BALL Microprocessors 758

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	On Chip Data RAM Width	Address Bus Width	Bit Size	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	RAM Words	Width	Additional Features	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Maximum Supply Current	Nominal Supply Voltage	No. of DMA Channels	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Speed	Low Power Mode	JESD-609 Code
MCIMX6D6AVT10ADR	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES				32	GRID ARRAY, FINE PITCH			125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.16 mm		21 mm	64-BIT BUS WIDTH AVAILABLE	YES			40	260	21 mm	CMOS				.8 mm	FIXED POINT	S-PBGA-B624	3	1000 rpm	NO	e1
T2080NXE8TTB	NXP Semiconductors	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	896	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES				64	GRID ARRAY, FINE PITCH			105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.61 mm		25 mm		NO			30	250	25 mm	CMOS				.8 mm	FIXED POINT	S-PBGA-B896	3	1800 rpm	NO	e1
XAM5728BABCXE	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY	NO	YES	1.2 V		16		GRID ARRAY, FINE PITCH		1.11 V	90 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	2.55 mm		23 mm		YES	32	38.4 MHz	30	250	23 mm	CMOS		1.15 V		.8 mm	FLOATING POINT	S-PBGA-B760	3	1500 rpm	YES	e1
D6417750RBA240HVU0	Renesas Electronics	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	256	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V		26	32	GRID ARRAY, HEAT SINK/SLUG		1.35 V	85 Cel	-40 Cel		BOTTOM	2.6 mm		27 mm		YES	64	34 MHz			27 mm	CMOS		1.5 V		1.27 mm	FLOATING POINT	S-PBGA-B256	3	240 rpm	YES
PCIMX6Q6AVT10AC	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	624	HBGA	SQUARE	PLASTIC/EPOXY		YES				32	GRID ARRAY, HEAT SINK/SLUG					TIN SILVER COPPER	BOTTOM	2.16 mm		21 mm					40	260	21 mm	CMOS				.8 mm		S-PBGA-B624	3	1000 rpm		e1
MCIMX6DP4AVT1AA	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.5 V		26	32	GRID ARRAY, FINE PITCH		1.35 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.16 mm		21 mm	24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE	YES	64		40	260	21 mm	CMOS				.8 mm	FLOATING POINT	S-PBGA-B624	3	1000 rpm	YES	e1
MCIMX6DP6AVT1AA	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.5 V		26	32	GRID ARRAY, FINE PITCH		1.35 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.16 mm		21 mm	24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE	YES	64		40	260	21 mm	CMOS				.8 mm	FLOATING POINT	S-PBGA-B624	3	1000 rpm	YES	e1
MCIMX6QP4AVT1AA	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.5 V		26	32	GRID ARRAY, FINE PITCH		1.35 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.16 mm		21 mm	24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE	YES	64		40	260	21 mm	CMOS				.8 mm	FLOATING POINT	S-PBGA-B624	3	1000 rpm	YES	e1
MCIMX6QP4AVT8AA	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.5 V		26	32	GRID ARRAY, FINE PITCH		1.225 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.16 mm		21 mm	24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE	YES	64		40	260	21 mm	CMOS		1.4 V		.8 mm	FLOATING POINT	S-PBGA-B624	3	852 rpm	YES	e1
MCIMX6QP6AVT1AA	NXP Semiconductors	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	624	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.5 V		26	32	GRID ARRAY, FINE PITCH		1.35 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.16 mm		21 mm	24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE	YES	64		40	260	21 mm	CMOS				.8 mm	FLOATING POINT	S-PBGA-B624	3	1000 rpm	YES	e1
X66AK2G02ZBB60	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	625	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	.95 V		16		GRID ARRAY, LOW PROFILE, FINE PITCH		.85 V	90 Cel	0 Cel		BOTTOM	1.7 mm		21 mm		YES	32	26 MHz			21 mm	CMOS		.9 V		.8 mm	FLOATING POINT	S-PBGA-B625		600 rpm	YES
MCIMX7D7DVK10SC	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	488	TFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.155 V		16	32	GRID ARRAY, THIN PROFILE, FINE PITCH		1.045 V				BOTTOM	1.1 mm		12 mm		YES	32		40	260	12 mm	CMOS		1.1 V		.4 mm	FLOATING POINT	S-PBGA-B488	3	1000 rpm	YES
MCIMX7S3DVK08SC	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	488	TFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.155 V		16	32	GRID ARRAY, THIN PROFILE, FINE PITCH		.95 V	95 Cel	0 Cel		BOTTOM	1.1 mm		12 mm	SEATED-HGT CALCULATED	YES	32		40	260	12 mm	CMOS		1 V		.4 mm	FLOATING POINT	S-PBGA-B488	3	800 rpm	YES
MCIMX7S3EVK08SC	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	488	TFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.155 V		16	32	GRID ARRAY, THIN PROFILE, FINE PITCH		.95 V	105 Cel	-20 Cel		BOTTOM	1.1 mm		12 mm	SEATED-HGT CALCULATED	YES	32		40	260	12 mm	CMOS		1 V		.4 mm	FLOATING POINT	S-PBGA-B488	3	800 rpm	YES
MCIMX7S5EVM08SC	NXP Semiconductors	MICROPROCESSOR, RISC	OTHER	BALL	541	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.155 V		16	32	GRID ARRAY, LOW PROFILE, FINE PITCH		.95 V	105 Cel	-20 Cel		BOTTOM	1.42 mm		19 mm	SEATED-HGT CALCULATED	YES	32		40	260	19 mm	CMOS		1 V		.75 mm	FLOATING POINT	S-PBGA-B541	3	800 rpm	YES
AM5726BABCXAR	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY	NO	YES	1.2 V		16		GRID ARRAY, FINE PITCH	BGA760,28X28,31	1.11 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.55 mm		23 mm		YES	32	38.4 MHz	30	250	23 mm	CMOS		1.15 V		.8 mm	FLOATING POINT	S-PBGA-B760	3	1500 rpm	YES	e1
AM5726BABCXA	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY	NO	YES	1.2 V		16		GRID ARRAY, FINE PITCH	BGA760,28X28,31	1.11 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.55 mm		23 mm		YES	32	38.4 MHz	30	250	23 mm	CMOS		1.15 V		.8 mm	FLOATING POINT	S-PBGA-B760	3	1500 rpm	YES	e1
AM5726BABCXEA	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY	NO	YES	1.2 V		16		GRID ARRAY, FINE PITCH	BGA760,28X28,31	1.11 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.55 mm		23 mm		YES	32	38.4 MHz	30	250	23 mm	CMOS		1.15 V		.8 mm	FLOATING POINT	S-PBGA-B760	3	1500 rpm	YES	e1
AM5726BABCX	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY	NO	YES	1.2 V		16		GRID ARRAY, FINE PITCH	BGA760,28X28,31	1.11 V	90 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	2.55 mm		23 mm		YES	32	38.4 MHz	30	250	23 mm	CMOS		1.15 V		.8 mm	FLOATING POINT	S-PBGA-B760	3	1500 rpm	YES	e1
AM5728BABCXA	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY	NO	YES	1.2 V		16		GRID ARRAY, FINE PITCH		1.11 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.55 mm		23 mm		YES	32	38.4 MHz	30	250	23 mm	CMOS		1.15 V		.8 mm	FLOATING POINT	S-PBGA-B760	3	1500 rpm	YES	e1
AM5728BABCXEA	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY	NO	YES	1.2 V		16		GRID ARRAY, FINE PITCH	BGA760,28X28,31	1.11 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.55 mm		23 mm		YES	32	38.4 MHz	30	250	23 mm	CMOS		1.15 V		.8 mm	FLOATING POINT	S-PBGA-B760	3	1500 rpm	YES	e1
AM5728BABCX	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	760	FBGA	SQUARE	PLASTIC/EPOXY	NO	YES	1.2 V		16		GRID ARRAY, FINE PITCH	BGA760,28X28,31	1.11 V	90 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	2.55 mm		23 mm		YES	32	38.4 MHz	30	250	23 mm	CMOS		1.15 V		.8 mm	FLOATING POINT	S-PBGA-B760	3	1500 rpm	YES	e1
AM3351BZCEA30	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	298	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.144 V	8	16	32	GRID ARRAY, LOW PROFILE, FINE PITCH		1.056 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm	131072	13 mm		YES	16	26 MHz	30	260	13 mm	CMOS	400 mA	1.1 V	64	.65 mm	FIXED POINT	S-PBGA-B298	3	300 rpm	YES	e1
MPC8535AVJANGA	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		16	32	GRID ARRAY		.95 V	90 Cel	0 Cel	TIN SILVER	BOTTOM	2.76 mm		29 mm		YES	64		40	260	29 mm	CMOS		1 V		1 mm	FIXED POINT	S-PBGA-B783	3	800 rpm	YES	e2
MPC8535BVJANGA	NXP Semiconductors	MICROPROCESSOR	OTHER	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		16	32	GRID ARRAY		.95 V	105 Cel	0 Cel	TIN SILVER	BOTTOM	2.76 mm		29 mm		YES	64		40	260	29 mm	CMOS		1 V		1 mm	FIXED POINT	S-PBGA-B783	3	800 rpm	YES	e2
T4081NSE7PQB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	1932	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES			16		GRID ARRAY, HEAT SINK/SLUG					TIN SILVER COPPER	BOTTOM	3.33 mm		45 mm		YES	64	133.3 MHz	30	250	45 mm	CMOS				1 mm	FIXED POINT	S-PBGA-B1932	3	1500 rpm	YES	e1
T4081NSE7QTB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	1932	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES			16		GRID ARRAY, HEAT SINK/SLUG					TIN SILVER COPPER	BOTTOM	3.33 mm		45 mm		YES	64	133.3 MHz	30	250	45 mm	CMOS				1 mm	FIXED POINT	S-PBGA-B1932	3	1667 rpm	YES	e1
T4081NSE7TTB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	1932	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES			16		GRID ARRAY, HEAT SINK/SLUG					TIN SILVER COPPER	BOTTOM	3.33 mm		45 mm		YES	64	133.3 MHz	30	250	45 mm	CMOS				1 mm	FIXED POINT	S-PBGA-B1932	3	1800 rpm	YES	e1
T4081NSN7PQB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	1932	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES			16		GRID ARRAY, HEAT SINK/SLUG					TIN SILVER COPPER	BOTTOM	3.33 mm		45 mm		YES	64	133.3 MHz	30	250	45 mm	CMOS				1 mm	FIXED POINT	S-PBGA-B1932	3	1500 rpm	YES	e1
T4081NSN7QTB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	1932	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES			16		GRID ARRAY, HEAT SINK/SLUG					TIN SILVER COPPER	BOTTOM	3.33 mm		45 mm		YES	64	133.3 MHz	30	250	45 mm	CMOS				1 mm	FIXED POINT	S-PBGA-B1932	3	1667 rpm	YES	e1
T4081NSN7TTB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	1932	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES			16		GRID ARRAY, HEAT SINK/SLUG					TIN SILVER COPPER	BOTTOM	3.33 mm		45 mm		YES	64	133.3 MHz	30	250	45 mm	CMOS				1 mm	FIXED POINT	S-PBGA-B1932	3	1800 rpm	YES	e1
T4081NXE7PQB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	1932	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES			16		GRID ARRAY, HEAT SINK/SLUG					TIN SILVER COPPER	BOTTOM	3.33 mm		45 mm		YES	64	133.3 MHz	30	250	45 mm	CMOS				1 mm	FIXED POINT	S-PBGA-B1932	3	1500 rpm	YES	e1
T4081NXE7QTB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	1932	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES			16		GRID ARRAY, HEAT SINK/SLUG					TIN SILVER COPPER	BOTTOM	3.33 mm		45 mm		YES	64	133.3 MHz	30	250	45 mm	CMOS				1 mm	FIXED POINT	S-PBGA-B1932	3	1667 rpm	YES	e1
T4081NXE7TTB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	1932	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES			16		GRID ARRAY, HEAT SINK/SLUG					TIN SILVER COPPER	BOTTOM	3.33 mm		45 mm		YES	64	133.3 MHz	30	250	45 mm	CMOS				1 mm	FIXED POINT	S-PBGA-B1932	3	1800 rpm	YES	e1
T4081NXN7PQB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	1932	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES			16		GRID ARRAY, HEAT SINK/SLUG					TIN SILVER COPPER	BOTTOM	3.33 mm		45 mm		YES	64	133.3 MHz	30	250	45 mm	CMOS				1 mm	FIXED POINT	S-PBGA-B1932	3	1500 rpm	YES	e1
T4081NXN7QTB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	1932	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES			16		GRID ARRAY, HEAT SINK/SLUG					TIN SILVER COPPER	BOTTOM	3.33 mm		45 mm		YES	64	133.3 MHz	30	250	45 mm	CMOS				1 mm	FIXED POINT	S-PBGA-B1932	3	1667 rpm	YES	e1
T4081NXN7TTB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	1932	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES			16		GRID ARRAY, HEAT SINK/SLUG					TIN SILVER COPPER	BOTTOM	3.33 mm		45 mm		YES	64	133.3 MHz	30	250	45 mm	CMOS				1 mm	FIXED POINT	S-PBGA-B1932	3	1800 rpm	YES	e1
T4160NSE7TTB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	1932	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES			16		GRID ARRAY, HEAT SINK/SLUG					TIN SILVER COPPER	BOTTOM	3.33 mm		45 mm		YES	64	133.3 MHz	30	250	45 mm	CMOS				1 mm	FIXED POINT	S-PBGA-B1932	3	1800 rpm	YES	e1
T4160NSN7TTB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	1932	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES			16		GRID ARRAY, HEAT SINK/SLUG					TIN SILVER COPPER	BOTTOM	3.33 mm		45 mm		YES	64	133.3 MHz	30	250	45 mm	CMOS				1 mm	FIXED POINT	S-PBGA-B1932	3	1800 rpm	YES	e1
T4161NSE7PQB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	1932	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES			16		GRID ARRAY, HEAT SINK/SLUG					TIN SILVER COPPER	BOTTOM	3.33 mm		45 mm		YES	64	133.3 MHz	30	250	45 mm	CMOS				1 mm	FIXED POINT	S-PBGA-B1932	3	1500 rpm	YES	e1
T4161NSE7QTB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	1932	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES			16		GRID ARRAY, HEAT SINK/SLUG					TIN SILVER COPPER	BOTTOM	3.33 mm		45 mm		YES	64	133.3 MHz	30	250	45 mm	CMOS				1 mm	FIXED POINT	S-PBGA-B1932	3	1667 rpm	YES	e1
T4161NSE7TTB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	1932	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES			16		GRID ARRAY, HEAT SINK/SLUG					TIN SILVER COPPER	BOTTOM	3.33 mm		45 mm		YES	64	133.3 MHz	30	250	45 mm	CMOS				1 mm	FIXED POINT	S-PBGA-B1932	3	1800 rpm	YES	e1
T4161NSN7PQB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	1932	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES			16		GRID ARRAY, HEAT SINK/SLUG					TIN SILVER COPPER	BOTTOM	3.33 mm		45 mm		YES	64	133.3 MHz	30	250	45 mm	CMOS				1 mm	FIXED POINT	S-PBGA-B1932	3	1500 rpm	YES	e1
T4161NSN7QTB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	1932	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES			16		GRID ARRAY, HEAT SINK/SLUG					TIN SILVER COPPER	BOTTOM	3.33 mm		45 mm		YES	64	133.3 MHz	30	250	45 mm	CMOS				1 mm	FIXED POINT	S-PBGA-B1932	3	1667 rpm	YES	e1
T4161NSN7TTB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	1932	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES			16		GRID ARRAY, HEAT SINK/SLUG					TIN SILVER COPPER	BOTTOM	3.33 mm		45 mm		YES	64	133.3 MHz	30	250	45 mm	CMOS				1 mm	FIXED POINT	S-PBGA-B1932	3	1800 rpm	YES	e1
T4161NXE7PQB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	1932	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES			16		GRID ARRAY, HEAT SINK/SLUG					TIN SILVER COPPER	BOTTOM	3.33 mm		45 mm		YES	64	133.3 MHz	30	250	45 mm	CMOS				1 mm	FIXED POINT	S-PBGA-B1932	3	1500 rpm	YES	e1
T4161NXE7QTB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	1932	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES			16		GRID ARRAY, HEAT SINK/SLUG					TIN SILVER COPPER	BOTTOM	3.33 mm		45 mm		YES	64	133.3 MHz	30	250	45 mm	CMOS				1 mm	FIXED POINT	S-PBGA-B1932	3	1667 rpm	YES	e1
T4161NXE7TTB	NXP Semiconductors	MICROPROCESSOR, RISC		BALL	1932	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES			16		GRID ARRAY, HEAT SINK/SLUG					TIN SILVER COPPER	BOTTOM	3.33 mm		45 mm		YES	64	133.3 MHz	30	250	45 mm	CMOS				1 mm	FIXED POINT	S-PBGA-B1932	3	1800 rpm	YES	e1

Microprocessors

A microprocessor is a small electronic component that serves as the central processing unit (CPU) of a computer or other electronic device. It is a programmable device that is capable of executing instructions and performing calculations.

Microprocessors are typically made up of millions of transistors and other components, all of which work together to perform complex calculations and operations. They are designed to be highly efficient, with the ability to process vast amounts of data quickly and accurately.

Microprocessors are used in a wide range of electronic devices, including computers, smartphones, tablets, and game consoles. They are also used in industrial control systems, medical devices, and other specialized applications.

One of the key advantages of microprocessors is their flexibility. They can be programmed to perform a wide range of functions and can be easily reprogrammed or updated as needed. This makes them ideal for a wide range of applications, from simple calculators to complex data processing systems.