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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	On Chip Data RAM Width	Address Bus Width	Bit Size	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	No. of External Interrupts	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	RAM Words	Width	Additional Features	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Maximum Supply Current	Nominal Supply Voltage	No. of DMA Channels	No. of Serial I/Os	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Speed	Low Power Mode	JESD-609 Code
AM5749ABZX	Texas Instruments	MICROPROCESSOR, RISC	COMMERCIAL	BALL	760	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.2 V		16		GRID ARRAY, LOW PROFILE, FINE PITCH		1.11 V	70 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.63 mm		23 mm		YES	32	38.4 MHz	30	250	23 mm	CMOS		1.15 V			.8 mm	FIXED POINT	S-PBGA-B760	3	1500 rpm	YES	e1
MIMXRT1061DVJ6A	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.3 V	8			GRID ARRAY, LOW PROFILE, FINE PITCH	BGA196,14X14,32	1.25 V	95 Cel		0 Cel	TIN SILVER	BOTTOM	1.52 mm	1048576	12 mm		YES		24 MHz	40	260	12 mm	CMOS	110 mA		32	8	.8 mm	FLOATING POINT	S-PBGA-B196	3	600 rpm	YES	e2
AM5729BABCXA	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY	NO	YES	1.2 V		16		GRID ARRAY, FINE PITCH	BGA760,28X28,31	1.11 V	105 Cel		-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	2.96 mm		23 mm	ALSO HAVING 16-BIT ADDRESS AND 32-BIT DATA BUS OF EMIF2	YES	32	32 MHz		250	23 mm	CMOS		1.15 V			.8 mm	FIXED POINT	S-PBGA-B760	3	1500 rpm	YES	e1
AM5729BABCXEAR	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY	NO	YES	1.2 V		16		GRID ARRAY, FINE PITCH	BGA760,28X28,31	1.11 V	105 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	2.96 mm		23 mm	ALSO HAVING 16-BIT ADDRESS AND 32-BIT DATA BUS OF EMIF2	YES	32	32 MHz	30	250	23 mm	CMOS		1.15 V			.8 mm	FIXED POINT	S-PBGA-B760	3	1500 rpm	YES	e1
AM5729BABCXEA	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY	NO	YES	1.2 V		16		GRID ARRAY, FINE PITCH	BGA760,28X28,31	1.11 V	105 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	2.96 mm		23 mm	ALSO HAVING 16-BIT ADDRESS AND 32-BIT DATA BUS OF EMIF2	YES	32	32 MHz	30	250	23 mm	CMOS		1.15 V			.8 mm	FIXED POINT	S-PBGA-B760	3	1500 rpm	YES	e1
AM5729BABCX	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY	NO	YES	1.2 V		16		GRID ARRAY, FINE PITCH	BGA760,28X28,31	1.11 V	90 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	2.96 mm		23 mm	ALSO HAVING 16-BIT ADDRESS AND 32-BIT DATA BUS OF EMIF2	YES	32	32 MHz	30	250	23 mm	CMOS		1.15 V			.8 mm	FIXED POINT	S-PBGA-B760	3	1500 rpm	YES	e1
STM32MP157AAA3	STMicroelectronics	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	448	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.25 V	8	26	32	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA448,22X22,32	.85 V	125 Cel		-40 Cel		BOTTOM	1.32 mm	724992	18 mm		YES	0	64 MHz	NOT SPECIFIED	NOT SPECIFIED	18 mm	CMOS	1000 mA	.9 V	48		.8 mm	FLOATING POINT	S-PBGA-B448		650 rpm	YES
STM32MP157AAB3T	STMicroelectronics	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	354	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.25 V	8	16	32	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA354,19X19,32	.85 V	125 Cel		-40 Cel		BOTTOM	1.29 mm	724992	16 mm		YES	16	64 MHz	NOT SPECIFIED	NOT SPECIFIED	16 mm	CMOS	1000 mA	.9 V	48		.8 mm	FLOATING POINT	S-PBGA-B354		650 rpm	YES
STM32MP157AAB3	STMicroelectronics	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	354	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.25 V	8	16	32	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA354,19X19,32	.85 V	125 Cel		-40 Cel		BOTTOM	1.29 mm	724992	16 mm		YES	16	64 MHz	NOT SPECIFIED	NOT SPECIFIED	16 mm	CMOS	1000 mA	.9 V	48		.8 mm	FLOATING POINT	S-PBGA-B354		650 rpm	YES
STM32MP157AAC3	STMicroelectronics	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	361	TFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.25 V	8	26	32	GRID ARRAY, THIN PROFILE, FINE PITCH		.85 V	125 Cel		-40 Cel		BOTTOM	1.2 mm	724992	12 mm		YES	0	64 MHz	NOT SPECIFIED	NOT SPECIFIED	12 mm	CMOS	1000 mA	.9 V	48		.65 mm	FLOATING POINT	S-PBGA-B361		650 rpm	YES
STM32MP157AAD3	STMicroelectronics	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	257	TFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.25 V	8	16	32	GRID ARRAY, THIN PROFILE, FINE PITCH		.85 V	125 Cel		-40 Cel		BOTTOM	1.2 mm	724992	10 mm		YES	16	64 MHz	NOT SPECIFIED	NOT SPECIFIED	10 mm	CMOS	1000 mA	.9 V	48		.65 mm	FLOATING POINT	S-PBGA-B257		650 rpm	YES
MIMXRT1064DVJ6A	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	196	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.3 V	8	0	32	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA196,14X14,32	1.25 V	85 Cel	0	0 Cel	TIN SILVER COPPER	BOTTOM	1.52 mm	1048576	12 mm		YES	0	24 MHz	40	260	12 mm	CMOS	110 mA		32	10	.8 mm	FLOATING-POINT	S-PBGA-B196	3	600 rpm	YES	e1
AT91SAM9260B-CU-100	Microchip Technology	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	217	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.95 V	8	26	32	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA217,17X17,32	1.65 V	85 Cel	3	-40 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm	8192	15 mm		YES	32	50 MHz			15 mm	CMOS		1.8 V	22		.8 mm	FIXED POINT	S-PBGA-B217		210 rpm	YES	e1
AT91SAM9263B-CU-999	Microchip Technology	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	324	TFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V	8	26	32	GRID ARRAY, THIN PROFILE, FINE PITCH	BGA324,18X18,32	1.08 V	85 Cel	2	-40 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm	98304	15 mm		YES	32	50 MHz			15 mm	CMOS	73.3 mA	1.2 V	22		.8 mm	FIXED POINT	S-PBGA-B324		240 rpm	YES	e1
66AK2H06BAAW24	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		16		GRID ARRAY		.95 V	85 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	3.75 mm		40 mm		YES	64		30	245	40 mm	CMOS		1 V			1 mm	FLOATING POINT	S-PBGA-B1517	4	1400 rpm	YES	e1
66AK2H06BAAW2	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		16		GRID ARRAY		.95 V	85 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	3.75 mm		40 mm		YES	64		30	245	40 mm	CMOS		1 V			1 mm	FLOATING POINT	S-PBGA-B1517	4	1200 rpm	YES	e1
66AK2H06BAAWA24	Texas Instruments	MICROPROCESSOR, RISC		BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		16		GRID ARRAY		.95 V				TIN SILVER COPPER	BOTTOM	3.75 mm		40 mm		YES	64		30	245	40 mm	CMOS		1 V			1 mm	FLOATING POINT	S-PBGA-B1517	4	1400 rpm	YES	e1
66AK2H06BAAWA2	Texas Instruments	MICROPROCESSOR, RISC		BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		16		GRID ARRAY		.95 V				TIN SILVER COPPER	BOTTOM	3.75 mm		40 mm		YES	64		30	245	40 mm	CMOS		1 V			1 mm	FLOATING POINT	S-PBGA-B1517	4	1200 rpm	YES	e1
66AK2H06BXAAW2	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		16		GRID ARRAY		.95 V	85 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	3.75 mm		40 mm		YES	64		30	245	40 mm	CMOS		1 V			1 mm	FLOATING POINT	S-PBGA-B1517	4	1200 rpm	YES	e1
66AK2H12BAAW24	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		16		GRID ARRAY		.95 V	85 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	3.75 mm		40 mm		YES	64		30	245	40 mm	CMOS		1 V			1 mm	FLOATING POINT	S-PBGA-B1517	4	1400 rpm	YES	e1
66AK2H12BAAW2	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		16		GRID ARRAY		.95 V	85 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	3.75 mm		40 mm		YES	64		30	245	40 mm	CMOS		1 V			1 mm	FLOATING POINT	S-PBGA-B1517	4	1200 rpm	YES	e1
66AK2H12BAAWA24	Texas Instruments	MICROPROCESSOR, RISC		BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		16		GRID ARRAY		.95 V				TIN SILVER COPPER	BOTTOM	3.75 mm		40 mm		YES	64		30	245	40 mm	CMOS		1 V			1 mm	FLOATING POINT	S-PBGA-B1517	4	1400 rpm	YES	e1
66AK2H12BAAWA2	Texas Instruments	MICROPROCESSOR, RISC		BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		16		GRID ARRAY		.95 V				TIN SILVER COPPER	BOTTOM	3.75 mm		40 mm		YES	64		30	245	40 mm	CMOS		1 V			1 mm	FLOATING POINT	S-PBGA-B1517	4	1200 rpm	YES	e1
66AK2H12BXAAW2	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		16		GRID ARRAY		.95 V	85 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	3.75 mm		40 mm		YES	64		30	245	40 mm	CMOS		1 V			1 mm	FLOATING POINT	S-PBGA-B1517	4	1200 rpm	YES	e1
66AK2H14BAAW24	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		16		GRID ARRAY		.95 V	85 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	3.75 mm		40 mm		YES	64		30	245	40 mm	CMOS		1 V			1 mm	FLOATING POINT	S-PBGA-B1517	4	1400 rpm	YES	e1
66AK2H14BAAWA24	Texas Instruments	MICROPROCESSOR, RISC		BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		16		GRID ARRAY		.95 V				TIN SILVER COPPER	BOTTOM	3.75 mm		40 mm		YES	64		30	245	40 mm	CMOS		1 V			1 mm	FLOATING POINT	S-PBGA-B1517	4	1400 rpm	YES	e1
66AK2H14BXAAW24	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		16		GRID ARRAY		.95 V	85 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	3.75 mm		40 mm		YES	64		30	245	40 mm	CMOS		1 V			1 mm	FLOATING POINT	S-PBGA-B1517	4	1400 rpm	YES	e1
AM3356BZCEA60	Texas Instruments	MICROPROCESSOR, RISC		BALL	298	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.248 V	8	28	32	GRID ARRAY, LOW PROFILE, FINE PITCH		1.152 V				TIN SILVER COPPER	BOTTOM	1.3 mm	131072	13 mm		YES	16	26 MHz	30	260	13 mm	CMOS	400 mA	1.2 V	64		.65 mm	FIXED POINT	S-PBGA-B298	3	600 rpm	YES	e1
DM388AAARD11F	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	609	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.42 V	8	28	32	GRID ARRAY, LOW PROFILE, FINE PITCH		1.28 V	90 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.32 mm	655360	16 mm		YES	16	30 MHz	30	260	16 mm	CMOS		1.35 V	72		.5 mm	FLOATING POINT	S-PBGA-B609	3	970 rpm	YES	e1
DM388AAARD11	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	609	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.42 V	8	28	32	GRID ARRAY, LOW PROFILE, FINE PITCH		1.28 V	95 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.32 mm	655360	16 mm		YES	16	30 MHz	30	260	16 mm	CMOS		1.35 V	72		.5 mm	FLOATING POINT	S-PBGA-B609	3	970 rpm	YES	e1
TMS320DM8127BCYED3	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	684	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.42 V		28	32	GRID ARRAY, FINE PITCH		1.28 V	90 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	3.06 mm		23 mm		YES	16	30 MHz	30	250	23 mm	CMOS		1.35 V			.8 mm	FLOATING POINT	S-PBGA-B684	4	1000 rpm	YES	e1
TMS320DM8127SCYE0	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	684	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.16 V	8	28	32	GRID ARRAY, FINE PITCH		1.05 V	90 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	3.06 mm	851968	23 mm		YES	16	30 MHz	30	250	23 mm	CMOS		1.1 V	72		.8 mm	FLOATING POINT	S-PBGA-B684	4	1000 rpm	YES	e1
TMS320DM8127SCYE1	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	684	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	8	28	32	GRID ARRAY, FINE PITCH		1.14 V	90 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	3.06 mm	851968	23 mm		YES	16	30 MHz	30	250	23 mm	CMOS		1.2 V	72		.8 mm	FLOATING POINT	S-PBGA-B684	4	1000 rpm	YES	e1
TMS320DM8127SCYE2	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	684	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.42 V	8	28	32	GRID ARRAY, FINE PITCH		1.28 V	90 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	3.06 mm	851968	23 mm		YES	16	30 MHz	30	250	23 mm	CMOS		1.35 V	72		.8 mm	FLOATING POINT	S-PBGA-B684	4	1000 rpm	YES	e1
TMS320DM8127SCYE3	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	684	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.42 V	8	28	32	GRID ARRAY, FINE PITCH		1.28 V	90 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	3.06 mm	851968	23 mm		YES	16	30 MHz	30	250	23 mm	CMOS		1.35 V	72		.8 mm	FLOATING POINT	S-PBGA-B684	4	1000 rpm	YES	e1
TMS320DM8127SCYED0	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	684	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.16 V	8	28	32	GRID ARRAY, FINE PITCH		1.05 V	90 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	3.06 mm	851968	23 mm		YES	16	30 MHz	30	250	23 mm	CMOS		1.1 V	72		.8 mm	FLOATING POINT	S-PBGA-B684	4	1000 rpm	YES	e1
TMS320DM8127SCYED2	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	684	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.42 V	8	28	32	GRID ARRAY, FINE PITCH		1.28 V	90 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	3.06 mm	851968	23 mm		YES	16	30 MHz	30	250	23 mm	CMOS		1.35 V	72		.8 mm	FLOATING POINT	S-PBGA-B684	4	1000 rpm	YES	e1
TMS320DM8127SCYED3	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	684	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.42 V	8	28	32	GRID ARRAY, FINE PITCH		1.28 V	90 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	3.06 mm	851968	23 mm		YES	16	30 MHz	30	250	23 mm	CMOS		1.35 V	72		.8 mm	FLOATING POINT	S-PBGA-B684	4	1000 rpm	YES	e1
AM3358BGCZA80EP	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	324	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.144 V		28	32	GRID ARRAY		1.056 V	105 Cel		-40 Cel	TIN LEAD	BOTTOM					YES	16		20	220		CMOS		1.1 V				FIXED POINT	S-PBGA-B324	3	800 rpm	YES	e0
AM3352BZCZT60R	Texas Instruments	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	324	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.248 V	8	28	32	GRID ARRAY, LOW PROFILE, FINE PITCH		1.152 V	125 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm	131072	15 mm		YES	16	26 MHz	30	260	15 mm	CMOS	400 mA	1.2 V	64		.8 mm	FIXED POINT	S-PBGA-B324	3	600 rpm	YES	e1
AM3352BZCZT60	Texas Instruments	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	324	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.248 V	8	28	32	GRID ARRAY, LOW PROFILE, FINE PITCH		1.152 V	125 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm	131072	15 mm		YES	16	26 MHz	30	260	15 mm	CMOS	400 mA	1.2 V	64		.8 mm	FIXED POINT	S-PBGA-B324	3	600 rpm	YES	e1
XAM5728AABCXE	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY	NO	YES	1.2 V		16		GRID ARRAY, FINE PITCH		1.11 V	90 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	2.55 mm		23 mm		YES	32	38.4 MHz	30	250	23 mm	CMOS		1.15 V			.8 mm	FLOATING POINT	S-PBGA-B760	3	1500 rpm	YES	e1
XAM5718ABCXE	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY	NO	YES	1.2 V		16		GRID ARRAY, FINE PITCH		1.11 V	90 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	2.96 mm		23 mm		YES	32	38.4 MHz	30	250	23 mm	CMOS		1.15 V			.8 mm	FLOATING POINT	S-PBGA-B760	3	1500 rpm	YES	e1
AM1705DPTPD4	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	GULL WING	176	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	YES		8	13	32	FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH			105 Cel		-40 Cel	NICKEL PALLADIUM GOLD	QUAD	1.6 mm	172032	24 mm		YES	16	50 MHz	30	260	24 mm	CMOS		1.2 V	40		.5 mm	FIXED POINT	S-PQFP-G176	4	375 rpm	YES	e4
AM3351BZCE30	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	298	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.144 V	8	16	32	GRID ARRAY, LOW PROFILE, FINE PITCH		1.056 V	90 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm	131072	13 mm		YES	16	26 MHz	30	260	13 mm	CMOS	400 mA	1.1 V	64		.65 mm	FIXED POINT	S-PBGA-B298	3	300 rpm	YES	e1
AM3351BZCE60	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	298	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.144 V	8	16	32	GRID ARRAY, LOW PROFILE, FINE PITCH		1.056 V	90 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm	131072	13 mm		YES	16	26 MHz	30	260	13 mm	CMOS	400 mA	1.1 V	64		.65 mm	FIXED POINT	S-PBGA-B298	3	600 rpm	YES	e1
MCIMX6D6AVT10ADR	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES				32	GRID ARRAY, FINE PITCH			125 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	2.16 mm		21 mm	64-BIT BUS WIDTH AVAILABLE	YES			40	260	21 mm	CMOS					.8 mm	FIXED POINT	S-PBGA-B624	3	1000 rpm	NO	e1
T2080NXE8TTB	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	896	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES				64	GRID ARRAY, FINE PITCH			105 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	2.61 mm		25 mm		NO			30	250	25 mm	CMOS					.8 mm	FIXED POINT	S-PBGA-B896	3	1800 rpm	NO	e1

Microprocessors

A microprocessor is a small electronic component that serves as the central processing unit (CPU) of a computer or other electronic device. It is a programmable device that is capable of executing instructions and performing calculations.

Microprocessors are typically made up of millions of transistors and other components, all of which work together to perform complex calculations and operations. They are designed to be highly efficient, with the ability to process vast amounts of data quickly and accurately.

Microprocessors are used in a wide range of electronic devices, including computers, smartphones, tablets, and game consoles. They are also used in industrial control systems, medical devices, and other specialized applications.

One of the key advantages of microprocessors is their flexibility. They can be programmed to perform a wide range of functions and can be easily reprogrammed or updated as needed. This makes them ideal for a wide range of applications, from simple calculators to complex data processing systems.