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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	On Chip Data RAM Width	Screening Level	Address Bus Width	Bit Size	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	No. of External Interrupts	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	ROM Words	RAM Words	Width	Data EEPROM Size	Additional Features	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Maximum Supply Current	Nominal Supply Voltage	No. of DMA Channels	No. of Serial I/Os	Connectivity	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Speed	Low Power Mode	JESD-609 Code
MCIMX6S1AVM08AD	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.5 V			16		GRID ARRAY, LOW PROFILE, FINE PITCH		1.275 V	125 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm			21 mm		24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE	YES	32		40	260	21 mm	CMOS						.8 mm	FLOATING POINT	S-PBGA-B624	3	800 rpm	YES	e1
MCIMX6S1AVM10AD	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.5 V			16		GRID ARRAY, LOW PROFILE, FINE PITCH		1.4 V	125 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm			21 mm		24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE	YES	32		40	260	21 mm	CMOS						.8 mm	FLOATING POINT	S-PBGA-B624	3	1000 rpm	YES	e1
MCIMX6S4AVM08AD	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.5 V			16		GRID ARRAY, LOW PROFILE, FINE PITCH		1.275 V	125 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm			21 mm		24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE	YES	32		40	260	21 mm	CMOS						.8 mm	FLOATING POINT	S-PBGA-B624	3	800 rpm	YES	e1
MCIMX6S4AVM10AD	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.5 V			16		GRID ARRAY, LOW PROFILE, FINE PITCH		1.4 V	125 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm			21 mm		24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE	YES	32		40	260	21 mm	CMOS						.8 mm	FLOATING POINT	S-PBGA-B624	3	1000 rpm	YES	e1
MCIMX6S6AVM08AD	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.5 V			16		GRID ARRAY, LOW PROFILE, FINE PITCH		1.275 V	125 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm			21 mm		24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE	YES	32		40	260	21 mm	CMOS						.8 mm	FLOATING POINT	S-PBGA-B624	3	800 rpm	YES	e1
MCIMX6S6AVM10AD	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.5 V			16		GRID ARRAY, LOW PROFILE, FINE PITCH		1.4 V	125 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm			21 mm		24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE	YES	32		40	260	21 mm	CMOS						.8 mm	FLOATING POINT	S-PBGA-B624	3	1000 rpm	YES	e1
MCIMX6U1AVM08AD	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.5 V			16		GRID ARRAY, LOW PROFILE, FINE PITCH		1.275 V	125 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm			21 mm		24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE	YES	64		40	260	21 mm	CMOS						.8 mm	FLOATING POINT	S-PBGA-B624	3	800 rpm	YES	e1
MCIMX6U1AVM10AD	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.5 V			16		GRID ARRAY, LOW PROFILE, FINE PITCH		1.4 V	125 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm			21 mm		24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE	YES	64		40	260	21 mm	CMOS						.8 mm	FLOATING POINT	S-PBGA-B624	3	1000 rpm	YES	e1
MCIMX6U4AVM08AD	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.5 V			16		GRID ARRAY, LOW PROFILE, FINE PITCH		1.275 V	125 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm			21 mm		24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE	YES	64		40	260	21 mm	CMOS						.8 mm	FLOATING POINT	S-PBGA-B624	3	800 rpm	YES	e1
MCIMX6U4AVM10AD	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.5 V			16		GRID ARRAY, LOW PROFILE, FINE PITCH		1.4 V	125 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm			21 mm		24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE	YES	64		40	260	21 mm	CMOS						.8 mm	FLOATING POINT	S-PBGA-B624	3	1000 rpm	YES	e1
MCIMX6U6AVM08AD	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.5 V			16		GRID ARRAY, LOW PROFILE, FINE PITCH		1.275 V	125 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm			21 mm		24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE	YES	64		40	260	21 mm	CMOS						.8 mm	FLOATING POINT	S-PBGA-B624	3	800 rpm	YES	e1
MCIMX6U6AVM10AD	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.5 V			16		GRID ARRAY, LOW PROFILE, FINE PITCH		1.4 V	125 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm			21 mm		24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE	YES	64		40	260	21 mm	CMOS						.8 mm	FLOATING POINT	S-PBGA-B624	3	1000 rpm	YES	e1
AM3358BZCE60	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	298	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.144 V			28	32	GRID ARRAY, LOW PROFILE, FINE PITCH		1.056 V	90 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm			13 mm		ALSO HAVING MULTIPLEXED 16 BIT ADDRESS	YES	16	26 MHz	30	260	13 mm	CMOS		1.1 V				.65 mm	FIXED POINT	S-PBGA-B298	3	600 rpm	YES	e1
AMIC120BZDNA30	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	491	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.144 V	8		16	32	GRID ARRAY, LOW PROFILE, FINE PITCH		1.056 V	105 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm	0	524288	17 mm	0	ALSO HAVING 28-BIT ADDRESS AND 16-BIT DATA OF GPMC	YES	32		30	260	17 mm	CMOS	600 mA	1.1 V	64	4	CAN, ETHERNET, I2C, SPI(2), UART, USB	.65 mm	FIXED POINT	S-PBGA-B491	3	300 rpm	YES	e1
STA1080EOA	STMicroelectronics	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V					GRID ARRAY, LOW PROFILE, FINE PITCH		1.14 V	85 Cel		-40 Cel		BOTTOM	1.7 mm			16 mm			YES			NOT SPECIFIED	NOT SPECIFIED	16 mm	CMOS						.8 mm	FIXED POINT	S-PBGA-B361		450 rpm	NO
STA1090HOA	STMicroelectronics	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V					GRID ARRAY, LOW PROFILE, FINE PITCH		1.14 V	85 Cel		-40 Cel		BOTTOM	1.7 mm			16 mm			YES			NOT SPECIFIED	NOT SPECIFIED	16 mm	CMOS						.8 mm	FIXED POINT	S-PBGA-B361		533 rpm	NO
HD6417750SX200V	Renesas Electronics	MICROPROCESSOR, RISC	COMMERCIAL EXTENDED	GULL WING	208	FQFP	SQUARE	PLASTIC/EPOXY	YES	YES	2.07 V			26	32	FLATPACK, FINE PITCH		1.8 V	75 Cel		-20 Cel	TIN BISMUTH	QUAD	3.56 mm			28 mm			YES	64	67 MHz			28 mm	CMOS		1.95 V				.5 mm	FLOATING POINT	S-PQFP-G208		200 rpm	YES	e6
T2081NSN8TTB	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.055 V			16		GRID ARRAY, FINE PITCH		.995 V	105 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	2.61 mm			23 mm			YES	64		30	250	23 mm	CMOS		1.025 V				.8 mm	FIXED POINT	S-PBGA-B780	3	1800 rpm	YES	e1
T2081NSE8MQLB	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.055 V			16		GRID ARRAY, FINE PITCH		.995 V	105 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	2.61 mm			23 mm			YES	64		30	250	23 mm	CMOS		1.025 V				.8 mm	FIXED POINT	S-PBGA-B780	3	1200 rpm	YES	e1
T2081NSE8P1B	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.055 V			16		GRID ARRAY, FINE PITCH		.995 V	105 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	2.61 mm			23 mm			YES	64		30	250	23 mm	CMOS		1.025 V				.8 mm	FIXED POINT	S-PBGA-B780	3	1533 rpm	YES	e1
T2081NSE8PTB	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.055 V			16		GRID ARRAY, FINE PITCH		.995 V	105 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	2.61 mm			23 mm			YES	64		30	250	23 mm	CMOS		1.025 V				.8 mm	FIXED POINT	S-PBGA-B780	3	1533 rpm	YES	e1
T2081NSE8T1B	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.055 V			16		GRID ARRAY, FINE PITCH		.995 V	105 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	2.61 mm			23 mm			YES	64		30	250	23 mm	CMOS		1.025 V				.8 mm	FIXED POINT	S-PBGA-B780	3	1800 rpm	YES	e1
T2081NSE8TTB	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.055 V			16		GRID ARRAY, FINE PITCH		.995 V	105 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	2.61 mm			23 mm			YES	64		30	250	23 mm	CMOS		1.025 V				.8 mm	FIXED POINT	S-PBGA-B780	3	1800 rpm	YES	e1
T2081NSN8MQLB	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.055 V			16		GRID ARRAY, FINE PITCH		.995 V	105 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	2.61 mm			23 mm			YES	64		30	250	23 mm	CMOS		1.025 V				.8 mm	FIXED POINT	S-PBGA-B780	3	1200 rpm	YES	e1
T2081NSN8P1B	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.055 V			16		GRID ARRAY, FINE PITCH		.995 V	105 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	2.61 mm			23 mm			YES	64		30	250	23 mm	CMOS		1.025 V				.8 mm	FIXED POINT	S-PBGA-B780	3	1533 rpm	YES	e1
T2081NSN8PTB	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.055 V			16		GRID ARRAY, FINE PITCH		.995 V	105 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	2.61 mm			23 mm			YES	64		30	250	23 mm	CMOS		1.025 V				.8 mm	FIXED POINT	S-PBGA-B780	3	1533 rpm	YES	e1
T2081NSN8T1B	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.055 V			16		GRID ARRAY, FINE PITCH		.995 V	105 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	2.61 mm			23 mm			YES	64		30	250	23 mm	CMOS		1.025 V				.8 mm	FIXED POINT	S-PBGA-B780	3	1800 rpm	YES	e1
T2081NXE8MQLB	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.055 V			16		GRID ARRAY, FINE PITCH		.995 V	105 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	2.61 mm			23 mm			YES	64		30	250	23 mm	CMOS		1.025 V				.8 mm	FIXED POINT	S-PBGA-B780	3	1200 rpm	YES	e1
T2081NXE8P1B	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.055 V			16		GRID ARRAY, FINE PITCH		.995 V	105 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	2.61 mm			23 mm			YES	64		30	250	23 mm	CMOS		1.025 V				.8 mm	FIXED POINT	S-PBGA-B780	3	1533 rpm	YES	e1
T2081NXE8PTB	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.055 V			16		GRID ARRAY, FINE PITCH		.995 V	105 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	2.61 mm			23 mm			YES	64		30	250	23 mm	CMOS		1.025 V				.8 mm	FIXED POINT	S-PBGA-B780	3	1533 rpm	YES	e1
T2081NXE8T1B	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.055 V			16		GRID ARRAY, FINE PITCH		.995 V	105 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	2.61 mm			23 mm			YES	64		30	250	23 mm	CMOS		1.025 V				.8 mm	FIXED POINT	S-PBGA-B780	3	1800 rpm	YES	e1
T2081NXE8TTB	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.055 V			16		GRID ARRAY, FINE PITCH		.995 V	105 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	2.61 mm			23 mm			YES	64		30	250	23 mm	CMOS		1.025 V				.8 mm	FIXED POINT	S-PBGA-B780	3	1800 rpm	YES	e1
T2081NXN8MQLB	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.055 V			16		GRID ARRAY, FINE PITCH		.995 V	105 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	2.61 mm			23 mm			YES	64		30	250	23 mm	CMOS		1.025 V				.8 mm	FIXED POINT	S-PBGA-B780	3	1200 rpm	YES	e1
T2081NXN8P1B	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.055 V			16		GRID ARRAY, FINE PITCH		.995 V	105 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	2.61 mm			23 mm			YES	64		30	250	23 mm	CMOS		1.025 V				.8 mm	FIXED POINT	S-PBGA-B780	3	1533 rpm	YES	e1
T2081NXN8PTB	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.055 V			16		GRID ARRAY, FINE PITCH		.995 V	105 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	2.61 mm			23 mm			YES	64		30	250	23 mm	CMOS		1.025 V				.8 mm	FIXED POINT	S-PBGA-B780	3	1533 rpm	YES	e1
T2081NXN8T1B	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.055 V			16		GRID ARRAY, FINE PITCH		.995 V	105 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	2.61 mm			23 mm			YES	64		30	250	23 mm	CMOS		1.025 V				.8 mm	FIXED POINT	S-PBGA-B780	3	1800 rpm	YES	e1
T2081NXN8TTB	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	780	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.055 V			16		GRID ARRAY, FINE PITCH		.995 V	105 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	2.61 mm			23 mm			YES	64		30	250	23 mm	CMOS		1.025 V				.8 mm	FIXED POINT	S-PBGA-B780	3	1800 rpm	YES	e1
FS32V232BMN1VUB	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	621	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	8	AEC-Q100	0	64	GRID ARRAY, FINE PITCH	BGA621,25X25,25	.95 V	125 Cel	1	-40 Cel		BOTTOM	2.44 mm		4194304	17 mm			YES	0	40 MHz	40	260	17 mm	CMOS		1 V	32	0		.65 mm	FLOATING POINT	S-PBGA-B621	3	800 rpm	YES
FS32V234BJN1VUB	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	621	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	8	AEC-Q100	0	64	GRID ARRAY, FINE PITCH	BGA621,25X25,25	.95 V	125 Cel	1	-40 Cel	TIN SILVER	BOTTOM	2.44 mm		4194304	17 mm			YES	0	40 MHz	40	260	17 mm	CMOS		1 V	32	0		.65 mm	FLOATING POINT	S-PBGA-B621	3	800 rpm	YES	e2
FS32V234BLN1VUB	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	621	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	8	AEC-Q100	0	64	GRID ARRAY, FINE PITCH	BGA621,25X25,25	.95 V	125 Cel	1	-40 Cel	TIN SILVER	BOTTOM	2.44 mm		4194304	17 mm			YES	0	40 MHz	40	260	17 mm	CMOS		1 V	32	0		.65 mm	FLOATING POINT	S-PBGA-B621	3	800 rpm	YES	e2
FS32V234BMN1VUB	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	621	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	8	AEC-Q100	0	64	GRID ARRAY, FINE PITCH	BGA621,25X25,25	.95 V	125 Cel	1	-40 Cel	TIN SILVER	BOTTOM	2.44 mm		4194304	17 mm			YES	0	40 MHz	40	260	17 mm	CMOS		1 V	32	0		.65 mm	FLOATING POINT	S-PBGA-B621	3	800 rpm	YES	e2
FS32V234CKN1VUB	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	621	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	8		0	64	GRID ARRAY, FINE PITCH	BGA621,25X25,25	.95 V	125 Cel	1	-40 Cel	TIN SILVER	BOTTOM	2.44 mm		4194304	17 mm			YES	0	40 MHz	40	260	17 mm	CMOS		1 V	32	0		.65 mm	FLOATING POINT	S-PBGA-B621	3	1000 rpm	YES	e2
FS32V234CMN1VUB	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	621	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	8	AEC-Q100	0	64	GRID ARRAY, FINE PITCH	BGA621,25X25,25	.95 V	125 Cel	1	-40 Cel	TIN SILVER	BOTTOM	2.44 mm		4194304	17 mm			YES	0	40 MHz	40	260	17 mm	CMOS		1 V	32	0		.65 mm	FLOATING POINT	S-PBGA-B621	3	1000 rpm	YES	e2
FS32V234CON1VUB	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	621	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	8		0	64	GRID ARRAY, FINE PITCH	BGA621,25X25,25	.95 V	125 Cel	1	-40 Cel	TIN SILVER	BOTTOM	2.44 mm		4194304	17 mm			YES	0	40 MHz	40	260	17 mm	CMOS		1 V	32	0		.65 mm	FLOATING POINT	S-PBGA-B621	3	1000 rpm	YES	e2
SVF311R3K2CKU2	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	GULL WING	176	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V			0		FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH		1.16 V	85 Cel		-40 Cel	TIN	QUAD	1.6 mm			24 mm			YES	0		40	260	24 mm	CMOS		1.23 V				.5 mm	FLOATING POINT	S-PQFP-G176	3	266 rpm	YES	e3
P1012NXE2HFB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	689	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V			16	32	GRID ARRAY		.95 V				TIN SILVER	BOTTOM	2.46 mm			31 mm			YES	32		40	260	31 mm	CMOS		1 V				1 mm	FLOATING POINT	S-PBGA-B689	3	800 rpm	YES	e2
CP3CN37VVAWQX/NOPB	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	GULL WING	144	LFQFP	SQUARE	PLASTIC/EPOXY	YES	YES	3.7 V			20		FLATPACK, LOW PROFILE, FINE PITCH		2.7 V	85 Cel		-40 Cel	MATTE TIN	QUAD	1.6 mm			20 mm			YES	16		30	260	20 mm	CMOS		3.3 V				.5 mm	FIXED POINT	S-PQFP-G144	3	96 rpm	YES	e3
MIMXRT1051DVL6A	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.3 V	8		0	32	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA196,14X14,25	1.25 V	95 Cel	0	0 Cel		BOTTOM	1.43 mm		524288	10 mm			YES	0	24 MHz			10 mm	CMOS	105 mA		32	29		.65 mm	FLOATING-POINT	S-PBGA-B196		600 rpm	YES

Microprocessors

A microprocessor is a small electronic component that serves as the central processing unit (CPU) of a computer or other electronic device. It is a programmable device that is capable of executing instructions and performing calculations.

Microprocessors are typically made up of millions of transistors and other components, all of which work together to perform complex calculations and operations. They are designed to be highly efficient, with the ability to process vast amounts of data quickly and accurately.

Microprocessors are used in a wide range of electronic devices, including computers, smartphones, tablets, and game consoles. They are also used in industrial control systems, medical devices, and other specialized applications.

One of the key advantages of microprocessors is their flexibility. They can be programmed to perform a wide range of functions and can be easily reprogrammed or updated as needed. This makes them ideal for a wide range of applications, from simple calculators to complex data processing systems.