SQUARE Microprocessors 841

Reset All

Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	On Chip Data RAM Width	Address Bus Width	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	RAM Words	Width	Additional Features	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Maximum Supply Current	Nominal Supply Voltage	No. of DMA Channels	Sub-Category	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	Low Power Mode	JESD-609 Code
AM3352BZCZD30	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	324	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.144 V	8	28	32	0.95/1.1	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA324,18X18,32	1.056 V	90 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm	131072	15 mm	ALSO OPERATES AT MIN 0.912 V	YES	16	26 MHz	30	260	15 mm	CMOS	400 mA	1.1 V	64	Microprocessors	.8 mm	FIXED POINT	S-PBGA-B324	3	Not Qualified	300 rpm	YES	e1
AM3354BZCE60	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	298	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.144 V	8	28	32	0.95/1.1	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA298,19X19,25	1.056 V	90 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm	131072	13 mm		YES	16	26 MHz	30	260	13 mm	CMOS	400 mA	1.1 V	64	Microprocessors	.65 mm	FIXED POINT	S-PBGA-B298	3	Not Qualified	600 rpm	YES	e1
AM3354BZCEA60	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	298	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.144 V	8	28	32	0.95/1.1	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA298,19X19,25	1.056 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm	131072	13 mm		YES	16	26 MHz	30	260	13 mm	CMOS	400 mA	1.1 V	64	Microprocessors	.65 mm	FIXED POINT	S-PBGA-B298	3	Not Qualified	600 rpm	YES	e1
AM3354BZCED60	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	298	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.144 V	8	28	32	0.95/1.1	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA298,19X19,25	1.056 V	90 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm	131072	13 mm		YES	16	26 MHz	30	260	13 mm	CMOS	400 mA	1.1 V	64	Microprocessors	.65 mm	FIXED POINT	S-PBGA-B298	3	Not Qualified	600 rpm	YES	e1
AM3354BZCZ100	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	324	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.378 V	8	28	32	0.95/1.1	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA324,18X18,32	1.272 V	90 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm	131072	15 mm		YES	16	26 MHz	30	260	15 mm	CMOS	400 mA	1.325 V	64	Microprocessors	.8 mm	FIXED POINT	S-PBGA-B324	3	Not Qualified	1000 rpm	YES	e1
AM3354BZCZ80	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	324	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.326 V	8	28	32	0.95/1.1	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA324,18X18,32	1.21 V	90 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm	131072	15 mm		YES	16	26 MHz	30	260	15 mm	CMOS	400 mA	1.26 V	64	Microprocessors	.8 mm	FIXED POINT	S-PBGA-B324	3	Not Qualified	800 rpm	YES	e1
AM3354BZCZA60	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	324	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.144 V	8	28	32	0.95/1.1	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA324,18X18,32	1.056 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm	131072	15 mm		YES	16	26 MHz	30	260	15 mm	CMOS	400 mA	1.1 V	64	Microprocessors	.8 mm	FIXED POINT	S-PBGA-B324	3	Not Qualified	600 rpm	YES	e1
AM3354BZCZA80	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	324	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.326 V	8	28	32	0.95/1.1	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA324,18X18,32	1.21 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm	131072	15 mm		YES	16	26 MHz	30	260	15 mm	CMOS	400 mA	1.26 V	64	Microprocessors	.8 mm	FIXED POINT	S-PBGA-B324	3	Not Qualified	800 rpm	YES	e1
AM3354BZCZD60	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	324	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.144 V	8	28	32	0.95/1.1	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA324,18X18,32	1.056 V	90 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm	131072	15 mm		YES	16	26 MHz	30	260	15 mm	CMOS	400 mA	1.1 V	64	Microprocessors	.8 mm	FIXED POINT	S-PBGA-B324	3	Not Qualified	600 rpm	YES	e1
AM3356BZCZ30	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	324	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.144 V	8	28	32	0.95/1.1	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA324,18X18,32	1.056 V	90 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm	131072	15 mm	ALSO OPERATES AT MIN 0.912 V	YES	16	26 MHz	30	260	15 mm	CMOS	400 mA	1.1 V	64	Microprocessors	.8 mm	FIXED POINT	S-PBGA-B324	3	Not Qualified	300 rpm	YES	e1
AM3356BZCZ60	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	324	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.144 V	8	28	32	0.95/1.1	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA324,18X18,32	1.056 V	90 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm	131072	15 mm		YES	16	26 MHz	30	260	15 mm	CMOS	400 mA	1.1 V	64	Microprocessors	.8 mm	FIXED POINT	S-PBGA-B324	3	Not Qualified	600 rpm	YES	e1
AM3356BZCZ80	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	324	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.326 V	8	28	32	0.95/1.1	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA324,18X18,32	1.21 V	90 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm	131072	15 mm		YES	16	26 MHz	30	260	15 mm	CMOS	400 mA	1.26 V	64	Microprocessors	.8 mm	FIXED POINT	S-PBGA-B324	3	Not Qualified	800 rpm	YES	e1
AM3356BZCZA30	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	324	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.144 V	8	28	32	0.95/1.1	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA324,18X18,32	1.056 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm	131072	15 mm	ALSO OPERATES AT MIN 0.912 V	YES	16	26 MHz	30	260	15 mm	CMOS	400 mA	1.1 V	64	Microprocessors	.8 mm	FIXED POINT	S-PBGA-B324	3	Not Qualified	300 rpm	YES	e1
AM3356BZCZA60	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	324	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.144 V	8	28	32	0.95/1.1	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA324,18X18,32	1.056 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm	131072	15 mm		YES	16	26 MHz	30	260	15 mm	CMOS	400 mA	1.1 V	64	Microprocessors	.8 mm	FIXED POINT	S-PBGA-B324	3	Not Qualified	600 rpm	YES	e1
AM3356BZCZA80	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	324	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.326 V	8	28	32	0.95/1.1	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA324,18X18,32	1.21 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm	131072	15 mm		YES	16	26 MHz	30	260	15 mm	CMOS	400 mA	1.26 V	64	Microprocessors	.8 mm	FIXED POINT	S-PBGA-B324	3	Not Qualified	800 rpm	YES	e1
AM3356BZCZD30	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	324	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.144 V	8	28	32	0.95/1.1	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA324,18X18,32	1.056 V	90 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm	131072	15 mm	ALSO OPERATES AT MIN 0.912 V	YES	16	26 MHz	30	260	15 mm	CMOS	400 mA	1.1 V	64	Microprocessors	.8 mm	FIXED POINT	S-PBGA-B324	3	Not Qualified	300 rpm	YES	e1
AM3356BZCZD60	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	324	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.144 V	8	28	32	0.95/1.1	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA324,18X18,32	1.056 V	90 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm	131072	15 mm		YES	16	26 MHz	30	260	15 mm	CMOS	400 mA	1.1 V	64	Microprocessors	.8 mm	FIXED POINT	S-PBGA-B324	3	Not Qualified	600 rpm	YES	e1
AM3357BZCZA30	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	324	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.144 V	8	28	32	0.95/1.1	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA324,18X18,32	1.056 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm	131072	15 mm	ALSO OPERATES AT MIN 0.912 V	YES	16	26 MHz	30	260	15 mm	CMOS	400 mA	1.1 V	64	Microprocessors	.8 mm	FIXED POINT	S-PBGA-B324	3	Not Qualified	300 rpm	YES	e1
AM3357BZCZA60	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	324	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.144 V	8	28	32	0.95/1.1	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA324,18X18,32	1.056 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm	131072	15 mm		YES	16	26 MHz	30	260	15 mm	CMOS	400 mA	1.1 V	64	Microprocessors	.8 mm	FIXED POINT	S-PBGA-B324	3	Not Qualified	600 rpm	YES	e1
AM3357BZCZD30	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	324	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.144 V	8	28	32	0.95/1.1	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA324,18X18,32	1.056 V	90 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm	131072	15 mm	ALSO OPERATES AT MIN 0.912 V	YES	16	26 MHz	30	260	15 mm	CMOS	400 mA	1.1 V	64	Microprocessors	.8 mm	FIXED POINT	S-PBGA-B324	3	Not Qualified	300 rpm	YES	e1
AM3357BZCZD60	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	324	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.144 V	8	28	32	0.95/1.1	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA324,18X18,32	1.056 V	90 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm	131072	15 mm		YES	16	26 MHz	30	260	15 mm	CMOS	400 mA	1.1 V	64	Microprocessors	.8 mm	FIXED POINT	S-PBGA-B324	3	Not Qualified	600 rpm	YES	e1
AM3358BZCZ60	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	324	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.144 V	8	28	32	0.95/1.1	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA324,18X18,32	1.056 V	90 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm	131072	15 mm		YES	16	26 MHz	30	260	15 mm	CMOS	400 mA	1.1 V	64	Microprocessors	.8 mm	FIXED POINT	S-PBGA-B324	3	Not Qualified	600 rpm	YES	e1
AM3358BZCZ80	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	324	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.326 V	8	28	32	0.95/1.1	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA324,18X18,32	1.21 V	90 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm	131072	15 mm		YES	16	26 MHz	30	260	15 mm	CMOS	400 mA	1.26 V	64	Microprocessors	.8 mm	FIXED POINT	S-PBGA-B324	3	Not Qualified	800 rpm	YES	e1
AM3358BZCZA80	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	324	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.326 V	8	28	32	0.95/1.1	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA324,18X18,32	1.21 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm	131072	15 mm		YES	16	26 MHz	30	260	15 mm	CMOS	400 mA	1.26 V	64	Microprocessors	.8 mm	FIXED POINT	S-PBGA-B324	3	Not Qualified	800 rpm	YES	e1
ADSP-BF606BBCZ-4	Analog Devices	MICROPROCESSOR	INDUSTRIAL	BALL	349	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V			32	1.8/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA349,22X22,32	1.19 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.5 mm		19 mm		YES		60 MHz	30	260	19 mm	CMOS		1.25 V		Microprocessors	.8 mm	FIXED POINT	S-PBGA-B349	3	Not Qualified	400 rpm	YES	e1
ADSP-BF606KBCZ-4	Analog Devices	MICROPROCESSOR	COMMERCIAL	BALL	349	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V			32	1.8/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA349,22X22,32	1.19 V	70 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.5 mm		19 mm		YES		60 MHz	30	260	19 mm	CMOS		1.25 V		Microprocessors	.8 mm	FIXED POINT	S-PBGA-B349	3	Not Qualified	400 rpm	YES	e1
ADSP-BF607BBCZ-5	Analog Devices	MICROPROCESSOR	INDUSTRIAL	BALL	349	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V			32	1.8/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA349,22X22,32	1.19 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.5 mm		19 mm		YES		60 MHz			19 mm	CMOS		1.25 V		Microprocessors	.8 mm	FIXED POINT	S-PBGA-B349	3	Not Qualified	500 rpm	YES	e1
ADSP-BF607KBCZ-5	Analog Devices	MICROPROCESSOR	COMMERCIAL	BALL	349	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V			32	1.8/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA349,22X22,32	1.19 V	70 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.5 mm		19 mm		YES		60 MHz			19 mm	CMOS		1.25 V		Microprocessors	.8 mm	FIXED POINT	S-PBGA-B349	3	Not Qualified	500 rpm	YES	e1
ADSP-BF608BBCZ-5	Analog Devices	MICROPROCESSOR	INDUSTRIAL	BALL	349	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V			32	1.8/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA349,22X22,32	1.19 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.5 mm		19 mm		YES		60 MHz	30	260	19 mm	CMOS		1.25 V		Microprocessors	.8 mm	FIXED POINT	S-PBGA-B349	3	Not Qualified	500 rpm	YES	e1
ADSP-BF608KBCZ-5	Analog Devices	MICROPROCESSOR	COMMERCIAL	BALL	349	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V			32	1.8/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA349,22X22,32	1.19 V	70 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.5 mm		19 mm		YES		60 MHz	30	260	19 mm	CMOS		1.25 V		Microprocessors	.8 mm	FIXED POINT	S-PBGA-B349	3	Not Qualified	500 rpm	YES	e1
ADSP-BF609BBCZ-5	Analog Devices	MICROPROCESSOR	INDUSTRIAL	BALL	349	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V			32	1.8/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA349,22X22,32	1.19 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.5 mm		19 mm		YES		60 MHz			19 mm	CMOS		1.25 V		Microprocessors	.8 mm	FIXED POINT	S-PBGA-B349	3	Not Qualified	500 rpm	YES	e1
ADSP-BF609KBCZ-5	Analog Devices	MICROPROCESSOR	COMMERCIAL	BALL	349	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V			32	1.8/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA349,22X22,32	1.19 V	70 Cel	0 Cel		BOTTOM	1.5 mm		19 mm		YES		60 MHz	NOT SPECIFIED	NOT SPECIFIED	19 mm	CMOS		1.25 V		Microprocessors	.8 mm	FIXED POINT	S-PBGA-B349		Not Qualified	500 rpm	YES
AM1705DPTP3	Texas Instruments	MICROPROCESSOR, RISC	OTHER	GULL WING	176	LFQFP	SQUARE	PLASTIC/EPOXY	YES	YES	1.35 V	8	13	32	1.2,1.8/3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP176,1.0SQ,20	1.25 V	90 Cel	0 Cel	NICKEL PALLADIUM GOLD	QUAD	1.6 mm	172032	24 mm		YES	16	50 MHz	30	260	24 mm	CMOS		1.3 V	40	Microprocessors	.5 mm	FIXED POINT	S-PQFP-G176	4	Not Qualified	375 rpm	YES	e4
AM1705DPTP4	Texas Instruments	MICROPROCESSOR, RISC	OTHER	GULL WING	176	LFQFP	SQUARE	PLASTIC/EPOXY	YES	YES	1.35 V	8	13	32	1.3,1.8/3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP176,1.0SQ,20	1.25 V	90 Cel	0 Cel	NICKEL PALLADIUM GOLD	QUAD	1.6 mm	172032	24 mm		YES	16	50 MHz	30	260	24 mm	CMOS		1.3 V	40	Microprocessors	.5 mm	FIXED POINT	S-PQFP-G176	4	Not Qualified	456 rpm	YES	e4
AM1705DPTPA3	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	GULL WING	176	LFQFP	SQUARE	PLASTIC/EPOXY	YES	YES	1.35 V	8	13	32	1.2,1.8/3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP176,1.0SQ,20	1.25 V	105 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	1.6 mm	172032	24 mm		YES	16	50 MHz	30	260	24 mm	CMOS		1.3 V	40	Microprocessors	.5 mm	FIXED POINT	S-PQFP-G176	4	Not Qualified	375 rpm	YES	e4
AM1707DZKB3	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	256	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V	8	13	32	1.2,1.8/3.3	GRID ARRAY, FINE PITCH	BGA256,16X16,40	1.14 V	90 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	2.05 mm	172032	17 mm		YES	16	30 MHz	30	260	17 mm	CMOS		1.2 V	40	Microprocessors	.5 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	375 rpm	YES	e1
AM1707DZKB4	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	256	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V	8	13	32	1.3,1.8/3.3	GRID ARRAY, FINE PITCH	BGA256,16X16,40	1.14 V	90 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	2.05 mm	172032	17 mm		YES	16	30 MHz	30	260	17 mm	CMOS		1.2 V	40	Microprocessors	.5 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	456 rpm	YES	e1
AM1707DZKBA3	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	256	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V	8	13	32	1.2,1.8/3.3	GRID ARRAY, FINE PITCH	BGA256,16X16,40	1.14 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.05 mm	172032	17 mm		YES	16	30 MHz	30	260	17 mm	CMOS		1.2 V	40	Microprocessors	.5 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	375 rpm	YES	e1
AM1707DZKBD4	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	256	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V	8	13	32	1.3,1.8/3.3	GRID ARRAY, FINE PITCH	BGA256,16X16,40	1.14 V	90 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.05 mm	172032	17 mm		YES	16	30 MHz	30	260	17 mm	CMOS		1.2 V	40	Microprocessors	.5 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	456 rpm	YES	e1
OMAP3530ECBBAR	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	515	VFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.35 V	8	26		1.1,1.8,3.3	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA515,28X28,16	.985 V	85 Cel	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	.9 mm	65536	12 mm		YES	16	38.4 MHz	NOT SPECIFIED	260	12 mm	CMOS		1 V	32	Graphics Processors	.4 mm	FLOATING POINT	S-PBGA-B515	3	Not Qualified	600 rpm	YES	e1
D6417751RBA240HVU0	Renesas Electronics	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	3.6 V		32	32		GRID ARRAY		3 V	85 Cel	-40 Cel		BOTTOM	2.6 mm		27 mm	IT ALSO OPERATES AT 1.5 V	YES	32	.032768 MHz			27 mm	CMOS		3.3 V			1.27 mm	FLOATING POINT	S-PBGA-B256	3		240 rpm	YES
X66AK2H06AAAW2	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		24			GRID ARRAY		.95 V	85 Cel	0 Cel		BOTTOM	3.75 mm		40 mm		YES	16	156.25 MHz			40 mm	CMOS		1 V			1 mm	FLOATING POINT	S-PBGA-B1517			1200 rpm	YES
X66AK2H12AAAWA2	Texas Instruments	MICROPROCESSOR, RISC		BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		24			GRID ARRAY		.95 V				BOTTOM	3.75 mm		40 mm		YES	16	156.25 MHz			40 mm	CMOS		1 V			1 mm	FLOATING POINT	S-PBGA-B1517			1200 rpm	YES
X66AK2H12AAW2	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	1517	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		24			GRID ARRAY		.95 V	85 Cel	0 Cel		BOTTOM	3.75 mm		40 mm		YES	16	156.25 MHz			40 mm	CMOS		1 V			1 mm	FLOATING POINT	S-PBGA-B1517			1200 rpm	YES
DM385AAAR01F	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	609	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V		28	32	1.14/1.42	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA609,31X31,20	1.14 V	95 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.32 mm	8192	16 mm		YES	16	30 MHz	30	260	16 mm	CMOS		1.2 V		Digital Signal Processors	.5 mm	FLOATING POINT	S-PBGA-B609	3	Not Qualified	720 rpm	YES	e1
DM385AAAR01	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	609	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V		28	32	1.14/1.42	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA609,31X31,20	1.14 V	95 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.32 mm	8192	16 mm		YES	16	30 MHz	30	260	16 mm	CMOS		1.2 V		Digital Signal Processors	.5 mm	FLOATING POINT	S-PBGA-B609	3	Not Qualified	720 rpm	YES	e1
DM385AAAR11F	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	609	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.42 V		28	32	1.14/1.42	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA609,31X31,20	1.28 V	95 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.32 mm	8192	16 mm		YES	16	30 MHz	30	260	16 mm	CMOS		1.35 V		Digital Signal Processors	.5 mm	FLOATING POINT	S-PBGA-B609	3	Not Qualified	970 rpm	YES	e1
DM385AAAR11	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	609	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.42 V		28	32	1.14/1.42	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA609,31X31,20	1.28 V	95 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.32 mm	8192	16 mm		YES	16	30 MHz	30	260	16 mm	CMOS		1.35 V		Digital Signal Processors	.5 mm	FLOATING POINT	S-PBGA-B609	3	Not Qualified	970 rpm	YES	e1

Microprocessors

A microprocessor is a small electronic component that serves as the central processing unit (CPU) of a computer or other electronic device. It is a programmable device that is capable of executing instructions and performing calculations.

Microprocessors are typically made up of millions of transistors and other components, all of which work together to perform complex calculations and operations. They are designed to be highly efficient, with the ability to process vast amounts of data quickly and accurately.

Microprocessors are used in a wide range of electronic devices, including computers, smartphones, tablets, and game consoles. They are also used in industrial control systems, medical devices, and other specialized applications.

One of the key advantages of microprocessors is their flexibility. They can be programmed to perform a wide range of functions and can be easily reprogrammed or updated as needed. This makes them ideal for a wide range of applications, from simple calculators to complex data processing systems.