FBGA Microprocessors 218

Reset All

Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	On Chip Data RAM Width	Address Bus Width	Bit Size	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	RAM Words	Width	Additional Features	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Nominal Supply Voltage	No. of DMA Channels	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Speed	Low Power Mode	JESD-609 Code
AM5728BABCX	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY	NO	YES	1.2 V		16		GRID ARRAY, FINE PITCH	BGA760,28X28,31	1.11 V	90 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	2.55 mm		23 mm		YES	32	38.4 MHz	30	250	23 mm	CMOS	1.15 V		.8 mm	FLOATING POINT	S-PBGA-B760	3	1500 rpm	YES	e1
T1042NXE7PQB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V		16	32	GRID ARRAY, FINE PITCH		.97 V			TIN SILVER COPPER	BOTTOM	2.07 mm		23 mm		YES	64	133.3 MHz	30	250	23 mm	CMOS	1 V		.8 mm	FIXED POINT	S-PBGA-B780	3	1400 rpm	YES	e1
T1022NSE7MQB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V		16	32	GRID ARRAY, FINE PITCH		.97 V			TIN SILVER COPPER	BOTTOM	2.07 mm		23 mm		YES	64	133.3 MHz	30	250	23 mm	CMOS	1 V		.8 mm	FIXED POINT	S-PBGA-B780	3	1200 rpm	YES	e1
T1022NSE7PQB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V		16	32	GRID ARRAY, FINE PITCH		.97 V			TIN SILVER COPPER	BOTTOM	2.07 mm		23 mm		YES	64	133.3 MHz	30	250	23 mm	CMOS	1 V		.8 mm	FIXED POINT	S-PBGA-B780	3	1400 rpm	YES	e1
T1022NSE7WQB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V		16	32	GRID ARRAY, FINE PITCH		.97 V			TIN SILVER COPPER	BOTTOM	2.07 mm		23 mm		YES	64	133.3 MHz	30	250	23 mm	CMOS	1 V		.8 mm	FIXED POINT	S-PBGA-B780	3	1500 rpm	YES	e1
T1022NSN7MQB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V		16	32	GRID ARRAY, FINE PITCH		.97 V			TIN SILVER COPPER	BOTTOM	2.07 mm		23 mm		YES	64	133.3 MHz	30	250	23 mm	CMOS	1 V		.8 mm	FIXED POINT	S-PBGA-B780	3	1200 rpm	YES	e1
T1022NSN7PQB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V		16	32	GRID ARRAY, FINE PITCH		.97 V			TIN SILVER COPPER	BOTTOM	2.07 mm		23 mm		YES	64	133.3 MHz	30	250	23 mm	CMOS	1 V		.8 mm	FIXED POINT	S-PBGA-B780	3	1400 rpm	YES	e1
T1022NSN7WQB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V		16	32	GRID ARRAY, FINE PITCH		.97 V				BOTTOM	2.07 mm		23 mm		YES	64	133.3 MHz	30	250	23 mm	CMOS	1 V		.8 mm	FIXED POINT	S-PBGA-B780	3	1500 rpm	YES
T1022NXE7MQB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V		16	32	GRID ARRAY, FINE PITCH		.97 V			TIN SILVER COPPER	BOTTOM	2.07 mm		23 mm		YES	64	133.3 MHz	30	250	23 mm	CMOS	1 V		.8 mm	FIXED POINT	S-PBGA-B780	3	1200 rpm	YES	e1
T1022NXE7WQB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V		16	32	GRID ARRAY, FINE PITCH		.97 V			TIN SILVER COPPER	BOTTOM	2.07 mm		23 mm		YES	64	133.3 MHz	30	250	23 mm	CMOS	1 V		.8 mm	FIXED POINT	S-PBGA-B780	3	1500 rpm	YES	e1
T1022NXN7MQB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V		16	32	GRID ARRAY, FINE PITCH		.97 V			TIN SILVER COPPER	BOTTOM	2.07 mm		23 mm		YES	64	133.3 MHz	30	250	23 mm	CMOS	1 V		.8 mm	FIXED POINT	S-PBGA-B780	3	1200 rpm	YES	e1
T1022NXN7PQB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V		16	32	GRID ARRAY, FINE PITCH		.97 V			TIN SILVER COPPER	BOTTOM	2.07 mm		23 mm		YES	64	133.3 MHz	30	250	23 mm	CMOS	1 V		.8 mm	FIXED POINT	S-PBGA-B780	3	1400 rpm	YES	e1
T1022NXN7WQB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V		16	32	GRID ARRAY, FINE PITCH		.97 V				BOTTOM	2.07 mm		23 mm		YES	64	133.3 MHz	30	250	23 mm	CMOS	1 V		.8 mm	FIXED POINT	S-PBGA-B780	3	1500 rpm	YES
T1042NSE7MQB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V		16	32	GRID ARRAY, FINE PITCH		.97 V			TIN SILVER COPPER	BOTTOM	2.07 mm		23 mm		YES	64	133.3 MHz	30	250	23 mm	CMOS	1 V		.8 mm	FIXED POINT	S-PBGA-B780	3	1200 rpm	YES	e1
T1042NSE7PQB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V		16	32	GRID ARRAY, FINE PITCH		.97 V			TIN SILVER COPPER	BOTTOM	2.07 mm		23 mm		YES	64	133.3 MHz	30	250	23 mm	CMOS	1 V		.8 mm	FIXED POINT	S-PBGA-B780	3	1400 rpm	YES	e1
T1042NSE7WQB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V		16	32	GRID ARRAY, FINE PITCH		.97 V			TIN SILVER COPPER	BOTTOM	2.07 mm		23 mm		YES	64	133.3 MHz	30	250	23 mm	CMOS	1 V		.8 mm	FIXED POINT	S-PBGA-B780	3	1500 rpm	YES	e1
T1042NSN7MQB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V		16	32	GRID ARRAY, FINE PITCH		.97 V				BOTTOM	2.07 mm		23 mm		YES	64	133.3 MHz	30	250	23 mm	CMOS	1 V		.8 mm	FIXED POINT	S-PBGA-B780	3	1200 rpm	YES
T1042NSN7PQB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V		16	32	GRID ARRAY, FINE PITCH		.97 V			TIN SILVER COPPER	BOTTOM	2.07 mm		23 mm		YES	64	133.3 MHz	30	250	23 mm	CMOS	1 V		.8 mm	FIXED POINT	S-PBGA-B780	3	1400 rpm	YES	e1
T1042NSN7WQB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V		16	32	GRID ARRAY, FINE PITCH		.97 V			TIN SILVER COPPER	BOTTOM	2.07 mm		23 mm		YES	64	133.3 MHz	30	250	23 mm	CMOS	1 V		.8 mm	FIXED POINT	S-PBGA-B780	3	1500 rpm	YES	e1
T1042NXE7MQB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V		16	32	GRID ARRAY, FINE PITCH		.97 V			TIN SILVER COPPER	BOTTOM	2.07 mm		23 mm		YES	64	133.3 MHz	30	250	23 mm	CMOS	1 V		.8 mm	FIXED POINT	S-PBGA-B780	3	1200 rpm	YES	e1
T1042NXE7WQB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V		16	32	GRID ARRAY, FINE PITCH		.97 V				BOTTOM	2.07 mm		23 mm		YES	64	133.3 MHz	30	250	23 mm	CMOS	1 V		.8 mm	FIXED POINT	S-PBGA-B780	3	1500 rpm	YES
T1042NXN7MQB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V		16	32	GRID ARRAY, FINE PITCH		.97 V			TIN SILVER COPPER	BOTTOM	2.07 mm		23 mm		YES	64	133.3 MHz	30	250	23 mm	CMOS	1 V		.8 mm	FIXED POINT	S-PBGA-B780	3	1200 rpm	YES	e1
T1042NXN7PQB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V		16	32	GRID ARRAY, FINE PITCH		.97 V			TIN SILVER COPPER	BOTTOM	2.07 mm		23 mm		YES	64	133.3 MHz	30	250	23 mm	CMOS	1 V		.8 mm	FIXED POINT	S-PBGA-B780	3	1400 rpm	YES	e1
T1042NXN7WQB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V		16	32	GRID ARRAY, FINE PITCH		.97 V			TIN SILVER COPPER	BOTTOM	2.07 mm		23 mm		YES	64	133.3 MHz	30	250	23 mm	CMOS	1 V		.8 mm	FIXED POINT	S-PBGA-B780	3	1500 rpm	YES	e1
MCIMX6Q4AVT10ADR	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.5 V		16	32	GRID ARRAY, FINE PITCH		1.35 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.16 mm		21 mm	PKG DETAIL: HTTP://CACHE.FREESCALE.COM/FILES/SHARED/DOC/PACKAGE_INFO/98ASA00330D.	YES	64		40	260	21 mm	CMOS			.8 mm	FLOATING POINT	S-PBGA-B624	3	1000 rpm	YES	e1
HPSDM8148CCYE2	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	684	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.42 V	8	28	32	GRID ARRAY, FINE PITCH		1.28 V	90 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	3.06 mm	1114112	23 mm		YES	16	30 MHz	NOT SPECIFIED	250	23 mm	CMOS	1.35 V	72	.8 mm	FLOATING POINT	S-PBGA-B684	4	1000 rpm	YES	e1
MTDM8148CCYE2	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	684	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.42 V	8	28	32	GRID ARRAY, FINE PITCH		1.28 V	90 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	3.06 mm	1114112	23 mm		YES	16	30 MHz	NOT SPECIFIED	250	23 mm	CMOS	1.35 V	72	.8 mm	FLOATING POINT	S-PBGA-B684	4	1000 rpm	YES	e1
LS1020ASE7HNB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	525	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V		16	32	GRID ARRAY, FINE PITCH		.97 V			TIN SILVER COPPER	BOTTOM	2.07 mm		19 mm		YES	32	133.3 MHz	40	260	19 mm	CMOS	1 V		.8 mm	FLOATING POINT	S-PBGA-B525	3	800 rpm	YES	e1
LS1020ASE7KQB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	525	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V		16	32	GRID ARRAY, FINE PITCH		.97 V				BOTTOM	2.07 mm		19 mm		YES	32	133.3 MHz	40	260	19 mm	CMOS	1 V		.8 mm	FLOATING POINT	S-PBGA-B525	3	1000 rpm	YES
LS1020ASN7HNB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	525	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V		16	32	GRID ARRAY, FINE PITCH		.97 V			TIN SILVER COPPER	BOTTOM	2.07 mm		19 mm		YES	32	133.3 MHz	40	260	19 mm	CMOS	1 V		.8 mm	FLOATING POINT	S-PBGA-B525	3	800 rpm	YES	e1
LS1020ASN7KQB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	525	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V		16	32	GRID ARRAY, FINE PITCH		.97 V			TIN SILVER COPPER	BOTTOM	2.07 mm		19 mm		YES	32	133.3 MHz	40	260	19 mm	CMOS	1 V		.8 mm	FLOATING POINT	S-PBGA-B525	3	1000 rpm	YES	e1
LS1020AXE7HNB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	525	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V		16	32	GRID ARRAY, FINE PITCH		.97 V			TIN SILVER COPPER	BOTTOM	2.07 mm		19 mm		YES	32	133.3 MHz	40	260	19 mm	CMOS	1 V		.8 mm	FLOATING POINT	S-PBGA-B525	3	800 rpm	YES	e1
LS1020AXE7KQB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	525	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V		16	32	GRID ARRAY, FINE PITCH		.97 V			TIN SILVER COPPER	BOTTOM	2.07 mm		19 mm		YES	32	133.3 MHz	40	260	19 mm	CMOS	1 V		.8 mm	FLOATING POINT	S-PBGA-B525	3	1000 rpm	YES	e1
LS1020AXN7KQB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	525	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V		16	32	GRID ARRAY, FINE PITCH		.97 V			TIN SILVER COPPER	BOTTOM	2.07 mm		19 mm		YES	32	133.3 MHz	40	260	19 mm	CMOS	1 V		.8 mm	FLOATING POINT	S-PBGA-B525	3	1000 rpm	YES	e1
MCIMX6DP4AVT1AB	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	624	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.5 V				GRID ARRAY, FINE PITCH		1.35 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.16 mm		21 mm	24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE				40	260	21 mm	CMOS			.8 mm		S-PBGA-B624	3			e1
MCIMX6QP4AVT1AB	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	624	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.5 V				GRID ARRAY, FINE PITCH		1.35 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.16 mm		21 mm	24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE				40	260	21 mm	CMOS			.8 mm		S-PBGA-B624	3			e1
MCIMX6QP4AVT8AB	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	624	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.5 V				GRID ARRAY, FINE PITCH		1.225 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.16 mm		21 mm	24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE				40	260	21 mm	CMOS			.8 mm		S-PBGA-B624	3			e1
MCIMX6QP6AVT1AB	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	624	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.5 V				GRID ARRAY, FINE PITCH		1.35 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.16 mm		21 mm	24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE				40	260	21 mm	CMOS			.8 mm		S-PBGA-B624	3			e1
MCIMX6QP6AVT8AB	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	624	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.5 V				GRID ARRAY, FINE PITCH		1.225 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.16 mm		21 mm	24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE				40	260	21 mm	CMOS			.8 mm		S-PBGA-B624	3			e1
T2081NSN8TTB	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.055 V		16		GRID ARRAY, FINE PITCH		.995 V	105 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	2.61 mm		23 mm		YES	64		30	250	23 mm	CMOS	1.025 V		.8 mm	FIXED POINT	S-PBGA-B780	3	1800 rpm	YES	e1
T2081NSE8MQLB	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.055 V		16		GRID ARRAY, FINE PITCH		.995 V	105 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	2.61 mm		23 mm		YES	64		30	250	23 mm	CMOS	1.025 V		.8 mm	FIXED POINT	S-PBGA-B780	3	1200 rpm	YES	e1
T2081NSE8P1B	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.055 V		16		GRID ARRAY, FINE PITCH		.995 V	105 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	2.61 mm		23 mm		YES	64		30	250	23 mm	CMOS	1.025 V		.8 mm	FIXED POINT	S-PBGA-B780	3	1533 rpm	YES	e1
T2081NSE8PTB	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.055 V		16		GRID ARRAY, FINE PITCH		.995 V	105 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	2.61 mm		23 mm		YES	64		30	250	23 mm	CMOS	1.025 V		.8 mm	FIXED POINT	S-PBGA-B780	3	1533 rpm	YES	e1
T2081NSE8T1B	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.055 V		16		GRID ARRAY, FINE PITCH		.995 V	105 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	2.61 mm		23 mm		YES	64		30	250	23 mm	CMOS	1.025 V		.8 mm	FIXED POINT	S-PBGA-B780	3	1800 rpm	YES	e1
T2081NSE8TTB	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.055 V		16		GRID ARRAY, FINE PITCH		.995 V	105 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	2.61 mm		23 mm		YES	64		30	250	23 mm	CMOS	1.025 V		.8 mm	FIXED POINT	S-PBGA-B780	3	1800 rpm	YES	e1
T2081NSN8MQLB	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.055 V		16		GRID ARRAY, FINE PITCH		.995 V	105 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	2.61 mm		23 mm		YES	64		30	250	23 mm	CMOS	1.025 V		.8 mm	FIXED POINT	S-PBGA-B780	3	1200 rpm	YES	e1
T2081NSN8P1B	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.055 V		16		GRID ARRAY, FINE PITCH		.995 V	105 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	2.61 mm		23 mm		YES	64		30	250	23 mm	CMOS	1.025 V		.8 mm	FIXED POINT	S-PBGA-B780	3	1533 rpm	YES	e1
T2081NSN8PTB	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.055 V		16		GRID ARRAY, FINE PITCH		.995 V	105 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	2.61 mm		23 mm		YES	64		30	250	23 mm	CMOS	1.025 V		.8 mm	FIXED POINT	S-PBGA-B780	3	1533 rpm	YES	e1

Microprocessors

A microprocessor is a small electronic component that serves as the central processing unit (CPU) of a computer or other electronic device. It is a programmable device that is capable of executing instructions and performing calculations.

Microprocessors are typically made up of millions of transistors and other components, all of which work together to perform complex calculations and operations. They are designed to be highly efficient, with the ability to process vast amounts of data quickly and accurately.

Microprocessors are used in a wide range of electronic devices, including computers, smartphones, tablets, and game consoles. They are also used in industrial control systems, medical devices, and other specialized applications.

One of the key advantages of microprocessors is their flexibility. They can be programmed to perform a wide range of functions and can be easily reprogrammed or updated as needed. This makes them ideal for a wide range of applications, from simple calculators to complex data processing systems.