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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	On Chip Data RAM Width	Address Bus Width	Bit Size	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	No. of External Interrupts	Minimum Operating Temperature	Terminal Finish	ADC Channels	Terminal Position	DMA Channels	Maximum Seated Height	RAM Words	Width	Additional Features	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Maximum Supply Current	Nominal Supply Voltage	No. of DMA Channels	PWM Channels	No. of Serial I/Os	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Speed	Low Power Mode	JESD-609 Code	No. of I/O Lines
MIMXRT1021DAF5A	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	YES	1.3 V	8	13	32	FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	1.25 V	95 Cel		0 Cel	TIN	YES	QUAD	YES	1.7 mm	262144	14 mm		YES	32	24 MHz	40	260	14 mm	CMOS	90 mA		32	YES	14	.5 mm	FLOATING POINT	S-PQFP-G100	3	500 rpm	YES	e3	57
LS1043ASE7KQB	NXP Semiconductors	SoC	OTHER	BALL	621	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	.93 V		16	64	GRID ARRAY, FINE PITCH		.87 V	105 Cel		0 Cel	TIN SILVER COPPER		BOTTOM		2.07 mm		21 mm	ALSO OPERATES AT 1V NOMINAL SUPPLY	YES	32		30	250	21 mm	CMOS		.9 V				.8 mm	FIXED POINT	S-PBGA-B621	3	1000 rpm	YES	e1
LS1043ASE7PQB	NXP Semiconductors	SoC	OTHER	BALL	621	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	.93 V		16	64	GRID ARRAY, FINE PITCH		.87 V	105 Cel		0 Cel	TIN SILVER COPPER		BOTTOM		2.07 mm		21 mm	ALSO OPERATES AT 1V NOMINAL SUPPLY	YES	32		30	250	21 mm	CMOS		.9 V				.8 mm	FIXED POINT	S-PBGA-B621	3	1400 rpm	YES	e1
LS1043ASE7QQB	NXP Semiconductors	SoC	OTHER	BALL	621	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	.93 V		16	64	GRID ARRAY, FINE PITCH		.87 V	105 Cel		0 Cel	TIN SILVER COPPER		BOTTOM		2.07 mm		21 mm	ALSO OPERATES AT 1V NOMINAL SUPPLY	YES	32		30	250	21 mm	CMOS		.9 V				.8 mm	FIXED POINT	S-PBGA-B621	3	1600 rpm	YES	e1
LS1043ASE8PQB	NXP Semiconductors	SoC	OTHER	BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	.93 V		14	64	GRID ARRAY, FINE PITCH		.87 V	105 Cel		0 Cel	TIN SILVER COPPER		BOTTOM		2.07 mm		23 mm	ALSO OPERATES AT 1V NOMINAL SUPPLY	YES	32		30	250	23 mm	CMOS		.9 V				.8 mm	FIXED POINT	S-PBGA-B780	3	1400 rpm	YES	e1
LS1043ASN8MQB	NXP Semiconductors	SoC	OTHER	BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	.93 V		14	64	GRID ARRAY, FINE PITCH		.87 V	105 Cel		0 Cel			BOTTOM		2.07 mm		23 mm	ALSO OPERATES AT 1V NOMINAL SUPPLY	YES	32		30	250	23 mm	CMOS		.9 V				.8 mm	FIXED POINT	S-PBGA-B780	3	1200 rpm	YES
LS1043AXE7QQB	NXP Semiconductors	SoC	INDUSTRIAL	BALL	621	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	.93 V		16	64	GRID ARRAY, FINE PITCH		.87 V	105 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM		2.07 mm		21 mm	ALSO OPERATES AT 1V NOMINAL SUPPLY	YES	32		30	250	21 mm	CMOS		.9 V				.8 mm	FIXED POINT	S-PBGA-B621	3	1600 rpm	YES	e1
MIMXRT1064DVL6A	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.3 V	8	0	32	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA196,14X14,25	1.25 V	85 Cel	0	0 Cel			BOTTOM		1.43 mm	1048576	10 mm		YES	0	24 MHz	40	260	10 mm	CMOS	110 mA		32		10	.65 mm	FLOATING-POINT	S-PBGA-B196	3	600 rpm	YES
MIMXRT1015DAF5A	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	YES	1.3 V	8	0	32	FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	1.25 V	95 Cel	0	0 Cel	TIN		QUAD		1.7 mm	131072	14 mm		YES	0	24 MHz	40	260	14 mm	CMOS	90 mA		32		16	.5 mm	FLOATING POINT	S-PQFP-G100	3	500 rpm	YES	e3
BSC9131NSN1KHKB,557	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	520	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		16	32	GRID ARRAY, FINE PITCH		.97 V	105 Cel		0 Cel			BOTTOM		1.97 mm		21 mm		YES	32				21 mm	CMOS		1 V				.8 mm	FIXED POINT	S-PBGA-B520		1000 rpm	YES
P1014NSN5FFA,557	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	425	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		0	32	GRID ARRAY, FINE PITCH		.95 V						BOTTOM		1.9 mm		19 mm		YES	0	100 MHz			19 mm	CMOS		1 V				.8 mm	FLOATING POINT	S-PBGA-B425		667 rpm	YES
P5010NXN7TNB,557	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	1295	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V		16		GRID ARRAY		1.05 V						BOTTOM		3.53 mm		37.5 mm		YES	64	166 MHz			37.5 mm	CMOS		1.1 V				1 mm	FIXED POINT	S-PBGA-B1295		1800 rpm	YES
P5020NSN1QMB,557	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	1295	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V		16		GRID ARRAY		1.05 V						BOTTOM		3.53 mm		37.5 mm		YES	64	166 MHz			37.5 mm	CMOS		1.1 V				1 mm	FIXED POINT	S-PBGA-B1295		1600 rpm	YES
P5020NXN7QMB,557	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	1295	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V		16		GRID ARRAY		1.05 V						BOTTOM		3.53 mm		37.5 mm		YES	64	166 MHz			37.5 mm	CMOS		1.1 V				1 mm	FIXED POINT	S-PBGA-B1295		1600 rpm	YES
HD6417727X100CV	Renesas Electronics	MICROPROCESSOR, RISC		GULL WING	240	FQFP	SQUARE	PLASTIC/EPOXY	YES	YES	2.05 V	8	26	32	FLATPACK, FINE PITCH	QFP240,1.3SQ,20	1.6 V	75 Cel	6	-20 Cel			QUAD		3.95 mm	16384	32 mm		YES	32	50 MHz	NOT SPECIFIED	NOT SPECIFIED	32 mm	CMOS	450 mA	1.9 V	4		3	.5 mm	FIXED POINT	S-PQFP-G240		100 rpm	YES
HD6417727X160CV	Renesas Electronics	MICROPROCESSOR, RISC		GULL WING	240	FQFP	SQUARE	PLASTIC/EPOXY	YES	YES	2.05 V	8	26	32	FLATPACK, FINE PITCH	QFP240,1.3SQ,20	1.7 V	75 Cel	6	-20 Cel			QUAD		3.95 mm	16384	32 mm		YES	32	66.67 MHz	NOT SPECIFIED	NOT SPECIFIED	32 mm	CMOS	650 mA	1.9 V	4		3	.5 mm	FIXED POINT	S-PQFP-G240		160 rpm	YES
AT97SC3205T-G3M4C20B	Microchip Technology	MICROPROCESSOR, RISC	COMMERCIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	NO	YES			0	8	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.16SQ,16		70 Cel		0 Cel			QUAD		.9 mm		4 mm		NO	0				4 mm	CMOS		3.3 V				.4 mm	FIXED POINT	S-PQCC-N32			NO
AT97SC3205T-H3M4C00B	Microchip Technology	MICROPROCESSOR, RISC	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	NO	YES			0	8	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.16SQ,16		85 Cel		-40 Cel			QUAD		.9 mm		4 mm		NO	0				4 mm	CMOS		3.3 V				.4 mm	FIXED POINT	S-PQCC-N32			NO
AT97SC3205T-H3M4C10B	Microchip Technology	MICROPROCESSOR, RISC	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	NO	YES			0	8	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.16SQ,16		85 Cel		-40 Cel			QUAD		.9 mm		4 mm		NO	0				4 mm	CMOS		3.3 V				.4 mm	FIXED POINT	S-PQCC-N32			NO
T1023NXE7PQA	NXP Semiconductors	MICROPROCESSOR	INDUSTRIAL	BALL	525	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V		16	64	GRID ARRAY, FINE PITCH	BGA525,23X23,32	.97 V	105 Cel	6	-40 Cel	TIN SILVER COPPER		BOTTOM		2.07 mm		19 mm		YES	32		40	260	19 mm	CMOS	5 mA	1 V	2		5	.8 mm	FIXED POINT	S-PBGA-B525	3	1400 rpm	YES	e1
T2080NXE8MQLB	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	896	BGA	SQUARE	PLASTIC/EPOXY	YES	YES				64	GRID ARRAY	BGA896(UNSPEC)		105 Cel		-40 Cel			BOTTOM						NO			30	250		CMOS							FIXED POINT	S-PBGA-B896	3	1200 rpm	NO
T2080NXN8P1B	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	896	BGA	SQUARE	PLASTIC/EPOXY	YES	YES				64	GRID ARRAY	BGA896(UNSPEC)		105 Cel		-40 Cel	TIN SILVER COPPER		BOTTOM						NO			30	250		CMOS							FIXED POINT	S-PBGA-B896	3	1533 rpm	NO	e1
MIMXRT1051DVJ6B	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.3 V	8	0	32	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA196,14X14,32	1.25 V	95 Cel	0	0 Cel	TIN SILVER		BOTTOM		1.52 mm	524288	12 mm		YES	0	24 MHz	40	260	12 mm	CMOS	105 mA		32		29	.8 mm	FLOATING-POINT	S-PBGA-B196	3	600 rpm	YES	e2
STM32MP151AAD3T	STMicroelectronics	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	257	TFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.25 V	8		32	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA257,19X19,25/20	1.18 V	125 Cel		-40 Cel			BOTTOM		1.2 mm	724992	10 mm	"TERM PITCH-MAX"	YES		48 MHz	NOT SPECIFIED	NOT SPECIFIED	10 mm	CMOS	100 mA	1.2 V	48		8	.65 mm	FLOATING-POINT	S-PBGA-B257		650 rpm	YES
STM32MP151AAB3T	STMicroelectronics	MICROPROCESSOR, RISC		BALL	354	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.25 V	8	26	32	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA354,19X19,32	1.18 V	125 Cel		-40 Cel			BOTTOM		1.29 mm	724992	16 mm		YES	16	48 MHz	NOT SPECIFIED	NOT SPECIFIED	16 mm	CMOS	940 mA	1.2 V	48		8	.8 mm	FLOATING POINT	S-PBGA-B354		650 rpm	YES
STM32MP151AAC3T	STMicroelectronics	MICROPROCESSOR, RISC		BALL	361	TFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.25 V	8	26	32	GRID ARRAY, THIN PROFILE, FINE PITCH	BGA361,23X23,25/20	1.18 V	125 Cel		-40 Cel			BOTTOM		1.2 mm	724992	12 mm		YES	16	48 MHz	NOT SPECIFIED	NOT SPECIFIED	12 mm	CMOS	940 mA	1.2 V	48		8	.65 mm	FLOATING POINT	S-PBGA-B361		650 rpm	YES
STM32MP151AAD3	STMicroelectronics	MICROPROCESSOR, RISC		BALL	257	TFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.25 V	8	26	32	GRID ARRAY, THIN PROFILE, FINE PITCH	BGA257,19X19,25/20	1.18 V	125 Cel		-40 Cel			BOTTOM		1.2 mm	724992	10 mm		YES	16	48 MHz	NOT SPECIFIED	NOT SPECIFIED	10 mm	CMOS	940 mA	1.2 V	48		8	.65 mm	FLOATING POINT	S-PBGA-B257		650 rpm	YES
STM32MP151AAA3T	STMicroelectronics	MICROPROCESSOR, RISC		BALL	448	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.25 V	8	26	32	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA448,22X22,32	1.18 V	125 Cel		-40 Cel	Tin/Silver/Copper/Nickel (Sn/Ag/Cu/Ni)		BOTTOM		1.32 mm	724992	18 mm		YES	16	48 MHz	30	260	18 mm	CMOS	940 mA	1.2 V	48		8	.8 mm	FLOATING POINT	S-PBGA-B448	3	650 rpm	YES	e2
STM32MP151DAA1	STMicroelectronics	MICROPROCESSOR, RISC		BALL	448	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.38 V	8	26	32	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA448,22X22,32	1.3 V	105 Cel		-20 Cel			BOTTOM		1.32 mm	724992	18 mm		YES	16	48 MHz			18 mm	CMOS	955 mA	1.34 V	48		8	.8 mm	FLOATING POINT	S-PBGA-B448		800 rpm	YES
STM32MP151DAB1	STMicroelectronics	MICROPROCESSOR, RISC		BALL	354	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.38 V	8	26	32	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA354,19X19,32	1.3 V	105 Cel		-20 Cel			BOTTOM		1.29 mm	724992	16 mm		YES	16	48 MHz			16 mm	CMOS	955 mA	1.34 V	48		8	.8 mm	FLOATING POINT	S-PBGA-B354		800 rpm	YES
STM32MP157DAC1	STMicroelectronics	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	361	TFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.25 V	8	26	32	GRID ARRAY, THIN PROFILE, FINE PITCH		.85 V	105 Cel		-20 Cel			BOTTOM		1.2 mm	724992	12 mm		YES	0	64 MHz			12 mm	CMOS	865 mA	.9 V	48			.65 mm	FLOATING POINT	S-PBGA-B361		800 rpm	YES
STM32MP157DAA1	STMicroelectronics	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	448	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.25 V	8	26	32	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA448,22X22,32	.85 V	105 Cel		-20 Cel			BOTTOM		1.32 mm	724992	18 mm		YES	0	64 MHz			18 mm	CMOS	865 mA	.9 V	48			.8 mm	FLOATING POINT	S-PBGA-B448		800 rpm	YES
OSD3358-512M-IND	Octavo Systems	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	400	BGA	SQUARE	PLASTIC/EPOXY	NO	YES		8	28		GRID ARRAY	BGA400,20X20,50		85 Cel	1	-40 Cel			BOTTOM		2.6 mm	65536	27 mm	64kbytes shared l3 ram also available	YES	16			245	27 mm	CMOS	2000 mA	1.1 V				1.27 mm	FIXED POINT	S-PBGA-B400	4	1000 rpm	NO
MC8640HJ1250HE	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	1023	HBGA	SQUARE	CERAMIC	YES	YES	1.1 V		32	32	GRID ARRAY, HEAT SINK/SLUG	BGA1023,32X32,40	1 V	105 Cel		0 Cel			BOTTOM		2.97 mm		33 mm		YES	32	166.66 MHz	30	245	33 mm	CMOS		1.05 V	4			1 mm	FLOATING POINT	S-CBGA-B1023	3	1250 rpm	NO
MC8640DTHJ1250HE	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	1023	HBGA	SQUARE	CERAMIC	YES	YES	1.1 V		32	32	GRID ARRAY, HEAT SINK/SLUG	BGA1023,32X32,40	1 V	105 Cel		-40 Cel			BOTTOM		2.97 mm		33 mm		YES	32	166.66 MHz	30	245	33 mm	CMOS		1.05 V	4			1 mm	FLOATING POINT	S-CBGA-B1023	3	1250 rpm	NO
MC8640DHJ1067NE	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	1023	HBGA	SQUARE	CERAMIC	YES	YES	1 V		32	32	GRID ARRAY, HEAT SINK/SLUG	BGA1023,32X32,40	.9 V	105 Cel		0 Cel			BOTTOM		2.97 mm		33 mm		YES	32	166.66 MHz	30	245	33 mm	CMOS		.95 V	4			1 mm	FLOATING POINT	S-CBGA-B1023	3	1067 rpm	NO
LX2080SC72029B	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	.88 V		36	64	GRID ARRAY	BGA1517.39X39,40	.82 V	105 Cel	12	0 Cel	TIN SILVER COPPER		BOTTOM		3.51 mm		40 mm		YES	128		30	245	40 mm	CMOS	.05 mA	.85 V			17	1 mm	FIXED POINT	S-PBGA-B1517	3	2000 rpm	YES	e1
LX2080SN71826B	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	.88 V		36	64	GRID ARRAY	BGA1517.39X39,40	.82 V	105 Cel	12	0 Cel	TIN SILVER COPPER		BOTTOM		3.51 mm		40 mm		YES	128		30	245	40 mm	CMOS	.05 mA	.85 V			17	1 mm	FIXED POINT	S-PBGA-B1517	3	1800 rpm	YES	e1
LX2080XC71826B	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	.88 V		36	64	GRID ARRAY	BGA1517.39X39,40	.82 V	105 Cel	12	-40 Cel	TIN SILVER COPPER		BOTTOM		3.51 mm		40 mm		YES	128		30	245	40 mm	CMOS	.05 mA	.85 V			17	1 mm	FIXED POINT	S-PBGA-B1517	3	1800 rpm	YES	e1
LX2080XC72029B	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	.88 V		36	64	GRID ARRAY	BGA1517.39X39,40	.82 V	105 Cel	12	-40 Cel	TIN SILVER COPPER		BOTTOM		3.51 mm		40 mm		YES	128		30	245	40 mm	CMOS	.05 mA	.85 V			17	1 mm	FIXED POINT	S-PBGA-B1517	3	2000 rpm	YES	e1
LX2080XE72232B	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	.88 V		36	64	GRID ARRAY	BGA1517.39X39,40	.82 V	105 Cel	12	-40 Cel			BOTTOM		3.51 mm		40 mm		YES	128		30	245	40 mm	CMOS	.05 mA	.85 V			17	1 mm	FIXED POINT	S-PBGA-B1517	3	2200 rpm	YES
LX2080XN72029B	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	.88 V		36	64	GRID ARRAY	BGA1517.39X39,40	.82 V	105 Cel	12	-40 Cel	TIN SILVER COPPER		BOTTOM		3.51 mm		40 mm		YES	128		30	245	40 mm	CMOS	.05 mA	.85 V			17	1 mm	FIXED POINT	S-PBGA-B1517	3	2000 rpm	YES	e1
LX2120SN71826B	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	.88 V		36	64	GRID ARRAY	BGA1517.39X39,40	.82 V	105 Cel	12	0 Cel	TIN SILVER COPPER		BOTTOM		3.51 mm		40 mm		YES	128		30	245	40 mm	CMOS	.05 mA	.85 V			17	1 mm	FIXED POINT	S-PBGA-B1517	3	1800 rpm	YES	e1
LX2120SN72029B	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	.88 V		36	64	GRID ARRAY	BGA1517.39X39,40	.82 V	105 Cel	12	0 Cel	TIN SILVER COPPER		BOTTOM		3.51 mm		40 mm		YES	128		30	245	40 mm	CMOS	.05 mA	.85 V			17	1 mm	FIXED POINT	S-PBGA-B1517	3	2000 rpm	YES	e1
LX2120XC72029B	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	.88 V		36	64	GRID ARRAY	BGA1517.39X39,40	.82 V	105 Cel	12	-40 Cel	TIN SILVER COPPER		BOTTOM		3.51 mm		40 mm		YES	128		30	245	40 mm	CMOS	.05 mA	.85 V			17	1 mm	FIXED POINT	S-PBGA-B1517	3	2000 rpm	YES	e1
LX2120XN71826B	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	.88 V		36	64	GRID ARRAY	BGA1517.39X39,40	.82 V	105 Cel	12	-40 Cel	TIN SILVER COPPER		BOTTOM		3.51 mm		40 mm		YES	128		30	245	40 mm	CMOS	.05 mA	.85 V			17	1 mm	FIXED POINT	S-PBGA-B1517	3	1800 rpm	YES	e1
LX2120XN72029B	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	.88 V		36	64	GRID ARRAY	BGA1517.39X39,40	.82 V	105 Cel	12	-40 Cel	TIN SILVER COPPER		BOTTOM		3.51 mm		40 mm		YES	128		30	245	40 mm	CMOS	.05 mA	.85 V			17	1 mm	FIXED POINT	S-PBGA-B1517	3	2000 rpm	YES	e1
LX2160SC72029B	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	.88 V		36	64	GRID ARRAY	BGA1517.39X39,40	.82 V	105 Cel	12	0 Cel	TIN SILVER COPPER		BOTTOM		3.51 mm		40 mm		YES	128		30	245	40 mm	CMOS	.05 mA	.85 V			17	1 mm	FIXED POINT	S-PBGA-B1517	3	2000 rpm	YES	e1

Microprocessors

A microprocessor is a small electronic component that serves as the central processing unit (CPU) of a computer or other electronic device. It is a programmable device that is capable of executing instructions and performing calculations.

Microprocessors are typically made up of millions of transistors and other components, all of which work together to perform complex calculations and operations. They are designed to be highly efficient, with the ability to process vast amounts of data quickly and accurately.

Microprocessors are used in a wide range of electronic devices, including computers, smartphones, tablets, and game consoles. They are also used in industrial control systems, medical devices, and other specialized applications.

One of the key advantages of microprocessors is their flexibility. They can be programmed to perform a wide range of functions and can be easily reprogrammed or updated as needed. This makes them ideal for a wide range of applications, from simple calculators to complex data processing systems.