	1000 rpm	YES

Microprocessors

A microprocessor is a small electronic component that serves as the central processing unit (CPU) of a computer or other electronic device. It is a programmable device that is capable of executing instructions and performing calculations.

Microprocessors are typically made up of millions of transistors and other components, all of which work together to perform complex calculations and operations. They are designed to be highly efficient, with the ability to process vast amounts of data quickly and accurately.

Microprocessors are used in a wide range of electronic devices, including computers, smartphones, tablets, and game consoles. They are also used in industrial control systems, medical devices, and other specialized applications.

One of the key advantages of microprocessors is their flexibility. They can be programmed to perform a wide range of functions and can be easily reprogrammed or updated as needed. This makes them ideal for a wide range of applications, from simple calculators to complex data processing systems.