BALL Microprocessors 758

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Integrated Cache	Surface Mount	Maximum Supply Voltage	On Chip Data RAM Width	Address Bus Width	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	RAM Words	Width	Additional Features	Boundary Scan	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Maximum Supply Current	Nominal Supply Voltage	No. of DMA Channels	No. of Serial I/Os	Sub-Category	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	Low Power Mode	JESD-609 Code
AM3517AZER	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	484	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.248 V	8	16	16	1.2,1.8,3.3	GRID ARRAY	BGA484,22X22,40	1.152 V	90 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	2.48 mm	65536	23 mm		YES	16	26 MHz	30	260	23 mm	CMOS	1500 mA	1.2 V	32		Microprocessors	1 mm	FLOATING POINT	S-PBGA-B484	3	Not Qualified	600 rpm	YES	e1
AM1707DZKBT3	Texas Instruments	MICROPROCESSOR, RISC	AUTOMOTIVE	BALL	256	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V		13	32	1.2,1.8/3.3	GRID ARRAY, FINE PITCH	BGA256,16X16,40	1.14 V	125 Cel	-40 Cel		BOTTOM	2.05 mm		17 mm		YES	16	30 MHz	NOT SPECIFIED	NOT SPECIFIED	17 mm	CMOS		1.2 V			Microprocessors	.5 mm	FIXED POINT	S-PBGA-B256		Not Qualified	375 rpm	YES
MPC8544CVTALF	Freescale Semiconductor	MICROPROCESSOR		BALL	783	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		0	32		GRID ARRAY, HEAT SINK/SLUG		.95 V			TIN SILVER	BOTTOM	2.8 mm		29 mm		YES	0	133 MHz	40	260	29 mm	CMOS		1 V				1 mm	FLOATING POINT	S-PBGA-B783	3		667 rpm	YES	e2
MPC8544CVTAQG	Freescale Semiconductor	MICROPROCESSOR		BALL	783	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		0	32		GRID ARRAY, HEAT SINK/SLUG		.95 V			TIN SILVER	BOTTOM	2.8 mm		29 mm		YES	0	133 MHz	40	260	29 mm	CMOS		1 V				1 mm	FLOATING POINT	S-PBGA-B783	3		1000 rpm	YES	e2
SPEAR310-2	STMicroelectronics	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	289	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V		0	32	1.2,1.8,3.3	GRID ARRAY	BGA289,17X17,32	1.14 V	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.7 mm		15 mm		YES	0		30	260	15 mm	CMOS		1.2 V			Microprocessors	.8 mm	FIXED POINT	S-PBGA-B289	3	Not Qualified	333 rpm	YES	e1
MPC8321VRADDC	Freescale Semiconductor	MICROPROCESSOR, RISC	OTHER	BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V		0	32	1,1.8/2.5,3.3	GRID ARRAY	BGA516,26X26,40	.95 V	105 Cel	0 Cel	TIN SILVER	BOTTOM	2.55 mm		27 mm		YES	0	66.67 MHz	40	260	27 mm	CMOS		1 V			Microprocessors	1 mm	FIXED POINT	S-PBGA-B516	3	Not Qualified	266 rpm	YES	e2
MPC8308CVMAGD	Freescale Semiconductor	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	473	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.05 V				1,1.8,2.5/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA473,23X23,32	.95 V	105 Cel	-40 Cel		BOTTOM	1.54 mm		19 mm		YES		66.67 MHz	40	260	19 mm	CMOS		1 V		2	Microprocessors	.8 mm	FLOATING POINT	S-PBGA-B473	3	Not Qualified	400 rpm	YES	e2
GCIXP1250BC	Intel	MICROPROCESSOR, RISC	COMMERCIAL	BALL	520	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	2.1 V		32	32		GRID ARRAY, LOW PROFILE		1.9 V	70 Cel	0 Cel		BOTTOM	1.7 mm		40 mm		YES	32	232 MHz	NOT SPECIFIED	NOT SPECIFIED	40 mm	CMOS		2 V				1.27 mm	FIXED POINT	S-PBGA-B520		Not Qualified	232 rpm	NO
GCIXP1200GA	Intel	MICROPROCESSOR, RISC	COMMERCIAL	BALL	432	LBGA	SQUARE	PLASTIC/EPOXY	YES	YES	2.1 V		32	32	2,3.3	GRID ARRAY, LOW PROFILE	BGA432,31X31,50	1.9 V	70 Cel	0 Cel	TIN LEAD	BOTTOM	1.67 mm		40 mm		YES	32	166 MHz			40 mm	CMOS		2 V			Microprocessors	1.27 mm	FIXED POINT	S-PBGA-B432		Not Qualified	166 rpm	NO	e0
AM1802EZWTD3	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V	8	23	32		GRID ARRAY, LOW PROFILE, FINE PITCH		1.14 V	90 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm	172032	16 mm		YES	16	30 MHz	30	260	16 mm	CMOS		1.2 V	80			.8 mm	FIXED POINT	S-PBGA-B361	3		300 rpm	YES	e1
AM1806EZCE3	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V	8	23	32		GRID ARRAY, LOW PROFILE, FINE PITCH		1.14 V	90 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm	172032	13 mm		YES	16	30 MHz	30	260	13 mm	CMOS		1.2 V	80			.65 mm	FIXED POINT	S-PBGA-B361	3		375 rpm	YES	e1
AM1806EZCE4	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.35 V	8	23	32		GRID ARRAY, LOW PROFILE, FINE PITCH		1.25 V	90 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm	172032	13 mm		YES	16	30 MHz	30	260	13 mm	CMOS		1.3 V	80			.65 mm	FIXED POINT	S-PBGA-B361	3		456 rpm	YES	e1
AM1806EZCEA3	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V	8	23	32		GRID ARRAY, LOW PROFILE, FINE PITCH		1.14 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm	172032	13 mm		YES	16	30 MHz	30	260	13 mm	CMOS		1.2 V	80			.65 mm	FIXED POINT	S-PBGA-B361	3		375 rpm	YES	e1
AM1806EZCED4	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.35 V	8	23	32		GRID ARRAY, LOW PROFILE, FINE PITCH		1.25 V	90 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm	172032	13 mm		YES	16	30 MHz	30	260	13 mm	CMOS		1.3 V	80			.65 mm	FIXED POINT	S-PBGA-B361	3		456 rpm	YES	e1
AM1806EZWT3	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V	8	23	32		GRID ARRAY, LOW PROFILE, FINE PITCH		1.14 V	90 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm	172032	16 mm		YES	16	30 MHz	30	260	16 mm	CMOS		1.2 V	80			.8 mm	FIXED POINT	S-PBGA-B361	3		375 rpm	YES	e1
AM1806EZWT4	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.35 V	8	23	32		GRID ARRAY, LOW PROFILE, FINE PITCH		1.25 V	90 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm	172032	16 mm		YES	16	30 MHz	30	260	16 mm	CMOS		1.3 V	80			.8 mm	FIXED POINT	S-PBGA-B361	3		456 rpm	YES	e1
AM1806EZWTD4	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.35 V	8	23	32		GRID ARRAY, LOW PROFILE, FINE PITCH		1.25 V	90 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm	172032	16 mm		YES	16	30 MHz	30	260	16 mm	CMOS		1.3 V	80			.8 mm	FIXED POINT	S-PBGA-B361	3		456 rpm	YES	e1
AM1808EZCE3	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V		23	32		GRID ARRAY, LOW PROFILE, FINE PITCH		1.14 V	90 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm		13 mm		YES	16	30 MHz	30	260	13 mm	CMOS		1.2 V				.65 mm	FIXED POINT	S-PBGA-B361	3		375 rpm	YES	e1
AM1808EZCE4	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.35 V		23	32		GRID ARRAY, LOW PROFILE, FINE PITCH		1.25 V	90 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm		13 mm		YES	16	30 MHz	30	260	13 mm	CMOS		1.3 V				.65 mm	FIXED POINT	S-PBGA-B361	3		456 rpm	YES	e1
AM1808EZCEA3	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V		23	32		GRID ARRAY, LOW PROFILE, FINE PITCH		1.14 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm		13 mm		YES	16	30 MHz	30	260	13 mm	CMOS		1.2 V				.65 mm	FIXED POINT	S-PBGA-B361	3		375 rpm	YES	e1
AM1808EZCED4	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.35 V		23	32		GRID ARRAY, LOW PROFILE, FINE PITCH		1.25 V	90 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm		13 mm		YES	16	30 MHz	30	260	13 mm	CMOS		1.3 V				.65 mm	FIXED POINT	S-PBGA-B361	3		456 rpm	YES	e1
AM1808EZWT3	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V		23	32		GRID ARRAY, LOW PROFILE, FINE PITCH		1.14 V	90 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm		16 mm		YES	16	30 MHz	30	260	16 mm	CMOS		1.2 V				.8 mm	FIXED POINT	S-PBGA-B361	3		375 rpm	YES	e1
AM1808EZWT4	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.35 V		23	32		GRID ARRAY, LOW PROFILE, FINE PITCH		1.25 V	90 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm		16 mm		YES	16	30 MHz	30	260	16 mm	CMOS		1.3 V				.8 mm	FIXED POINT	S-PBGA-B361	3		456 rpm	YES	e1
AM1808EZWTA3	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V		23	32		GRID ARRAY, LOW PROFILE, FINE PITCH		1.14 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm		16 mm		YES	16	30 MHz	30	260	16 mm	CMOS		1.2 V				.8 mm	FIXED POINT	S-PBGA-B361	3		375 rpm	YES	e1
AM1810EZWTA3	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V	8	14	32		GRID ARRAY, LOW PROFILE, FINE PITCH		1.14 V	105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm	131072	16 mm		YES	16	50 MHz	30	260	16 mm	CMOS	.31 mA	1.2 V	64			.8 mm	FIXED POINT	S-PBGA-B361	3		375 rpm	YES	e1
AM3352ZZCZA60	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	324	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES			16	32		GRID ARRAY, LOW PROFILE, FINE PITCH			105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm		15 mm		YES	16	26 MHz	30	260	15 mm	CMOS						.8 mm	FIXED POINT	S-PBGA-B324	3		600 rpm	YES	e1
AM3354BZCZ30	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	324	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.144 V	8	28	32		GRID ARRAY, LOW PROFILE, FINE PITCH		1.056 V	90 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm	131072	15 mm		YES	16	26 MHz	30	260	15 mm	CMOS	400 mA	1.1 V	64			.8 mm	FIXED POINT	S-PBGA-B324	3		300 rpm	YES	e1
DM388AAAR21F	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	609	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.42 V	8	28	32		GRID ARRAY, LOW PROFILE, FINE PITCH		1.28 V	95 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.32 mm	655360	16 mm		YES	16	30 MHz	30	260	16 mm	CMOS		1.35 V	72			.5 mm	FLOATING POINT	S-PBGA-B609	3		1000 rpm	YES	e1
DM388AAAR21	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	609	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.42 V	8	28	32		GRID ARRAY, LOW PROFILE, FINE PITCH		1.28 V	95 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.32 mm	655360	16 mm		YES	16	30 MHz	30	260	16 mm	CMOS		1.35 V	72			.5 mm	FLOATING POINT	S-PBGA-B609	3		1000 rpm	YES	e1
DM388AAARD11FP	Texas Instruments	MICROPROCESSOR, RISC		BALL	609	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.42 V	8	28	32		GRID ARRAY, LOW PROFILE, FINE PITCH		1.28 V			TIN SILVER COPPER	BOTTOM	1.32 mm	655360	16 mm		YES	16	30 MHz	30	260	16 mm	CMOS		1.35 V	72			.5 mm	FLOATING POINT	S-PBGA-B609	3		970 rpm	YES	e1
DM388AAARD21FP	Texas Instruments	MICROPROCESSOR, RISC		BALL	609	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.42 V	8	28	32		GRID ARRAY, LOW PROFILE, FINE PITCH		1.28 V			TIN SILVER COPPER	BOTTOM	1.32 mm	655360	16 mm		YES	16	30 MHz	30	260	16 mm	CMOS		1.35 V	72			.5 mm	FLOATING POINT	S-PBGA-B609	3		1000 rpm	YES	e1
DM388AAARD21F	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	609	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.42 V	8	28	32		GRID ARRAY, LOW PROFILE, FINE PITCH		1.28 V	95 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.32 mm	655360	16 mm		YES	16	30 MHz	30	260	16 mm	CMOS		1.35 V	72			.5 mm	FLOATING POINT	S-PBGA-B609	3		1000 rpm	YES	e1
DM388AAARD21	Texas Instruments	MICROPROCESSOR, RISC	INDUSTRIAL	BALL	609	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.42 V	8	28	32		GRID ARRAY, LOW PROFILE, FINE PITCH		1.28 V	95 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.32 mm	655360	16 mm		YES	16	30 MHz	30	260	16 mm	CMOS		1.35 V	72			.5 mm	FLOATING POINT	S-PBGA-B609	3		1000 rpm	YES	e1
FX053013	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	298	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES			16	32		GRID ARRAY, LOW PROFILE, FINE PITCH			90 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm		13 mm		YES	16	26 MHz	30	260	13 mm	CMOS						.65 mm	FIXED POINT	S-PBGA-B298	3			YES	e1
SN278792960	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	324	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES		8	16	32		GRID ARRAY, LOW PROFILE, FINE PITCH			90 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm	131072	15 mm	GPMC 28 BIT ADDRESS BUS AND 16 BIT DATA BUS AVAILABLE	YES	16	26 MHz	30	260	15 mm	CMOS			64			.8 mm	FIXED POINT	S-PBGA-B324	3			YES	e1
VCBU3730GSCUS100	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	423	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.2 V		26			GRID ARRAY, LOW PROFILE, FINE PITCH		1.08 V	90 Cel	0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	1.4 mm		16 mm		YES	16	54 MHz	30	260	16 mm	CMOS		1.14 V				.65 mm	FLOATING POINT	S-PBGA-B423	3		1000 rpm	YES	e1
AM1707BZKB3	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	256	FBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.32 V		16	32	1.2,1.8/3.3	GRID ARRAY, FINE PITCH	BGA256,16X16,40	1.14 V	90 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	2.05 mm		17 mm		YES	16	20 MHz	30	260	17 mm	CMOS		1.2 V			Microprocessors	.5 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	375 rpm	YES	e1
XAM3517ZCN	Texas Instruments	MICROPROCESSOR		BALL	491	LFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.248 V		16	32	1.2,1.8,1.8/3.3,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA491,25X25,25	1.152 V				BOTTOM	1.3 mm		17 mm		YES	16	26 MHz	NOT SPECIFIED	NOT SPECIFIED	17 mm	CMOS		1.2 V			Microprocessors	.65 mm	FLOATING POINT	S-PBGA-B491		Not Qualified	600 rpm	YES
MPC8313EVRAFFB	Freescale Semiconductor	MICROPROCESSOR	OTHER	BALL	516	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.5 V		32	32	1,1.8/2.5,3.3	GRID ARRAY, HEAT SINK/SLUG	BGA516,26X26,40	.95 V	105 Cel	0 Cel	TIN SILVER	BOTTOM	2.55 mm		27 mm	ALSO REQUIRES 3.3V I/O SUPPLY	YES	32	66.67 MHz	40	260	27 mm	CMOS		1 V			Microprocessors	1 mm	FLOATING POINT	S-PBGA-B516	3	Not Qualified	333 rpm	YES	e2
MPC8313VRAFFB	Freescale Semiconductor	MICROPROCESSOR	OTHER	BALL	516	HBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.5 V		32	32	1,1.8/2.5,3.3	GRID ARRAY, HEAT SINK/SLUG	BGA516,26X26,40	.95 V	105 Cel	0 Cel	TIN SILVER	BOTTOM	2.55 mm		27 mm	ALSO REQUIRES 3.3V I/O SUPPLY	YES	32	66.67 MHz	40	260	27 mm	CMOS		1 V			Microprocessors	1 mm	FLOATING POINT	S-PBGA-B516	3	Not Qualified	333 rpm	YES	e2
KMPC8270CVRMIBA	Freescale Semiconductor	MICROPROCESSOR, RISC		BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V		32	32		GRID ARRAY		1.45 V			TIN SILVER	BOTTOM	2.55 mm		27 mm		YES	64	266 MHz	30	245	27 mm	CMOS		1.5 V				1 mm	FLOATING POINT	S-PBGA-B516	3	Not Qualified	66.67 rpm	NO	e2
KMPC8270CZQMIBA	Freescale Semiconductor	MICROPROCESSOR, RISC		BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V		32	32		GRID ARRAY		1.45 V			Tin/Lead/Silver (Sn/Pb/Ag)	BOTTOM	2.55 mm		27 mm		YES	64	266 MHz	30	245	27 mm	CMOS		1.5 V				1 mm	FLOATING POINT	S-PBGA-B516	3	Not Qualified	66.67 rpm	NO	e0
KMPC8270VRMIBA	Freescale Semiconductor	MICROPROCESSOR, RISC	COMMERCIAL	BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V		32	32		GRID ARRAY		1.45 V	70 Cel	0 Cel	TIN SILVER	BOTTOM	2.55 mm		27 mm		YES	64	266 MHz	30	245	27 mm	CMOS		1.5 V				1 mm	FLOATING POINT	S-PBGA-B516	3	Not Qualified	66.67 rpm	NO	e2
KMPC8275CVRMIBA	Freescale Semiconductor	MICROPROCESSOR, RISC		BALL	516	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.6 V		32	32		GRID ARRAY		1.45 V			TIN SILVER	BOTTOM	2.55 mm		27 mm		YES	64	266 MHz	30	245	27 mm	CMOS		1.5 V				1 mm	FLOATING POINT	S-PBGA-B516	3	Not Qualified	66.67 rpm	NO	e2
KMPC852TVR100A	Freescale Semiconductor	MICROPROCESSOR, RISC		BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.9 V		32	32		GRID ARRAY		1.7 V			TIN SILVER COPPER	BOTTOM	2.54 mm		23 mm	ALSO REQUIRES 3.3V SUPPLY	YES	32	66 MHz	30	245	23 mm	CMOS		1.8 V				1.27 mm	FIXED POINT	S-PBGA-B256	3	Not Qualified	100 rpm	YES	e1
OMAP3530DZCBB	Texas Instruments	MICROPROCESSOR, RISC	OTHER	BALL	515	VFBGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.91 V		26		1.1,1.8,3.3	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA515,28X28,16	1.71 V	90 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	.9 mm		12 mm		YES	16	59 MHz	30	260	12 mm	CMOS		1.8 V			Graphics Processors	.4 mm	FLOATING POINT	S-PBGA-B515	3	Not Qualified	600 rpm	YES	e1
MPC8540VT833LB	Freescale Semiconductor	MICROPROCESSOR	OTHER	BALL	783	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V		64	32	1.2,2.5/3.3	GRID ARRAY	BGA783,28X28,40	1.14 V	105 Cel	0 Cel	Tin/Silver (Sn/Ag)	BOTTOM	3.85 mm		29 mm		YES	64	166 MHz	40	260	29 mm	CMOS		1.2 V			Microprocessors	1 mm	FIXED POINT	S-PBGA-B783	3	Not Qualified	667 rpm	YES	e2
MPC8347VRAGD	Freescale Semiconductor	MICROPROCESSOR, RISC	OTHER	BALL	620	BGA	SQUARE	PLASTIC/EPOXY	YES	YES	1.26 V		32	32	1.2,2.5,3.3	GRID ARRAY	BGA620,28X28,40	1.14 V	105 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	2.46 mm		29 mm		YES	32	66 MHz	40	260	29 mm	CMOS		1.2 V			Microprocessors	1 mm	FLOATING POINT	S-PBGA-B620	3	Not Qualified	400 rpm	YES	e1

Microprocessors

A microprocessor is a small electronic component that serves as the central processing unit (CPU) of a computer or other electronic device. It is a programmable device that is capable of executing instructions and performing calculations.

Microprocessors are typically made up of millions of transistors and other components, all of which work together to perform complex calculations and operations. They are designed to be highly efficient, with the ability to process vast amounts of data quickly and accurately.

Microprocessors are used in a wide range of electronic devices, including computers, smartphones, tablets, and game consoles. They are also used in industrial control systems, medical devices, and other specialized applications.

One of the key advantages of microprocessors is their flexibility. They can be programmed to perform a wide range of functions and can be easily reprogrammed or updated as needed. This makes them ideal for a wide range of applications, from simple calculators to complex data processing systems.