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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	On Chip Data RAM Width	Address Bus Width	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	RAM Words	Width	Additional Features	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Maximum Supply Current	Nominal Supply Voltage	No. of DMA Channels	Sub-Category	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	Low Power Mode	JESD-609 Code
AM1806EZCEA3	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V	8	23	32		GRID ARRAY, LOW PROFILE, FINE PITCH		1.14 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm	172032	13 mm		YES	16	30 MHz	30	260	13 mm	CMOS		1.2 V	80		.65 mm	FIXED POINT	S-PBGA-B361	3		375 rpm	YES	e1
AM1806EZCED4	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.35 V	8	23	32		GRID ARRAY, LOW PROFILE, FINE PITCH		1.25 V	90 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm	172032	13 mm		YES	16	30 MHz	30	260	13 mm	CMOS		1.3 V	80		.65 mm	FIXED POINT	S-PBGA-B361	3		456 rpm	YES	e1
AM1806EZWT3	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V	8	23	32		GRID ARRAY, LOW PROFILE, FINE PITCH		1.14 V	90 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm	172032	16 mm		YES	16	30 MHz	30	260	16 mm	CMOS		1.2 V	80		.8 mm	FIXED POINT	S-PBGA-B361	3		375 rpm	YES	e1
AM1806EZWT4	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.35 V	8	23	32		GRID ARRAY, LOW PROFILE, FINE PITCH		1.25 V	90 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm	172032	16 mm		YES	16	30 MHz	30	260	16 mm	CMOS		1.3 V	80		.8 mm	FIXED POINT	S-PBGA-B361	3		456 rpm	YES	e1
AM1806EZWTD4	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.35 V	8	23	32		GRID ARRAY, LOW PROFILE, FINE PITCH		1.25 V	90 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm	172032	16 mm		YES	16	30 MHz	30	260	16 mm	CMOS		1.3 V	80		.8 mm	FIXED POINT	S-PBGA-B361	3		456 rpm	YES	e1
AM1808EZCE3	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V		23	32		GRID ARRAY, LOW PROFILE, FINE PITCH		1.14 V	90 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm		13 mm		YES	16	30 MHz	30	260	13 mm	CMOS		1.2 V			.65 mm	FIXED POINT	S-PBGA-B361	3		375 rpm	YES	e1
AM1808EZCE4	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.35 V		23	32		GRID ARRAY, LOW PROFILE, FINE PITCH		1.25 V	90 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm		13 mm		YES	16	30 MHz	30	260	13 mm	CMOS		1.3 V			.65 mm	FIXED POINT	S-PBGA-B361	3		456 rpm	YES	e1
AM1808EZCEA3	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V		23	32		GRID ARRAY, LOW PROFILE, FINE PITCH		1.14 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm		13 mm		YES	16	30 MHz	30	260	13 mm	CMOS		1.2 V			.65 mm	FIXED POINT	S-PBGA-B361	3		375 rpm	YES	e1
AM1808EZCED4	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.35 V		23	32		GRID ARRAY, LOW PROFILE, FINE PITCH		1.25 V	90 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm		13 mm		YES	16	30 MHz	30	260	13 mm	CMOS		1.3 V			.65 mm	FIXED POINT	S-PBGA-B361	3		456 rpm	YES	e1
AM1808EZWT3	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V		23	32		GRID ARRAY, LOW PROFILE, FINE PITCH		1.14 V	90 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm		16 mm		YES	16	30 MHz	30	260	16 mm	CMOS		1.2 V			.8 mm	FIXED POINT	S-PBGA-B361	3		375 rpm	YES	e1
AM1808EZWT4	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.35 V		23	32		GRID ARRAY, LOW PROFILE, FINE PITCH		1.25 V	90 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm		16 mm		YES	16	30 MHz	30	260	16 mm	CMOS		1.3 V			.8 mm	FIXED POINT	S-PBGA-B361	3		456 rpm	YES	e1
AM1808EZWTA3	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V		23	32		GRID ARRAY, LOW PROFILE, FINE PITCH		1.14 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm		16 mm		YES	16	30 MHz	30	260	16 mm	CMOS		1.2 V			.8 mm	FIXED POINT	S-PBGA-B361	3		375 rpm	YES	e1
AM1810EZWTA3	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V	8	14	32		GRID ARRAY, LOW PROFILE, FINE PITCH		1.14 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm	131072	16 mm		YES	16	50 MHz	30	260	16 mm	CMOS	.31 mA	1.2 V	64		.8 mm	FIXED POINT	S-PBGA-B361	3		375 rpm	YES	e1
AM3352ZZCZA60	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	324	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES			16	32		GRID ARRAY, LOW PROFILE, FINE PITCH			105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm		15 mm		YES	16	26 MHz	30	260	15 mm	CMOS					.8 mm	FIXED POINT	S-PBGA-B324	3		600 rpm	YES	e1
AM3354BZCZ30	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	324	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.144 V	8	28	32		GRID ARRAY, LOW PROFILE, FINE PITCH		1.056 V	90 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm	131072	15 mm		YES	16	26 MHz	30	260	15 mm	CMOS	400 mA	1.1 V	64		.8 mm	FIXED POINT	S-PBGA-B324	3		300 rpm	YES	e1
DM388AAAR21F	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	609	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.42 V	8	28	32		GRID ARRAY, LOW PROFILE, FINE PITCH		1.28 V	95 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.32 mm	655360	16 mm		YES	16	30 MHz	30	260	16 mm	CMOS		1.35 V	72		.5 mm	FLOATING POINT	S-PBGA-B609	3		1000 rpm	YES	e1
DM388AAAR21	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	609	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.42 V	8	28	32		GRID ARRAY, LOW PROFILE, FINE PITCH		1.28 V	95 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.32 mm	655360	16 mm		YES	16	30 MHz	30	260	16 mm	CMOS		1.35 V	72		.5 mm	FLOATING POINT	S-PBGA-B609	3		1000 rpm	YES	e1
DM388AAARD11FP	Texas Instruments	MICROPROCESSOR, RISC		BALL	609	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.42 V	8	28	32		GRID ARRAY, LOW PROFILE, FINE PITCH		1.28 V			TIN SILVER COPPER	BOTTOM	1.32 mm	655360	16 mm		YES	16	30 MHz	30	260	16 mm	CMOS		1.35 V	72		.5 mm	FLOATING POINT	S-PBGA-B609	3		970 rpm	YES	e1
DM388AAARD21FP	Texas Instruments	MICROPROCESSOR, RISC		BALL	609	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.42 V	8	28	32		GRID ARRAY, LOW PROFILE, FINE PITCH		1.28 V			TIN SILVER COPPER	BOTTOM	1.32 mm	655360	16 mm		YES	16	30 MHz	30	260	16 mm	CMOS		1.35 V	72		.5 mm	FLOATING POINT	S-PBGA-B609	3		1000 rpm	YES	e1
DM388AAARD21F	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	609	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.42 V	8	28	32		GRID ARRAY, LOW PROFILE, FINE PITCH		1.28 V	95 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.32 mm	655360	16 mm		YES	16	30 MHz	30	260	16 mm	CMOS		1.35 V	72		.5 mm	FLOATING POINT	S-PBGA-B609	3		1000 rpm	YES	e1
DM388AAARD21	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	609	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.42 V	8	28	32		GRID ARRAY, LOW PROFILE, FINE PITCH		1.28 V	95 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.32 mm	655360	16 mm		YES	16	30 MHz	30	260	16 mm	CMOS		1.35 V	72		.5 mm	FLOATING POINT	S-PBGA-B609	3		1000 rpm	YES	e1
FX053013	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	298	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES			16	32		GRID ARRAY, LOW PROFILE, FINE PITCH			90 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm		13 mm		YES	16	26 MHz	30	260	13 mm	CMOS					.65 mm	FIXED POINT	S-PBGA-B298	3			YES	e1
SN278792960	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	324	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES		8	16	32		GRID ARRAY, LOW PROFILE, FINE PITCH			90 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm	131072	15 mm	GPMC 28 BIT ADDRESS BUS AND 16 BIT DATA BUS AVAILABLE	YES	16	26 MHz	30	260	15 mm	CMOS			64		.8 mm	FIXED POINT	S-PBGA-B324	3			YES	e1
VCBU3730GSCUS100	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	423	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.2 V		26			GRID ARRAY, LOW PROFILE, FINE PITCH		1.08 V	90 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	1.4 mm		16 mm		YES	16	54 MHz	30	260	16 mm	CMOS		1.14 V			.65 mm	FLOATING POINT	S-PBGA-B423	3		1000 rpm	YES	e1
AM1707BZKB3	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	256	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V		16	32	1.2,1.8/3.3	GRID ARRAY, FINE PITCH	BGA256,16X16,40	1.14 V	90 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	2.05 mm		17 mm		YES	16	20 MHz	30	260	17 mm	CMOS		1.2 V		Microprocessors	.5 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	375 rpm	YES	e1
XAM3517ZCN	Texas Instruments	MICROPROCESSOR		BALL	491	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.248 V		16	32	1.2,1.8,1.8/3.3,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA491,25X25,25	1.152 V				BOTTOM	1.3 mm		17 mm		YES	16	26 MHz	NOT SPECIFIED	NOT SPECIFIED	17 mm	CMOS		1.2 V		Microprocessors	.65 mm	FLOATING POINT	S-PBGA-B491		Not Qualified	600 rpm	YES
NG80960JD3V66	Intel	MICROPROCESSOR, RISC		GULL WING	132	QFP	SQUARE	PLASTIC/EPOXY	YES	YES	3.45 V		32	32		FLATPACK		3.15 V				QUAD					YES	32	33.3 MHz	NOT SPECIFIED	NOT SPECIFIED		CMOS		3.3 V				FIXED POINT	S-PQFP-G132		Not Qualified	66 rpm	YES
MPC8313EVRAFFB	Freescale Semiconductor	MICROPROCESSOR	OTHER	BALL	516	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.5 V		32	32	1,1.8/2.5,3.3	GRID ARRAY, HEAT SINK/SLUG	BGA516,26X26,40	.95 V	105 Cel	0 Cel	TIN SILVER	BOTTOM	2.55 mm		27 mm	ALSO REQUIRES 3.3V I/O SUPPLY	YES	32	66.67 MHz	40	260	27 mm	CMOS		1 V		Microprocessors	1 mm	FLOATING POINT	S-PBGA-B516	3	Not Qualified	333 rpm	YES	e2
MPC8313VRAFFB	Freescale Semiconductor	MICROPROCESSOR	OTHER	BALL	516	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.5 V		32	32	1,1.8/2.5,3.3	GRID ARRAY, HEAT SINK/SLUG	BGA516,26X26,40	.95 V	105 Cel	0 Cel	TIN SILVER	BOTTOM	2.55 mm		27 mm	ALSO REQUIRES 3.3V I/O SUPPLY	YES	32	66.67 MHz	40	260	27 mm	CMOS		1 V		Microprocessors	1 mm	FLOATING POINT	S-PBGA-B516	3	Not Qualified	333 rpm	YES	e2
KMPC8270CVRMIBA	Freescale Semiconductor	MICROPROCESSOR, RISC		BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V		32	32		GRID ARRAY		1.45 V			TIN SILVER	BOTTOM	2.55 mm		27 mm		YES	64	266 MHz	30	245	27 mm	CMOS		1.5 V			1 mm	FLOATING POINT	S-PBGA-B516	3	Not Qualified	66.67 rpm	NO	e2
KMPC8270CZQMIBA	Freescale Semiconductor	MICROPROCESSOR, RISC		BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V		32	32		GRID ARRAY		1.45 V			Tin/Lead/Silver (Sn/Pb/Ag)	BOTTOM	2.55 mm		27 mm		YES	64	266 MHz	30	245	27 mm	CMOS		1.5 V			1 mm	FLOATING POINT	S-PBGA-B516	3	Not Qualified	66.67 rpm	NO	e0
KMPC8270VRMIBA	Freescale Semiconductor	MICROPROCESSOR, RISC	COMMERCIAL	BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V		32	32		GRID ARRAY		1.45 V	70 Cel	0 Cel	TIN SILVER	BOTTOM	2.55 mm		27 mm		YES	64	266 MHz	30	245	27 mm	CMOS		1.5 V			1 mm	FLOATING POINT	S-PBGA-B516	3	Not Qualified	66.67 rpm	NO	e2
KMPC8275CVRMIBA	Freescale Semiconductor	MICROPROCESSOR, RISC		BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V		32	32		GRID ARRAY		1.45 V			TIN SILVER	BOTTOM	2.55 mm		27 mm		YES	64	266 MHz	30	245	27 mm	CMOS		1.5 V			1 mm	FLOATING POINT	S-PBGA-B516	3	Not Qualified	66.67 rpm	NO	e2
XAM1705BPTP3	Texas Instruments	MICROPROCESSOR, RISC	OTHER	GULL WING	176	LFQFP	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V		0	32	1.2,1.8,3.3	FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP176,1.0SQ,20	1.14 V	90 Cel	0 Cel		QUAD	1.6 mm		24 mm		YES	0	50 MHz			24 mm	CMOS	.3 mA	1.2 V		Microprocessors	.5 mm	FIXED POINT	S-PQFP-G176		Not Qualified	375 rpm	YES
KMPC852TVR100A	Freescale Semiconductor	MICROPROCESSOR, RISC		BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V		32	32		GRID ARRAY		1.7 V			TIN SILVER COPPER	BOTTOM	2.54 mm		23 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	66 MHz	30	245	23 mm	CMOS		1.8 V			1.27 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	100 rpm	YES	e1
OMAP3530DZCBB	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	515	VFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.91 V		26		1.1,1.8,3.3	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA515,28X28,16	1.71 V	90 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	.9 mm		12 mm		YES	16	59 MHz	30	260	12 mm	CMOS		1.8 V		Graphics Processors	.4 mm	FLOATING POINT	S-PBGA-B515	3	Not Qualified	600 rpm	YES	e1
NG80960JS25	Intel	MICROPROCESSOR, RISC		GULL WING	132	QFP	SQUARE	PLASTIC/EPOXY	YES	YES	3.45 V		32	32	3.3,3.3/5	FLATPACK	SPQFP132,1.1SQ	3.15 V				QUAD					YES	32	25 MHz	NOT SPECIFIED	NOT SPECIFIED		CMOS	190 mA	3.3 V		Microprocessors	.635 mm	FIXED POINT	S-PQFP-G132		Not Qualified	25 rpm	YES
MPC8540VT833LB	Freescale Semiconductor	MICROPROCESSOR	OTHER	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V		64	32	1.2,2.5/3.3	GRID ARRAY	BGA783,28X28,40	1.14 V	105 Cel	0 Cel	Tin/Silver (Sn/Ag)	BOTTOM	3.85 mm		29 mm		YES	64	166 MHz	40	260	29 mm	CMOS		1.2 V		Microprocessors	1 mm	FIXED POINT	S-PBGA-B783	3	Not Qualified	667 rpm	YES	e2
MPC8347VRAGD	Freescale Semiconductor	MICROPROCESSOR, RISC	OTHER	BALL	620	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V		32	32	1.2,2.5,3.3	GRID ARRAY	BGA620,28X28,40	1.14 V	105 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	2.46 mm		29 mm		YES	32	66 MHz	40	260	29 mm	CMOS		1.2 V		Microprocessors	1 mm	FLOATING POINT	S-PBGA-B620	3	Not Qualified	400 rpm	YES	e1
KMPC885CVR133	Freescale Semiconductor	MICROPROCESSOR, RISC		BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V		32	32	1.8,3.3	GRID ARRAY	BGA357,19X19,50	1.7 V			TIN SILVER COPPER	BOTTOM	2.52 mm		25 mm		YES	32		40	260	25 mm	CMOS		1.8 V		Microprocessors	1.27 mm	FIXED POINT	S-PBGA-B357	3	Not Qualified	133 rpm	YES	e1
KMPC885VR133	Freescale Semiconductor	MICROPROCESSOR, RISC		BALL	357	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V		32	32	1.8,3.3	GRID ARRAY	BGA357,19X19,50	1.7 V			TIN SILVER COPPER	BOTTOM	2.52 mm		25 mm		YES	32		40	260	25 mm	CMOS		1.8 V		Microprocessors	1.27 mm	FIXED POINT	S-PBGA-B357	3	Not Qualified	133 rpm	YES	e1
AM1808BZCEA3	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V		23	32	1.2,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA361,19X19,25	1.14 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm		13 mm	ALSO OPERATES AT 1V AND 1.1 V NOMINAL	YES	16	50 MHz	30	260	13 mm	CMOS		1.2 V		Microprocessors	.65 mm	FIXED POINT	S-PBGA-B361	3	Not Qualified	375 rpm	YES	e1
AM1808BZCED4	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.35 V		23	32	1.3,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA361,19X19,25	1.25 V	90 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm		13 mm	ALSO OPERATES AT 1V AND 1.1 V NOMINAL	YES	16	50 MHz	30	260	13 mm	CMOS		1.3 V		Microprocessors	.65 mm	FIXED POINT	S-PBGA-B361	3	Not Qualified	456 rpm	YES	e1
AM1808BZWTD4	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.35 V		23	32	1.3,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA361,19X19,32	1.25 V	90 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm		16 mm	ALSO OPERATES AT 1V AND 1.1 V NOMINAL	YES	16	50 MHz	30	260	16 mm	CMOS		1.3 V		Microprocessors	.8 mm	FIXED POINT	S-PBGA-B361	3	Not Qualified	456 rpm	YES	e1
DM3725CBC	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	515	VFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.2 V		26	32	1.2,1.8	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA515,26X26,20	1.08 V	90 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	1 mm	16384	14 mm		YES	16	54 MHz	NOT SPECIFIED	260	14 mm	CMOS	37 mA	1.14 V	128	Digital Signal Processors	.5 mm	FLOATING POINT	S-PBGA-B515	3	Not Qualified	800 rpm	YES	e1
DM3725CBP	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	515	VFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.2 V		26	32	1.2,1.8	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA515,28X28,16	1.08 V	90 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	.71 mm	16384	12 mm		YES	16	54 MHz	NOT SPECIFIED	260	12 mm	CMOS	37 mA	1.14 V	128	Digital Signal Processors	.4 mm	FLOATING POINT	S-PBGA-B515	3	Not Qualified	800 rpm	YES	e1
DM3730CBC100	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	515	VFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.2 V	8	26	32	1.2,1.8	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA515,26X26,20	1.08 V	90 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	1 mm	16384	14 mm		YES	16	54 MHz	NOT SPECIFIED	260	14 mm	CMOS	37 mA	1.14 V	128	Digital Signal Processors	.5 mm	FLOATING POINT	S-PBGA-B515	3	Not Qualified	1000 rpm	YES	e1
DM3730CBC	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	515	VFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.2 V	8	26	32	1.2,1.8	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA515,26X26,20	1.08 V	90 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	1 mm	16384	14 mm		YES	16	54 MHz	NOT SPECIFIED	260	14 mm	CMOS	37 mA	1.14 V	128	Digital Signal Processors	.5 mm	FLOATING POINT	S-PBGA-B515	3	Not Qualified	800 rpm	YES	e1

Microprocessors

A microprocessor is a small electronic component that serves as the central processing unit (CPU) of a computer or other electronic device. It is a programmable device that is capable of executing instructions and performing calculations.

Microprocessors are typically made up of millions of transistors and other components, all of which work together to perform complex calculations and operations. They are designed to be highly efficient, with the ability to process vast amounts of data quickly and accurately.

Microprocessors are used in a wide range of electronic devices, including computers, smartphones, tablets, and game consoles. They are also used in industrial control systems, medical devices, and other specialized applications.

One of the key advantages of microprocessors is their flexibility. They can be programmed to perform a wide range of functions and can be easily reprogrammed or updated as needed. This makes them ideal for a wide range of applications, from simple calculators to complex data processing systems.