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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	On Chip Data RAM Width	Address Bus Width	Bit Size	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	No. of External Interrupts	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	RAM Words	Width	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Maximum Supply Current	Nominal Supply Voltage	No. of DMA Channels	No. of Serial I/Os	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Speed	Low Power Mode	JESD-609 Code
LS1012AXE7EKB	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	NO LEAD	211	VFLGA	SQUARE	UNSPECIFIED	YES	YES	.93 V		16	64	GRID ARRAY, VERY THIN PROFILE, FINE PITCH		.87 V	105 Cel		-40 Cel		BOTTOM	.925 mm		9.6 mm	YES	16	25 MHz	40	260	9.6 mm	CMOS		.9 V			.5 mm	FIXED POINT	S-XBGA-N211	3	600 rpm	YES
T1040NSN7WQB	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V		16	64	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.97 V	105 Cel	12	0 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm		23 mm	YES	64		30	250	23 mm	CMOS		1 V	8		.8 mm	FIXED POINT	S-PBGA-B780	3	1500 rpm	YES	e1
T1040NXN7PQB	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V		16	64	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.97 V	105 Cel	12	-40 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm		23 mm	YES	64		30	250	23 mm	CMOS		1 V	8		.8 mm	FIXED POINT	S-PBGA-B780	3	1400 rpm	YES	e1
T1040NXN7MQB	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V		16	64	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.97 V	105 Cel	12	-40 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm		23 mm	YES	64		30	250	23 mm	CMOS		1 V	8		.8 mm	FIXED POINT	S-PBGA-B780	3	1200 rpm	YES	e1
T1040NSN7PQB	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V		16	64	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.97 V	105 Cel	12	0 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm		23 mm	YES	64		30	250	23 mm	CMOS		1 V	8		.8 mm	FIXED POINT	S-PBGA-B780	3	1400 rpm	YES	e1
T1040NSN7MQB	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	780	HFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V		16	64	GRID ARRAY, HEAT SINK/SLUG, FINE PITCH	BGA780,28X28,32	.97 V	105 Cel	12	0 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm		23 mm	YES	64		30	250	23 mm	CMOS		1 V	8		.8 mm	FIXED POINT	S-PBGA-B780	3	1200 rpm	YES	e1
P1010NSN5HFB	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	425	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		16		GRID ARRAY, FINE PITCH	BGA425,23X23,32	.95 V	105 Cel	4	0 Cel	TIN SILVER	BOTTOM	1.9 mm		19 mm	YES	32		40	260	19 mm	CMOS		1 V	4		.8 mm	FIXED POINT	S-PBGA-B425	3	800 rpm	NO	e2
P1010NXE5FFB	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	425	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		16		GRID ARRAY, FINE PITCH	BGA425,23X23,32	.95 V	105 Cel	4	-40 Cel	TIN SILVER	BOTTOM	1.9 mm		19 mm	YES	32		40	260	19 mm	CMOS		1 V	4		.8 mm	FIXED POINT	S-PBGA-B425	3	667 rpm	NO	e2
P1010NXN5KHB	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	425	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		16		GRID ARRAY, FINE PITCH	BGA425,23X23,32	.95 V	105 Cel	4	-40 Cel	TIN SILVER	BOTTOM	1.9 mm		19 mm	YES	32		40	260	19 mm	CMOS		1 V	4		.8 mm	FIXED POINT	S-PBGA-B425	3	1000 rpm	NO	e2
P1010NXE5HFB	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	425	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		16		GRID ARRAY, FINE PITCH	BGA425,23X23,32	.95 V	105 Cel	4	-40 Cel	TIN SILVER	BOTTOM	1.9 mm		19 mm	YES	32		40	260	19 mm	CMOS		1 V	4		.8 mm	FIXED POINT	S-PBGA-B425	3	800 rpm	NO	e2
P1010NXE5KHB	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	425	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		16		GRID ARRAY, FINE PITCH	BGA425,23X23,32	.95 V	105 Cel	4	-40 Cel	TIN SILVER	BOTTOM	1.9 mm		19 mm	YES	32		40	260	19 mm	CMOS		1 V	4		.8 mm	FIXED POINT	S-PBGA-B425	3	1000 rpm	NO	e2
P1010NXN5FFB	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	425	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		16		GRID ARRAY, FINE PITCH	BGA425,23X23,32	.95 V	105 Cel	4	-40 Cel	TIN SILVER	BOTTOM	1.9 mm		19 mm	YES	32		40	260	19 mm	CMOS		1 V	4		.8 mm	FIXED POINT	S-PBGA-B425	3	667 rpm	NO	e2
P1010NSE5FFB	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	425	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		16		GRID ARRAY, FINE PITCH	BGA425,23X23,32	.95 V	105 Cel	4	0 Cel	TIN SILVER	BOTTOM	1.9 mm		19 mm	YES	32		40	260	19 mm	CMOS		1 V	4		.8 mm	FIXED POINT	S-PBGA-B425	3	667 rpm	NO	e2
P1010NSN5DFB	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	425	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		16		GRID ARRAY, FINE PITCH	BGA425,23X23,32	.95 V	105 Cel	4	0 Cel	TIN SILVER	BOTTOM	1.9 mm		19 mm	YES	32		40	260	19 mm	CMOS		1 V	4		.8 mm	FIXED POINT	S-PBGA-B425	3	533 rpm	NO	e2
P1010NSN5FFB	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	425	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		16		GRID ARRAY, FINE PITCH	BGA425,23X23,32	.95 V	105 Cel	4	0 Cel	TIN SILVER	BOTTOM	1.9 mm		19 mm	YES	32		40	260	19 mm	CMOS		1 V	4		.8 mm	FIXED POINT	S-PBGA-B425	3	667 rpm	NO	e2
P1010NSN5KHB	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	425	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		16		GRID ARRAY, FINE PITCH	BGA425,23X23,32	.95 V	105 Cel	4	0 Cel	TIN SILVER	BOTTOM	1.9 mm		19 mm	YES	32		40	260	19 mm	CMOS		1 V	4		.8 mm	FIXED POINT	S-PBGA-B425	3	1000 rpm	NO	e2
P1010NXN5DFB	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	425	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		16		GRID ARRAY, FINE PITCH	BGA425,23X23,32	.95 V	105 Cel	4	-40 Cel	TIN SILVER	BOTTOM	1.9 mm		19 mm	YES	32		40	260	19 mm	CMOS		1 V	4		.8 mm	FIXED POINT	S-PBGA-B425	3	533 rpm	NO	e2
MIMXRT1024DAG5A	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	GULL WING	144	LFQFP	SQUARE	PLASTIC/EPOXY	YES	YES	3.6 V	8	13	32	FLATPACK, LOW PROFILE, FINE PITCH	QFP144,.87SQ,20	3 V	95 Cel		0 Cel		QUAD	1.6 mm	262144	20 mm	YES	16	24 MHz	40	260	20 mm	CMOS	90 mA	3.3 V	32	8	.5 mm	FLOATING POINT	S-PQFP-G144	3	500 rpm	YES
MIMXRT1024CAG4A	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	GULL WING	144	LFQFP	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	8	0	32	FLATPACK, LOW PROFILE, FINE PITCH	QFP144,.87SQ,20	1.15 V	105 Cel	0	-40 Cel		QUAD	1.6 mm	262144	20 mm	YES	0	24 MHz	40	260	20 mm	CMOS	90 mA		32	20	.5 mm	FLOATING-POINT	S-PQFP-G144	3	396 rpm	YES
MIMXRT1171AVM8A	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.95 V	8			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.71 V	125 Cel		-40 Cel		BOTTOM	1.52 mm	2097152	14 mm	YES		48 MHz	40	260	14 mm	CMOS	850 mA	1.8 V	32	1	.8 mm	FLOATING-POINT	S-PBGA-B289	3	800 rpm	YES
MIMXRT1172AVM8A	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.95 V	8			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.71 V	125 Cel		-40 Cel		BOTTOM	1.52 mm	2097152	14 mm	YES		48 MHz	40	260	14 mm	CMOS	850 mA	1.8 V	32	1	.8 mm	FLOATING-POINT	S-PBGA-B289	3	800 rpm	YES
MIMXRT1175AVM8A	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.95 V	8			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.71 V	125 Cel		-40 Cel		BOTTOM	1.52 mm	2097152	14 mm	YES		48 MHz	40	260	14 mm	CMOS	850 mA	1.8 V	32	1	.8 mm	FLOATING-POINT	S-PBGA-B289	3	800 rpm	YES
LS1012ASE7HKA	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	NO LEAD	211	VFLGA	SQUARE	UNSPECIFIED	YES	YES	.93 V		16	64	GRID ARRAY, VERY THIN PROFILE, FINE PITCH		.87 V	105 Cel		0 Cel		BOTTOM	.925 mm		9.6 mm	YES	16	25 MHz	40	260	9.6 mm	CMOS		.9 V			.5 mm	FIXED POINT	S-XBGA-N211	3	800 rpm	YES
LS1012ASN7EKA	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	NO LEAD	211	VFLGA	SQUARE	UNSPECIFIED	YES	YES	.93 V		16	64	GRID ARRAY, VERY THIN PROFILE, FINE PITCH		.87 V	105 Cel		0 Cel		BOTTOM	.925 mm		9.6 mm	YES	16	25 MHz	40	260	9.6 mm	CMOS		.9 V			.5 mm	FIXED POINT	S-XBGA-N211	3	600 rpm	YES
LS1012AXE7HKA	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	NO LEAD	211	VFLGA	SQUARE	UNSPECIFIED	YES	YES	.93 V		16	64	GRID ARRAY, VERY THIN PROFILE, FINE PITCH		.87 V	105 Cel		-40 Cel		BOTTOM	.925 mm		9.6 mm	YES	16	25 MHz	40	260	9.6 mm	CMOS		.9 V			.5 mm	FIXED POINT	S-XBGA-N211	3	800 rpm	YES
LS1012AXN7EKA	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	NO LEAD	211	VFLGA	SQUARE	UNSPECIFIED	YES	YES	.93 V		16	64	GRID ARRAY, VERY THIN PROFILE, FINE PITCH		.87 V	105 Cel		-40 Cel		BOTTOM	.925 mm		9.6 mm	YES	16	25 MHz	40	260	9.6 mm	CMOS		.9 V			.5 mm	FIXED POINT	S-XBGA-N211	3	600 rpm	YES
LS1012ASE7EKA	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	NO LEAD	211	VFLGA	SQUARE	UNSPECIFIED	YES	YES	.93 V		16	64	GRID ARRAY, VERY THIN PROFILE, FINE PITCH		.87 V	105 Cel		0 Cel		BOTTOM	.925 mm		9.6 mm	YES	16	25 MHz	40	260	9.6 mm	CMOS		.9 V			.5 mm	FIXED POINT	S-XBGA-N211	3	600 rpm	YES
MCIMX537CVP8C2	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	529	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V	8	26	32	GRID ARRAY, FINE PITCH	BGA529,23X23,32	1.05 V	125 Cel		-40 Cel		BOTTOM	1.85 mm	147456	19 mm	YES	32	27 MHz	40	260	19 mm	CMOS	800 mA	1.1 V	32	52	.8 mm	FLOATING POINT	S-PBGA-B529	3	800 rpm	YES
MCIMX535DVP2C2	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	529	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.4 V	8	26	32	GRID ARRAY, FINE PITCH	BGA529,23X23,32	1.3 V	85 Cel		-20 Cel		BOTTOM	1.85 mm	147456	19 mm	YES	32	27 MHz	40	260	19 mm	CMOS	800 mA	1.35 V		5	.8 mm	FLOATING POINT	S-PBGA-B529	3	1200 rpm	YES
MCIMX535DVP1C2	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	529	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.4 V	8	26	32	GRID ARRAY, FINE PITCH	BGA529,23X23,32	1.2 V	85 Cel		-20 Cel		BOTTOM	1.85 mm	147456	19 mm	YES	32	27 MHz	40	260	19 mm	CMOS	800 mA	1.25 V		5	.8 mm	FLOATING POINT	S-PBGA-B529	3	1000 rpm	YES
MIMXRT1021DAF5B	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	YES	1.3 V	8	13	32	FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	1.25 V	95 Cel		0 Cel	TIN	QUAD	1.7 mm	262144	14 mm	YES	32	24 MHz	40	260	14 mm	CMOS	90 mA		32	14	.5 mm	FLOATING POINT	S-PQFP-G100	3	500 rpm	YES	e3
T1023NSN7KQA	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	525	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V		16	64	GRID ARRAY, FINE PITCH	BGA525,23X23,32	.97 V	105 Cel	6	0 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm		19 mm	YES	32		40	260	19 mm	CMOS	5 mA	1 V	2	5	.8 mm	FIXED POINT	S-PBGA-B525	3	1000 rpm	YES	e1
T1023NXN7KQA	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	525	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V		16	64	GRID ARRAY, FINE PITCH	BGA525,23X23,32	.97 V	105 Cel	6	-40 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm		19 mm	YES	32		40	260	19 mm	CMOS	5 mA	1 V	2	5	.8 mm	FIXED POINT	S-PBGA-B525	3	1000 rpm	YES	e1
T1023NXN7MQA	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	525	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V		16	64	GRID ARRAY, FINE PITCH	BGA525,23X23,32	.97 V	105 Cel	6	-40 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm		19 mm	YES	32		40	260	19 mm	CMOS	5 mA	1 V	2	5	.8 mm	FIXED POINT	S-PBGA-B525	3	1200 rpm	YES	e1
T1023NXE7KQA	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	525	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V		16	64	GRID ARRAY, FINE PITCH	BGA525,23X23,32	.97 V	105 Cel	6	-40 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm		19 mm	YES	32		40	260	19 mm	CMOS	5 mA	1 V	2	5	.8 mm	FIXED POINT	S-PBGA-B525	3	1000 rpm	YES	e1
T1023NXE7MQA	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	525	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V		16	64	GRID ARRAY, FINE PITCH	BGA525,23X23,32	.97 V	105 Cel	6	-40 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm		19 mm	YES	32		40	260	19 mm	CMOS	5 mA	1 V	2	5	.8 mm	FIXED POINT	S-PBGA-B525	3	1200 rpm	YES	e1
T1013NSE7MQA	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	525	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V		16	64	GRID ARRAY, FINE PITCH	BGA525,23X23,32	.97 V	105 Cel	6	0 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm		19 mm	YES	32		40	260	19 mm	CMOS	5 mA	1 V	2	5	.8 mm	FIXED POINT	S-PBGA-B525	3	1200 rpm	YES	e1
T1013NSN7KQA	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	525	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V		16	64	GRID ARRAY, FINE PITCH	BGA525,23X23,32	.97 V	105 Cel	6	0 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm		19 mm	YES	32		40	260	19 mm	CMOS	5 mA	1 V	2	5	.8 mm	FIXED POINT	S-PBGA-B525	3	1000 rpm	YES	e1
T1013NSN7MQA	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	525	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V		16	64	GRID ARRAY, FINE PITCH	BGA525,23X23,32	.97 V	105 Cel	6	0 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm		19 mm	YES	32		40	260	19 mm	CMOS	5 mA	1 V	2	5	.8 mm	FIXED POINT	S-PBGA-B525	3	1200 rpm	YES	e1
T1023NXN7PQA	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	525	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V		16	64	GRID ARRAY, FINE PITCH	BGA525,23X23,32	.97 V	105 Cel	6	-40 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm		19 mm	YES	32		40	260	19 mm	CMOS	5 mA	1 V	2	5	.8 mm	FIXED POINT	S-PBGA-B525	3	1400 rpm	YES	e1
T1013NSE7KQA	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	525	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V		16	64	GRID ARRAY, FINE PITCH	BGA525,23X23,32	.97 V	105 Cel	6	0 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm		19 mm	YES	32		40	260	19 mm	CMOS	5 mA	1 V	2	5	.8 mm	FIXED POINT	S-PBGA-B525	3	1000 rpm	YES	e1
T1013NSN7PQA	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	525	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V		16	64	GRID ARRAY, FINE PITCH	BGA525,23X23,32	.97 V	105 Cel	6	0 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm		19 mm	YES	32		40	260	19 mm	CMOS	5 mA	1 V	2	5	.8 mm	FIXED POINT	S-PBGA-B525	3	1400 rpm	YES	e1
T1013NXE7KQA	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	525	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V		16	64	GRID ARRAY, FINE PITCH	BGA525,23X23,32	.97 V	105 Cel	6	-40 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm		19 mm	YES	32		40	260	19 mm	CMOS	5 mA	1 V	2	5	.8 mm	FIXED POINT	S-PBGA-B525	3	1000 rpm	YES	e1
T1013NXE7MQA	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	525	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V		16	64	GRID ARRAY, FINE PITCH	BGA525,23X23,32	.97 V	105 Cel	6	-40 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm		19 mm	YES	32		40	260	19 mm	CMOS	5 mA	1 V	2	5	.8 mm	FIXED POINT	S-PBGA-B525	3	1200 rpm	YES	e1
T1013NXE7PQA	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	525	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V		16	64	GRID ARRAY, FINE PITCH	BGA525,23X23,32	.97 V	105 Cel	6	-40 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm		19 mm	YES	32		40	260	19 mm	CMOS	5 mA	1 V	2	5	.8 mm	FIXED POINT	S-PBGA-B525	3	1400 rpm	YES	e1
T1023NSN7PQA	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	525	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V		16	64	GRID ARRAY, FINE PITCH	BGA525,23X23,32	.97 V	105 Cel	6	0 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm		19 mm	YES	32		40	260	19 mm	CMOS	5 mA	1 V	2	5	.8 mm	FIXED POINT	S-PBGA-B525	3	1400 rpm	YES	e1
T1023NSE7PQA	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	525	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V		16	64	GRID ARRAY, FINE PITCH	BGA525,23X23,32	.97 V	105 Cel	6	0 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm		19 mm	YES	32		40	260	19 mm	CMOS	5 mA	1 V	2	5	.8 mm	FIXED POINT	S-PBGA-B525	3	1400 rpm	YES	e1
T1023NSE7KQA	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	525	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V		16	64	GRID ARRAY, FINE PITCH	BGA525,23X23,32	.97 V	105 Cel	6	0 Cel	TIN SILVER COPPER	BOTTOM	2.07 mm		19 mm	YES	32		40	260	19 mm	CMOS	5 mA	1 V	2	5	.8 mm	FIXED POINT	S-PBGA-B525	3	1000 rpm	YES	e1

Microprocessors

A microprocessor is a small electronic component that serves as the central processing unit (CPU) of a computer or other electronic device. It is a programmable device that is capable of executing instructions and performing calculations.

Microprocessors are typically made up of millions of transistors and other components, all of which work together to perform complex calculations and operations. They are designed to be highly efficient, with the ability to process vast amounts of data quickly and accurately.

Microprocessors are used in a wide range of electronic devices, including computers, smartphones, tablets, and game consoles. They are also used in industrial control systems, medical devices, and other specialized applications.

One of the key advantages of microprocessors is their flexibility. They can be programmed to perform a wide range of functions and can be easily reprogrammed or updated as needed. This makes them ideal for a wide range of applications, from simple calculators to complex data processing systems.