BALL Microprocessors 758

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	On Chip Data RAM Width	Screening Level	Address Bus Width	Bit Size	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	No. of External Interrupts	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	RAM Words	Width	Additional Features	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Maximum Supply Current	Nominal Supply Voltage	No. of DMA Channels	No. of Serial I/Os	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Speed	Low Power Mode	JESD-609 Code
T4241NXE7TTB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	1932	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.055 V			16		GRID ARRAY		.995 V				TIN SILVER COPPER	BOTTOM	3.33 mm		45 mm		YES	64	133.3 MHz	30	250	45 mm	CMOS		1.025 V			1 mm	FIXED POINT	S-PBGA-B1932	3	1800 rpm	YES	e1
T4241NXN7PQB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	1932	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.055 V			16		GRID ARRAY		.995 V				TIN SILVER COPPER	BOTTOM	3.33 mm		45 mm		YES	64	133.3 MHz	30	250	45 mm	CMOS		1.025 V			1 mm	FIXED POINT	S-PBGA-B1932	3	1500 rpm	YES	e1
T4241NXN7QTB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	1932	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.055 V			16		GRID ARRAY		.995 V				TIN SILVER COPPER	BOTTOM	3.33 mm		45 mm		YES	64	133.3 MHz	30	250	45 mm	CMOS		1.025 V			1 mm	FIXED POINT	S-PBGA-B1932	3	1667 rpm	YES	e1
T4241NXN7TTB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	1932	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.055 V			16		GRID ARRAY		.995 V				TIN SILVER COPPER	BOTTOM	3.33 mm		45 mm		YES	64	133.3 MHz	30	250	45 mm	CMOS		1.025 V			1 mm	FIXED POINT	S-PBGA-B1932	3	1800 rpm	YES	e1
DM3725CBPDR100	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	515	VFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.2 V			26		GRID ARRAY, VERY THIN PROFILE, FINE PITCH		1.08 V	90 Cel		-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	.71 mm		12 mm		YES	16	54 MHz	30	260	12 mm	CMOS		1.14 V			.4 mm	FLOATING POINT	S-PBGA-B515	3	1000 rpm	YES	e1
MCIMX6X2EVN10ABR	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY		YES					32	GRID ARRAY, LOW PROFILE, FINE PITCH						TIN SILVER COPPER	BOTTOM	1.27 mm		17 mm					40	260	17 mm	CMOS					.8 mm		S-PBGA-B400	3	800 rpm		e1
MCIMX7D2DVM12SC	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	541	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.25 V			26	32	GRID ARRAY, LOW PROFILE, FINE PITCH		1.2 V	85 Cel		0 Cel		BOTTOM	1.42 mm		19 mm		YES	16		40	260	19 mm	CMOS		1.225 V			.75 mm	FLOATING POINT	S-PBGA-B541	3	1200 rpm	YES
MCIMX6Q4AVT10ADR	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.5 V			16	32	GRID ARRAY, FINE PITCH		1.35 V	125 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	2.16 mm		21 mm	PKG DETAIL: HTTP://CACHE.FREESCALE.COM/FILES/SHARED/DOC/PACKAGE_INFO/98ASA00330D.	YES	64		40	260	21 mm	CMOS					.8 mm	FLOATING POINT	S-PBGA-B624	3	1000 rpm	YES	e1
ATSAMA5D22C-CNR	Microchip Technology	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	196	TFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V	8		26	32	GRID ARRAY, THIN PROFILE, FINE PITCH	BGA196,14X14,30	1.2 V	105 Cel	1	-40 Cel	TIN SILVER COPPER NICKEL	BOTTOM	1.2 mm	131072	11 mm	ALSO OPERATES WITH 1.2V NOM @ 400 MHZ SPEED	YES	16	24 MHz			11 mm	CMOS		1.25 V	32		.75 mm	FLOATING POINT	S-PBGA-B196		500 rpm	YES	e2
ATSAMA5D22C-CN	Microchip Technology	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	196	TFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V	8		26	32	GRID ARRAY, THIN PROFILE, FINE PITCH	BGA196,14X14,30	1.2 V	105 Cel	1	-40 Cel	TIN SILVER COPPER NICKEL	BOTTOM	1.2 mm	131072	11 mm	ALSO OPERATES WITH 1.2V NOM @ 400 MHZ SPEED	YES	16	24 MHz			11 mm	CMOS		1.25 V	32		.75 mm	FLOATING POINT	S-PBGA-B196		500 rpm	YES	e2
ATSAMA5D22C-CU	Microchip Technology	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	196	TFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V	8		26	32	GRID ARRAY, THIN PROFILE, FINE PITCH	BGA196,14X14,30	1.2 V	85 Cel	1	-40 Cel	TIN SILVER COPPER NICKEL	BOTTOM	1.2 mm	131072	11 mm	ALSO OPERATES WITH 1.2V NOM @ 400 MHZ SPEED	YES	16	24 MHz			11 mm	CMOS		1.25 V	32		.75 mm	FLOATING POINT	S-PBGA-B196		500 rpm	YES	e2
ATSAMA5D26C-CNR	Microchip Technology	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V	8		26	32	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.2 V	105 Cel	1	-40 Cel		BOTTOM	1.4 mm	131072	14 mm	ALSO OPERATES WITH 1.2V NOM @ 400 MHZ SPEED	YES	16	24 MHz	NOT SPECIFIED	NOT SPECIFIED	14 mm	CMOS		1.25 V	32		.8 mm	FLOATING POINT	S-PBGA-B289		500 rpm	YES
ATSAMA5D26C-CN	Microchip Technology	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V	8		26	32	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.2 V	105 Cel	1	-40 Cel		BOTTOM	1.4 mm	131072	14 mm	ALSO OPERATES WITH 1.2V NOM @ 400 MHZ SPEED	YES	16	24 MHz	NOT SPECIFIED	NOT SPECIFIED	14 mm	CMOS		1.25 V	32		.8 mm	FLOATING POINT	S-PBGA-B289		500 rpm	YES
ATSAMA5D27C-CN	Microchip Technology	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V	8		26	32	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.2 V	105 Cel	1	-40 Cel		BOTTOM	1.4 mm	131072	14 mm	ALSO OPERATES WITH 1.2V NOM @ 400 MHZ SPEED	YES	16	24 MHz	NOT SPECIFIED	NOT SPECIFIED	14 mm	CMOS		1.25 V	32		.8 mm	FLOATING POINT	S-PBGA-B289		500 rpm	YES
ATSAMA5D27C-CU	Microchip Technology	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V	8		26	32	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.2 V	85 Cel	1	-40 Cel		BOTTOM	1.4 mm	131072	14 mm	ALSO OPERATES WITH 1.2V NOM @ 400 MHZ SPEED	YES	16	24 MHz	NOT SPECIFIED	NOT SPECIFIED	14 mm	CMOS		1.25 V	32		.8 mm	FLOATING POINT	S-PBGA-B289		500 rpm	YES
DM383AAAR21F	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	609	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.42 V			27	32	GRID ARRAY, LOW PROFILE, FINE PITCH		1.28 V	95 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.32 mm		16 mm		YES	16	30 MHz	30	260	16 mm	CMOS		1.35 V			.5 mm	FLOATING POINT	S-PBGA-B609	3	1000 rpm	YES	e1
DM383AAAR21	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	609	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.42 V			27	32	GRID ARRAY, LOW PROFILE, FINE PITCH		1.28 V	95 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.32 mm		16 mm		YES	16	30 MHz	30	260	16 mm	CMOS		1.35 V			.5 mm	FLOATING POINT	S-PBGA-B609	3	1000 rpm	YES	e1
AM3351BZCE30R	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	298	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.144 V	8		28	32	GRID ARRAY, LOW PROFILE, FINE PITCH		1.056 V	90 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm	131072	13 mm	ALSO OPERATES AT MIN 0.912 V	YES	16	26 MHz	30	260	13 mm	CMOS	400 mA	1.1 V	64		.65 mm	FIXED POINT	S-PBGA-B298	3	300 rpm	YES	e1
AM3351BZCE60R	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	298	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.144 V	8		28	32	GRID ARRAY, LOW PROFILE, FINE PITCH		1.056 V	90 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm	131072	13 mm		YES	16	26 MHz	30	260	13 mm	CMOS	400 mA	1.1 V	64		.65 mm	FIXED POINT	S-PBGA-B298	3	600 rpm	YES	e1
HPSDM8148CCYE2	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	684	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.42 V	8		28	32	GRID ARRAY, FINE PITCH		1.28 V	90 Cel		0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	3.06 mm	1114112	23 mm		YES	16	30 MHz	NOT SPECIFIED	250	23 mm	CMOS		1.35 V	72		.8 mm	FLOATING POINT	S-PBGA-B684	4	1000 rpm	YES	e1
MTDM8148CCYE2	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	684	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.42 V	8		28	32	GRID ARRAY, FINE PITCH		1.28 V	90 Cel		0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	3.06 mm	1114112	23 mm		YES	16	30 MHz	NOT SPECIFIED	250	23 mm	CMOS		1.35 V	72		.8 mm	FLOATING POINT	S-PBGA-B684	4	1000 rpm	YES	e1
AM5718AZBOXEM	Texas Instruments	MICROPROCESSOR, RISC	MILITARY	BALL	760	BGA	SQUARE	PLASTIC/EPOXY	NO	YES	1.2 V	8	AEC-Q100	16		GRID ARRAY		1.11 V	125 Cel		-55 Cel	TIN LEAD	BOTTOM		524288	23 mm	ALSO OPERATES AT 0.85 V TO 1.15 V AFTER AVS ENABLED	YES	32	32 MHz		250	23 mm	CMOS		1.15 V	1			FIXED POINT	S-PBGA-B760	3	1500 rpm	YES	e0
LS1020ASE7HNB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	525	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V			16	32	GRID ARRAY, FINE PITCH		.97 V				TIN SILVER COPPER	BOTTOM	2.07 mm		19 mm		YES	32	133.3 MHz	40	260	19 mm	CMOS		1 V			.8 mm	FLOATING POINT	S-PBGA-B525	3	800 rpm	YES	e1
LS1020ASE7KQB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	525	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V			16	32	GRID ARRAY, FINE PITCH		.97 V					BOTTOM	2.07 mm		19 mm		YES	32	133.3 MHz	40	260	19 mm	CMOS		1 V			.8 mm	FLOATING POINT	S-PBGA-B525	3	1000 rpm	YES
LS1020ASN7HNB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	525	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V			16	32	GRID ARRAY, FINE PITCH		.97 V				TIN SILVER COPPER	BOTTOM	2.07 mm		19 mm		YES	32	133.3 MHz	40	260	19 mm	CMOS		1 V			.8 mm	FLOATING POINT	S-PBGA-B525	3	800 rpm	YES	e1
LS1020ASN7KQB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	525	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V			16	32	GRID ARRAY, FINE PITCH		.97 V				TIN SILVER COPPER	BOTTOM	2.07 mm		19 mm		YES	32	133.3 MHz	40	260	19 mm	CMOS		1 V			.8 mm	FLOATING POINT	S-PBGA-B525	3	1000 rpm	YES	e1
LS1020AXE7HNB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	525	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V			16	32	GRID ARRAY, FINE PITCH		.97 V				TIN SILVER COPPER	BOTTOM	2.07 mm		19 mm		YES	32	133.3 MHz	40	260	19 mm	CMOS		1 V			.8 mm	FLOATING POINT	S-PBGA-B525	3	800 rpm	YES	e1
LS1020AXE7KQB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	525	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V			16	32	GRID ARRAY, FINE PITCH		.97 V				TIN SILVER COPPER	BOTTOM	2.07 mm		19 mm		YES	32	133.3 MHz	40	260	19 mm	CMOS		1 V			.8 mm	FLOATING POINT	S-PBGA-B525	3	1000 rpm	YES	e1
LS1020AXN7KQB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	525	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.03 V			16	32	GRID ARRAY, FINE PITCH		.97 V				TIN SILVER COPPER	BOTTOM	2.07 mm		19 mm		YES	32	133.3 MHz	40	260	19 mm	CMOS		1 V			.8 mm	FLOATING POINT	S-PBGA-B525	3	1000 rpm	YES	e1
ATSAMA5D225C-D1M-CU	Microchip Technology	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	196	TFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.3 V	16		0	16	GRID ARRAY, THIN PROFILE, FINE PITCH	BGA196,14X14,30	1.14 V	85 Cel		-40 Cel	TIN SILVER COPPER NICKEL	BOTTOM	1.2 mm	65536	11 mm		YES	0	24 MHz			11 mm	CMOS		1.2 V	51	1	.75 mm	FIXED POINT	S-PBGA-B196		500 rpm	YES	e2
ATSAMA5D41B-CU	Microchip Technology	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V	8	TS 16949	26	32	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA289,17X17,32	1.16 V	85 Cel	1	-40 Cel		BOTTOM	1.4 mm	131072	14 mm		YES	16	50 MHz			14 mm	CMOS		1.26 V	32	2	.8 mm	FLOATING POINT	S-PBGA-B289		600 rpm	YES
ATSAMA5D42B-CU	Microchip Technology	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	361	TFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V	8	TS 16949	26	32	GRID ARRAY, THIN PROFILE, FINE PITCH	BGA361,19X19,32	1.16 V	85 Cel	1	-40 Cel		BOTTOM	1.2 mm	131072	16 mm		YES	32	50 MHz			16 mm	CMOS		1.26 V	32	2	.8 mm	FLOATING POINT	S-PBGA-B361		600 rpm	YES
ATSAMA5D44B-CU	Microchip Technology	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	361	TFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V	8	TS 16949	26	32	GRID ARRAY, THIN PROFILE, FINE PITCH	BGA361,19X19,32	1.16 V	85 Cel	1	-40 Cel		BOTTOM	1.2 mm	131072	16 mm		YES	32	50 MHz			16 mm	CMOS		1.26 V	32	2	.8 mm	FLOATING POINT	S-PBGA-B361		600 rpm	YES
MCIMX6L2DVN10AC	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL		TFBGA	SQUARE	PLASTIC/EPOXY		YES	1.5 V					GRID ARRAY, THIN PROFILE, FINE PITCH		1.375 V	95 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.1 mm		13 mm					40	260	13 mm	CMOS					.5 mm		S-PBGA-B	3			e1
MCIMX6L2EVN10AC	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL		TFBGA	SQUARE	PLASTIC/EPOXY		YES	1.5 V					GRID ARRAY, THIN PROFILE, FINE PITCH		1.375 V	105 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.1 mm		13 mm					40	260	13 mm	CMOS					.5 mm		S-PBGA-B	3			e1
MCIMX6L3EVN10AC	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL		TFBGA	SQUARE	PLASTIC/EPOXY		YES	1.5 V					GRID ARRAY, THIN PROFILE, FINE PITCH		1.375 V	105 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.1 mm		13 mm					40	260	13 mm	CMOS					.5 mm		S-PBGA-B	3			e1
MCIMX6L8DVN10AC	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL		TFBGA	SQUARE	PLASTIC/EPOXY		YES	1.5 V					GRID ARRAY, THIN PROFILE, FINE PITCH		1.375 V	95 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.1 mm		13 mm					40	260	13 mm	CMOS					.5 mm		S-PBGA-B	3			e1
MCIMX6DP4AVT1AB	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	624	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.5 V					GRID ARRAY, FINE PITCH		1.35 V	125 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	2.16 mm		21 mm	24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE				40	260	21 mm	CMOS					.8 mm		S-PBGA-B624	3			e1
MCIMX6QP4AVT1AB	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	624	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.5 V					GRID ARRAY, FINE PITCH		1.35 V	125 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	2.16 mm		21 mm	24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE				40	260	21 mm	CMOS					.8 mm		S-PBGA-B624	3			e1
MCIMX6QP4AVT8AB	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	624	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.5 V					GRID ARRAY, FINE PITCH		1.225 V	125 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	2.16 mm		21 mm	24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE				40	260	21 mm	CMOS					.8 mm		S-PBGA-B624	3			e1
MCIMX6QP6AVT1AB	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	624	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.5 V					GRID ARRAY, FINE PITCH		1.35 V	125 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	2.16 mm		21 mm	24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE				40	260	21 mm	CMOS					.8 mm		S-PBGA-B624	3			e1
MCIMX6QP6AVT8AB	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	624	FBGA	SQUARE	PLASTIC/EPOXY		YES	1.5 V					GRID ARRAY, FINE PITCH		1.225 V	125 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	2.16 mm		21 mm	24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE				40	260	21 mm	CMOS					.8 mm		S-PBGA-B624	3			e1
MCIMX6S1AVM08AD	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.5 V			16		GRID ARRAY, LOW PROFILE, FINE PITCH		1.275 V	125 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm		21 mm	24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE	YES	32		40	260	21 mm	CMOS					.8 mm	FLOATING POINT	S-PBGA-B624	3	800 rpm	YES	e1
MCIMX6S1AVM10AD	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.5 V			16		GRID ARRAY, LOW PROFILE, FINE PITCH		1.4 V	125 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm		21 mm	24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE	YES	32		40	260	21 mm	CMOS					.8 mm	FLOATING POINT	S-PBGA-B624	3	1000 rpm	YES	e1
MCIMX6S4AVM08AD	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.5 V			16		GRID ARRAY, LOW PROFILE, FINE PITCH		1.275 V	125 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm		21 mm	24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE	YES	32		40	260	21 mm	CMOS					.8 mm	FLOATING POINT	S-PBGA-B624	3	800 rpm	YES	e1
MCIMX6S4AVM10AD	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.5 V			16		GRID ARRAY, LOW PROFILE, FINE PITCH		1.4 V	125 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm		21 mm	24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE	YES	32		40	260	21 mm	CMOS					.8 mm	FLOATING POINT	S-PBGA-B624	3	1000 rpm	YES	e1
MCIMX6S6AVM08AD	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.5 V			16		GRID ARRAY, LOW PROFILE, FINE PITCH		1.275 V	125 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm		21 mm	24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE	YES	32		40	260	21 mm	CMOS					.8 mm	FLOATING POINT	S-PBGA-B624	3	800 rpm	YES	e1
MCIMX6S6AVM10AD	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.5 V			16		GRID ARRAY, LOW PROFILE, FINE PITCH		1.4 V	125 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm		21 mm	24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE	YES	32		40	260	21 mm	CMOS					.8 mm	FLOATING POINT	S-PBGA-B624	3	1000 rpm	YES	e1

Microprocessors

A microprocessor is a small electronic component that serves as the central processing unit (CPU) of a computer or other electronic device. It is a programmable device that is capable of executing instructions and performing calculations.

Microprocessors are typically made up of millions of transistors and other components, all of which work together to perform complex calculations and operations. They are designed to be highly efficient, with the ability to process vast amounts of data quickly and accurately.

Microprocessors are used in a wide range of electronic devices, including computers, smartphones, tablets, and game consoles. They are also used in industrial control systems, medical devices, and other specialized applications.

One of the key advantages of microprocessors is their flexibility. They can be programmed to perform a wide range of functions and can be easily reprogrammed or updated as needed. This makes them ideal for a wide range of applications, from simple calculators to complex data processing systems.