| Part | RoHS | Manufacturer | Peripheral IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Package Body Material | Integrated Cache | Surface Mount | Maximum Supply Voltage | On Chip Data RAM Width | Screening Level | Address Bus Width | DAC Channels | Bit Size | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Minimum Supply Voltage | Maximum Operating Temperature | CPU Family | No. of External Interrupts | Minimum Operating Temperature | Terminal Finish | ADC Channels | Terminal Position | DMA Channels | Maximum Seated Height | ROM Words | RAM Words | Width | Data EEPROM Size | Additional Features | Boundary Scan | Peripherals | External Data Bus Width | Maximum Clock Frequency | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length | Total Dose (V) | RAM Bytes | Technology | Analog To Digital Convertors | Maximum Supply Current | Nominal Supply Voltage | No. of DMA Channels | PWM Channels | No. of Serial I/Os | Sub-Category | Connectivity | ROM Programmability | Bus Compatibility | Terminal Pitch | Format | JESD-30 Code | Moisture Sensitivity Level (MSL) | Qualification | Speed | Low Power Mode | JESD-609 Code | On Chip Program ROM Width | No. of I/O Lines |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
NXP Semiconductors |
MICROPROCESSOR, RISC |
OTHER |
BALL |
520 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.05 V |
16 |
32 |
GRID ARRAY, FINE PITCH |
.97 V |
105 Cel |
0 Cel |
BOTTOM |
1.97 mm |
21 mm |
YES |
32 |
21 mm |
CMOS |
1 V |
.8 mm |
FIXED POINT |
S-PBGA-B520 |
1000 rpm |
YES |
||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROPROCESSOR, RISC |
BALL |
425 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.05 V |
0 |
32 |
GRID ARRAY, FINE PITCH |
.95 V |
BOTTOM |
1.9 mm |
19 mm |
YES |
0 |
100 MHz |
19 mm |
CMOS |
1 V |
.8 mm |
FLOATING POINT |
S-PBGA-B425 |
667 rpm |
YES |
||||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROPROCESSOR, RISC |
BALL |
1295 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.15 V |
16 |
GRID ARRAY |
1.05 V |
BOTTOM |
3.53 mm |
37.5 mm |
YES |
64 |
166 MHz |
37.5 mm |
CMOS |
1.1 V |
1 mm |
FIXED POINT |
S-PBGA-B1295 |
1800 rpm |
YES |
|||||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROPROCESSOR, RISC |
BALL |
1295 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.15 V |
16 |
GRID ARRAY |
1.05 V |
BOTTOM |
3.53 mm |
37.5 mm |
YES |
64 |
166 MHz |
37.5 mm |
CMOS |
1.1 V |
1 mm |
FIXED POINT |
S-PBGA-B1295 |
1600 rpm |
YES |
|||||||||||||||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROPROCESSOR, RISC |
BALL |
1295 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.15 V |
16 |
GRID ARRAY |
1.05 V |
BOTTOM |
3.53 mm |
37.5 mm |
YES |
64 |
166 MHz |
37.5 mm |
CMOS |
1.1 V |
1 mm |
FIXED POINT |
S-PBGA-B1295 |
1600 rpm |
YES |
|||||||||||||||||||||||||||||||||||||||
|
|
NXP Semiconductors |
MICROPROCESSOR |
INDUSTRIAL |
BALL |
525 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.03 V |
16 |
64 |
GRID ARRAY, FINE PITCH |
BGA525,23X23,32 |
.97 V |
105 Cel |
6 |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
2.07 mm |
19 mm |
YES |
32 |
40 |
260 |
19 mm |
CMOS |
5 mA |
1 V |
2 |
5 |
.8 mm |
FIXED POINT |
S-PBGA-B525 |
3 |
1400 rpm |
YES |
e1 |
|||||||||||||||||||||||||
|
|
NXP Semiconductors |
MICROPROCESSOR, RISC |
INDUSTRIAL |
BALL |
896 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
64 |
GRID ARRAY |
BGA896(UNSPEC) |
105 Cel |
-40 Cel |
BOTTOM |
NO |
30 |
250 |
CMOS |
FIXED POINT |
S-PBGA-B896 |
3 |
1200 rpm |
NO |
||||||||||||||||||||||||||||||||||||||||
|
|
NXP Semiconductors |
MICROPROCESSOR, RISC |
INDUSTRIAL |
BALL |
896 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
64 |
GRID ARRAY |
BGA896(UNSPEC) |
105 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
NO |
30 |
250 |
CMOS |
FIXED POINT |
S-PBGA-B896 |
3 |
1533 rpm |
NO |
e1 |
||||||||||||||||||||||||||||||||||||||
|
|
NXP Semiconductors |
MICROPROCESSOR, RISC |
OTHER |
BALL |
196 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.3 V |
8 |
0 |
32 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA196,14X14,32 |
1.25 V |
95 Cel |
0 |
0 Cel |
TIN SILVER |
BOTTOM |
1.52 mm |
524288 |
12 mm |
YES |
0 |
24 MHz |
40 |
260 |
12 mm |
CMOS |
105 mA |
32 |
29 |
.8 mm |
FLOATING-POINT |
S-PBGA-B196 |
3 |
600 rpm |
YES |
e2 |
|||||||||||||||||||||||
|
|
STMicroelectronics |
MICROPROCESSOR, RISC |
AUTOMOTIVE |
BALL |
257 |
TFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.25 V |
8 |
32 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA257,19X19,25/20 |
1.18 V |
125 Cel |
-40 Cel |
BOTTOM |
1.2 mm |
724992 |
10 mm |
"TERM PITCH-MAX" |
YES |
48 MHz |
NOT SPECIFIED |
NOT SPECIFIED |
10 mm |
CMOS |
100 mA |
1.2 V |
48 |
8 |
.65 mm |
FLOATING-POINT |
S-PBGA-B257 |
650 rpm |
YES |
|||||||||||||||||||||||||||
|
|
STMicroelectronics |
MICROPROCESSOR, RISC |
BALL |
354 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.25 V |
8 |
26 |
32 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA354,19X19,32 |
1.18 V |
125 Cel |
-40 Cel |
BOTTOM |
1.29 mm |
724992 |
16 mm |
YES |
16 |
48 MHz |
NOT SPECIFIED |
NOT SPECIFIED |
16 mm |
CMOS |
940 mA |
1.2 V |
48 |
8 |
.8 mm |
FLOATING POINT |
S-PBGA-B354 |
650 rpm |
YES |
|||||||||||||||||||||||||||
|
|
STMicroelectronics |
MICROPROCESSOR, RISC |
BALL |
361 |
TFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.25 V |
8 |
26 |
32 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
BGA361,23X23,25/20 |
1.18 V |
125 Cel |
-40 Cel |
BOTTOM |
1.2 mm |
724992 |
12 mm |
YES |
16 |
48 MHz |
NOT SPECIFIED |
NOT SPECIFIED |
12 mm |
CMOS |
940 mA |
1.2 V |
48 |
8 |
.65 mm |
FLOATING POINT |
S-PBGA-B361 |
650 rpm |
YES |
|||||||||||||||||||||||||||
|
|
STMicroelectronics |
MICROPROCESSOR, RISC |
BALL |
257 |
TFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.25 V |
8 |
26 |
32 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
BGA257,19X19,25/20 |
1.18 V |
125 Cel |
-40 Cel |
BOTTOM |
1.2 mm |
724992 |
10 mm |
YES |
16 |
48 MHz |
NOT SPECIFIED |
NOT SPECIFIED |
10 mm |
CMOS |
940 mA |
1.2 V |
48 |
8 |
.65 mm |
FLOATING POINT |
S-PBGA-B257 |
650 rpm |
YES |
|||||||||||||||||||||||||||
|
|
STMicroelectronics |
MICROPROCESSOR, RISC |
BALL |
448 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.25 V |
8 |
26 |
32 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA448,22X22,32 |
1.18 V |
125 Cel |
-40 Cel |
Tin/Silver/Copper/Nickel (Sn/Ag/Cu/Ni) |
BOTTOM |
1.32 mm |
724992 |
18 mm |
YES |
16 |
48 MHz |
30 |
260 |
18 mm |
CMOS |
940 mA |
1.2 V |
48 |
8 |
.8 mm |
FLOATING POINT |
S-PBGA-B448 |
3 |
650 rpm |
YES |
e2 |
||||||||||||||||||||||||
|
|
STMicroelectronics |
MICROPROCESSOR, RISC |
BALL |
448 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.38 V |
8 |
26 |
32 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA448,22X22,32 |
1.3 V |
105 Cel |
-20 Cel |
BOTTOM |
1.32 mm |
724992 |
18 mm |
YES |
16 |
48 MHz |
18 mm |
CMOS |
955 mA |
1.34 V |
48 |
8 |
.8 mm |
FLOATING POINT |
S-PBGA-B448 |
800 rpm |
YES |
|||||||||||||||||||||||||||||
|
|
STMicroelectronics |
MICROPROCESSOR, RISC |
BALL |
354 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.38 V |
8 |
26 |
32 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA354,19X19,32 |
1.3 V |
105 Cel |
-20 Cel |
BOTTOM |
1.29 mm |
724992 |
16 mm |
YES |
16 |
48 MHz |
16 mm |
CMOS |
955 mA |
1.34 V |
48 |
8 |
.8 mm |
FLOATING POINT |
S-PBGA-B354 |
800 rpm |
YES |
|||||||||||||||||||||||||||||
|
|
STMicroelectronics |
MICROPROCESSOR, RISC |
INDUSTRIAL |
BALL |
361 |
TFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.25 V |
8 |
26 |
32 |
GRID ARRAY, THIN PROFILE, FINE PITCH |
.85 V |
105 Cel |
-20 Cel |
BOTTOM |
1.2 mm |
724992 |
12 mm |
YES |
0 |
64 MHz |
12 mm |
CMOS |
865 mA |
.9 V |
48 |
.65 mm |
FLOATING POINT |
S-PBGA-B361 |
800 rpm |
YES |
||||||||||||||||||||||||||||||
|
|
STMicroelectronics |
MICROPROCESSOR, RISC |
INDUSTRIAL |
BALL |
448 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1.25 V |
8 |
26 |
32 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA448,22X22,32 |
.85 V |
105 Cel |
-20 Cel |
BOTTOM |
1.32 mm |
724992 |
18 mm |
YES |
0 |
64 MHz |
18 mm |
CMOS |
865 mA |
.9 V |
48 |
.8 mm |
FLOATING POINT |
S-PBGA-B448 |
800 rpm |
YES |
|||||||||||||||||||||||||||||
|
|
Octavo Systems |
MICROPROCESSOR, RISC |
INDUSTRIAL |
BALL |
400 |
BGA |
SQUARE |
PLASTIC/EPOXY |
NO |
YES |
8 |
28 |
GRID ARRAY |
BGA400,20X20,50 |
85 Cel |
1 |
-40 Cel |
BOTTOM |
2.6 mm |
65536 |
27 mm |
64kbytes shared l3 ram also available |
YES |
16 |
245 |
27 mm |
CMOS |
2000 mA |
1.1 V |
1.27 mm |
FIXED POINT |
S-PBGA-B400 |
4 |
1000 rpm |
NO |
||||||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROPROCESSOR, RISC |
OTHER |
BALL |
1023 |
HBGA |
SQUARE |
CERAMIC |
YES |
YES |
1.1 V |
32 |
32 |
GRID ARRAY, HEAT SINK/SLUG |
BGA1023,32X32,40 |
1 V |
105 Cel |
0 Cel |
BOTTOM |
2.97 mm |
33 mm |
YES |
32 |
166.66 MHz |
30 |
245 |
33 mm |
CMOS |
1.05 V |
4 |
1 mm |
FLOATING POINT |
S-CBGA-B1023 |
3 |
1250 rpm |
NO |
||||||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROPROCESSOR, RISC |
INDUSTRIAL |
BALL |
1023 |
HBGA |
SQUARE |
CERAMIC |
YES |
YES |
1.1 V |
32 |
32 |
GRID ARRAY, HEAT SINK/SLUG |
BGA1023,32X32,40 |
1 V |
105 Cel |
-40 Cel |
BOTTOM |
2.97 mm |
33 mm |
YES |
32 |
166.66 MHz |
30 |
245 |
33 mm |
CMOS |
1.05 V |
4 |
1 mm |
FLOATING POINT |
S-CBGA-B1023 |
3 |
1250 rpm |
NO |
||||||||||||||||||||||||||||||
|
NXP Semiconductors |
MICROPROCESSOR, RISC |
OTHER |
BALL |
1023 |
HBGA |
SQUARE |
CERAMIC |
YES |
YES |
1 V |
32 |
32 |
GRID ARRAY, HEAT SINK/SLUG |
BGA1023,32X32,40 |
.9 V |
105 Cel |
0 Cel |
BOTTOM |
2.97 mm |
33 mm |
YES |
32 |
166.66 MHz |
30 |
245 |
33 mm |
CMOS |
.95 V |
4 |
1 mm |
FLOATING POINT |
S-CBGA-B1023 |
3 |
1067 rpm |
NO |
||||||||||||||||||||||||||||||
|
|
NXP Semiconductors |
MICROPROCESSOR, RISC |
OTHER |
BALL |
1517 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
.88 V |
36 |
64 |
GRID ARRAY |
BGA1517.39X39,40 |
.82 V |
105 Cel |
12 |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
3.51 mm |
40 mm |
YES |
128 |
30 |
245 |
40 mm |
CMOS |
.05 mA |
.85 V |
17 |
1 mm |
FIXED POINT |
S-PBGA-B1517 |
3 |
2000 rpm |
YES |
e1 |
||||||||||||||||||||||||||
|
|
NXP Semiconductors |
MICROPROCESSOR, RISC |
OTHER |
BALL |
1517 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
.88 V |
36 |
64 |
GRID ARRAY |
BGA1517.39X39,40 |
.82 V |
105 Cel |
12 |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
3.51 mm |
40 mm |
YES |
128 |
30 |
245 |
40 mm |
CMOS |
.05 mA |
.85 V |
17 |
1 mm |
FIXED POINT |
S-PBGA-B1517 |
3 |
1800 rpm |
YES |
e1 |
||||||||||||||||||||||||||
|
|
NXP Semiconductors |
MICROPROCESSOR, RISC |
INDUSTRIAL |
BALL |
1517 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
.88 V |
36 |
64 |
GRID ARRAY |
BGA1517.39X39,40 |
.82 V |
105 Cel |
12 |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
3.51 mm |
40 mm |
YES |
128 |
30 |
245 |
40 mm |
CMOS |
.05 mA |
.85 V |
17 |
1 mm |
FIXED POINT |
S-PBGA-B1517 |
3 |
1800 rpm |
YES |
e1 |
||||||||||||||||||||||||||
|
|
NXP Semiconductors |
MICROPROCESSOR, RISC |
INDUSTRIAL |
BALL |
1517 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
.88 V |
36 |
64 |
GRID ARRAY |
BGA1517.39X39,40 |
.82 V |
105 Cel |
12 |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
3.51 mm |
40 mm |
YES |
128 |
30 |
245 |
40 mm |
CMOS |
.05 mA |
.85 V |
17 |
1 mm |
FIXED POINT |
S-PBGA-B1517 |
3 |
2000 rpm |
YES |
e1 |
||||||||||||||||||||||||||
|
|
NXP Semiconductors |
MICROPROCESSOR, RISC |
INDUSTRIAL |
BALL |
1517 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
.88 V |
36 |
64 |
GRID ARRAY |
BGA1517.39X39,40 |
.82 V |
105 Cel |
12 |
-40 Cel |
BOTTOM |
3.51 mm |
40 mm |
YES |
128 |
30 |
245 |
40 mm |
CMOS |
.05 mA |
.85 V |
17 |
1 mm |
FIXED POINT |
S-PBGA-B1517 |
3 |
2200 rpm |
YES |
||||||||||||||||||||||||||||
|
|
NXP Semiconductors |
MICROPROCESSOR, RISC |
INDUSTRIAL |
BALL |
1517 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
.88 V |
36 |
64 |
GRID ARRAY |
BGA1517.39X39,40 |
.82 V |
105 Cel |
12 |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
3.51 mm |
40 mm |
YES |
128 |
30 |
245 |
40 mm |
CMOS |
.05 mA |
.85 V |
17 |
1 mm |
FIXED POINT |
S-PBGA-B1517 |
3 |
2000 rpm |
YES |
e1 |
||||||||||||||||||||||||||
|
|
NXP Semiconductors |
MICROPROCESSOR, RISC |
OTHER |
BALL |
1517 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
.88 V |
36 |
64 |
GRID ARRAY |
BGA1517.39X39,40 |
.82 V |
105 Cel |
12 |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
3.51 mm |
40 mm |
YES |
128 |
30 |
245 |
40 mm |
CMOS |
.05 mA |
.85 V |
17 |
1 mm |
FIXED POINT |
S-PBGA-B1517 |
3 |
1800 rpm |
YES |
e1 |
||||||||||||||||||||||||||
|
|
NXP Semiconductors |
MICROPROCESSOR, RISC |
OTHER |
BALL |
1517 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
.88 V |
36 |
64 |
GRID ARRAY |
BGA1517.39X39,40 |
.82 V |
105 Cel |
12 |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
3.51 mm |
40 mm |
YES |
128 |
30 |
245 |
40 mm |
CMOS |
.05 mA |
.85 V |
17 |
1 mm |
FIXED POINT |
S-PBGA-B1517 |
3 |
2000 rpm |
YES |
e1 |
||||||||||||||||||||||||||
|
|
NXP Semiconductors |
MICROPROCESSOR, RISC |
INDUSTRIAL |
BALL |
1517 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
.88 V |
36 |
64 |
GRID ARRAY |
BGA1517.39X39,40 |
.82 V |
105 Cel |
12 |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
3.51 mm |
40 mm |
YES |
128 |
30 |
245 |
40 mm |
CMOS |
.05 mA |
.85 V |
17 |
1 mm |
FIXED POINT |
S-PBGA-B1517 |
3 |
2000 rpm |
YES |
e1 |
||||||||||||||||||||||||||
|
|
NXP Semiconductors |
MICROPROCESSOR, RISC |
INDUSTRIAL |
BALL |
1517 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
.88 V |
36 |
64 |
GRID ARRAY |
BGA1517.39X39,40 |
.82 V |
105 Cel |
12 |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
3.51 mm |
40 mm |
YES |
128 |
30 |
245 |
40 mm |
CMOS |
.05 mA |
.85 V |
17 |
1 mm |
FIXED POINT |
S-PBGA-B1517 |
3 |
1800 rpm |
YES |
e1 |
||||||||||||||||||||||||||
|
|
NXP Semiconductors |
MICROPROCESSOR, RISC |
INDUSTRIAL |
BALL |
1517 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
.88 V |
36 |
64 |
GRID ARRAY |
BGA1517.39X39,40 |
.82 V |
105 Cel |
12 |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
3.51 mm |
40 mm |
YES |
128 |
30 |
245 |
40 mm |
CMOS |
.05 mA |
.85 V |
17 |
1 mm |
FIXED POINT |
S-PBGA-B1517 |
3 |
2000 rpm |
YES |
e1 |
||||||||||||||||||||||||||
|
|
NXP Semiconductors |
MICROPROCESSOR, RISC |
OTHER |
BALL |
1517 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
.88 V |
36 |
64 |
GRID ARRAY |
BGA1517.39X39,40 |
.82 V |
105 Cel |
12 |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
3.51 mm |
40 mm |
YES |
128 |
30 |
245 |
40 mm |
CMOS |
.05 mA |
.85 V |
17 |
1 mm |
FIXED POINT |
S-PBGA-B1517 |
3 |
2000 rpm |
YES |
e1 |
||||||||||||||||||||||||||
|
|
NXP Semiconductors |
MICROPROCESSOR, RISC |
OTHER |
BALL |
1517 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
.88 V |
36 |
64 |
GRID ARRAY |
BGA1517.39X39,40 |
.82 V |
105 Cel |
12 |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
3.51 mm |
40 mm |
YES |
128 |
30 |
245 |
40 mm |
CMOS |
.05 mA |
.85 V |
17 |
1 mm |
FIXED POINT |
S-PBGA-B1517 |
3 |
2200 rpm |
YES |
e1 |
||||||||||||||||||||||||||
|
|
NXP Semiconductors |
MICROPROCESSOR, RISC |
INDUSTRIAL |
BALL |
1517 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
.88 V |
36 |
64 |
GRID ARRAY |
BGA1517.39X39,40 |
.82 V |
105 Cel |
12 |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
3.51 mm |
40 mm |
YES |
128 |
30 |
245 |
40 mm |
CMOS |
.05 mA |
.85 V |
17 |
1 mm |
FIXED POINT |
S-PBGA-B1517 |
3 |
1800 rpm |
YES |
e1 |
||||||||||||||||||||||||||
|
|
NXP Semiconductors |
MICROPROCESSOR, RISC |
INDUSTRIAL |
BALL |
1517 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
.88 V |
36 |
64 |
GRID ARRAY |
BGA1517.39X39,40 |
.82 V |
105 Cel |
12 |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
3.51 mm |
40 mm |
YES |
128 |
30 |
245 |
40 mm |
CMOS |
.05 mA |
.85 V |
17 |
1 mm |
FIXED POINT |
S-PBGA-B1517 |
3 |
2000 rpm |
YES |
e1 |
||||||||||||||||||||||||||
|
|
NXP Semiconductors |
MICROPROCESSOR, RISC |
OTHER |
BALL |
1517 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
.88 V |
36 |
64 |
GRID ARRAY |
BGA1517.39X39,40 |
.82 V |
105 Cel |
12 |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
3.51 mm |
40 mm |
YES |
128 |
30 |
245 |
40 mm |
CMOS |
.05 mA |
.85 V |
17 |
1 mm |
FIXED POINT |
S-PBGA-B1517 |
3 |
2000 rpm |
YES |
e1 |
||||||||||||||||||||||||||
|
|
NXP Semiconductors |
MICROPROCESSOR, RISC |
INDUSTRIAL |
BALL |
1517 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
.88 V |
36 |
64 |
GRID ARRAY |
BGA1517.39X39,40 |
.82 V |
105 Cel |
12 |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
3.51 mm |
40 mm |
YES |
128 |
30 |
245 |
40 mm |
CMOS |
.05 mA |
.85 V |
17 |
1 mm |
FIXED POINT |
S-PBGA-B1517 |
3 |
1800 rpm |
YES |
e1 |
||||||||||||||||||||||||||
|
|
NXP Semiconductors |
MICROPROCESSOR, RISC |
OTHER |
BALL |
1517 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
.88 V |
36 |
64 |
GRID ARRAY |
BGA1517.39X39,40 |
.82 V |
105 Cel |
12 |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
3.51 mm |
40 mm |
YES |
128 |
30 |
245 |
40 mm |
CMOS |
.05 mA |
.85 V |
17 |
1 mm |
FIXED POINT |
S-PBGA-B1517 |
3 |
1800 rpm |
YES |
e1 |
||||||||||||||||||||||||||
|
|
NXP Semiconductors |
MICROPROCESSOR, RISC |
OTHER |
BALL |
1517 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
.88 V |
36 |
64 |
GRID ARRAY |
BGA1517.39X39,40 |
.82 V |
105 Cel |
12 |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
3.51 mm |
40 mm |
YES |
128 |
30 |
245 |
40 mm |
CMOS |
.05 mA |
.85 V |
17 |
1 mm |
FIXED POINT |
S-PBGA-B1517 |
3 |
1800 rpm |
YES |
e1 |
||||||||||||||||||||||||||
|
|
NXP Semiconductors |
MICROPROCESSOR, RISC |
OTHER |
BALL |
1517 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
.88 V |
36 |
64 |
GRID ARRAY |
BGA1517.39X39,40 |
.82 V |
105 Cel |
12 |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
3.51 mm |
40 mm |
YES |
128 |
30 |
245 |
40 mm |
CMOS |
.05 mA |
.85 V |
17 |
1 mm |
FIXED POINT |
S-PBGA-B1517 |
3 |
2000 rpm |
YES |
e1 |
||||||||||||||||||||||||||
|
|
NXP Semiconductors |
MICROPROCESSOR, RISC |
OTHER |
BALL |
1517 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
.88 V |
36 |
64 |
GRID ARRAY |
BGA1517.39X39,40 |
.82 V |
105 Cel |
12 |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
3.51 mm |
40 mm |
YES |
128 |
30 |
245 |
40 mm |
CMOS |
.05 mA |
.85 V |
17 |
1 mm |
FIXED POINT |
S-PBGA-B1517 |
3 |
2200 rpm |
YES |
e1 |
||||||||||||||||||||||||||
|
|
NXP Semiconductors |
MICROPROCESSOR, RISC |
INDUSTRIAL |
BALL |
1517 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
.88 V |
36 |
64 |
GRID ARRAY |
BGA1517.39X39,40 |
.82 V |
105 Cel |
12 |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
3.51 mm |
40 mm |
YES |
128 |
30 |
245 |
40 mm |
CMOS |
.05 mA |
.85 V |
17 |
1 mm |
FIXED POINT |
S-PBGA-B1517 |
3 |
2000 rpm |
YES |
e1 |
||||||||||||||||||||||||||
|
|
NXP Semiconductors |
MICROPROCESSOR, RISC |
OTHER |
BALL |
1517 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
.88 V |
36 |
64 |
GRID ARRAY |
BGA1517.39X39,40 |
.82 V |
105 Cel |
12 |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
3.51 mm |
40 mm |
YES |
128 |
30 |
245 |
40 mm |
CMOS |
.05 mA |
.85 V |
17 |
1 mm |
FIXED POINT |
S-PBGA-B1517 |
3 |
2200 rpm |
YES |
e1 |
||||||||||||||||||||||||||
|
|
NXP Semiconductors |
MICROPROCESSOR, RISC |
OTHER |
BALL |
1517 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
.88 V |
36 |
64 |
GRID ARRAY |
BGA1517.39X39,40 |
.82 V |
105 Cel |
12 |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
3.51 mm |
40 mm |
YES |
128 |
30 |
245 |
40 mm |
CMOS |
.05 mA |
.85 V |
17 |
1 mm |
FIXED POINT |
S-PBGA-B1517 |
3 |
1800 rpm |
YES |
e1 |
||||||||||||||||||||||||||
|
|
NXP Semiconductors |
MICROPROCESSOR, RISC |
OTHER |
BALL |
1517 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
.88 V |
36 |
64 |
GRID ARRAY |
BGA1517.39X39,40 |
.82 V |
105 Cel |
12 |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
3.51 mm |
40 mm |
YES |
128 |
30 |
245 |
40 mm |
CMOS |
.05 mA |
.85 V |
17 |
1 mm |
FIXED POINT |
S-PBGA-B1517 |
3 |
2200 rpm |
YES |
e1 |
||||||||||||||||||||||||||
|
|
NXP Semiconductors |
MICROPROCESSOR, RISC |
INDUSTRIAL |
BALL |
1517 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
.88 V |
36 |
64 |
GRID ARRAY |
BGA1517.39X39,40 |
.82 V |
105 Cel |
12 |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
3.51 mm |
40 mm |
YES |
128 |
30 |
245 |
40 mm |
CMOS |
.05 mA |
.85 V |
17 |
1 mm |
FIXED POINT |
S-PBGA-B1517 |
3 |
2200 rpm |
YES |
e1 |
A microprocessor is a small electronic component that serves as the central processing unit (CPU) of a computer or other electronic device. It is a programmable device that is capable of executing instructions and performing calculations.
Microprocessors are typically made up of millions of transistors and other components, all of which work together to perform complex calculations and operations. They are designed to be highly efficient, with the ability to process vast amounts of data quickly and accurately.
Microprocessors are used in a wide range of electronic devices, including computers, smartphones, tablets, and game consoles. They are also used in industrial control systems, medical devices, and other specialized applications.
One of the key advantages of microprocessors is their flexibility. They can be programmed to perform a wide range of functions and can be easily reprogrammed or updated as needed. This makes them ideal for a wide range of applications, from simple calculators to complex data processing systems.