SQUARE Microprocessors 841

Reset All

Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	On Chip Data RAM Width	Address Bus Width	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	RAM Words	Width	Additional Features	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Maximum Supply Current	Nominal Supply Voltage	No. of DMA Channels	Sub-Category	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	Low Power Mode	JESD-609 Code
AM3354ZCZ60	Texas Instruments	MICROPROCESSOR, RISC		BALL	324	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.248 V		28	32	0.95/1.1,0.95/1.26	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA324,18X18,32	1.152 V			TIN SILVER COPPER	BOTTOM	1.4 mm		15 mm		YES	16	26 MHz	30	260	15 mm	CMOS		1.2 V		Microprocessors	.8 mm	FIXED POINT	S-PBGA-B324	3	Not Qualified	600 rpm	YES	e1
AM3354ZCZD72	Texas Instruments	MICROPROCESSOR, RISC		BALL	324	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.326 V		28	32	0.95/1.1,0.95/1.26	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA324,18X18,32	1.21 V			TIN SILVER COPPER	BOTTOM	1.4 mm		15 mm		YES	16	26 MHz	30	260	15 mm	CMOS		1.26 V		Microprocessors	.8 mm	FIXED POINT	S-PBGA-B324	3	Not Qualified	720 rpm	YES	e1
AM3357ZCZD27	Texas Instruments	MICROPROCESSOR, RISC		BALL	324	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.144 V		28	32	0.95/1.1,0.95/1.26	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA324,18X18,32	1.056 V			TIN SILVER COPPER	BOTTOM	1.4 mm		15 mm		YES	16	26 MHz	30	260	15 mm	CMOS		1.1 V		Microprocessors	.8 mm	FIXED POINT	S-PBGA-B324	3	Not Qualified	275 rpm	YES	e1
AM3357ZCZD72	Texas Instruments	MICROPROCESSOR, RISC		BALL	324	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.326 V		28	32	0.95/1.1,0.95/1.26	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA324,18X18,32	1.21 V			TIN SILVER COPPER	BOTTOM	1.4 mm		15 mm		YES	16	26 MHz	30	260	15 mm	CMOS		1.26 V		Microprocessors	.8 mm	FIXED POINT	S-PBGA-B324	3	Not Qualified	720 rpm	YES	e1
AM3359ZCZD72	Texas Instruments	MICROPROCESSOR, RISC		BALL	324	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.326 V		28	32	0.95/1.1,0.95/1.26	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA324,18X18,32	1.21 V			TIN SILVER COPPER	BOTTOM	1.4 mm		15 mm		YES	16	26 MHz	30	260	15 mm	CMOS		1.26 V		Microprocessors	.8 mm	FIXED POINT	S-PBGA-B324	3	Not Qualified	720 rpm	YES	e1
AM3894BCYGA120	Texas Instruments	MICROPROCESSOR, RISC		BALL	1031	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		28	32	1	GRID ARRAY, FINE PITCH	BGA1031,37X37,25	.95 V			TIN SILVER COPPER	BOTTOM	3.31 mm		25 mm		YES	16	27 MHz	30	245	25 mm	CMOS		1 V		Microprocessors	.65 mm	FLOATING POINT	S-PBGA-B1031	4	Not Qualified	1200 rpm	YES	e1
OMAP3525ECBBA	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	515	VFBGA	SQUARE	PLASTIC/EPOXY		YES					1.1,1.2,1.8,1.8/3	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA515,28X28,16		105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	.9 mm		12 mm					30	260	12 mm	CMOS				Graphics Processors	.4 mm		S-PBGA-B515	3	Not Qualified	600 rpm		e1
OMAP3525ECBC	Texas Instruments	MICROPROCESSOR, RISC	COMMERCIAL	BALL	515	VFBGA	SQUARE	PLASTIC/EPOXY		YES					1.1,1.2,1.8,1.8/3	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA515,26X26,20		70 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	.95 mm		14 mm					30	260	14 mm	CMOS				Graphics Processors	.5 mm		S-PBGA-B515	3	Not Qualified			e1
OMAP3525ECUS	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	423	LFBGA	SQUARE	PLASTIC/EPOXY		YES					1.1,1.2,1.8,1.8/3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA423,24X24,25		90 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm		16 mm					30	260	16 mm	CMOS				Graphics Processors	.65 mm		S-PBGA-B423	4	Not Qualified	600 rpm		e1
OMAP3530ECBB72	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	515	VFBGA	SQUARE	PLASTIC/EPOXY		YES					1.1,1.2,1.8,1.8/3	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA515,28X28,16		90 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	.9 mm		12 mm					30	260	12 mm	CMOS				Graphics Processors	.4 mm		S-PBGA-B515	3	Not Qualified	720 rpm		e1
OMAP3530ECBB	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	515	VFBGA	SQUARE	PLASTIC/EPOXY		YES					1.1,1.2,1.8,1.8/3	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA515,28X28,16		90 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	.9 mm		12 mm					30	260	12 mm	CMOS				Graphics Processors	.4 mm		S-PBGA-B515	3	Not Qualified	720 rpm		e1
OMAP3530ECBCA	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	515	VFBGA	SQUARE	PLASTIC/EPOXY		YES					1.1,1.2,1.8,1.8/3	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA515,26X26,20		85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	.95 mm		14 mm					30	260	14 mm	CMOS				Graphics Processors	.5 mm		S-PBGA-B515	3	Not Qualified			e1
TMS320DM8147BCYE1	Texas Instruments	MICROPROCESSOR, RISC		BALL	684	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.42 V		28	32	0.95/1.35	GRID ARRAY, FINE PITCH	BGA688,28X28,32	1.28 V			TIN SILVER COPPER	BOTTOM	3.06 mm	16384	23 mm		YES	16	30 MHz	30	250	23 mm	CMOS		1.35 V		Digital Signal Processors	.8 mm	FLOATING POINT	S-PBGA-B684	4	Not Qualified	1000 rpm	YES	e1
TMS320DM8147BCYE2	Texas Instruments	MICROPROCESSOR, RISC		BALL	684	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.42 V		28	32	0.95/1.35	GRID ARRAY, FINE PITCH	BGA688,28X28,32	1.28 V			TIN SILVER COPPER	BOTTOM	3.06 mm	16384	23 mm		YES	16	30 MHz	30	250	23 mm	CMOS		1.35 V		Digital Signal Processors	.8 mm	FLOATING POINT	S-PBGA-B684	4	Not Qualified	1000 rpm	YES	e1
TMS320DM8148BCYE1	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	684	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.42 V		28	32	0.95/1.35	GRID ARRAY, FINE PITCH	BGA688,28X28,32	1.28 V	90 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	3.06 mm	16384	23 mm		YES	16	30 MHz	30	250	23 mm	CMOS		1.35 V		Digital Signal Processors	.8 mm	FLOATING POINT	S-PBGA-B684	4	Not Qualified	1000 rpm	YES	e1
TMS320DM8148BCYE2	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	684	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.42 V		28	32	0.95/1.35	GRID ARRAY, FINE PITCH	BGA688,28X28,32	1.28 V	90 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	3.06 mm	16384	23 mm		YES	16	30 MHz	30	250	23 mm	CMOS		1.35 V		Digital Signal Processors	.8 mm	FLOATING POINT	S-PBGA-B684	4	Not Qualified	1000 rpm	YES	e1
AM1705CPTP3	Texas Instruments	MICROPROCESSOR, RISC	OTHER	GULL WING	176	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	YES			13	32	1.2,1.8/3.3	FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP176,1.0SQ,20		90 Cel	0 Cel	NICKEL PALLADIUM GOLD	QUAD	1.6 mm		24 mm		YES	16	50 MHz	30	260	24 mm	CMOS		1.2 V		Microprocessors	.5 mm	FIXED POINT	S-PQFP-G176	4	Not Qualified	375 rpm	YES	e4
AM1705CPTP4	Texas Instruments	MICROPROCESSOR, RISC	OTHER	GULL WING	176	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	YES			13	32	1.3,1.8/3.3	FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP176,1.0SQ,20		90 Cel	0 Cel	NICKEL PALLADIUM GOLD	QUAD	1.6 mm		24 mm		YES	16	50 MHz	30	260	24 mm	CMOS		1.2 V		Microprocessors	.5 mm	FIXED POINT	S-PQFP-G176	4	Not Qualified	375 rpm	YES	e4
AM1705CPTPA3	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	GULL WING	176	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	YES			13	32	1.2,1.8/3.3	FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP176,1.0SQ,20		105 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	1.6 mm		24 mm		YES	16	50 MHz	30	260	24 mm	CMOS		1.2 V		Microprocessors	.5 mm	FIXED POINT	S-PQFP-G176	4	Not Qualified	375 rpm	YES	e4
AM1705CPTPD4	Texas Instruments	MICROPROCESSOR, RISC	OTHER	GULL WING	176	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	YES			13	32	1.3,1.8/3.3	FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP176,1.0SQ,20		90 Cel	0 Cel	NICKEL PALLADIUM GOLD	QUAD	1.6 mm		24 mm		YES	16	50 MHz	30	260	24 mm	CMOS		1.2 V		Microprocessors	.5 mm	FIXED POINT	S-PQFP-G176	4	Not Qualified	375 rpm	YES	e4
ADSP-21488BSWZ-3A	Analog Devices	MICROPROCESSOR	INDUSTRIAL	GULL WING	100	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V		24	40	1.1,3.3	FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	1.05 V	85 Cel	-40 Cel	Matte Tin (Sn) - annealed	QUAD	1.6 mm	98304	14 mm		YES	16	25 MHz			14 mm	CMOS		1.1 V		Digital Signal Processors	.5 mm	FLOATING POINT	S-PQFP-G100	3	Not Qualified	350 rpm	NO	e3
AM3871CCYE100	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	684	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES		8	28	32	0.95/1.35	GRID ARRAY, FINE PITCH	BGA684,28X28,32		90 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	3.06 mm	786432	23 mm		YES	16	30 MHz	NOT SPECIFIED	250	23 mm	CMOS		1.35 V	64	Microprocessors	.8 mm	FLOATING POINT	S-PBGA-B684	4	Not Qualified	1000 rpm	YES	e1
AM3871CCYE80	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	684	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES		8	28	32	0.95/1.35	GRID ARRAY, FINE PITCH	BGA684,28X28,32		90 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	3.06 mm	786432	23 mm		YES	16	30 MHz	NOT SPECIFIED	250	23 mm	CMOS		1.35 V	64	Microprocessors	.8 mm	FLOATING POINT	S-PBGA-B684	4	Not Qualified	800 rpm	YES	e1
AM3874CCYE80	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	684	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES		8	28	32	0.95/1.35	GRID ARRAY, FINE PITCH	BGA684,28X28,32		90 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	3.06 mm	786432	23 mm		YES	16	30 MHz	NOT SPECIFIED	250	23 mm	CMOS		1.35 V	64	Microprocessors	.8 mm	FLOATING POINT	S-PBGA-B684	4	Not Qualified	800 rpm	YES	e1
AM3874CCYEA80	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	684	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES		8	28	32	0.95/1.35	GRID ARRAY, FINE PITCH	BGA684,28X28,32		105 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	3.06 mm	786432	23 mm		YES	16	30 MHz	NOT SPECIFIED	250	23 mm	CMOS		1.35 V	64	Microprocessors	.8 mm	FLOATING POINT	S-PBGA-B684	4	Not Qualified	800 rpm	YES	e1
AM3894CCYG120	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	1031	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	8	28	32	1	GRID ARRAY, FINE PITCH	BGA1031,37X37,25	.95 V	95 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	3.31 mm	65536	25 mm		YES	16	27 MHz	30	245	25 mm	CMOS		1 V	72	Microprocessors	.65 mm	FLOATING POINT	S-PBGA-B1031	4	Not Qualified	1200 rpm	YES	e1
AM3894CCYGA120	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	1031	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	8	28	32	1	GRID ARRAY, FINE PITCH	BGA1031,37X37,25	.95 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	3.31 mm	65536	25 mm		YES	16	27 MHz	30	245	25 mm	CMOS		1 V	72	Microprocessors	.65 mm	FLOATING POINT	S-PBGA-B1031	4	Not Qualified	1200 rpm	YES	e1
TMS320DM8148CCYE1	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	684	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.42 V	8	28	32	0.95/1.35	GRID ARRAY, FINE PITCH	BGA684,28X28,32	1.28 V	90 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	3.06 mm	16384	23 mm		YES	16	30 MHz	NOT SPECIFIED	250	23 mm	CMOS		1.35 V	72	Digital Signal Processors	.8 mm	FLOATING POINT	S-PBGA-B684	4	Not Qualified	1000 rpm	YES	e1
TMS320DM8148CCYEA0	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	684	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	8	28	32	0.95/1.35	GRID ARRAY, FINE PITCH	BGA684,28X28,32	1.14 V	90 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	3.06 mm	16384	23 mm		YES	16	30 MHz	NOT SPECIFIED	250	23 mm	CMOS		1.2 V	72	Digital Signal Processors	.8 mm	FLOATING POINT	S-PBGA-B684	4	Not Qualified	720 rpm	YES	e1
AM3354ZCZ80	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	324	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES			16	32	0.95/1.1,0.95/1.26	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA324,18X18,32		90 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm		15 mm		YES	16		30	260	15 mm	CMOS	800 mA			Microprocessors	.8 mm	FIXED POINT	S-PBGA-B324	3	Not Qualified	800 rpm	YES	e1
AM3892CCYG120	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	1031	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	8	28	32	1	GRID ARRAY, FINE PITCH	BGA1031,37X37,25	.95 V	95 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	3.31 mm	786432	25 mm		YES	16	27 MHz	30	245	25 mm	CMOS		1 V	64	Microprocessors	.65 mm	FLOATING POINT	S-PBGA-B1031	4	Not Qualified	1200 rpm	YES	e1
AM3894CCYG135	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	1031	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	8	28	32	1	GRID ARRAY, FINE PITCH	BGA1031,37X37,25	.95 V	95 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	3.31 mm	65536	25 mm		YES	16	27 MHz	30	245	25 mm	CMOS		1 V	72	Microprocessors	.65 mm	FLOATING POINT	S-PBGA-B1031	4	Not Qualified	1200 rpm	YES	e1
TMS320DM8148CCYE0	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	684	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V	8	28	32	0.95/1.35	GRID ARRAY, FINE PITCH	BGA684,28X28,32	1.14 V	90 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	3.06 mm	16384	23 mm		YES	16	30 MHz	NOT SPECIFIED	250	23 mm	CMOS		1.2 V	72	Digital Signal Processors	.8 mm	FLOATING POINT	S-PBGA-B684	4	Not Qualified	720 rpm	YES	e1
TMS320DM8148CCYE2	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	684	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.42 V	8	28	32	0.95/1.35	GRID ARRAY, FINE PITCH	BGA684,28X28,32	1.28 V	90 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	3.06 mm	16384	23 mm		YES	16	30 MHz	NOT SPECIFIED	250	23 mm	CMOS		1.35 V	72	Digital Signal Processors	.8 mm	FLOATING POINT	S-PBGA-B684	4	Not Qualified	1000 rpm	YES	e1
AM3892CCYG135	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	1031	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V	8	28	32	1	GRID ARRAY, FINE PITCH	BGA1031,37X37,25	.95 V	95 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	3.31 mm	786432	25 mm		YES	16	27 MHz	30	245	25 mm	CMOS		1 V	64	Microprocessors	.65 mm	FLOATING POINT	S-PBGA-B1031	4	Not Qualified	1200 rpm	YES	e1
TMS320C6474FCUN	Texas Instruments	MICROPROCESSOR	OTHER	BALL	561	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.2 V	8	14	32	1.1,1.8	GRID ARRAY, FINE PITCH	BGA561,27X27,32	.9 V	85 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	3.3 mm	8192	23 mm		YES	32	625 MHz	30	245	23 mm	CMOS		1.1 V	64	Digital Signal Processors	.8 mm	FLOATING POINT	S-PBGA-B561	4	Not Qualified	1000 rpm	YES	e1
AM1808BZWTT3	Texas Instruments	MICROPROCESSOR, RISC		BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V		23	32		GRID ARRAY, LOW PROFILE, FINE PITCH		1.14 V			TIN SILVER COPPER	BOTTOM	1.4 mm		16 mm		YES	16	50 MHz	30	260	16 mm	CMOS		1.2 V			.8 mm	FIXED POINT	S-PBGA-B361	3		375 rpm	YES	e1
ADSP-21488KSWZ-4B1	Analog Devices	MICROPROCESSOR	COMMERCIAL	GULL WING	176	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V		24	40		FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH		1.05 V	70 Cel	0 Cel	Matte Tin (Sn) - annealed	QUAD	1.6 mm		24 mm		YES	16	25 MHz			24 mm	CMOS		1.1 V			.5 mm	FLOATING POINT	S-PQFP-G176	3		400 rpm	NO	e3
ADSP-21489KSWZ-5B	Analog Devices	MICROPROCESSOR	COMMERCIAL	GULL WING	176	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	YES	1.15 V		24	40		FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH		1 V	70 Cel	0 Cel	Matte Tin (Sn) - annealed	QUAD	1.6 mm		24 mm		YES	16	25 MHz			24 mm	CMOS		1.1 V			.5 mm	FLOATING POINT	S-PQFP-G176	3		450 rpm	NO	e3
AM3352BZCE30	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	298	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.144 V	8	28	32	0.95/1.1	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA298,19X19,25	1.056 V	90 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm	131072	13 mm	ALSO OPERATES AT MIN 0.912 V	YES	16	26 MHz	30	260	13 mm	CMOS	400 mA	1.1 V	64	Microprocessors	.65 mm	FIXED POINT	S-PBGA-B298	3	Not Qualified	300 rpm	YES	e1
AM3352BZCE60	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	298	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.144 V	8	28	32	0.95/1.1	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA298,19X19,25	1.056 V	90 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm	131072	13 mm		YES	16	26 MHz	30	260	13 mm	CMOS	400 mA	1.1 V	64	Microprocessors	.65 mm	FIXED POINT	S-PBGA-B298	3	Not Qualified	600 rpm	YES	e1
AM3352BZCEA30R	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	298	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.144 V	8	28	32	0.95/1.1	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA298,19X19,25	1.056 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm	131072	13 mm	ALSO OPERATES AT MIN 0.912 V	YES	16	26 MHz	30	260	13 mm	CMOS	400 mA	1.1 V	64	Microprocessors	.65 mm	FIXED POINT	S-PBGA-B298	3	Not Qualified	300 rpm	YES	e1
AM3352BZCEA30	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	298	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.144 V	8	28	32	0.95/1.1	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA298,19X19,25	1.056 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm	131072	13 mm	ALSO OPERATES AT MIN 0.912 V	YES	16	26 MHz	30	260	13 mm	CMOS	400 mA	1.1 V	64	Microprocessors	.65 mm	FIXED POINT	S-PBGA-B298	3	Not Qualified	300 rpm	YES	e1
AM3352BZCEA60R	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	298	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.144 V	8	28	32	0.95/1.1	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA298,19X19,25	1.056 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm	131072	13 mm		YES	16	26 MHz	30	260	13 mm	CMOS	400 mA	1.1 V	64	Microprocessors	.65 mm	FIXED POINT	S-PBGA-B298	3	Not Qualified	600 rpm	YES	e1
AM3352BZCEA60	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	298	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.144 V	8	28	32	0.95/1.1	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA298,19X19,25	1.056 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm	131072	13 mm		YES	16	26 MHz	30	260	13 mm	CMOS	400 mA	1.1 V	64	Microprocessors	.65 mm	FIXED POINT	S-PBGA-B298	3	Not Qualified	600 rpm	YES	e1
AM3352BZCED30	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	298	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.144 V	8	28	32	0.95/1.1	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA298,19X19,25	1.056 V	90 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm	131072	13 mm	ALSO OPERATES AT MIN 0.912 V	YES	16	26 MHz	30	260	13 mm	CMOS	400 mA	1.1 V	64	Microprocessors	.65 mm	FIXED POINT	S-PBGA-B298	3	Not Qualified	300 rpm	YES	e1
AM3352BZCED60	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	298	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.144 V	8	28	32	0.95/1.1	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA298,19X19,25	1.056 V	90 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm	131072	13 mm		YES	16	26 MHz	30	260	13 mm	CMOS	400 mA	1.1 V	64	Microprocessors	.65 mm	FIXED POINT	S-PBGA-B298	3	Not Qualified	600 rpm	YES	e1
AM3352BZCZ80	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	324	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.326 V	8	28	32	0.95/1.1	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA324,18X18,32	1.21 V	90 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm	131072	15 mm		YES	16	26 MHz	30	260	15 mm	CMOS	400 mA	1.26 V	64	Microprocessors	.8 mm	FIXED POINT	S-PBGA-B324	3	Not Qualified	800 rpm	YES	e1

Microprocessors

A microprocessor is a small electronic component that serves as the central processing unit (CPU) of a computer or other electronic device. It is a programmable device that is capable of executing instructions and performing calculations.

Microprocessors are typically made up of millions of transistors and other components, all of which work together to perform complex calculations and operations. They are designed to be highly efficient, with the ability to process vast amounts of data quickly and accurately.

Microprocessors are used in a wide range of electronic devices, including computers, smartphones, tablets, and game consoles. They are also used in industrial control systems, medical devices, and other specialized applications.

One of the key advantages of microprocessors is their flexibility. They can be programmed to perform a wide range of functions and can be easily reprogrammed or updated as needed. This makes them ideal for a wide range of applications, from simple calculators to complex data processing systems.